Introduction to AIM Photonics and NY Creates PICs and Packaging Capabilities

https://www.youtube.com/watch?v=stvB1MPTF-c

Summary

TL;DR — AIM Photonics and NY Creates offer comprehensive capabilities in photonic integrated circuits (PICs), interposers, heterogeneous integration, and packaging, leveraging advanced 300mm facilities in Albany and Rochester, NY. They provide end-to-end solutions from design automation to testing and workforce development, aiming to make advanced photonic technologies accessible to a wider community.

Key points

• AIM Photonics, an institute of manufacturing innovation, focuses on advancing PICs, interposers, heterogeneous integration, and packaging.

• NY Creates provides access to state-of-the-art semiconductor research facilities, including a 300mm nanotech complex and a test assembly and packaging facility.

• Capabilities include MPW (Multi-Project Wafer) services for PICs, custom packaging, electronic-photonic design automation (EPDA), and support for emerging applications like quantum technologies and co-packaged optics.

• The facilities offer advanced lithography, wafer-level and chip-level packaging operations, and specialized processes like hybrid bonding and micro-transfer printing.

• Educational programs and resources, including online courses and hands-on kits, are available to train the future photonics workforce.

Takeaway — AIM Photonics and NY Creates are key enablers for the development and adoption of advanced photonic technologies through their integrated design, manufacturing, and educational ecosystem.