Optica Online Industry Meeting: PIC Packaging for Volume Production

Full Transcript

https://www.youtube.com/watch?v=eoD1nyFnhY4

[00:11] [Music]
[01:50] Music
[01:53] Music
[02:47] Music on Tuesday 25th of February at 10:00.
[02:50] on Tuesday 25th of February at 10:00 a.m. eastern time or Optica corporate.
[02:53] a.m. eastern time or Optica corporate members meet to discuss how to collaborate on pck packaging and test.
[02:55] members meet to discuss how to collaborate on pck packaging and test.
[02:58] collaborate on pck packaging and test the goal is to answer the Optica.
[03:00] the goal is to answer the Optica question what can you do for them and.
[03:02] question what can you do for them and what can they do for you photonic integr.
[03:05] what can they do for you photonic integr circuits or Peaks are at the core of.
[03:08] circuits or Peaks are at the core of modern Optical modules however one of.
[03:11] modern Optical modules however one of the biggest challenges for the industry.
[03:13] the biggest challenges for the industry is how to efficiently package and test.
[03:16] is how to efficiently package and test at a scale that meets the growing.
[03:17] at a scale that meets the growing demands from the coming arvr Ai mettech.
[03:21] demands from the coming arvr Ai mettech and consumer Trends in this meeting we.
[03:24] and consumer Trends in this meeting we will explore the transformation of peak.
[03:26] will explore the transformation of peak packaging and volume manufacturing.
[03:28] packaging and volume manufacturing drawing parallels to to the.
[03:30] drawing parallels to to the wellestablished simos microelectronics.
[03:32] wellestablished simos microelectronics industry our discussion will focus on.
[03:35] industry our discussion will focus on critical challenges such as Precision.
[03:37] critical challenges such as Precision Alignment thermal management and co-.
[03:40] Alignment thermal management and co- packaging with electronic components.
[03:43] packaging with electronic components this discussion will be led by Peter.
[03:45] this discussion will be led by Peter O'Brien the director of pix up the.
[03:47] O'Brien the director of pix up the photonic packaging pilot line at tinda.
[03:50] photonic packaging pilot line at tinda National Institute Nick Salia principal.
[03:54] National Institute Nick Salia principal engineer at Intel Jun D the CTO of fixed.
[03:58] engineer at Intel Jun D the CTO of fixed photonics assembly and L shaming the.
[04:02] photonics assembly and L shaming the program manager for silicon photonics at.
[04:04] program manager for silicon photonics at imch they will be joined by the rest of.
[04:07] imch they will be joined by the rest of our corporate members in what I.
[04:09] our corporate members in what I anticipate will be a very active Zoom.
[04:11] anticipate will be a very active Zoom room join us live on Zoom or follow the.
[04:14] room join us live on Zoom or follow the discussion in YouTube.
[04:16] discussion in YouTube If you're not yet.
[04:18] an Optica corporate member now it is the time to become part of the most active.
[04:21] time to become part of the most active and engaged community in the photonics.
[04:24] and engaged community in the photonics together we shap the future of our.
[04:25] together we shap the future of our industry.
[04:34] good morning afternoon evening everybody.
[04:36] good morning afternoon evening everybody wherever you are in the world uh my name.
[04:38] wherever you are in the world uh my name is John Pew I'm the director of pick and.
[04:40] is John Pew I'm the director of pick and Quantum Technologies at Optica welcome.
[04:43] Quantum Technologies at Optica welcome to the online industry meeting for pick.
[04:45] to the online industry meeting for pick packaging for volume.
[04:49] production uh we have many system.
[04:52] production uh we have many system integrators and enablers in the room.
[04:55] integrators and enablers in the room here as you can see on the left we have talks from Tindall Intel uh CITC fix Sig.
[05:02] Tomo and imch and then enablers coming in to talk about where their enabling Technologies can can help the system.
[05:08] integrators we have sponsors for the meeting many sponsors for this very popular meeting new photonics open light.
[05:15] fix fine Tech quantify for tonics pick Advanced conscient and Vanguard automation.
[05:21] Thank You for Your sponsorship and support to the meeting.
[05:26] we have a series of upcoming on industry meetings this year uh we have um today and in a week's time we have uh oleds and micro LEDs and you can see the list coming up over the coming year um please join us for those meetings.
[05:47] so the Optica corporate membership is uh a global trusted
[05:52] Membership is uh a global trusted network uh.
[05:55] We have market reports year round events the OIMS and also in-person summits.
[06:00] Uh where we facilitate networking between companies.
