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Panel Delivering on Co-packaged Optics
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https://www.youtube.com/watch?v=0m1IvO5Hj2Y
Summary
TL;DR — Co-packaged optics (CPO) are emerging as a critical technology to overcome the limitations of copper interconnects in high-performance computing, particularly for AI and machine learning workloads. The panel discussed the key drivers, challenges, and future roadmap for CPO adoption, emphasizing the need for ecosystem-wide collaboration and advancements in manufacturing and testing.
Key points
- The primary impetus for CPO is the increasing demand for bandwidth and the power wall encountered with copper interconnects as data rates and compute density rise.
- CPO offers solutions for both scale-up (within a rack) and scale-out (across racks) architectures, addressing reach, latency, and power consumption issues.
- Key challenges include high volume manufacturing, cost, reliability, ecosystem changes (packaging, lasers, testing), and the need for standardization.
- The