# 75th ECTC Thursday Lunch EPS Presentation

https://www.youtube.com/watch?v=O3mbYC7sIx0

[07:04] Check.
[07:04] Howdy y'all.
[07:04] Welcome to my town.
[07:08] Glad to have you all here today.
[07:10] Please direct your attention to the slide on the gayla reception.
[07:13] Um, in celebration of our 75th anniversary, we're having it at a special location.
[07:17] It's at the Glass Cactus located here on the property.
[07:19] If you're not sure where it is, see any member of the staff or the executive committee.
[07:22] And if you need help with mobility, just check with the same folks.
[07:25] On behalf of the ITLE E packaging society, I'm delighted to welcome you to the 75th electronic components and technology conference, the world's premier event for electronics packaging.
[07:27] Our society's core purposes are to foster in innovation in and implementation of electronic packaging technology and disseminate the technology worldwide through media education and events such as this ECTC.
[08:05] Our vision is to be internationally recognized as the preeminent source of electronic packaging information and educational resources to the engineering community for the betterment of human society.
[08:17] Here at the 2025 ECTC, the conference leadership team has leveraged 74 years of excellence to provide an exciting technical program containing the latest advances in electronic packaging through panels, plenaries, and technical sessions.
[08:37] In addition, the conference leadership has provided ample time for interactions and networking at a range of events.
[08:42] Attendance at this year's conference is greater than 2,500 people.
[08:50] Another record reflecting the value ECTC provides.
[08:59] EPS is proud to provide two flagship conferences in addition to the North Americabased ECTC.
[09:03] The Asiabased 2025
[09:08] Electronic packaging technology conference will be held this December in Singapore.
[09:12] In Europe, the 2026 Electronic Systems Integration Technology Conference will be held in Helsinki in September.
[09:24] EPS continues to foster electronic packaging internationally.
[09:29] In the past 12 months, we've added four professional chapters and five student chapters.
[09:34] We now have both student and professional chapters in South America.
[09:39] We continue to grow in 2025 with additional professional and student chapters in the formation and approval stages.
[09:47] We're active in initiating and growing workshops in India, Africa, and South America.
[09:53] Currently, our VPs of conferences, technology, publications, education, and membership are collaborating within and outside of EPS on opportunities for dedication and commitment of our board of governors, our many ad hoc leaders,
[10:08] and our technical committee chairs and volunteers.
[10:12] I'm deeply appreciative to all these many volunteers and to the ECTC and EPS staff for their outstanding efforts in bringing this year's event forward.
[10:23] We're all extremely fortunate to have such an enthusiastic and talented team that continues to find new ways to serve the electronic packaging community.
[10:30] And now I'd like to introduce the head table.
[10:33] Starting on my right, Tom Coughlin, ILE E past president.
[10:42] Jeffrey Suling, EPS president-elect.
[10:47] Kitty Pearel, junior past president.
[10:51] Chris Bailey, who couldn't make it.
[10:54] He's our senior past president.
[10:58] David McCann, EPS vice president of technology.
[11:02] Alan Huffman, EPS vice president of membership.
[11:04] Moving to my left, Patrick McCcluskey, the EPS awards program
[11:10] director.
[11:12] Denise Manning, EPS executive director,
[11:15] with whom nothing would get done.
[11:20] Tony Matillaa, our EPS vice president of
[11:23] finance, Ravi Mahajin, EPS vice
[11:26] president of publications. Tanya Braun,
[11:30] EPS vice president of conferences,
[11:33] Eric Perfecto, EPS vice president of
[11:35] education,
[11:37] Floren Hero, who's our ECTC general
[11:40] chair, and Annette Tang, who's our
[11:42] region 1 to7 and nine director and the
[11:45] liaison to ECTC.
[11:48] Now, it's my pleasure to introduce David McCann, senior vice president of Amcor,
[11:54] one of our wonderful platinum sponsors.
[11:57] Dave,
[11:58] [Applause]
[12:02] thanks everybody and what a great event.
[12:05] Um, I was reminded this morning that
[12:07] this is like a giant reunion. It's a
[12:10] reunion of customers and suppliers. It's
[12:13] An intersection of industry and academia.
