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EPIC Online Technology Meeting on PIC Packaging and Testing
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Engineers, researchers, and business professionals involved in the photonics and semiconductor industries.
TL;DR
This video covers the critical aspects of Photonic Integrated Circuit (PIC) packaging and testing, featuring insights from industry experts across the value chain. It highlights the challenges and solutions in bringing PICs from prototype to high-volume production, emphasizing advanced assembly and testing techniques.
Key Takeaways
- The photonics industry is experiencing significant growth, necessitating advancements in packaging and testing to meet demand across various applications.
- Companies like Fix, PiContact, and amTec offer specialized services in PIC packaging, ranging from prototyping to high-volume production and advanced electronic interfacing.
- Micro-optics manufacturers, such as Asus, play a crucial role by providing essential components like micro-lenses that enable the miniaturization and functionality of PICs.
- The complexity of PIC packaging involves intricate steps like die bonding, active alignment, and precise epoxy dispensing, especially for small indium phosphide chips.
- Testing of photonic integrated circuits is performed at both the component and wafer level, ensuring quality and performance throughout the manufacturing process.
- Integration of test systems directly into production lines is a growing trend, aiming to streamline the manufacturing and validation of PICs.
- The demand for PICs is expanding into diverse markets including telecommunications, data centers, medical, automotive, and aerospace, highlighting the technology's versatility.
In This Video
- 00:00Introduction to Photonics Technology Meetings
This video covers online technology meetings focused on photonics, specifically PIC packaging and testing. It features seven speakers from across the industry value chain.
- 00:38Speakers and Industry Value Chain
Seven speakers will present, covering the entire photonics industry value chain. Attendees represent R&D, semiconductor manufacturing, laser/optics providers, and system integrators.
- 02:11Event Sponsors and Introductions
The event is sponsored by Fix, Content, Tech, Accept, Results, and Micro Optics. Each sponsor will briefly introduce their company and services.
- 02:33Fix: PIC Packaging Expertise
Fix specializes in packaging photonic integrated circuits and MEMS-based components, from prototype to high volume. They offer expertise in hybrid assembly and high-frequency electronics interfacing.
- 03:21Five Contact: Photonic Solutions
Five Contact provides automated photonic solutions for alignment, assembly, and testing of PICs. They handle micro-optics, PICs, and electronic components, including wafer-level testing.
- 04:24Amtec: Advanced Electronic Packaging
Amtec offers advanced electronic packaging services, from process development to production. They integrate test systems and serve markets like medical, semiconductor, and telecommunication.
- 06:13Asus Micro Optics: Enabling PICs
Asus is a leading manufacturer of micro-optics, including lenses and diffractive elements. Their products enable optical transceivers and are crucial for high-integration PICs.
Questions & Answers
What is PIC packaging and testing?
PIC packaging and testing involves the processes required to take a photonic integrated circuit chip and package it into a functional device, including steps like die bonding, alignment, and sealing.
What services does Fix offer for PICs?
Fix offers packaging of photonic integrated circuits and MM-based components in various volumes, specializing in hybrid PIC assembly, fiber attachment, and high-frequency electronics interfacing up to 120 GHz.
What does I.M.T. (amtec) specialize in?
I.M.T. (amtec) specializes in advanced electronic packaging services, from process development to production, including integrating test systems and serving markets like medical, semiconductor, and data telecommunication.
What kind of micro-optics does ASML (Accessories) manufacture?
ASML (Accessories) is a leading manufacturer of micro-optics, including micro lenses, lens arrays, cylindrical lens arrays, and diffractive optical elements, enabling various optical transceivers and integrated photonic circuits.
What are the challenges in PIC packaging?
Challenges in PIC packaging include the small scale of chips (hundreds of microns), the need for precise alignment, epoxy dispensing, and hermetic sealing to create a functional and reliable device.
What is the role of micro-optics in PICs?
Micro-optics are crucial for PICs, enabling functions like laser diode coupling and light transmission within optical transceivers, and facilitating high integration by providing features for precise assembly and dicing.
Key Terms
- PIC — PIC stands for Photonic Integrated Circuit, a device that integrates multiple photonic functions onto a single chip.
- Hybrid PIC Assembly — Hybrid PIC assembly is a technique used in packaging where different types of components, like semiconductors and optics, are integrated onto a common substrate.
- Micro-optics — Micro-optics are optical components with dimensions in the micrometer range, used for precise light manipulation in devices like optical transceivers.
- COSA/ROSA — COSA (Coherent Optical Sub-Assembly) and ROSA (Receive Optical Sub-Assembly) are key components in optical transceivers, handling signal transmission and reception.