# Introduction to AIM Photonics and NY Creates PICs and Packaging Capabilities

https://www.youtube.com/watch?v=stvB1MPTF-c

[00:08] Okay.
[00:11] Okay.
[00:12] Okay.
[00:12] Hello everyone.
[00:12] Yeah, we can start.
[00:14] Hello everyone.
[00:14] Yeah, we can start.
[00:14] Hello everyone.
[00:14] My name is AJ Jacob and
[00:17] Hello everyone.
[00:17] My name is AJ Jacob and I'm the director of projects at the
[00:19] I'm the director of projects at the California Dream Subub.
[00:19] It's my pleasure
[00:21] California Dream Subub.
[00:21] It's my pleasure to invite Dr. David Harami.
[00:21] Uh he is the
[00:26] to invite Dr. David Harami.
[00:26] Uh he is the COO of AIM Photonix.
[00:26] Many of you know uh
[00:29] COO of AIM Photonix.
[00:29] Many of you know uh what AIM is.
[00:32] what AIM is.
[00:32] Uh it's the American Institute of
[00:34] Uh it's the American Institute of Manufacturing for the Photonics.
[00:37] Manufacturing for the Photonics.
[00:37] Uh he is also the associate vice
[00:40] Uh he is also the associate vice president of for New York creates and he
[00:40] president of for New York creates and he manages photonics electronic photonic
[00:42] manages photonics electronic photonic design automation test assembly and
[00:44] design automation test assembly and packaging technical areas and he has
[00:46] packaging technical areas and he has been with a photonics since 2019 and in
[00:46] been with a photonics since 2019 and in his current position Dr. Harami manages
[00:48] his current position Dr. Harami manages all the technology development in the
[00:51] all the technology development in the photonics and packaging areas for AIM
[00:51] photonics and packaging areas for AIM photonics in Albany, New York as well as
[00:54] photonics in Albany, New York as well as in the Albany nanotech center in uh in
[00:56] in the Albany nanotech center in uh in the Rochester, New York area uh for the
[00:58] the Rochester, New York area uh for the test assembly and packaging facility.
[01:00] the test assembly and packaging facility.
[01:03] the test assembly and packaging facility.
[01:05] the test assembly and packaging facility.
[01:09] test assembly and packaging facility.
[01:12] Prior to joining AIM Photonics, Dr. Har was a global foundaries fellow and CTO for development and enablement.
[01:18] Uh David was an IBM fellow and CTO for development and enablement at IBM before joining GF.
[01:26] Uh David Harami is an IT fellow and received the ITE Daniel E Nobel Award in emerging technologies for the development of manufacturable silicon germanmanium HPT bipolar and bicymos technologies.
[01:37] Uh David is best known for his work bringing silicon germanmanium byos into manufacturing.
[01:42] uh David David also worked on foundry enablement and technology development for RFCOS RFPD and FDSOI technologies uh and he received his PhD in electrical engineering very long time ago from Stanford University
[01:56] uh David it's my pleasure to invite you to give this talk thank you so much to accept our invitation and the floor is yours
[02:04] okay thank you very much for that kind introduction
[02:07] okay so it's my pleasure today to talk
[02:09] okay so it's my pleasure today to talk to everybody about uh inonics.
[02:12] to everybody about uh inonics uh and New York creates our picks and packaging capabilities.
[02:15] uh and New York creates our picks and packaging capabilities.
[02:18] So this will be a uh this is a brief outline.
[02:20] We're basically going to run through these kind of topics starting out with some essential aspects of amphetonics and New York creates.
[02:22] basically going to run through these kind of topics starting out with some essential aspects of amphetonics and New York creates.
[02:24] essential aspects of amphetonics and New York creates who they are what they are and then talk a little bit about the technologies we have focus on picks.
[02:26] essential aspects of amphetonics and New York creates who they are what they are and then talk a little bit about the technologies we have focus on picks.
[02:28] and then talk a little bit about the technologies we have focus on picks interposers heterogeneous integration in our packaging technologies and with a little bit of electronic platonic design automation and then uh talk about uh uh our education workforce development aspects.
[02:30] technologies we have focus on picks interposers heterogeneous integration in our packaging technologies and with a little bit of electronic platonic design automation and then uh talk about uh uh our education workforce development aspects.
[02:32] focus on picks interposers heterogeneous integration in our packaging technologies and with a little bit of electronic platonic design automation and then uh talk about uh uh our education workforce development aspects.
[02:35] interposers heterogeneous integration in our packaging technologies and with a little bit of electronic platonic design automation and then uh talk about uh uh our education workforce development aspects.
[02:38] our packaging technologies and with a little bit of electronic platonic design automation and then uh talk about uh uh our education workforce development aspects.
[02:40] little bit of electronic platonic design automation and then uh talk about uh uh our education workforce development aspects.
[02:43] automation and then uh talk about uh uh our education workforce development aspects.
[02:46] our education workforce development aspects.
[02:48] So first of all what is a fetonics?
[02:50] It's a defense department manufacturing uh innovation institute and it offers nan solutions in fatonic integrated circuits interposers heterogeneous integration packaging and EPDA.
[02:52] and it offers nan solutions in fatonic integrated circuits interposers heterogeneous integration packaging and EPDA.
[02:55] nan solutions in fatonic integrated circuits interposers heterogeneous integration packaging and EPDA.
[02:57] integrated circuits interposers heterogeneous integration packaging and EPDA.
[02:59] heterogeneous integration packaging and EPDA.
[03:02] Now we're part of New York creates.
[03:04] New York creates accelerates next generation technology research uh through its facilities and it's best known for the 300 millimeter Albany.
[03:07] next generation technology research uh through its facilities and it's best known for the 300 millimeter Albany.
[03:09] through its facilities and it's best known for the 300 millimeter Albany.
[03:11] known for the 300 millimeter Albany nanotech complex uh which includes a nanotech complex uh which includes a semiconductor research center that semiconductor research center that people are making two nanometer sheet people are making two nanometer sheet transistors there the heterogeneous transistors there the heterogeneous integration center and the newest integration center and the newest element which is the high NA EUV element which is the high NA EUV accelerator center.
[03:26] So this uh this site overall is about $2 billion of investment when you add everything overall is about $2 billion of investment when you add everything together in the associated groups.
[03:36] The Rochester test assembly and packaging facility provide state-of-the-art facility provide state-of-the-art capability.
[03:40] We'll explain all these aspects, but as an MI, we're really aspects, but as an MI, we're really charged to advance platonics and charged to advance platonics and packaging and particularly make all packaging and particularly make all these advances accessible.
[03:48] So we're not really a commercial uh enterprise. We're really a commercial uh enterprise. We're trying to develop technologies and make trying to develop technologies and make them available and then educate people them available and then educate people how to use them.
[03:57] So we have the educational aspects uh we our our latest efforts is really educational aspects uh we our our latest efforts is really to work around u building functional to work around u building functional opto electronic systems things like uh opto electronic systems things like uh co- package optics uh etc.
[04:09] So first
[04:13] Co-package optics, uh, etc. So first, let's just talk about New York Creates.
[04:15] Let's just talk about New York Creates.
[04:18] It has three functions: R&D for advanced semiconductors we just mentioned, uh, the center ecosystem economic development.
[04:23] That's really what the name stands for, and education and workforce training.
[04:28] Here's AIM Photonics, as I said, they have three functions.
[04:33] Uh, and we really have these two facilities.
[04:35] One is the Albany Nanotech Complex on the showing on the left, and on the right is our test assembly and packaging facility in Rochester.
[04:41] So these are the two places where we build our facilities, and we're primarily a 300 mm, uh, platonic, uh, and, uh, electronic, electronic photonic interposer facility.
[04:55] We do a lot of wafer-level and chip-level simulated heterogeneous integration and packaging, both in the Albany Nanotech Center and at the test assembly and packaging operation in Rochester, New York.
[05:07] Now, we do four things.
[05:09] Uh, we do picks and, uh, we've had a running MPW providing photonic.
[05:15] A running MPW providing photonic integrated circuits since 2015.
[05:19] Uh we have electronic and electronic photonic interposers.
[05:24] Uh we do custom packaging services and support a packaging roadmap.
[05:30] And uh we have uh electronic fatonic design automations.
[05:33] So we the EPDA supports all of the uh picks the interposers.
[05:38] And as we talk discussed today we're in the process of rolling out ADKs to support packaging.
[05:43] Now I want to mention one thing about uh 300 mm.
[05:48] Uh you know you get a lot of benefits from it uh compared to smaller wafers.
[05:53] Uh I'm going to show you some data in a minute, but basically uh it's just uh better alignment and much more uniform processes across the entire wafer.
[06:02] So we really benefit from this and the Albony Nanotech Center in particular is a real center for advanced lithography.
[06:09] So uh it really is an advantage in our technologies because because for the phatonic elements they may be large but
[06:15] Phatonic elements they may be large but you really want very well defined and smooth surfaces uh for lower losses and process control and and that's what we benefit from.
[06:23] This is actually a slide from AJ 2017 and it just simply shows this was a technology that was at global foundaries.
[06:32] It was running in a 200 mm fab.
[06:34] They went to 300 mm and you can see how it just sharpened up all of the controls on the wafers.
[06:40] There's some other material I gave the reference here.
[06:42] But basically the net is there's a lot of advantages to being in in 300 mm for ponics.
[06:47] Uh and we we benefit from that and extremely strong lithography base.
[06:49] Now let's talk about the uh facilities that we leverage in Albany.
[06:53] The Albany nanotech center.
[06:55] So it really largely consists of three elements.
[06:58] It has this center for sepiconductor research.
[07:00] You see the north fabs and these central fabs and here's where this 2nmter sheet transistor kind of controls are.
[07:02] We have the heterogeneous
[07:16] are.
[07:16] We have the heterogeneous integration center.
[07:18] And we have what is integration center.
[07:18] And we have what is coming up now which is this uh uh what they call nanoflab reflection but it really is the site of the high EUV center.
[07:27] It's a multi-tenant site.
[07:30] So that's another advantage actually of being on the site.
[07:32] There's IBM, there's applied materials, there's TEL, there's other uh uh companies that make uh semiconductor tools.
