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EPIC Online Technology Meeting on Automated Packaging & Testing of Photonic Integrated Circuits
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Engineers, researchers, and business professionals involved in the photonics industry, particularly those focused on integrated circuit packaging and testing.
TL;DR
This video summarizes key advancements and demands in the automated packaging and testing of photonic integrated circuits (PICs). It highlights industry successes, new technologies like micro-optics, and the importance of collaboration for mass commercialization in areas like biosensing and 3D sensing.
Key Takeaways
- The photonic integrated circuits industry requires an assembly design kit for OSATs to ensure seamless technology integration and agreement.
- Advancements in modulators necessitate novel RF connectivity solutions to support higher frequencies, such as those exceeding 70 gigahertz.
- A 'test before invest' strategy is crucial for diverse applications like 3D sensing and medical devices to validate investment decisions.
- Micro-optics integration is essential for reducing costs in fiber array assembly and improving overall cost-effectiveness in PIC packaging.
- Publicly listed companies like Lightwave Logic can accelerate technology commercialization and access broader capital markets for growth.
- Silicon photonics holds significant potential for consumer applications, exemplified by glucose monitoring devices enabling continuous biomarker measurement.
- The photonic integrated circuits ecosystem is rapidly expanding, with over 120 companies participating in this technology meeting, fostering collaboration and business leads.
- Access to design rules and a high volume of chips is vital for optimizing packaging processes and driving innovation in PIC development.
In This Video
- 00:00Recap of Previous Packaging Meeting
Reviewing conclusions from the last meeting on April 26th, focusing on four key demands for photonic integrated circuit packaging.
- 00:15Key Demands for PIC Packaging
Four demands: assembly design kit for OSATs, novel RF connectors for high-speed modulators, test-before-invest packaging, and micro optics for cost-effectiveness.
- 01:01Industry Shifts and Success Stories
Highlighting seismic industry shifts and success stories like Lightwave Logic and Rockley Photonics, showcasing market growth and innovation.
- 02:34Exciting Era for PICs
Entering the most exciting era for PICs, with a community meeting on October 4th to discuss packaging and testing advancements.
- 03:50EPIC's Role and Services
EPIC's growth to 750 members, offering networking, capital access, market research, and organizing online technology meetings.
- 04:55Sponsors and Agenda Overview
Acknowledging sponsors supporting the meeting on packaging and testing of PICs, and introducing key participating companies.
- 08:04Focus on European Packaging Success
Highlighting European success in photonic packaging, with a focus on design rules and access to chips for process optimization.
Questions & Answers
What are the four main demands for advancing photonic integrated circuits?
The four demands are an assembly design kit for OSATs, novel RF connectivity for faster modulators, test before invest packaging for diverse applications, and micro optics for cost-effective fiber array assembly.
How has Lightwave Logic benefited from being listed on Nasdaq?
Being listed on Nasdaq allows Lightwave Logic to access wider capital markets, get technology to market faster, work with bigger semiconductor foundries, and achieve mass commercialization.
What is Rockley Photonics' focus in the consumer market?
Rockley Photonics uses silicon photonics for biosensing, specifically glucose monitoring, to bring continuous biomarker measurement to consumer wearable devices.
What is the purpose of the upcoming online technology meeting on October 4th?
The meeting aims to reunite packaging specialists and industry drivers in photonic integrated circuits to discuss advancements and foster new cooperations.
How can attendees connect with each other and participants at the event?
Attendees can connect via an internal chat, by emailing jose.poto@epic-assoc.com for introductions, and by accessing the participant list on the event website.
What role does EPIC play for its members?
EPIC organizes events, provides access to a network, helps raise capital, offers job listings on photonicsjobs.com, and provides exclusive market data.
Key Terms
- OSATs — Outsourced Semiconductor Assembly and Test companies that provide manufacturing services for semiconductor devices.
- Photonic Integrated Circuits (PICs) — Integrated circuits that use photons (light) instead of electrons to perform functions, often used in telecommunications and sensing.
- Micro-optics — Miniaturized optical components that are essential for compact and cost-effective optical systems, particularly in fiber array assembly.
- Wafer Level Optics (WLO) — Optical components fabricated directly on a semiconductor wafer, allowing for mass production and integration with electronic circuits.