[12:15] It's a time when colleagues from different competitors can converse with each other and share experiences and learn.
[12:21] So, welcome to the 75th ECTC conference.
[12:26] This marks a significant gathering of our industry leaders together.
[12:30] I'd like to extend a a sincere thank you to the ECTC organizing committee and to the Electronic Packaging Society for sponsoring this event.
[12:40] I'm truly impressed by the depth of the dynamic community of industry partners we have here today as we celebrate our achievements, your achievements together.
[13:02] We're an industry of big trends.
[13:06] Think mobile and all the things that that changed.
[13:08] Then high performance computing and data centers and now
[13:14] Artificial intelligence.
[13:16] This is the perfect conference for the intersection of so many different technologies for artificial intelligence and these trends continue to drive industry growth.
[13:24] Data generation will exponentially increase amplifying computing and the power that we need for that computing.
[13:32] The growth is fueled by innovations in advanced packaging technologies including Amcor's silicon connect technology solutions.
[13:45] Amcor silicon connect technology or S connect is a revolutionary bridge die interposer technology solution empowering AI and high performance computing applications.
[13:58] S connect enables the seamless integration of multiple silicon devices within a single package.
[14:03] Experience the convergence of GPUs, CPUs, memory, and chiplets in a compact highdensity configuration, unlocking a new era of
[14:15] computing.
[14:17] Whether it's power efficient mobile devices or a high performance computing system, Sconnect scales seamlessly across the power spectrum.
[14:24] Amcor's Sconnect technology offers the flexibility to address diverse market trends, providing a unified platform for innovation.
[14:36] Now, I want to show you a cool video advancement in semiconductor packaging, redefining the possibilities for high performance and energy efficient computing.
[14:51] Sconnect seamlessly integrates multiple silicon dyes within a single package, enabling unprecedented levels of performance, flexibility, and miniaturization.
[15:03] Let's walk through the advanced capabilities Amcor brings to Sconnect wafer processing.
[15:21] Down.
[15:46] Down.
[15:49] Heat.
[15:49] Heat.
[15:49] N.
[15:59] Heat.
[15:59] Heat.
[16:11] [Music]
[16:49] Sconnect from Amcore enables convergence of CPUs, GPUs, and chiplets in a compact and highdensity configuration, unlocking a new era of computing power for edge devices, AI and machine learning applications, and data center solutions.
[17:11] [Applause]
[17:17] And thank you to every one of you for being here at the 75th ECTC conference.
[17:22] Thanks. Enjoy your lunch.
[17:32] Thank you, David, and thank you, Amcor, for your great support of ECTC through the years.
[17:38] It's now my honor to introduce the ILE E past president, Tom Coughlin, who will present the 2025 it eamala electronics packaging technical field award.
[17:52] Thank you.
[17:56] Howdy everyone.
[17:59] It is my pleasure to be able to participate in the celebration today and to represent the ITLE E board of directors to present one of ILE E's most prestigious technical field awards.
[18:11] The ITE Ral R Tamala Electronics Packaging Award sponsored by the ILE E Electronic Packaging Society and friends of Ral R Tamala.
[18:20] The award recognizes meritorious contributions to advancements of components, electronic packaging or manufacturing technologies.
[18:31] This year it is my pleasure to recognize IA fellow G Su for her contributions to industryleading high bandwidth networking systems including advanced IC and silicon photonics packaging.
[18:46] Dr. Sue is vice president of technology and quality at Cisco Systems located in San Jose, California.
[18:52] Dr. Sue is a
[18:55] technologist with three decades of contributions to performance networking systems and high volume mobile communication systems.
[19:04] Her groundbreaking contributions have transformed the global telecommunications and data center industries.
[19:11] As an engineering leader at Cisco for over 24 years, she leads a global team responsible for pathfinding, developing, and executing technology innovations that enable all Cisco networking product portfolio.
[19:25] This includes leading her team to develop system level packaging technology roadmaps driving a 20fold bandwidth increase across generations of networking systems.