[07:40] And that really gives us an element of advantage because we work with these tenants uh for things like hybrid bonding tools, advanced packaging tools, etc.
[07:49] So that's another aspect working with us.
[07:52] you're gaining access to some expertise of the multi-tenant site in addition to just the facilities themselves.
[07:56] This shows the CSR and the main aspect here is it's basically an advanced 300 millimeter 24/7 uh automated uh fab.
[08:05] It has a a fully uh uh manufacturing uh execution system.
[08:11] Everything is tracked
[08:16] system.
[08:16] Everything is tracked controlled.
[08:18] Different tenants can keep controlled.
[08:18] Different tenants can keep their things proprietary.
[08:23] leading edge lithography.
[08:27] uh it runs a a production 65 nanometer.
[08:28] uh to investigate different memory devices and RFCOS and uh basically just 24/7.
[08:35] So a lot of support to run the wafers.
[08:37] The next part is the heterogeneous integration fab and here.
[08:44] what we see is it it has uh bonding methods you can do TSV TSV reveal.
[08:48] Uh so the fab really takes uh wafers exoded the seamos fab and then you can go through enough of the packaging operations uh to simulate them and and package them in Albany.
[09:01] So there is some duplication between what's in Albany and in Rochester.
[09:07] But there's this facility largely focused around packaging operations for 300 millimeter dense bumping.
[09:14] Now in our Rochester test assembly and packaging facility, this is
[09:16] assembly and packaging facility, this is a real general uh facility.
[09:19] We do a lot of wafer level operations.
[09:21] We have really 300 up where we're in the process of uh acquiring tools to be able to support 200 millimeter operations.
[09:30] Uh you can see uh lithography, PVD, plating, electrolytic and electroly bumping, RDL, bond to bonding and solder jetting.
[09:40] So these are the wafer level kind of operation chip level.
[09:45] Our busiest sector is really fiber attachment phonics.
[09:49] We do a lot of that but we can do full advanced kind of packaging with die stacking flip chip wire bonding assembly solder jetting.
[09:58] This is an example of a LAR chip.
[10:00] The pick was fabricated by us and this is an amphetics pick and on top you see six of these CMOS wafers.
[10:09] We actually got these wafers from a foundry, bumped them, and then flipped them.
[10:11] Uh so there's 3,000* 6 bonds full uh you know 100% yield.
[10:15] So
[10:19] 6 bonds full uh you know 100% yield.
[10:23] So in addition uh we have uh value analysis and test on site uh to debug processes.
[10:26] and test on site uh to debug processes while we're doing development.
[10:29] And we have some advanced tools coming in particularly largely focused around fatonic and optic kind of packaging processes.
[10:33] particularly largely focused around fatonic and optic kind of packaging processes.
[10:36] Here we're doing microtransfer printing, photonic wire bond so we can use 3D uh printing uh to uh create lenses die to wafer hybrid bonding wafer reconstruction etc.
[10:38] Here we're doing microtransfer printing, photonic wire
[10:40] bond so we can use 3D uh printing uh to uh create lenses die to wafer hybrid
[10:44] uh create lenses die to wafer hybrid bonding wafer reconstruction etc.
[10:47] bonding wafer reconstruction etc.
[10:50] So these kind of processes are the wafer reconstruction is still in development but the other processes were getting tools putting on site and have been doing these operations.
[10:52] these kind of processes are the wafer reconstruction is still in development
[10:54] reconstruction is still in development but the other processes were getting
[10:55] but the other processes were getting tools putting on site and have been doing these operations.
[10:57] tools putting on site and have been doing these operations.
[11:00] Let's talk about the MPW.
[11:03] So we really think that by having the pick and the interposer processes in house, this gives us a real advantage for end toend kind of development for things like co-ackage optics.
[11:06] having the pick and the interposer processes in house, this gives us a real
[11:08] advantage for end toend kind of development for things like co-ackage
[11:11] development for things like co-ackage optics.
[11:13] optics. For one thing, you want to be able to modify the pick to get the most out of a full co-ackage optics uh kind
[11:15] For one thing, you want to be able to modify the pick to get the most
[11:18] able to modify the pick to get the most out of a full co-ackage optics uh kind
[11:22] out of a full co-ackage optics uh kind of offering.
[11:24] We've been running the base MPW since 2015, so it's very mature.
[11:28] It has multiple component libraries and some of them have statistical models.
[11:33] There's other ones that are lower level.
[11:35] We communicate that to you.
[11:37] So you can pick up components developed of different uh uh maturity.
[11:42] We have a passive where we've removed the implants, the metals and the geranium.
[11:46] This actually was uh one of the primary elements used for COVID sensors during the pandemic.
[11:50] And since then we have developed a a very low loss silicon nitrite platform which is being used for sensors.
[11:58] There's a near IR and the visible uh aspect to it and it's being used for some quantum aspects as well now.
[12:05] So this is a very low loss platform and you can see here we have electronic interposer.
[12:10] We're in the process of doing electronic platonic.
[12:12] Now it's really important if you have MPWs that you run with uh you just constantly run.
[12:16] So it it's not like we'll we'll run or
[12:23] So it it's not like we'll we'll run or not depending on how many writers we get.
[12:25] So you can see here these are our silicon nitride the passive electronic interposer the full active and we run these quarterly.
[12:36] One aspects that differentiates us from large foundaries is the ability to do customization.
[12:41] We actually you can sign up and uh when you do your uh purchase your MPW you can actually sign up to modify different processes.
[12:50] Now there are additional costs for this.
[12:52] a wafer has to be pulled out because all of the customers may not want to get the customizations that you want.
[12:57] But you can change metals, you can change implants, you can change thicknesses and that that flexibility I think really distinguishes us and and uh there's a lot of new emerging applications in phatonics and uh developers really want the ability to modify the process to optimize it for those emerging applications.
[13:19] So let's talk a little bit about the pick offerings.
[13:22] And when we
[13:25] about the pick offerings.
[13:27] And when we orient towards the pick offerings, we orient towards the pick offerings, we think of oursel as having some application uh some generic application specific platforms for the pick and then we develop uh heterogeneous operations on top of that that can go across any of these other platforms.
[13:43] Uh so we'll explain that more in a minute.
[13:45] So here's the uh platonic applications uh the platforms we have.
[13:52] So you can see this is this base MPW it's been running since 2015.
[13:58] We now have a second version of it which is driving down losses improving performance.
[14:03] We have silicon nitride.
[14:06] So this is heavily used for sensors but now also being used more for more visible applications and uh quantum.
[14:14] We have a full silicon phetonics for quantum.
[14:16] This is is quite different from the base.
[14:18] It was completely redone from the ground up.
[14:23] It has different implants and optimized very low loss.
[14:25] optimized very low loss.
[14:28] You can see here is a single photon emitter here is a single photon emitter entanglement uh device.
[14:31] Uh the idea here is that we will not only have this generic offering from silicon patonics,
[14:35] but I'll show you later.
[14:37] We're going to add elements and you'll be able to come in and pick up uh quantum optimized cells for silicon platonic and then
[14:44] we're working on integration of 35.
[14:47] There many different ways to integrate 35s.
[14:48] We'll talk about that a little bit in the talk but one way is heteroepitially.
[14:54] We we're working on this because we think it's the densest form of integration and you can see here this is on our 300 mm wafer.
[15:00] The end processing was actually done in a in a cut down version at UCSB.
[15:05] But this is a this was all 300 millimeter processing to grow the epi and make contacts.
[15:10] And you can see here's a fully functional laser on it.
[15:13] These are quantum dot lasers oen.
[15:14] So here's the interposer platform.
[15:18] The first is the electronic interposer and there really aren't a lot of US-based uh
[15:25] there really aren't a lot of US-based uh interposer offerings.
[15:29] And uh you can customize this.
[15:32] Again it has TSVs uh you can the metals uh uh how many metals you want etc.
[15:39] And we do have uh other elements here that have been enabled capacitors resistors inductors for passive kind of devices.
[15:45] Here's the electronic phatonic interposer.
[15:47] So we take this and basically flip the uh uh the MPW full silicon phatonics on top.
[15:54] Remove the backside and wire these things together.
[15:56] I'll show you uh for some slides later on.
[16:01] This is being redone a little bit.
[16:03] These connections are being replaced with hybrid bonds for low parasitic connections between the two.
[16:08] There's a lot of interest out there in large area uh interposers or substrates uh with waveguides on the surface and these are low waveguides and a fairly mature offering.
[16:20] You get the silicon phatonic devices in addition and very early on when AIM was actually started uh this was done initially with
[16:27] Started, uh, this was done initially with CMOS wafers.
[16:30] So you could do SEMOS here, CMOS wafers.
[16:32] So you could do SEMOS here as well.
[16:34] These are our packaging platforms.
[16:36] So we've broken our packaging platforms into four areas and again we do packaging in Albany Nanotech HI Center.
[16:43] And in the test assembly and packaging facility in Rochester.
[16:45] So we're able to leverage the more dense side in Albany and the generic side in uh in Rochester.
[16:55] So here you can see wafer level operations, 300 mm PVD lithography, plating, etc.
[17:00] If you take a look at the assembly package, we simulate devices.
[17:03] We do plasma dicing, laser dicing.
[17:06] We do plasma dicing, laser dicing, mechanical dicing.
[17:09] Uh, we can build up different uh cobar substrates.
[17:11] We can build up different uh cobar substrates.
[17:14] We can place things in different packages, wire bond, flip the chip, uh or we could uh you know connect fiber.
[17:17] So there's a lot of assembly done.
[17:20] We're working on reconstituted wafers.
[17:21] So there's a lot of assembly done.
[17:24] We're working on reconstituted wafers.
[17:26] It's not quite there yet, but we we plan on uh offering.
[17:29] there yet, but we we plan on uh offering this.
[17:31] And then we have a fairly large area focus on optical coupling.
[17:33] We'll describe that in a minute.
[17:36] So here just shows you some of the uh uh characteristics of our 300 mm base MPW.
[17:43] We have a inline tester.
[17:45] We do wafer acceptance criteria.
[17:47] We measure every wafer.
[17:50] It just shows you here's here was the first version.
