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EPIC Online Technology Meeting on Co-packaged Optics (in cooperation with COBO & EA)
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Professionals and researchers in the photonics, data center, and telecommunications industries interested in co-packaged optics and related technologies.
TL;DR
This video summarizes an online technology meeting focused on co-packaged optics, a critical area for data center and telecom advancements. It highlights collaborations between key industry players and showcases innovations in silicon photonics, micro-optics, and packaging solutions.
Key Takeaways
- Co-packaged optics (CPO) is a significant technological advancement aimed at improving performance and efficiency in data communication networks.
- The meeting highlights the collaborative efforts of various companies and organizations, including COBO and EA, to advance CPO technology.
- EPIC, the organizer, plays a crucial role in fostering industry collaboration and providing market intelligence through its reports and events.
- The development of CPO involves a complex supply chain, encompassing component manufacturers, packaging specialists, equipment providers, and software solutions.
- Standardization efforts in datacom and telecom are essential for the widespread adoption and interoperability of new technologies like CPO.
- European projects like FASHION are contributing to the development of new infrastructure for metro networks, leveraging CPO and silicon photonics.
- The event emphasizes the importance of understanding end-user challenges to drive innovation and provide effective solutions within the photonics industry.
In This Video
- 00:00Welcome to Online Technology Meetings
The meeting starts with a welcome and introduction to the topic of co-packaged optics. The speaker expresses enthusiasm for the global participation.
- 01:08Upcoming 24-Hour Photonics Event
An announcement for an upcoming 24-hour non-stop photonics event on June 24th, featuring speakers from around the world.
- 01:32Datacom and Automotive Standards Update
A reminder about upcoming discussions on July 1st regarding standards in datacom, telecom, and the automotive sector, especially for 400G.
- 02:31Accessing Market Reports and Resources
Information about accessing a large list of market reports on the EPI website, including detailed analysis of components within transceivers.
- 03:15EPIC's Role in European Photonics
Highlighting EPIC's four-year effort to unite European companies in photonics packaging for the data com market, leading to collaborations.
- 03:51Sponsor Recognition and Contributions
Thanks to sponsors providing micro optics, silicon photonics design, software solutions, and automation for photonic device packaging and testing.
- 05:34Supply Chain Collaboration and Challenges
The goal is to foster collaboration across the entire supply chain, understanding end-user challenges and how photonics can provide solutions.
Questions & Answers
What is the main topic of this online technology meeting?
The main topic is co-packaged optics, with companies from around the world participating.
How many online technology meetings has EPIC organized?
As of this meeting, EPIC has organized 39 online technology meetings in about three months.
What is the 24-hour event happening on June 24th?
It's a 24-hour non-stop event focused on photonics, featuring speakers from New Zealand to California.
Where can I find market reports and data?
You can access a long list of market reports on the EPIC website. Non-members can download 17,000 market data points.
Who are the sponsors of the EPIC meeting?
Sponsors include Access, BDT, Gamma, Lightguide, Opto, Octave, and Sylex.
How can I contact speakers or participants from the meeting?
You can contact the host, Jose Potots, at jose.potots@epic-assoc.com for introductions to any participant.
Key Terms
- Co-packaged Optics — A technology that integrates optical components directly with electronic components on the same package.
- Silicon Photonics — A technology that uses silicon as a material to create optical circuits and devices.
- Wafer Level Optics — Optical components manufactured on a wafer, allowing for mass production and integration.
- Photonic Integrated Circuits (PICs) — Integrated circuits that use photons instead of electrons to perform functions.