[19:39] Dr. pursues invent uh innovations encompass two crucial areas of packaging technologies pushing industry boundaries with achievements such as the large body size fanout package for high bandwidth and high performance networking as6
[19:56] Recognizing the need for technology transitions to address power constraints and data centers, she led the team in the ecosystem development of silicon photonics technology.
[20:05] Overall, Dr. Sue's visionary leadership has had a transformative impact on the global networking industry.
[20:14] On behalf of the ILE E board of directors, it is my honor to recognize ILE E fellow Dr. G. Zoo as the recipient of the 2025 E R Tamala Electronics Packaging Award.
[20:31] [Applause]
[20:47] Over here a little bit.
[20:51] [Applause]
[20:59] I think she'd like to say something out.
[21:03] Thank you very much, Tom.
[21:03] Um, I am deeply honored to receive this award.
[21:10] Um, I'd like to thank the ITLE EPS society and the uh EPS award committee for this uh incredible recognition.
[21:22] This award is a very special to me.
[21:22] This moment brings me back to 25 years ago.
[21:29] My first ECTC conference where I sit in a session taught by professor Ral Tamola and I learned about micro electronic packaging.
[21:40] That day and that conference was the beginning of my lifelong passion for packaging and it set me to the path that I could have never imagined.
[21:53] Today it is exciting and inspiring to see our industry playing critical role
[21:59] in AI and the digital transformation impacting lives across the globe.
[22:06] It is our golden time.
[22:09] There are many people I need to thank.
[22:13] Um I am especially grateful to Bill Chan, Kitty Periso, John Law and Mark Brahar.
[22:21] also to professor Paul Ho, Professor CP Wong and Professor Shujin Fan for their advocacy and their mentorship throughout my career.
[22:31] I also want to thank my incredible colleagues at Cisco, Motorola and all the partners sitting in this room that I worked more than 30 years.
[22:44] You all have shaped this moment in my journey.
[22:49] I also want to say a few words to all the women's in this room and beyond.
[22:55] It is a challenging time and it's exciting time.
[23:00] This field really needs your talent, your leadership and your voice.
[23:06] So this is the place where you get engaged, you lead and make a longlasting difference and impact.
[23:15] Thank you all.
[23:23] And now I invite the EPS awards program director Patrick McCcluskey to present the 2025 electronic packaging society awards.
[23:42] Uh thank you Pat.
[23:45] Uh, I asked the recipients to come to the table at the side to receive their award from the EPS president, Patrick Thompson.
[24:02] Uh, I ask the recipients again to come to the table at the side to receive their award from the EPS president, Patrick Thompson.
[24:12] It is now my honor to introduce the 2025 EPS award recipients.
[24:19] The 2025 EPS electronics manufacturing technology award goes to Richard Audi for for a career spanning 50 years and more than 75 patents and significant contributions to the innovation of electronics manufacturing technology.
[24:41] Uh please come forward.
[24:49] Uh Richard okay.
[24:53] Uh the 2025 ITLE EPS Outstanding Sustained Technical Contribution Award goes to Paul Franen
[25:09] for 25 years over 25 years of outstanding contributions in 2 and 1/2D and 3DIC design and CAD IO.
[25:21] modeling and innovative systems solutions leveraging advanced packaging.
[25:36] The 2025 ITLE EPS exceptional technical achievement award goes to Tu Jiang for exceptional contributions on micro electronics packaging device reliability and test.
[25:50] So, congratulations to Tu Zang.
[25:59] The 2025 ILE EPS William Chen Distinguished Service Award goes to Eric
[26:07] Perfecto.
[26:12] for outstanding EPS service leadership for 30 years in varied roles by introducing enhanced membership benefits and development, championing and achieving education goals and extensive knowledge dissemination via conference presentations.
[26:29] PDC's and webinars.
[26:31] So congratulations Eric.
[26:37] The 2025 ITLE EPS Outstanding Young Engineer Award is presented to Acradi Jane.
[26:52] for contributions to thermal design and management of electronic packagings.
[26:58] enabling novel bond and assembly processes for advanced packaging and supporting ILE E's EPS activities such as ongoing such as organizing seminars.
[27:09] And conferences.
[27:12] So congratulations and thanks to Akarati.