[17:52] You can see we've reduced the losses in the second version.
[17:55] And again, every wafer goes through and is characterized in line.
[17:59] Uh this happens to be a tail preio with a lot of keys site uh characterization equipment on it.
[18:07] We're now going a level above this to actually include visible.
[18:09] you know, you can't really just go out there and buy an inline visible tester.
[18:13] So, we're custom developing this with our collaborators.
[18:17] uh this is our uh silica nitride platform and essentially I'd mentioned that in our full fatonics uh when we remove the implants and metals and germanmanium you can run this it's just.
[18:29] germanium you can run this it's just a passive but uh the uh the NRL.
[18:33] a passive but uh the uh the NRL laboratory came and said listen we need to really drive these losses down uh.
[18:37] to really drive these losses down uh very low fluorescence and less coupling.
[18:39] very low fluorescence and less coupling to the substrate so they told us what they were doing in smaller form factors.
[18:44] they were doing in smaller form factors and we collaborated together to implement that in in a uh 300 mm offering.
[18:50] implement that in in a uh 300 mm offering. So this is now they're running all their stuff with us now essentially.
[18:52] offering. So this is now they're running all their stuff with us now essentially and and uh we're now driving this towards shorter wavelengths, more visible and also adding heaters here.
[18:56] and and uh we're now driving this towards shorter wavelengths, more visible and also adding heaters here.
[18:58] towards shorter wavelengths, more visible and also adding heaters here. We think this will be a very interesting uh platform uh for sensors and quantum etc.
[19:01] visible and also adding heaters here. We think this will be a very interesting uh platform uh for sensors and quantum etc.
[19:03] think this will be a very interesting uh platform uh for sensors and quantum etc.
[19:07] platform uh for sensors and quantum etc. Here's an example of what we did with the passive.
[19:09] Here's an example of what we did with the passive. This is a uh co 19 bio sensor.
[19:14] the passive. This is a uh co 19 bio sensor. Uh you can see we have these rings.
[19:17] sensor. Uh you can see we have these rings. There's there's a control and one with absorbate sensitive uh to co antigens and uh you can see here uh the control no signal and you can see this.
[19:19] rings. There's there's a control and one with absorbate sensitive uh to co antigens and uh you can see here uh the control no signal and you can see this.
[19:23] with absorbate sensitive uh to co antigens and uh you can see here uh the control no signal and you can see this.
[19:27] antigens and uh you can see here uh the control no signal and you can see this.
[19:31] control no signal and you can see this uh rising signal here for the positive.
[19:33] uh rising signal here for the positive.
[19:36] So this was early on this was done with Ben Miller at University of Rochester.
[19:39] Ben Miller at University of Rochester.
[19:40] They've extensively published in this and they've also actually generated a startup photonics.
[19:42] and they've also actually generated a startup photonics.
[19:45] There's also Scyfox using us.
[19:48] So there's other uh companies now that are coming to use us uh to take advantage of our sensor platforms.
[19:50] now that are coming to use us uh to take advantage of our sensor platforms.
[19:53] advantage of our sensor platforms.
[19:57] Now let's talk about quantum.
[19:59] So we developed our quantum platform jointly with AFL, RIT, Colombia.
[20:03] jointly with AFL, RIT, Colombia.
[20:05] There were several people uh several groups that contributed to this.
[20:07] that contributed to this.
[20:11] This shows a MPW in the technology.
[20:13] By the way, the government has really been interested in this and this has also been swept up into the mic micro electronics common Nortech hub.
[20:15] interested in this and this has also been swept up into the mic micro electronics common Nortech hub.
[20:18] been swept up into the mic micro electronics common Nortech hub.
[20:20] Nortech is known as QLEX, I'm sorry, QIX, quant alter broadbound photonic integrated circuits.
[20:24] alter broadbound photonic integrated circuits.
[20:26] Here we have QLEX and name phonics.
[20:28] You can come in and run an MPW.
[20:31] phonics. You can come in and run an MPW. Uh what we see here is here's some of
[20:34] Uh what we see here is here's some of these single and tangled photon sources.
[20:36] these single and tangled photon sources. Uh and again you're going to be able to
[20:38] Uh and again you're going to be able to come in and pick this up as an IP block.
[20:40] come in and pick this up as an IP block. And uh if we have done various uh
[20:44] And uh if we have done various uh cavities and exposed wave guides here's
[20:47] cavities and exposed wave guides here's an example showing a lithium diabate
[20:50] an example showing a lithium diabate device. We have the ability to do
[20:52] device. We have the ability to do cavities underneath active devices or uh
[20:56] cavities underneath active devices or uh thermoptic phase shifters and other
[20:57] thermoptic phase shifters and other aspects. So you can thermally control
[21:00] aspects. So you can thermally control devices. Here's an example where we
[21:02] devices. Here's an example where we actually did some phatonic crystals.
[21:04] actually did some phatonic crystals. Let's go back to the comments I made
[21:06] Let's go back to the comments I made about lithography. Just the 193
[21:08] about lithography. Just the 193 immersion that we pervasively have. I
[21:10] immersion that we pervasively have. I mean, we basically patterned all these
[21:12] mean, we basically patterned all these and light propagating through these just
[21:14] and light propagating through these just has different properties. So, this is
[21:16] has different properties. So, this is also a capability. It's a custom thing.
[21:18] also a capability. It's a custom thing. It's not generically offered, but this
[21:20] It's not generically offered, but this is uh we're able to do this. And uh just
[21:24] is uh we're able to do this. And uh just some other things. Here's our losses
[21:26] some other things. Here's our losses that are in the platform. And we're in
[21:28] that are in the platform. And we're in the process of developing aluminina
[21:30] the process of developing aluminina nitride uh aluminina and thick nitrides.
[21:33] nitride uh aluminina and thick nitrides. So that's showing here this happens to
[21:36] So that's showing here this happens to uh show that we're doing this in three
[21:38] uh show that we're doing this in three phases. Uh today today we're doing phase
[21:42] phases. Uh today today we're doing phase one which is just the straight silicon
[21:44] one which is just the straight silicon phatonic.
[21:46] phatonic. Phase two we're going to expand
[21:48] Phase two we're going to expand different materials. Here we show
[21:50] different materials. Here we show aluminina and aluminina nitride being
[21:52] aluminina and aluminina nitride being offered to the full silicon photonics
[21:55] offered to the full silicon photonics platform. And then phase three we're
[21:57] platform. And then phase three we're going to add thick nitride for cones. Uh
[22:01] going to add thick nitride for cones. Uh so we think this will be a really
[22:02] so we think this will be a really interesting offering and it's being used
[22:05] interesting offering and it's being used now in micro electronics common dorc and
[22:08] now in micro electronics common dorc and also across our amphetonics quantum
[22:11] also across our amphetonics quantum activities. Quantum's a really big
[22:14] activities. Quantum's a really big interest. This just shows some of the
[22:16] interest. This just shows some of the fact that we have these uh cavities that
[22:18] fact that we have these uh cavities that we uh uh remove silicon for just to make
[22:22] we uh uh remove silicon for just to make a much better control. We also uh uh
[22:26] a much better control. We also uh uh control different aspects of uh of
[22:29] control different aspects of uh of removing silicon underneath edge
[22:30] removing silicon underneath edge couplers in order to get lower loss.
[22:34] couplers in order to get lower loss. So again this platform is available
[22:36] So again this platform is available today in AIM under QLEX and micro
[22:40] today in AIM under QLEX and micro electronics qu uh QPIX and also there's
[22:45] electronics qu uh QPIX and also there's a quantum networking uh Nordc project
[22:48] a quantum networking uh Nordc project that's also using it. So, we have both
[22:50] that's also using it. So, we have both of these uh in in the Commons and uh the
[22:54] of these uh in in the Commons and uh the Commons actually has uh we've actually
[22:56] Commons actually has uh we've actually gotten sponsorship from AFRL in order to
[23:00] gotten sponsorship from AFRL in order to uh offer an MPW. So, it's a generic
[23:03] uh offer an MPW. So, it's a generic offering for anybody in the country. Uh
[23:06] offering for anybody in the country. Uh uh and you can submit. We're now doing
[23:09] uh and you can submit. We're now doing this once a year. Uh we've got one
[23:11] this once a year. Uh we've got one running now that should be out in a
[23:13] running now that should be out in a couple months. Uh here's our uh 35
[23:16] couple months. Uh here's our uh 35 integration platform. What we have here
[23:20] integration platform. What we have here is uh the ability to integrate uh lasers
[23:24] is uh the ability to integrate uh lasers quantum dot lasers with silicon
[23:26] quantum dot lasers with silicon photonics. So this is kind of a
[23:28] photonics. So this is kind of a cross-section of the uh device cartoon.
[23:30] cross-section of the uh device cartoon. Here you can see the full silicon
[23:32] Here you can see the full silicon photonic offerings the metals and here
[23:35] photonic offerings the metals and here we have etched down into the substrate
[23:38] we have etched down into the substrate actually growing this laser quantum dot
[23:41] actually growing this laser quantum dot laser. You can see all the different
[23:42] laser. You can see all the different layers and uh at the center here we have
[23:45] layers and uh at the center here we have quantum dot layers uh that are formed
[23:48] quantum dot layers uh that are formed and that's the part that's uh doing the
[23:51] and that's the part that's uh doing the uh emitting of light.
[23:54] uh emitting of light. Okay, this just shows an example where
[23:56] Okay, this just shows an example where we have fabricated these lasers and
[23:58] we have fabricated these lasers and coupled them to passive elements. In
[24:01] coupled them to passive elements. In this case, we have some silicon rings
[24:04] this case, we have some silicon rings and DBRs for filtering. So, we can uh uh
[24:07] and DBRs for filtering. So, we can uh uh control move the uh uh wavelengths uh uh
[24:11] control move the uh uh wavelengths uh uh where these uh uh dips are occurring.
[24:15] where these uh uh dips are occurring. Um and uh we can also take these lasers
[24:18] Um and uh we can also take these lasers and sort of operate them in a different
[24:20] and sort of operate them in a different mode and then we have photo dodes. So,
[24:23] mode and then we have photo dodes. So, this just shows an example of a photo
[24:25] this just shows an example of a photo diode where we've done exactly that.
