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EPIC Online Technology Meeting on Roadmap 2021 for Co-packaged Optics
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Engineers, researchers, and business strategists in the photonics and data center industries should watch this video.
TL;DR
This video summarizes a crucial online technology meeting focused on the 2021 roadmap for co-packaged optics. Industry leaders discussed challenges and opportunities in integrating optics with electronics to address data center traffic growth, power consumption, and cost.
Key Takeaways
- Co-packaged optics (CPO) are seen as a crucial technology to address the escalating data center traffic growth by significantly reducing power consumption and costs at the switch-optic electrical interface.
- The roadmap for CPO development is heavily influenced by cost considerations, necessitating accelerated development processes while simultaneously maximizing manufacturing yield.
- Key technology areas for CPO include specialized equipment for alignment, packaging, and assembly, alongside advancements in silicon photonics and indium phosphide integrated circuits.
- Integrating lasers, detectors, and modulators through semiconductor processes, connected via glass or silicon waveguides, is essential for CPO development.
- The supply chain needs to address yield expectations at the foundry level and define requirements for individual testing of CPO components.
- Collaboration between hyperscale data centers, like Facebook and Microsoft, and the photonics supply chain is vital for driving CPO adoption and innovation.
- The development of CPO requires a comprehensive ecosystem, encompassing equipment manufacturers, component suppliers, testing services, and packaging specialists.
- European initiatives like the PASSION project and PYLONs are contributing to the development of new architectures and standardized manufacturing solutions for CPO.
In This Video
- 00:00Introduction to EPIC Online Technology Meeting
Jose introduces the online meeting on Co-packaged Optics, highlighting its global reach and importance.
- 00:54Co-packaged Optics Collaboration and Goals
Facebook and Microsoft lead a collaboration to address data center traffic growth by reducing power consumption and cost.
- 01:30Key Technology Areas for Co-packaged Optics
Focus on equipment for alignment, packaging, assembly, and the integration of silicon photonics and indium phosphide.
- 02:23Supply Chain and Testing for Co-packaged Optics
Involving semiconductor companies for integration and addressing yield, testing, and equipment needs.
- 03:22EPIC Membership and Services
EPIC welcomes new members and offers services like networking, capital raising, market reports, and job listings.
- 04:21Upcoming EPIC Meetings and Initiatives
Highlights include meetings on Lidar, Quantum technologies, and the importance of co-packaged optics.
- 05:24Sponsors and Partners of the Event
Thanks to media partners, alliance partners, and sponsors like NKT Photonics, EXFO, and Modulight.
Questions & Answers
What is the main goal of co-packaged optics?
Co-packaged optics aims to address the challenge of data center traffic growth by reducing power consumption and cost of the switch optic electrical interface.
What are the key technology areas discussed for co-packaged optics?
The key areas are equipment for alignment, packaging, and assembly; silicon photonics and indium phosphide integrated circuits; and semiconductor processes for integrating lasers, detectors, and modulators.
Which companies are mentioned as leaders or participants in co-packaged optics?
Intel, Facebook, Microsoft, Lenovo, Broadcom, Adva, Infinera, Smart Photonics, IHP, IMEC, ASE, ATNS, and various equipment and component suppliers are mentioned.
What is the role of EPIC in the co-packaged optics initiative?
EPIC's role is to translate the challenges of co-packaging into business opportunities and connect the drivers of compact optics with the photonics supply chain.
When and where was the online technology meeting on co-packaged optics held?
The meeting was held on Wednesday, March 3rd, at 3 pm Central European Time.
What are some of the challenges in co-packaged optics development?
Challenges include the need for specific alignment, packaging, and assembly equipment, developing standard silicon photonic transceivers, integrating lasers and detectors, and ensuring high yield at the foundry level.
Key Terms
- Co-packaged Optics (CPO) — A technology where optical components are placed directly on or very near the switch ASIC, reducing power consumption and improving performance.
- Silicon Photonics — An area of photonics that uses silicon as a material to fabricate optical devices and circuits for data communication.
- Indium Phosphide (InP) — A compound semiconductor material used for high-speed optical devices like lasers and modulators, often integrated with silicon photonics.
- EPIC — The European Photonics Industry Consortium, an organization that supports and connects companies within the photonics industry.