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EPIC Online Technology Meeting on PIC Packaging
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Engineers, researchers, and business professionals in the photonics and semiconductor industries interested in packaging advancements.
TL;DR
This video summarizes an EPIC online technology meeting focused on photonic integrated circuit (PIC) packaging. Discussions covered industry standards, design rules, testing integration, and the challenges of scaling production from die to wafer level.
In This Video
- 00:00Introduction to Photonics Packaging
Global meeting on photonic integration, packaging, and testing. Goal is to connect the supply chain and establish industry standards.
- 00:37Industry Collaboration and Goals
Emphasizes short-term collaboration to avoid reinventing the wheel. Discusses design rules and linking packaging to testing.
- 01:29Diverse Packaging Requirements
Different applications like lidar and transceivers have unique packaging needs. Design rules require input from all industry actors.
- 02:12Alignment and Micro Optics
Discussion on active vs. passive alignment and the role of micro optics. Wafer-level packaging is seen as the future.
- 02:59Wafer Level Packaging Transition
Moving packaging processes from die to wafer level. Explores what can be moved, when, and volume justifications.
- 03:26Rapid Prototyping and Demonstrators
Focus on quick, inexpensive demonstrators for new applications. Offers innovators a test-before-invest opportunity.
- 06:02Sponsors and Partners
Acknowledges sponsors like Ficon Tech, OFS, and others. Highlights companies offering manufacturing, materials, and equipment.
Questions & Answers
What is the main topic of the EPIC online technology meeting?
The meeting focuses on photonic integrated circuits (PIC) packaging, aiming to connect the entire supply chain and discuss industry standards for packaging.
What is the difference between short-term and long-term goals for PIC packaging?
The short-term goal is collaboration and avoiding redundant work, while the long-term goal is to establish industry standards for PIC packaging.
What are some examples of companies and their applications discussed in PIC packaging?
Scantinel (lidar), Effect Photonics (transceivers), and Lightebit Logic (modulators) have different packaging requirements based on their specific applications.
What are the key considerations for PIC packaging discussed in the meeting?
Discussions include active vs. passive alignment, micro-optics assembly, wafer-level packaging, and the transition of processes from die to wafer level.
What is the significance of wafer-level packaging in PIC packaging?
Wafer-level packaging is considered the 'promised land' for PIC packaging, aiming to move processes to the wafer level for efficiency and cost-effectiveness.
How can innovators test their photonic products quickly and inexpensively?
The meeting explores the availability of non-optimized, inexpensive packaging solutions that allow innovators to demonstrate proof of principle before significant investment.
Key Terms
- Photonic Integrated Circuits (PIC) — Electronic circuits that use photons (light) instead of electrons to perform functions, often integrated onto a single chip.
- PIC Packaging — The process of enclosing and protecting photonic integrated circuits, including assembly, alignment, and interconnection with other components.
- Wafer Level Packaging — A packaging technique where multiple integrated circuits are processed and packaged while still on the wafer, before being diced.
- Active Alignment — A method used in photonic packaging where optical components are actively adjusted and aligned using active feedback during the assembly process.