[24:29] diode where we've done exactly that. Now let's talk about the interposers. So
[24:31] Now let's talk about the interposers. So interposers are particularly interested.
[24:33] interposers are particularly interested. Uh we've uh we've supported electronic
[24:36] Uh we've uh we've supported electronic interposer and a lot of custom builds
[24:38] interposer and a lot of custom builds and uh now we're really rolling out the
[24:40] and uh now we're really rolling out the electronic fatonic interposer. And again
[24:43] electronic fatonic interposer. And again this has the ability of putting
[24:45] this has the ability of putting different uh wafers underneath here. It
[24:47] different uh wafers underneath here. It doesn't have to just be the electronic
[24:49] doesn't have to just be the electronic interposer. This is an example of an
[24:52] interposer. This is an example of an electronic interposer. You can see we
[24:54] electronic interposer. You can see we got it. We built the interposer. uh we
[24:57] got it. We built the interposer. uh we simulated it. Uh we we uh made it so
[25:01] simulated it. Uh we we uh made it so it's accessible for bumping. Uh we uh uh
[25:06] it's accessible for bumping. Uh we uh uh formed bumps and attached electronic IC
[25:09] formed bumps and attached electronic IC to it. And then we uh the other side uh
[25:12] to it. And then we uh the other side uh attached it to a PCB. So this just shows
[25:16] attached it to a PCB. So this just shows an X-ray of it. And you can see
[25:18] an X-ray of it. And you can see cross-section here of the devices here
[25:21] cross-section here of the devices here and what this is. So it's an example of
[25:23] and what this is. So it's an example of a build that we can do. Let's talk about
[25:26] a build that we can do. Let's talk about lasers. So, there are many different
[25:27] lasers. So, there are many different ways to attach lasers. More conventional
[25:29] ways to attach lasers. More conventional ways is just to either bring them up
[25:31] ways is just to either bring them up with free space optics or through fiber
[25:35] with free space optics or through fiber uh uh budling or however you're going to
[25:37] uh uh budling or however you're going to do it. Uh people are using phatonic wire
[25:40] do it. Uh people are using phatonic wire bonds. We're in the process of
[25:42] bonds. We're in the process of developing that. We do a lot of 2 and
[25:44] developing that. We do a lot of 2 and 1/2d uh flip chip. This is uh this is
[25:48] 1/2d uh flip chip. This is uh this is something we're going to be offering in
[25:49] something we're going to be offering in the MPW. So, uh, probably roll this out
[25:52] the MPW. So, uh, probably roll this out this year in June. And later in the
[25:55] this year in June. And later in the year, you'll be able to at your MPW
[25:57] year, you'll be able to at your MPW order, uh, as a, uh, just a different
[26:00] order, uh, as a, uh, just a different component, an actual 2 and a halfD
[26:02] component, an actual 2 and a halfD laser. Uh, initially it'll be Cband and,
[26:05] laser. Uh, initially it'll be Cband and, uh, it'll be, uh, you'll be able to put
[26:07] uh, it'll be, uh, you'll be able to put that cavity in and have light sources on
[26:10] that cavity in and have light sources on ship. It's just part of our MPW
[26:11] ship. It's just part of our MPW offering. And, uh, you can see we just
[26:14] offering. And, uh, you can see we just talked about Lumos where we've been
[26:16] talked about Lumos where we've been monolithically growing these. And uh we
[26:19] monolithically growing these. And uh we have not we have not done hybrid uh as
[26:22] have not we have not done hybrid uh as an offering although we are doing
[26:24] an offering although we are doing projects heterogeneously attaching 35
[26:27] projects heterogeneously attaching 35 coupons. This just shows the 2 and 1/2D
[26:30] coupons. This just shows the 2 and 1/2D laser work. This is an example.
[26:34] This is a laser actually we acquired
[26:36] This is a laser actually we acquired this uh sorry that thing keeps popping
[26:39] this uh sorry that thing keeps popping up. We acquired this from freedom. uh
[26:42] up. We acquired this from freedom. uh and uh so we have lasers and we uh
[26:46] and uh so we have lasers and we uh define the element uh the cavity here
[26:49] define the element uh the cavity here and it's a it says an edge coupled at
[26:51] and it's a it says an edge coupled at the end of the cavity. This just shows
[26:53] the end of the cavity. This just shows you an LIV curve from it. Uh and this is
[26:56] you an LIV curve from it. Uh and this is has a full PDK element. So you're going
[26:59] has a full PDK element. So you're going to be able to come in as an MPW and just
[27:01] to be able to come in as an MPW and just place this and be able to have light uh
[27:04] place this and be able to have light uh on on wafer. So let's talk a little bit
[27:07] on on wafer. So let's talk a little bit about coupling.
[27:10] about coupling. many different ways to couple. You can
[27:12] many different ways to couple. You can do it with gradings and we offer a
[27:13] do it with gradings and we offer a variety of different gradings. We have a
[27:16] variety of different gradings. We have a edge coupling and uh here we get
[27:18] edge coupling and uh here we get particularly low loss by uh doing uh
[27:22] particularly low loss by uh doing uh removing silicon underneath and of
[27:24] removing silicon underneath and of course optimizing the coupling
[27:26] course optimizing the coupling structures. We're now uh in the process
[27:28] structures. We're now uh in the process of developing eancent coupling options.
[27:32] of developing eancent coupling options. Uh we're printing micro lenses and we
[27:34] Uh we're printing micro lenses and we actually uh are doing that with a couple
[27:37] actually uh are doing that with a couple different uh 3D printing vendors
[27:40] different uh 3D printing vendors photonic wire bonds and uh we have not
[27:43] photonic wire bonds and uh we have not done a free space polymer yet but I
[27:45] done a free space polymer yet but I think that's going to be coming as well.
[27:47] think that's going to be coming as well. So uh users that are interested in in
[27:50] So uh users that are interested in in having a fabricate things I think we
[27:53] having a fabricate things I think we have a variety of different ways for you
[27:54] have a variety of different ways for you to get light on chip. This just shows a
[27:57] to get light on chip. This just shows a grading for instance. You can see
[27:59] grading for instance. You can see there's some advantages especially for
[28:01] there's some advantages especially for uh wafer level test and uh uh getting in
[28:05] uh wafer level test and uh uh getting in and out easily the grading disadvantages
[28:08] and out easily the grading disadvantages high coupling loss etc. But there's a
[28:11] high coupling loss etc. But there's a variety of different
[28:13] variety of different uh gradings and we're cons constantly
[28:15] uh gradings and we're cons constantly improving uh the performance of these.
[28:18] improving uh the performance of these. This shows edge coupling.
[28:22] This shows edge coupling. What you see here is a structure where
[28:24] What you see here is a structure where we have actually gone on underneath the
[28:27] we have actually gone on underneath the wave guide and removed silicon. So you
[28:30] wave guide and removed silicon. So you can see in cross-section the edge
[28:32] can see in cross-section the edge couplers coming here and the silicon has
[28:33] couplers coming here and the silicon has been removed and that enables us to get
[28:36] been removed and that enables us to get very low losses.
[28:39] very low losses. Uh here's some example of some other
[28:41] Uh here's some example of some other coupling work that we're doing. We're
[28:43] coupling work that we're doing. We're printing micro lenses. We're doing
[28:45] printing micro lenses. We're doing infidescent coupling and uh we're also
[28:48] infidescent coupling and uh we're also uh you know doing other kinds of devices
[28:50] uh you know doing other kinds of devices just to get better optical coupling
[28:52] just to get better optical coupling performance. So let's talk about
[28:54] performance. So let's talk about packaging.
[28:57] packaging. These are the different kind of
[28:58] These are the different kind of packaging operations.
[29:00] packaging operations. We have a lot of 3D wafer to wafer
[29:02] We have a lot of 3D wafer to wafer bonding. Uh we have not uh yet we have
[29:06] bonding. Uh we have not uh yet we have tooling uh really on site and we're
[29:09] tooling uh really on site and we're going to be starting guide to wafer
[29:11] going to be starting guide to wafer efforts both in Albany and in Rochester.
[29:14] efforts both in Albany and in Rochester. So we have extensive wafer to wafer bond
[29:16] So we have extensive wafer to wafer bond to bond and have already started some of
[29:19] to bond and have already started some of the u dto wafer work. So hybrid bonding
[29:22] the u dto wafer work. So hybrid bonding this shows one micron pitch that we did.
[29:25] this shows one micron pitch that we did. Again going back we have some advantages
[29:27] Again going back we have some advantages because there are vendors on site that
[29:29] because there are vendors on site that are developing tools for this and we
[29:31] are developing tools for this and we work with them.
[29:33] work with them. And here's some 2 and 1 halfd placed
[29:35] And here's some 2 and 1 halfd placed lasers here. We also have picss that
[29:38] lasers here. We also have picss that were placed here in this example and
[29:40] were placed here in this example and dense bumping. This shows 23 micron
[29:43] dense bumping. This shows 23 micron copper pillar. Here's 50 micron uh
[29:47] copper pillar. Here's 50 micron uh copper pillar with 10 silver caps. Uh so
[29:50] copper pillar with 10 silver caps. Uh so we have this offering both in Albany and
[29:54] we have this offering both in Albany and in Rochester.
[29:56] in Rochester. Here's this is a little more description
[29:59] Here's this is a little more description of our tap facility in Rochester. So
[30:02] of our tap facility in Rochester. So again it has 300 mm
[30:05] again it has 300 mm uh wafer level chip level assembly
[30:08] uh wafer level chip level assembly metrology and test. This just shows you
[30:11] metrology and test. This just shows you couple pictures of the facility. Here's
[30:13] couple pictures of the facility. Here's some examples of builds we've done. So,
[30:15] some examples of builds we've done. So, incoming wafer, we bump it. Uh we
[30:18] incoming wafer, we bump it. Uh we simulate it, we flip chip it, uh we may
[30:21] simulate it, we flip chip it, uh we may build some submounts and other things.
[30:23] build some submounts and other things. We can do wire bonding, fiber attach,
[30:25] We can do wire bonding, fiber attach, and then we can test it on site. So,
[30:28] and then we can test it on site. So, there's extensive test capability.
