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75th ECTC Thursday Lunch EPS Presentation
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Engineers, researchers, and industry professionals interested in the latest trends and innovations in electronic packaging and semiconductor technology.
TL;DR
This video summarizes the 75th Electronic Components and Technology Conference (ECTC), highlighting advancements in electronic packaging, particularly Amcor's Sconnect technology for AI and high-performance computing. It also features the presentation of the 2025 ER Tamala Electronics Packaging Award to Dr. G. Su for her contributions to networking systems.
Key Takeaways
- The Electronic Components and Technology Conference (ECTC) is the world's premier event for electronics packaging, fostering innovation and global technology dissemination.
- The 75th ECTC saw record attendance exceeding 2,500 participants, highlighting the conference's growing value and the dynamic nature of the electronics packaging community.
- The Electronic Packaging Society (EPS) actively expands its global reach by establishing new professional and student chapters, particularly in South America, India, and Africa.
- Major industry trends like AI and high-performance computing are driving significant growth and demand for advanced packaging technologies.
- Amcor's Sconnect technology offers a revolutionary bridge die interposer solution for seamless integration of multiple silicon devices, enabling new levels of performance and miniaturization.
- Dr. G. Su was honored with the 2025 IEEE R. Tamala Electronics Packaging Award for her significant contributions to high bandwidth networking systems and advanced packaging.
- Dr. Su's leadership at Cisco drove a 20-fold bandwidth increase in networking systems through innovations in large body size fanout packages and silicon photonics ecosystem development.
- The ECTC serves as a crucial intersection for industry and academia, facilitating collaboration, knowledge sharing, and networking among diverse stakeholders.
In This Video
- 07:04Welcome to ECTC 75th Anniversary
Welcome to the 75th ECTC conference. Information about the gayla reception and society's mission is provided.
- 08:17ECTC 2025 Technical Program
The 2025 ECTC features an exciting technical program with latest advances. Attendance exceeds 2,500, a new record.
- 08:59Global EPS Conferences and Growth
EPS hosts conferences in Asia and Europe. The society is growing with new chapters and international workshops.
- 10:30Introduction of Head Table
The speaker introduces the head table members, including IEEE past president and EPS officers.
- 11:48Sponsor Introduction and Industry Trends
David McCann from Amcor, a platinum sponsor, welcomes attendees. He discusses industry trends like AI and high-performance computing.
- 13:32Amcor's Sconnect Technology
Amcor's Sconnect technology integrates multiple silicon devices for AI and HPC. It offers flexibility and scalability.
- 17:38Tamala Award Presentation
Tom Coughlin presents the 2025 IEEE Tamala Electronics Packaging Award to Dr. G. Su for her contributions.
Questions & Answers
What is the 75th ECTC conference?
The 75th ECTC is the world's premier event for electronics packaging, celebrating 75 years of innovation and providing a technical program with the latest advances in the field.
Where is the gayla reception being held?
The gayla reception is being held at the Glass Cactus, located on the property of the conference venue.
What are the core purposes of the ITLE E packaging society?
The society's core purposes are to foster innovation and implementation of electronic packaging technology and disseminate this technology worldwide through media, education, and events like ECTC.
What is Amcor's Sconnect technology?
Sconnect is a revolutionary bridge die interposer technology solution that enables seamless integration of multiple silicon devices within a single package for AI and high-performance computing.
Who received the 2025 ER Tamala Electronics Packaging Award?
Dr. G. Su, an IEEE fellow and vice president of technology and quality at Cisco Systems, received the award for her contributions to high bandwidth networking systems and advanced packaging.
Key Terms
- ECTC — The Electronic Components and Technology Conference, a premier global event for electronics packaging.
- Electronic Packaging Society (EPS) — A society within IEEE focused on fostering innovation and disseminating knowledge in electronic packaging technology.
- Sconnect — Amcor's bridge die interposer technology for integrating multiple silicon devices in a single package for advanced computing.