[06:02] We have substantial discounts to our events and some other events.
[06:06] Uh we promote your achievements as companies and many other engagement opportunities.
[06:16] So download all the Optica industry content here on the QR code.
[06:19] Uh we have the market reports presentations from these meetings, videos, tutorial and road maps and much much more.
[06:32] So we're also live on YouTube um so you can see this this meeting will also be available on YouTube following the meeting in our corporate engagement Channel.
[06:43] Um so yes uh please please watch the meeting afterwards too so um.
[06:50] Advancements in photonic integrated circuit packaging uh um for volume.
[06:55] Circuit packaging uh um for volume production has been accelerating driven.
[06:58] Production has been accelerating driven primarily by the demand for high.
[07:00] Primarily by the demand for high performance costeffective solutions in.
[07:02] Performance costeffective solutions in data centers but other applications in.
[07:05] Data centers but other applications in telecommunications lidar biosensing and.
[07:08] Telecommunications lidar biosensing and Quantum competing are becoming much more.
[07:10] Quantum competing are becoming much more prominent key developments and topics.
[07:12] Prominent key developments and topics that will be discussed today include.
[07:15] That will be discussed today include heterogeneous integration Advanced.
[07:17] Heterogeneous integration Advanced packaging techniques improved fiber.
[07:19] Packaging techniques improved fiber coupling methods standardization and.
[07:21] Coupling methods standardization and Automation and also cost reduction.
[07:24] Automation and also cost reduction strategies I'd like to thank in advance.
[07:26] Strategies I'd like to thank in advance all our speakers for joining this.
[07:28] All our speakers for joining this meeting today and and being prepared to.
[07:30] Meeting today and and being prepared to answer your questions we're thrilled to.
[07:32] Answer your questions we're thrilled to welcome back the first Speaker of the.
[07:34] Welcome back the first Speaker of the meeting Peter O'Brien director of fonic.
[07:37] P packaging pilot line at Tindall.
[07:39] National Institute in Cork Peter with.
[07:42] The announcement of the 400 million euro.
[07:44] Chips ju pick pilot line picks Europe uh.
[07:48] Can you give us an update on how you'll.
[07:50] Bring tinel's Advanced packaging.
[07:52] Expertise to help the pilot line build.
[07:55] The future technology supply chain yeah.
[07:58] the future technology supply chain yeah thanks thanks John you can hear me okay.
[08:00] thanks thanks John you can hear me okay can you see my screen yeah okay so I was going to talk very briefly about two things and of course one of them is h h.
[08:07] h pix Europe uh but I was going to keep the best thing for last um just very briefly kind of what we're doing in pix Europe.
[08:13] I I'll speak a little bit about that um and my first one or two slides is kind of speaking towards that because it's really interesting um kind of Trends we beginning to see so you know you might have seen me present this slide before where you there's a lot of intricacies in photonic and electronic packaging so we need to consider Electronics when we when we're packaging these components so there's a lot there and we see very complex chips so um for example this is a very large chip we're currently we're working on um and you can see this type type of package very very large it's not unique so there's there's a big push now towards very Advanced very complex um extreme packages let's call it that moving away.
[09:00] packages let's call it that moving away from the gold box.
[09:03] so this is really kind of a a very important Trend so where we see you know historically we had the butterfly package or kind of variations of that maybe more custom.
[09:12] what we're seeing and what we're doing in pix Europe to a large degree is kind of linking in with the the Big H development towards um chiplet style packaging.
[09:24] so in the electronics world where we're breaking up the chips from very large high-end um uh potentially low yielding uh Foundry processes to chiplets and integrating them onto substrates so interposers.
[09:37] so for example having silicon or glass interposers and then what's really important is that the packages then are looking more like an electronic style package so like a ball grid array BGA style package.
[09:50] so this is a very important Trend it's kind of driving applications like in co-packaged Optics but we see it in other areas as well and a fantastic development here is we're starting to see an alignment of photonics packaging with electronics.