[30:31] there's extensive test capability. Now, it's really important that we're
[30:33] Now, it's really important that we're able to uh do uh enablement. Uh so early
[30:39] able to uh do uh enablement. Uh so early on we started doing PDKs and one of the
[30:42] on we started doing PDKs and one of the aspects of our PDKs is for each
[30:44] aspects of our PDKs is for each technology there's a PDK and then
[30:46] technology there's a PDK and then there's multiple component libraries
[30:48] there's multiple component libraries that you can use. So when you get PDK
[30:51] that you can use. So when you get PDK access you go in you pick your
[30:53] access you go in you pick your technology and then you can select from
[30:56] technology and then you can select from different component libraries. There may
[30:58] different component libraries. There may be very mature ones. They might come
[31:00] be very mature ones. They might come with some licensing commercial licensing
[31:03] with some licensing commercial licensing restrictions there. Some are Sunni
[31:05] restrictions there. Some are Sunni provides. uh both of those devices are
[31:07] provides. uh both of those devices are really open and there's some other uh we
[31:10] really open and there's some other uh we call them crowdsourced or application
[31:13] call them crowdsourced or application specific uh elements uh that we've
[31:16] specific uh elements uh that we've assembled. We're also working on a
[31:18] assembled. We're also working on a measurement design kit. So what this is
[31:21] measurement design kit. So what this is is basically a layout setup. So if you
[31:24] is basically a layout setup. So if you copy uh these layouts, they're
[31:26] copy uh these layouts, they're immediately uh uh compatible with our
[31:29] immediately uh uh compatible with our test setup in Albany and in Rochester.
[31:33] test setup in Albany and in Rochester. And then you can test the device fairly
[31:35] And then you can test the device fairly simply. And then we're the what real
[31:38] simply. And then we're the what real activity now is on the assembly design
[31:40] activity now is on the assembly design kit.
[31:42] kit. Here we have uh some comments about ADKs
[31:45] Here we have uh some comments about ADKs in general. So the CMOS industry is
[31:48] in general. So the CMOS industry is extremely mature, right? Verification,
[31:50] extremely mature, right? Verification, sign off, uh PCB design, interposer, all
[31:54] sign off, uh PCB design, interposer, all these different aspects are just routine
[31:56] these different aspects are just routine in the SEMOS world. Photonix, optics,
[31:59] in the SEMOS world. Photonix, optics, not so much. So we're trying to
[32:02] not so much. So we're trying to especially with ADK and other aspects
[32:04] especially with ADK and other aspects drive putting these steps in place just
[32:06] drive putting these steps in place just to mature overall the phetonics uh
[32:10] to mature overall the phetonics uh electronic fatonic design automation.
[32:12] electronic fatonic design automation. Here are some examples of where people
[32:14] Here are some examples of where people have used our EPDA. This is our quantum
[32:18] have used our EPDA. This is our quantum technology. It kind of shows all these
[32:20] technology. It kind of shows all these components which are in the PDK. Uh
[32:23] components which are in the PDK. Uh people go in and they can use this to
[32:25] people go in and they can use this to design different elements. Here's an
[32:27] design different elements. Here's an example of one now. I'm at a vertical
[32:29] example of one now. I'm at a vertical junction ring modulator and uh and then
[32:32] junction ring modulator and uh and then you know they build some circuits and it
[32:34] you know they build some circuits and it shows it. I want to make a comment here
[32:35] shows it. I want to make a comment here about the EPDA here which is you know a
[32:38] about the EPDA here which is you know a lot of these uh uh electronic phatonic
[32:41] lot of these uh uh electronic phatonic design automation providers uh uh they
[32:44] design automation providers uh uh they have what they call layer builder files.
[32:46] have what they call layer builder files. So what we've done is gone in and worked
[32:48] So what we've done is gone in and worked with these vendors so that uh the the
[32:52] with these vendors so that uh the the detailed process information is is
[32:54] detailed process information is is encrypted but you have access to
[32:57] encrypted but you have access to simulate with the real uh end profiles
[33:00] simulate with the real uh end profiles and the our uh uh documentation gives
[33:03] and the our uh uh documentation gives you a lot more information about all of
[33:06] you a lot more information about all of the different uh uh dopen levels that
[33:09] the different uh uh dopen levels that are available kind of sheet rows uh
[33:12] are available kind of sheet rows uh center of uh uh the centress of the
[33:15] center of uh uh the centress of the dopen profile And then when you simulate
[33:17] dopen profile And then when you simulate by using a wave this layer builder file,
[33:20] by using a wave this layer builder file, you can actually simulate with the real
[33:22] you can actually simulate with the real dopen profiles. So we think especially
[33:24] dopen profiles. So we think especially people that want to do custom
[33:25] people that want to do custom development
[33:27] development that's a big advantage. I don't know
[33:28] that's a big advantage. I don't know that any of the large foundaries are
[33:30] that any of the large foundaries are offering that. So uh we've gone out of
[33:33] offering that. So uh we've gone out of our way to try and be multiple uh vendor
[33:35] our way to try and be multiple uh vendor kind of support. Here you can see our
[33:38] kind of support. Here you can see our prime our our premier platforms are
[33:41] prime our our premier platforms are synopsis and cadence but we also have K
[33:44] synopsis and cadence but we also have K layout and we've also implemented K
[33:46] layout and we've also implemented K layout DRC and then a host of other
[33:49] layout DRC and then a host of other things including GDS factory Luca of
[33:52] things including GDS factory Luca of course answers uh Lumerical that's
[33:55] course answers uh Lumerical that's extensively supported and tidy 3D. So I
[33:59] extensively supported and tidy 3D. So I would say for each of those
[34:00] would say for each of those technologies, not only are there
[34:02] technologies, not only are there multiple component libraries, but
[34:04] multiple component libraries, but there's a pretty large suite of uh of
[34:06] there's a pretty large suite of uh of EDA tools that you can use. So let's
[34:09] EDA tools that you can use. So let's talk a little bit about Copaki Optics.
[34:12] talk a little bit about Copaki Optics. This just uh shows that there's uh
[34:15] This just uh shows that there's uh several different ways of of getting
[34:17] several different ways of of getting bandwidth up. You know, one way is just
[34:19] bandwidth up. You know, one way is just by the number of lanes. Uh you can just
[34:22] by the number of lanes. Uh you can just have a lot more fibers, a lot more
[34:24] have a lot more fibers, a lot more wavelengths in fibers. you can have uh
[34:27] wavelengths in fibers. you can have uh your modulators run faster or you can
[34:30] your modulators run faster or you can have more complex uh modulation. So you
[34:33] have more complex uh modulation. So you put all these things together uh uh you
[34:36] put all these things together uh uh you know we're trying to enable uh the
[34:38] know we're trying to enable uh the ability to do this. I'll show you some
[34:40] ability to do this. I'll show you some examples obviously of the integration uh
[34:44] examples obviously of the integration uh bringing the uh components uh closer
[34:46] bringing the uh components uh closer into the device to reduce electrical
[34:49] into the device to reduce electrical connections and bring the optical
[34:51] connections and bring the optical connections closer is also a large
[34:54] connections closer is also a large element of uh of getting a better
[34:57] element of uh of getting a better performance. This is shown here. This is
[35:00] performance. This is shown here. This is a article by Margalith the John Bowers
[35:02] a article by Margalith the John Bowers group and what you see here is more uh
[35:05] group and what you see here is more uh uh pluggable optics. You can see the
[35:08] uh pluggable optics. You can see the pluggable optics around the face plate.
[35:10] pluggable optics around the face plate. These still exist and but there's longer
[35:13] These still exist and but there's longer electrical leads that go into the switch
[35:15] electrical leads that go into the switch IC. The next step was to try and take
[35:18] IC. The next step was to try and take these these pluggable optical uh
[35:21] these these pluggable optical uh transceivers and put onboard optic
[35:23] transceivers and put onboard optic modules. This shortens the metal length
[35:25] modules. This shortens the metal length so reduces the delays. Then there's 2
[35:28] so reduces the delays. Then there's 2 and 1/2D where you're taking some of
[35:30] and 1/2D where you're taking some of these optic modules and placing them in
[35:32] these optic modules and placing them in the same substrate. and the package
[35:34] the same substrate. and the package substrate. You're doing 3D co-package
[35:37] substrate. You're doing 3D co-package optics where you're stacking these
[35:39] optics where you're stacking these different elements. And then we're
[35:40] different elements. And then we're working uh again on actually uh fully
[35:44] working uh again on actually uh fully integrating uh the the laser elements
[35:47] integrating uh the the laser elements into the technology not just with 2 and
[35:49] into the technology not just with 2 and 1/2D but hetereroatically growing it. I
[35:52] 1/2D but hetereroatically growing it. I might add that that Intel is an example
[35:54] might add that that Intel is an example of somebody that they use coupon
[35:56] of somebody that they use coupon approach but they're also doing the same
[35:59] approach but they're also doing the same approach for co-ackage optics. This is
[36:02] approach for co-ackage optics. This is an example of what we've been doing in
[36:04] an example of what we've been doing in co- package optics with one of our
[36:06] co- package optics with one of our collaborators. This is Karen Bergman.
[36:08] collaborators. This is Karen Bergman. She's done this work, Broadcom, Cisco,
[36:11] She's done this work, Broadcom, Cisco, Juniper, Arista. And what they had here
[36:13] Juniper, Arista. And what they had here was they took our photonic integrated
[36:16] was they took our photonic integrated circuit platform. They developed custom
[36:19] circuit platform. They developed custom modulators. So these are very low power
[36:22] modulators. So these are very low power modulators. uh Anthony Rizzo who who was
[36:26] modulators. uh Anthony Rizzo who who was at Colombia went to the Air Force now
[36:28] at Colombia went to the Air Force now he's at Dartmouth he's published
[36:30] he's at Dartmouth he's published extensively on the work done on our pick
[36:32] extensively on the work done on our pick platform but you can see take a comb
[36:35] platform but you can see take a comb laser this goes in uh uh to uh a lot lot
[36:40] laser this goes in uh uh to uh a lot lot of wavelengths you're really modulating
[36:43] of wavelengths you're really modulating uh selecting and modulating each of
[36:45] uh selecting and modulating each of those wavelengths and then of course
[36:47] those wavelengths and then of course after you transmit it you have to have
[36:49] after you transmit it you have to have the receiver indiscri filters and then
[36:53] the receiver indiscri filters and then photo diodes.