[27:17] The 2025 ITLE ePS regional contributions award for regions 1 through 7 and nine.
[27:26] The Americas goes to T-wayi.
[27:35] For outstanding leadership and contributions to the ILE EPS central Indiana chapter.
[27:43] Helping it become the largest and most active in the Midwest through organizing symposiums, monthly seminars, and supporting student chapter activities.
[27:56] The 2025 ITLE EPS regional contributions award for region 10 Asia is presented to Po Lang Yu.
[28:12] for outstanding leadership in ILE EPS
[28:16] Malaysia, exemplifying active
[28:18] volunteerism, fostering regional
[28:21] engagement and making significant
[28:23] contributions as a speaker and leader in
[28:26] advancing EPS initiatives across the
[28:29] region.
[28:35] The recipient of the 2025
[28:38] ILE EPS PhD fellowship is Lee Mingdu
[28:45] uh of the University of Texas uh for
[28:49] pioneering research on the microscale
[28:52] mechanical properties of centered copper
[28:54] nano particles integrating multiscale
[28:57] modeling and advanced experiments to
[29:00] enhance reliability and electronic
[29:02] packaging and power electronics
[29:04] applications. So, congratulations to Lee
[29:07] Mingdu.
[29:12] And now, and now it gives me great
[29:16] pleasure to announce the EPS chapter of
[29:19] the year award.
[29:21] This award goes to the EPS Malaysia
[29:23] chapter
[29:25] for its outstanding leadership in
[29:27] fostering a strong connection to and
[29:29] development of its members, volunteers,
[29:32] and communities. And accepting on behalf
[29:35] of the chapter is the past chapter
[29:38] chair, Po Lang Yu. And congratulations
[29:43] to the Malaysian chapter.
[29:51] Uh now the award for the best paper
[29:54] published in the 2024 transactions on
[29:57] components packaging and manufacturing
[29:59] technology. Uh the best paper award in
[30:03] advanced packaging goes to heterogeneous
[30:07] integration enabled by 3D stitch chips
[30:11] authored by Shane O.
[30:15] Jeang Hao Jang Hao Jiang Paul Joe
[30:20] Muhammed Bakir and Gay Yu Yian who could
[30:23] not attend today.
[30:28] So once again I ask you uh to join me in
[30:32] congratulating all of the recipients and
[30:35] I would like to encourage all of you to
[30:38] nominate a peer for next year's awards
[30:41] cycle.
[30:46] Uh the next awards that we will talk
[30:49] about are the certificates of
[30:51] achievement.
[30:52] Uh and here to accept the EPS
[30:55] certificate of achievement are Golam
[30:58] Sarwa, Yun Yun Lee Jiang and uh Chima
[31:04] Lamari Hemathkumar
[31:07] who unfortunately could not be here. uh
[31:09] accepting on his behalf is his colleague
[31:12] Vasaraa Nagendra Sakar.
[31:18] Other recipients who could not be here
[31:20] today are Christopher Alanis Louu Chu
[31:26] Parnika Gupta Dong Hugh Mod Ishtiak Iben
[31:31] Hassain and Adu
[31:35] Enamar.
[31:41] The recipient of the 2025 EPS
[31:45] certificate of distinguished achievement
[31:47] for technical leadership and expertise
[31:50] is Paul Parrot.
[31:54] >> So congratulations to all our
[31:57] certificate
[31:58] uh uh recipients.
[32:07] I would also like to recognize the work
[32:09] and efforts of our associate editors. We
[32:12] would like to acknowledge the 2025 best
[32:16] associate editor recipients. And here to
[32:19] receive their certificates
[32:22] are uh Sun Chang,
[32:26] Antonio Mafuchi,
[32:29] Sriant Naramanchi,
[32:31] and PM Raj.
[32:34] uh Patrick Fay and Tim Persoons were
[32:37] also uh recipients of this award but
[32:41] they are unable to join us today.
[32:48] So let's congratulate the associate
[32:50] editor recipients.
