2025 OCP APAC Summit Keynote - ASE

https://www.youtube.com/watch?v=PMb2OfiLeIM

Summary

TL;DR — The AI revolution is driving exponential growth in data and compute power, presenting significant challenges for the semiconductor industry in terms of performance, memory bandwidth, power consumption, and thermal management. ASE is developing advanced packaging solutions, including heterogeneous integration, silicon bridges, and co-packaged optics, to address these challenges and enable the next generation of AI hardware.

Key points

• The AI economy is projected to grow to nearly $5 trillion by 2033, necessitating a 25-fold increase in compute power.

• Exponential data growth requires significant increases in memory bandwidth (2-10x) and larger chiplet/SoC designs, leading to larger module sizes (up to 10 reticle sizes).

• Power delivery and thermal management are critical challenges, with future GPUs and CPUs requiring significantly more power and lower operating temperatures.

• ASE's advanced packaging solutions include VIP (Vertical Integrated Package) with chiplets, High Bandwidth Memory (HBM), silicon bridges, and co-packaged optics (CPO) to improve efficiency and performance.

• Innovations like larger panel sizes (up to 600mm) and Power SIP (System-in-Package) with integrated voltage regulators aim to increase utilization, reduce power loss, and enhance power efficiency.

• The integration of silicon photonics (CPO) is crucial for next-generation data centers, offering higher bandwidth and compute power by converting electrons to photons.

Takeaway — ASE is innovating in advanced semiconductor packaging to overcome the performance, power, and thermal limitations imposed by the rapid growth of AI, enabling future breakthroughs in compute power and data processing.