[36:56] So Karen Bergman, I believe, holds the
[36:58] So Karen Bergman, I believe, holds the record for the highest bandwidth, lowest
[37:01] record for the highest bandwidth, lowest power. And uh this was based on our
[37:04] power. And uh this was based on our technology.
[37:06] technology. Uh this is our test and measurement
[37:08] Uh this is our test and measurement structure. It just shows you a little
[37:10] structure. It just shows you a little bit about what you can do at what site.
[37:13] bit about what you can do at what site. This is uh we have an offline lab in
[37:15] This is uh we have an offline lab in Albany. Our test assembly and packaging
[37:17] Albany. Our test assembly and packaging facility in Rochester has has a
[37:20] facility in Rochester has has a measurement lab. And then of course we
[37:23] measurement lab. And then of course we have inline. So this just shows some of
[37:26] have inline. So this just shows some of the different measurements that you can
[37:28] the different measurements that you can do. Now one of the aspects about the
[37:29] do. Now one of the aspects about the measurements, you know, if you're in
[37:30] measurements, you know, if you're in Albany nanotech, that's like a over 20
[37:34] Albany nanotech, that's like a over 20 billion investment. So you can't really
[37:36] billion investment. So you can't really have customers come in and run tools on
[37:38] have customers come in and run tools on their own. It's not really a user
[37:40] their own. It's not really a user facility. Uh but the measurement lab's a
[37:42] facility. Uh but the measurement lab's a little bit different, right? So so we uh
[37:45] little bit different, right? So so we uh we're uh and the tap facility is also
[37:48] we're uh and the tap facility is also different. We're, you know, if if uh
[37:51] different. We're, you know, if if uh there's an effort that you'd like to
[37:52] there's an effort that you'd like to have people come on site and
[37:54] have people come on site and participate, particularly in the
[37:55] participate, particularly in the measurement lab, you know, we have that.
[37:58] measurement lab, you know, we have that. And there's also some opportunity
[38:00] And there's also some opportunity depending on what the agreements are,
[38:02] depending on what the agreements are, uh, to do more like in the test assembly
[38:04] uh, to do more like in the test assembly and packaging facility. But, uh, the
[38:07] and packaging facility. But, uh, the test facility will work with you. It's
[38:10] test facility will work with you. It's easy access to a lot of equipment and
[38:12] easy access to a lot of equipment and particularly if you use the measurement
[38:14] particularly if you use the measurement design kit you can gain immediate access
[38:17] design kit you can gain immediate access to it. So uh we're going to be kind of
[38:20] to it. So uh we're going to be kind of closing the discussion here talking
[38:22] closing the discussion here talking about education workforce development.
[38:25] about education workforce development. So uh there really is two two parts to
[38:27] So uh there really is two two parts to this. One is the New York create side
[38:29] this. One is the New York create side and one is a photonics. The New York
[38:31] and one is a photonics. The New York great side has really focused around uh
[38:34] great side has really focused around uh technician training and uh they have uh
[38:37] technician training and uh they have uh they actually train the technicians. Uh
[38:39] they actually train the technicians. Uh Global Foundaries has a large fab in
[38:42] Global Foundaries has a large fab in Malta and uh actually New York creates
[38:45] Malta and uh actually New York creates training technicians for them and
[38:46] training technicians for them and they've had a uh they're interested in
[38:49] they've had a uh they're interested in STEM and they've had a large footprint
[38:51] STEM and they've had a large footprint on this. So that has been ongoing just
[38:54] on this. So that has been ongoing just uh general. But if you take a look at
[38:56] uh general. But if you take a look at amphetonics, we've got uh several
[38:58] amphetonics, we've got uh several different ways to teach futonics. Uh I
[39:01] different ways to teach futonics. Uh I would say the the one that's had the
[39:03] would say the the one that's had the largest impact have been our online
[39:05] largest impact have been our online courses. So today we have our pick one
[39:08] courses. So today we have our pick one course and then there's a series of
[39:10] course and then there's a series of other courses. There's pick two, there's
[39:12] other courses. There's pick two, there's one on sensors, there's one on ring
[39:14] one on sensors, there's one on ring design. These things are all online. uh
[39:17] design. These things are all online. uh the uh the pick one course has had uh
[39:21] the uh the pick one course has had uh literally uh over I don't know maybe
[39:24] literally uh over I don't know maybe it's up to 10,000 now participants so
[39:26] it's up to 10,000 now participants so not everybody takes the full course and
[39:29] not everybody takes the full course and actually lays out an integrated circuit
[39:31] actually lays out an integrated circuit but you you pick you can take this
[39:33] but you you pick you can take this course during the course you learn about
[39:36] course during the course you learn about you know how to build some devices and
[39:38] you know how to build some devices and you tape out a chip they take the best
[39:41] you tape out a chip they take the best chips and aggregate them and we run them
[39:44] chips and aggregate them and we run them and then in a test course you can
[39:46] and then in a test course you can actually test those chips. So, we have
[39:49] actually test those chips. So, we have uh inter for hands-on. We have packaging
[39:52] uh inter for hands-on. We have packaging workshops and test workshops in
[39:54] workshops and test workshops in Rochester. There's a Summit Academy
[39:56] Rochester. There's a Summit Academy that's held at MIT. We have internship
[39:59] that's held at MIT. We have internship and co-op programs. Educational
[40:02] and co-op programs. Educational development. We have reach out. Uh we're
[40:04] development. We have reach out. Uh we're trying to do more for STEM. And one of
[40:07] trying to do more for STEM. And one of the things we've been doing is
[40:08] the things we've been doing is developing a syllabus or a platform so
[40:11] developing a syllabus or a platform so that universities can have their own
[40:14] that universities can have their own kind of phatonic course offerings and
[40:16] kind of phatonic course offerings and they can do it by actually taking real
[40:18] they can do it by actually taking real phatonic circuits and and offering
[40:20] phatonic circuits and and offering students the capability of testing
[40:22] students the capability of testing those. So we call this hands-on phatonic
[40:25] those. So we call this hands-on phatonic education. You get one of these kits and
[40:27] education. You get one of these kits and it's fully enabled with uh a full
[40:30] it's fully enabled with uh a full syllabus. there's like six different
[40:32] syllabus. there's like six different modules and you can use this as a
[40:35] modules and you can use this as a breakup of uh teaching uh platonics in
[40:38] breakup of uh teaching uh platonics in the university. So I would say in net uh
[40:42] the university. So I would say in net uh I kind of talked briefly here uh briskly
[40:45] I kind of talked briefly here uh briskly so I'll be open for questions but
[40:47] so I'll be open for questions but essentially infotonics is a
[40:49] essentially infotonics is a manufacturing innovation institute uh we
[40:52] manufacturing innovation institute uh we offer end to end so we're really trying
[40:54] offer end to end so we're really trying to give you the ability to design the
[40:58] to give you the ability to design the pick your interposer custom packaging
[41:01] pick your interposer custom packaging and be able to test them and support
[41:03] and be able to test them and support everything with electronic photonic
[41:05] everything with electronic photonic design automation. We really benefit
[41:08] design automation. We really benefit from the 300 millimeter Albany nanotech
[41:10] from the 300 millimeter Albany nanotech complex. The lithography there
[41:12] complex. The lithography there capabilities that just alone is just
[41:15] capabilities that just alone is just amazing and the tools have to be very
[41:17] amazing and the tools have to be very uniform in order to support things like
[41:19] uniform in order to support things like 2nometer sheet transistor development
[41:22] 2nometer sheet transistor development and we have all of the on-site vendors
[41:24] and we have all of the on-site vendors that we also collaborate with in next
[41:27] that we also collaborate with in next generation technology. So this is a big
[41:29] generation technology. So this is a big advantage for a photonic. You're getting
[41:31] advantage for a photonic. You're getting access to those by just running in our
[41:34] access to those by just running in our our MPW or custom runs. Then there's the
[41:37] our MPW or custom runs. Then there's the Rochester Tech Assembly and package
[41:39] Rochester Tech Assembly and package which is a very focused more around the
[41:42] which is a very focused more around the fatonic packaging. It's not in the CMOS
[41:45] fatonic packaging. It's not in the CMOS fab. So there's some materials you
[41:48] fab. So there's some materials you cannot run in a seamos like lithium
[41:50] cannot run in a seamos like lithium nibbate. Those things are all
[41:52] nibbate. Those things are all heterogeneously placed or run in uh in
[41:55] heterogeneously placed or run in uh in in Rochester. So we did give the
[41:58] in Rochester. So we did give the capability of doing different types of
[42:00] capability of doing different types of materials. So uh we're we're uh
[42:03] materials. So uh we're we're uh missioned to advance platonics and
[42:05] missioned to advance platonics and packaging make it available and build a
[42:07] packaging make it available and build a skilled workforce. I think our education
[42:09] skilled workforce. I think our education programs are have been particularly
[42:11] programs are have been particularly successful and invite people to look
[42:13] successful and invite people to look into them if they want to learn more
[42:15] into them if they want to learn more about fatonics and uh you know we've uh
[42:18] about fatonics and uh you know we've uh put a lot of efforts on uh end to end
[42:21] put a lot of efforts on uh end to end and building co-package optics and
[42:23] and building co-package optics and addressing some of the challenges in
[42:25] addressing some of the challenges in fatonic packaging and that's basically
[42:28] fatonic packaging and that's basically it. So I'm open to question. Thank you
[42:31] it. So I'm open to question. Thank you very much for your kind attention and uh
[42:33] very much for your kind attention and uh interest.
[42:36] interest. Thank you David. Great. It's a lot of
[42:39] Thank you David. Great. It's a lot of work uh happening at AM Photonics.
[42:43] work uh happening at AM Photonics. Uh lot I mean lots of information you
[42:45] Uh lot I mean lots of information you try to conceptual con put it into 40
[42:48] try to conceptual con put it into 40 minutes.