[32:56] Uh the grade of ILE E fellow recognizes
[33:01] accomplishments of professionals in our
[33:03] industry and serves as the highest honor
[33:06] they can receive. It is my pleasure to
[33:10] recognize the EPS members who have been
[33:13] inducted into the ILE E fellow class of
[33:16] 2025.
[33:18] And those recipients are Chi Pin Hong
[33:23] for leadership in developing and
[33:26] commercialing commercializing
[33:28] highdensity interconnect packaging. So
[33:30] congratulations to uh Chi Pin Hong
[33:35] uh Rajin Marugan of Intel for
[33:40] for contributions to multifysics codees
[33:44] and characterization methods of advanced
[33:46] heterogeneous packages. So
[33:48] congratulations to Rajin
[33:51] Suresh
[33:53] uh Sesh Ramolingan
[33:56] for his leadership in technology
[33:58] innovation to commercialize the 2 and
[34:00] 1/2D silicon interposer. Congratulations
[34:03] Sesh
[34:05] and to Raja Secharan Swami Nathan
[34:10] for his leadership in chiplet technology
[34:12] architecture for high performance
[34:14] computing. Congratulations uh Raja
[34:16] Sakaran.
[34:20] Next I would like to introduce the
[34:22] recipients of the 2025 ECTC student
[34:26] travel grants.
[34:29] Uh we have a number of recipients for
[34:31] this. Uh we have Chun Tali from the
[34:34] National Yangming Chowo Tong University.
[34:38] We have Un Ho Lee of the Sun uh Kuan
[34:42] Kuan University,
[34:45] Ting Yu Chen of the National Yang Ming
[34:48] Chao Tong University, Yi Yang from
[34:51] Purdue University, Thomas Lassur from
[34:55] Sherbrook University,
[34:57] Taiu Pan from the National Chiang Kong
[35:00] University,
[35:02] uh Musa Alzanina from Bingmpington
[35:05] University,
[35:06] Sari Alzeri from Bingmpington
[35:09] University. Yulin He from the University
[35:13] of Illinois Urbana Champagne.
[35:16] Matthew Lawyer from ST Micro
[35:18] Electronics. Katyun Yayi from the
[35:22] University of Florida. Riotaro Kawashima
[35:26] from Tohoku University.
[35:29] Max Frank Hler of TU Dresden and Hari
[35:34] Ram Moan Ram of the University of Texas
[35:37] at Arlington. Congratulations to all of
[35:40] our student grant awardees. Uh, and
[35:44] thank you for coming to give your papers
[35:46] at the conference.
[35:49] Uh, and lastly, I would like to honor
[35:52] those who have served ECTC over the
[35:54] years, and I am honored to present Beth
[35:57] Keyser with a plaque in appreciation of
[36:01] 25 years of sustained contributions to
[36:04] the conference. Congratulations, Beth.
[36:10] Uh as you can see there are a number of
[36:12] other recipients who have served for 10
[36:15] years and they will be accepting their
[36:18] awards from the conference committee uh
[36:20] later on. And with that, I'd like to
[36:23] thank all the awardees again and
[36:25] congratulate all the awardees again and
[36:27] turn the uh meeting over uh to our
[36:31] president, Patrick Thompson
[36:33] uh who is G who's giving the awards. So
[36:38] he will when he is finished giving the
[36:39] awards, he will conclude today's
[36:41] ceremonies. Thank you.
[39:39] Thank you, Tom. I greatly appreciate it.
[39:42] >> Thank you, Patrick.
[39:48] I said,
[40:12] >> thank you, Patrick, and congratulations
[40:14] to all of this year's awards.
[40:17] recipients. I want to remind you of the
[40:21] Asia-Pacific Flagship Conference, EPTC,
[40:24] which will take place December 2nd to
[40:27] 5th
[40:29] at the Resorts World Sentosa in
[40:31] Singapore. We hope to see you there.
[40:35] That concludes today's award
[40:37] presentation. Thank you for joining us
[40:39] for the EPS lunchon. Enjoy the rest of
[40:41] the conference and we look forward to
[40:43] seeing you in Singapore. And I want to
[40:45] remind you once more tonight's event,
[40:48] the gayla reception will be in the glass
[40:50] cactus beginning at 7:30.