[42:50] minutes. Uh any questions? Uh oh there are some
[42:54] Uh any questions? Uh oh there are some questions I guess.
[42:58] Uh ci has two questions. Ci do you want
[43:02] Uh ci has two questions. Ci do you want to take the mic and ask the question?
[43:15] Yeah. My question is is the PDK include
[43:19] Yeah. My question is is the PDK include uh weather or environmental parameter
[43:23] uh weather or environmental parameter for example like a temperature affect
[43:25] for example like a temperature affect the wavelengths and output.
[43:29] the wavelengths and output. >> Well, yeah, that's a good question. I
[43:31] >> Well, yeah, that's a good question. I think the components are largely OCL.
[43:33] think the components are largely OCL. Obviously,
[43:35] Obviously, there has to be some thermal for
[43:37] there has to be some thermal for thermologactic field shifters and
[43:39] thermologactic field shifters and effects of the temperature. I I don't
[43:41] effects of the temperature. I I don't know that there's I I actually don't
[43:44] know that there's I I actually don't sorry I I can't really answer the
[43:46] sorry I I can't really answer the questions about how much thermal is in
[43:48] questions about how much thermal is in the models. I uh there's some there's
[43:51] the models. I uh there's some there's some in probably the more mature
[43:53] some in probably the more mature offering uh that's act one and I think
[43:56] offering uh that's act one and I think that's an interest where people are well
[43:58] that's an interest where people are well that's an area of more interest. We're
[44:00] that's an area of more interest. We're probably going to be including more of
[44:02] probably going to be including more of that. But I think if you look at the
[44:04] that. But I think if you look at the more mature offering the base that
[44:06] more mature offering the base that there's some thermal effects in there as
[44:08] there's some thermal effects in there as well as different wavelengths but just
[44:10] well as different wavelengths but just OCL for that for the more visible and uh
[44:14] OCL for that for the more visible and uh different wavelengths that's going to be
[44:16] different wavelengths that's going to be supported across the quantum platform
[44:18] supported across the quantum platform the QLEX and the silicon nitride
[44:21] the QLEX and the silicon nitride platform.
[44:23] platform. >> Thank you. Did
[44:24] >> Thank you. Did >> that answer the question? I can get you
[44:26] >> that answer the question? I can get you more information about that what's in
[44:27] more information about that what's in the compact models if you give me some
[44:30] the compact models if you give me some uh you know send the question.
[44:33] uh you know send the question. >> Okay. Thank you.
[44:37] >> Uh any other questions? Oh there is
[44:39] >> Uh any other questions? Oh there is there are two other questions. Uh anu
[44:42] there are two other questions. Uh anu you want and you want to take the mic
[44:44] you want and you want to take the mic and ask anu bahu from semi.
[44:57] Excellent presentation, a lot of uh
[44:59] Excellent presentation, a lot of uh information as AJ said. One is uh semi
[45:04] information as AJ said. One is uh semi is a industry body and we're doing some
[45:06] is a industry body and we're doing some work in CPO and and and packaging. Would
[45:08] work in CPO and and and packaging. Would you be open for a for a reach out or
[45:10] you be open for a for a reach out or connect uh with us?
[45:12] connect uh with us? >> Yeah, 100%. You bet.
[45:15] >> Yeah, 100%. You bet. >> Okay. And is it a is it possible to get
[45:17] >> Okay. And is it a is it possible to get a copy of the slides if I can reach out
[45:19] a copy of the slides if I can reach out to you on that?
[45:20] to you on that? >> Yes. While the webinar is being
[45:22] >> Yes. While the webinar is being recorded, I can give a copy of the slide
[45:24] recorded, I can give a copy of the slide to AJ. You can distribute it to him.
[45:26] to AJ. You can distribute it to him. >> Yeah, this webinar is being recorded and
[45:28] >> Yeah, this webinar is being recorded and you can watch the webinar in the
[45:30] you can watch the webinar in the YouTube.
[45:31] YouTube. >> You can go to California Dreams YouTube
[45:33] >> You can go to California Dreams YouTube site and then you can watch it.
[45:36] site and then you can watch it. >> Okay. And and David, your contact
[45:38] >> Okay. And and David, your contact information,
[45:40] information, >> your contact information will be
[45:42] >> your contact information will be somewhere on on the AM4 website, right?
[45:45] somewhere on on the AM4 website, right? >> Yeah, I think my my I mean my last name
[45:47] >> Yeah, I think my my I mean my last name is H A R A M E. My user ID is
[45:50] is H A R A M E. My user ID is dermy-creat.org
[45:53] and that's on the website and I'm sure a
[45:56] and that's on the website and I'm sure a if you ask AJ he can give you that
[45:58] if you ask AJ he can give you that information as well.
[46:00] information as well. >> Thank you. Thanks. Thank you.
[46:02] >> Thank you. Thanks. Thank you. >> Yes.
[46:04] >> Yes. Uh Dave Karas has a question. Dave, do
[46:07] Uh Dave Karas has a question. Dave, do you want to take the mic and ask the
[46:08] you want to take the mic and ask the question?
[46:13] >> Okay. Dave's question is can you
[46:14] >> Okay. Dave's question is can you describe your TSV offerings? what kind
[46:17] describe your TSV offerings? what kind of dimensions and
[46:19] of dimensions and >> yeah today we have 10 by 100 we're uh
[46:23] >> yeah today we have 10 by 100 we're uh but we have a TSV scaling program uh
[46:26] but we have a TSV scaling program uh we're driving more towards 50 50 micron
[46:29] we're driving more towards 50 50 micron and uh trying to uh shrink the length as
[46:32] and uh trying to uh shrink the length as well as the width below that so we're
[46:35] well as the width below that so we're currently working on TSB scaling that of
[46:38] currently working on TSB scaling that of course requires some wafer thinning
[46:41] course requires some wafer thinning scaling as well right so we have a a
[46:44] scaling as well right so we have a a program in that in place right now that
[46:46] program in that in place right now that we're doing uh today it's uh really kind
[46:50] we're doing uh today it's uh really kind of 100 micron width 10 by 100 oh sorry
[46:53] of 100 micron width 10 by 100 oh sorry 10 by 100
[46:59] did that answer the question
[47:02] did that answer the question okay
[47:04] okay uh
[47:07] I think so 10 by 100
[47:10] I think so 10 by 100 uh
[47:12] uh the next question is from uh Sri Priya
[47:15] the next question is from uh Sri Priya Yeah, Shri, you want to take the mic and
[47:17] Yeah, Shri, you want to take the mic and ask the question?
[47:25] Okay. Uh, let me ask the question. So,
[47:28] Okay. Uh, let me ask the question. So, she says, "Great work, David. With
[47:31] she says, "Great work, David. With current facilities, what kind of maximum
[47:33] current facilities, what kind of maximum wafer volume can the QEX and passive
[47:36] wafer volume can the QEX and passive silicon nitride process flows?
[47:38] silicon nitride process flows? Similarly, what is the capacity of tap
[47:40] Similarly, what is the capacity of tap facility?"
[47:42] facility?" >> Well, you asked kind of two questions
[47:44] >> Well, you asked kind of two questions there. tap is packaging. So, I think we
[47:46] there. tap is packaging. So, I think we can do low volume production there. In
[47:49] can do low volume production there. In terms of the wafer fab, you know, I what
[47:52] terms of the wafer fab, you know, I what I like to say is uh we have sort of a 10
[47:55] I like to say is uh we have sort of a 10 100 1,000 kind of approach to it. So, if
[47:58] 100 1,000 kind of approach to it. So, if you come and you want 10 wafers during a
[48:00] you come and you want 10 wafers during a year, we can easily accommodate that. If
[48:02] year, we can easily accommodate that. If you want a 100, we have to expand a
[48:05] you want a 100, we have to expand a little bit the footprint, but that's not
[48:06] little bit the footprint, but that's not difficult. You know, we have a multi-use
[48:09] difficult. You know, we have a multi-use FAB, right? So uh we have a a a portion
[48:12] FAB, right? So uh we have a a a portion of the fab uh that we possess. If you
[48:15] of the fab uh that we possess. If you start wanting more than like a thousand
[48:17] start wanting more than like a thousand wafers a year or so, then we have to uh
[48:20] wafers a year or so, then we have to uh we'd have to on your advocate negotiate
[48:22] we'd have to on your advocate negotiate for kind of part of the activity of the
[48:25] for kind of part of the activity of the fab. That's possible. So I I would say
[48:28] fab. That's possible. So I I would say that there is a possibility to go from
[48:31] that there is a possibility to go from lower volume to higher. There are some
[48:33] lower volume to higher. There are some that are just going to be immediate.
[48:35] that are just going to be immediate. some we just have to get uh our our our
[48:38] some we just have to get uh our our our slice of the pie expanded to support and
[48:40] slice of the pie expanded to support and then even beyond that we'd have to go to
[48:43] then even beyond that we'd have to go to the organization that runs the fab which
[48:45] the organization that runs the fab which is actually New York creates so we're
[48:47] is actually New York creates so we're kind of part of that organization but
[48:49] kind of part of that organization but anyways uh uh you we could also uh
[48:53] anyways uh uh you we could also uh that's also possible did that answer the
[48:55] that's also possible did that answer the question
[48:57] question >> I think so yes
[49:01] >> uh any other questions
[49:03] >> uh any other questions >> yeah I have a quick one uh are you able
[49:06] >> yeah I have a quick one uh are you able to compare uh between 2.5D
[49:10] to compare uh between 2.5D and direct bounding and the monolithic
[49:12] and direct bounding and the monolithic the thermal management difficulty?
[49:16] the thermal management difficulty? >> I didn't hear the last part. I heard you
[49:18] >> I didn't hear the last part. I heard you compare 2 and a halfD and monolithic but
[49:21] compare 2 and a halfD and monolithic but I didn't hear the last part of the
[49:22] I didn't hear the last part of the question.
[49:22] question. >> Uh 2.5D hybrid and monol monolithic and
[49:27] >> Uh 2.5D hybrid and monol monolithic and the thermal management comparison.
[49:30] the thermal management comparison. >> Well, that's really a good question. You
[49:32] >> Well, that's really a good question. You know, by the way, one of the aspects of
[49:34] know, by the way, one of the aspects of building the laser by by heterap
[49:36] building the laser by by heterap actually growing it is is on the
[49:38] actually growing it is is on the silicon. So, it does kind of provide a
[49:40] silicon. So, it does kind of provide a bit of a heat sink there. Uh uh
[49:42] bit of a heat sink there. Uh uh obviously 2 and 1/2D uh you know is
[49:45] obviously 2 and 1/2D uh you know is going to have some concerns there
[49:47] going to have some concerns there depending on how it it's heat sunk. Uh
[49:49] depending on how it it's heat sunk. Uh we're we're in the process of rolling
[49:51] we're we're in the process of rolling these offerings out. Uh we hope to have
[49:54] these offerings out. Uh we hope to have the MPW. We, you know, we're currently
[49:57] the MPW. We, you know, we're currently for the 35 growth, we've got about 11
[49:59] for the 35 growth, we've got about 11 riders on that and we'll have hopefully
[50:01] riders on that and we'll have hopefully we'll have our our fully functional 300
[50:04] we'll have our our fully functional 300 millimeter offering coming out in
[50:06] millimeter offering coming out in September. We hope in 27 to be offering
[50:08] September. We hope in 27 to be offering an MPW. I I don't have a lot of
[50:11] an MPW. I I don't have a lot of information right now on a comparison
[50:13] information right now on a comparison across but that's a great a great
[50:15] across but that's a great a great question and uh you know I think that's
[50:18] question and uh you know I think that's something that we need to do is kind of
[50:19] something that we need to do is kind of publish a comparison of the three in
[50:21] publish a comparison of the three in terms of thermal of course depends a
[50:25] terms of thermal of course depends a little bit on the 2 and 1/2D device
[50:27] little bit on the 2 and 1/2D device that's being offered. We're we're we're
[50:28] that's being offered. We're we're we're we're we're putting 2 and 1/2Ds using
[50:31] we're we're putting 2 and 1/2Ds using microtransfer printing and uh with
[50:34] microtransfer printing and uh with thinner uh devices and some thicker ones
[50:37] thinner uh devices and some thicker ones and the uh more conventional 2 and 1/2D.
[50:40] and the uh more conventional 2 and 1/2D. Uh so there's a couple different ways to
[50:42] Uh so there's a couple different ways to do that and of course their thermal
[50:43] do that and of course their thermal behavior will be different. I that's
[50:46] behavior will be different. I that's something that we need to publish more
[50:47] something that we need to publish more extensively on. We've not done that yet
[50:49] extensively on. We've not done that yet and I think that's a great suggestion.
[50:51] and I think that's a great suggestion. Thank you.
[50:52] Thank you. >> So you don't recommend one more than the
[50:54] >> So you don't recommend one more than the other, right? So
[50:56] other, right? So >> well I think it's a question of what you
[50:57] >> well I think it's a question of what you want to do long term right let's say
[50:59] want to do long term right let's say that that uh tomorrow we had the uh the
[51:02] that that uh tomorrow we had the uh the 35 growth so you could really look at
[51:04] 35 growth so you could really look at the three the fir the first thing is
[51:06] the three the fir the first thing is that if you have two and a halfd you're
[51:09] that if you have two and a halfd you're paying per placement of lasers so to
[51:11] paying per placement of lasers so to speak because there's some time consumed
[51:13] speak because there's some time consumed there so it's not really scalable if you
[51:16] there so it's not really scalable if you need to put you know tens or hundreds of
[51:19] need to put you know tens or hundreds of lasers on each chip right there's just a
[51:23] lasers on each chip right there's just a lot of placement there Now microtransfer
[51:26] lot of placement there Now microtransfer printing gives you the capability of of
[51:28] printing gives you the capability of of possibly putting many elements in the
[51:32] possibly putting many elements in the same one. People actually use this kind
[51:34] same one. People actually use this kind of technology for displays. So they have
[51:36] of technology for displays. So they have proved that these kind of technologies
[51:38] proved that these kind of technologies can be used for replacement of a lot of
[51:41] can be used for replacement of a lot of devices. But I think the ultimate is
[51:43] devices. But I think the ultimate is really the growth right then it's like a
[51:45] really the growth right then it's like a regular semiconductor process and you
[51:47] regular semiconductor process and you grow them everywhere on the wafers.
[51:49] grow them everywhere on the wafers. Yeah. We're we're we're we're pursuing
[51:51] Yeah. We're we're we're we're pursuing this because we want to have dense
[51:53] this because we want to have dense integration of S S S S S S S S S S S S S
[51:54] integration of S S S S S S S S S S S S S S S S S S S S S O Soas and laser and
[51:55] S S S S S S S S O Soas and laser and there you wouldn't have the restrictions
[51:57] there you wouldn't have the restrictions of the time consuming part of placing
[52:00] of the time consuming part of placing each individual device. Did that
[52:03] each individual device. Did that >> Thank you so much.
[52:04] >> Thank you so much. >> Yeah. Thank you.
[52:06] >> Yeah. Thank you. >> Great. Any more questions?
[52:10] >> Great. Any more questions? >> I I have a question David and it's very
[52:13] >> I I have a question David and it's very simple. uh you it's excellent
[52:16] simple. uh you it's excellent presentation uh but how do someone how
[52:18] presentation uh but how do someone how do a user access aim facility uh is that
[52:21] do a user access aim facility uh is that information on the website or how do
[52:23] information on the website or how do they approach you? Yeah, thank you for
[52:25] they approach you? Yeah, thank you for that question, AJ. And yeah, we have a
[52:28] that question, AJ. And yeah, we have a photonix uh website. You can just uh go
[52:31] photonix uh website. You can just uh go straight on to that website. There's a
[52:34] straight on to that website. There's a section that is for MPW
[52:37] section that is for MPW uh and you can go in and request the PDK
[52:40] uh and you can go in and request the PDK and put your information in there and
[52:43] and put your information in there and then uh you get access to the PDK. You
[52:45] then uh you get access to the PDK. You can design it. All of our prices for all
[52:47] can design it. All of our prices for all of our MPW offerings are on the website.
[52:50] of our MPW offerings are on the website. It's more limited for uh packaging
[52:52] It's more limited for uh packaging what's on the website just because a
[52:55] what's on the website just because a there's a lot of custom kind of packages
[52:57] there's a lot of custom kind of packages that people need. But the way you engage
[52:59] that people need. But the way you engage with the packaging side is basically put
[53:01] with the packaging side is basically put in an inquiry. Hey, I'm interested in
[53:03] in an inquiry. Hey, I'm interested in some kind of a services agreement to do
[53:05] some kind of a services agreement to do some packages. Uh we get back to you, we
[53:09] some packages. Uh we get back to you, we sit down and go over your statement of
[53:10] sit down and go over your statement of work, what you want packaged, and then
[53:12] work, what you want packaged, and then we give you a quote. So, it's pretty
[53:14] we give you a quote. So, it's pretty straightforward and uh can move pretty
[53:16] straightforward and uh can move pretty quickly. So, uh, of both sides, the MPW
[53:20] quickly. So, uh, of both sides, the MPW can be you can just get a PDK and just
[53:23] can be you can just get a PDK and just do it. The, uh, you don't have to be a
[53:25] do it. The, uh, you don't have to be a member or anything. If you want more
[53:27] member or anything. If you want more custom, a lot of people come because
[53:29] custom, a lot of people come because they want some customization and then
[53:32] they want some customization and then you can either do this byite-size custom
[53:34] you can either do this byite-size custom if it's more limited where again
[53:36] if it's more limited where again everything's priced and everything's
[53:38] everything's priced and everything's apparent on the website. If you have a
[53:40] apparent on the website. If you have a more custom development and we do do
[53:42] more custom development and we do do sponsored projects and do custom
[53:43] sponsored projects and do custom development, we would have to agree on a
[53:45] development, we would have to agree on a statement of work in order to understand
[53:47] statement of work in order to understand what you need and then we would
[53:49] what you need and then we would implement that. The packaging, it's just
[53:52] implement that. The packaging, it's just put the inquiry in, we'll set up a
[53:54] put the inquiry in, we'll set up a meeting. Uh we kind of traffic in
[53:58] meeting. Uh we kind of traffic in cartoons. You got to give us a little
[53:59] cartoons. You got to give us a little bit of a cartoon, your build, what you
[54:01] bit of a cartoon, your build, what you need, what your pitches are. And uh
[54:04] need, what your pitches are. And uh we're trying to do these ADKs so we get
[54:06] we're trying to do these ADKs so we get out ahead of you. So when you design
[54:08] out ahead of you. So when you design picks or EIC's, well, you can design
[54:10] picks or EIC's, well, you can design them uh to make sure that we can
[54:12] them uh to make sure that we can actually package them. So we'll help you
[54:14] actually package them. So we'll help you do that. It's almost a syllabus of
[54:16] do that. It's almost a syllabus of packaging when you get our design
[54:18] packaging when you get our design equipment. But basically, you just uh
[54:20] equipment. But basically, you just uh interact with us and we'll go over your
[54:23] interact with us and we'll go over your packaging build and give you a quote.
[54:28] >> Thank you.
[54:28] >> Thank you. >> Did that answer your question?
[54:30] >> Did that answer your question? >> Yes. Uh thank you.
[54:34] >> Yes. Uh thank you. So, is there any more questions?
[54:38] Okay, if not, thank you so much, David.
[54:41] Okay, if not, thank you so much, David. It was a great presentation and thank
[54:44] It was a great presentation and thank you for your time. Thank you very much
[54:46] you for your time. Thank you very much for attending.
[54:46] for attending. >> Thank you everybody for hearing. Thank
[54:48] >> Thank you everybody for hearing. Thank you. Bye-bye.
[54:50] you. Bye-bye. >> Next week's presentation, go to the
[54:52] >> Next week's presentation, go to the second slide.
[54:54] second slide. Uh, next week it is Alexander Jantaa
[54:58] Uh, next week it is Alexander Jantaa Psinski from IBM Bramont.
[55:04] Thank you.
[55:07] Thank you. Thank you.