[10:02] photonics packaging with electronics packaging so for example in AI where packaging so for example in AI where photonics is being integrated into the photonics is being integrated into the chip to to uh bring uh more efficient chip to to uh bring uh more efficient and high bandwidth data to the edge of and high bandwidth data to the edge of the chip so this is work we've done the chip so this is work we've done recently um presented at ofc not so long recently um presented at ofc not so long ago this is with Intel and Altera um and ago this is with Intel and Altera um and um packaging a very large electrical um packaging a very large electrical chips like an fpga with photonic and chips like an fpga with photonic and electron Ric chips and bringing Optical electron Ric chips and bringing Optical fibers onto that package so again it fibers onto that package so again it speaks that is kind of chiplet style speaks that is kind of chiplet style packaging and to kind of support that packaging and to kind of support that and we have other projects for example and we have other projects for example where we're using glass platforms so where we're using glass platforms so using glass as an electrical interposer using glass as an electrical interposer so flip chipping components H in this so flip chipping components H in this case it's an Indian phosphide pick but case it's an Indian phosphide pick but with micro optics for out ofpl optic with micro optics for out ofpl optic coupling and obviously in a pilot line coupling and obviously in a pilot line it enables you to develop the equipment it enables you to develop the equipment um and all the ne Neary materials to be um and all the ne Neary materials to be able to develop such a type solution so
[11:03] able to develop such a type solution so again these types of electronic style.
[11:06] again these types of electronic style packaging processes interposers chiplets.
[11:09] packaging processes interposers chiplets electrical integration and BGA packages.
[11:12] electrical integration and BGA packages we're seeing a very strong Trend there.
[11:14] we're seeing a very strong Trend there so John you asked me to speak very.
[11:16] so John you asked me to speak very briefly about uh pix Europe This is a a.
[11:19] briefly about uh pix Europe This is a a major investment by the European.
[11:20] major investment by the European commission as part of the chips ju the.
[11:23] commission as part of the chips ju the chips joint undertaking and it's one of.
[11:25] chips joint undertaking and it's one of five uh pilot lines so CPL 5 as we call.
[11:29] five uh pilot lines so CPL 5 as we call it and essentially what we're doing here.
[11:31] it and essentially what we're doing here is pix apppp was a was a standalone.
[11:34] is pix apppp was a was a standalone packaging pilot line the Fantastic thing.
[11:36] packaging pilot line the Fantastic thing about pix Europe is we're bringing all.
[11:38] about pix Europe is we're bringing all parts of the ecosystem so design chips.
[11:41] parts of the ecosystem so design chips integration packaging of course Tes and.
[11:43] integration packaging of course Tes and reliability developing systems and.
[11:46] reliability developing systems and training and operations to enable users.
[11:48] training and operations to enable users to access those facilities so just very.
[11:51] to access those facilities so just very briefly you can see the list of Partners.
[11:53] briefly you can see the list of Partners here so the coordinators EO in Spain um.
[11:57] here so the coordinators EO in Spain um and Tindle for example will be leading.
[11:59] and Tindle for example will be leading the packaging activities we have the.
[12:01] the packaging activities we have the Netherlands Belgium Poland United.
[12:04] Netherlands Belgium Poland United Kingdom France Austria Italy Finland and.
[12:07] Kingdom France Austria Italy Finland and Portugal all play a very important role.
[12:10] Portugal all play a very important role um for example in developing the chips.
[12:11] um for example in developing the chips some major foundaries and a key part of.
[12:15] some major foundaries and a key part of this I can't emphasize this enough we.
[12:17] this I can't emphasize this enough we want to work with industry so as soon as.
[12:19] want to work with industry so as soon as we can we want to engage with industry.
[12:22] we can we want to engage with industry the plan is we we start very soon.
[12:24] the plan is we we start very soon potentially in may possibly June um we.
[12:27] potentially in may possibly June um we will open our doors and start to work.
[12:29] will open our doors and start to work work um on on on developing these more.
[12:32] work um on on on developing these more advanced packaging Solutions and we want.
[12:34] advanced packaging Solutions and we want and we need to work with industry a key.
[12:37] and we need to work with industry a key key enabler to enable uh users to engage.
[12:40] key enabler to enable uh users to engage with the pilot line you know we've.
[12:42] with the pilot line you know we've developed these packaging design rules.
[12:44] developed these packaging design rules adks assembly design kits these will be.
[12:47] adks assembly design kits these will be closely linked with process design kits.
[12:49] closely linked with process design kits coming out of The Foundry and test.
[12:51] coming out of The Foundry and test design kits and then that's really the.
[12:54] design kits and then that's really the interface so the users will use these.
[12:56] interface so the users will use these design rules to interface with the chip.
[12:58] design rules to interface with the chip the packaging in the test so really what.
[13:01] the packaging in the test so really what we're hoping is that we can offer a.
[13:03] we're hoping is that we can offer a single point entry point to a very wide.
[13:06] single point entry point to a very wide ecosystem across Europe and I think this is a a manufacturing production ecosystem and as I say I can't emphasize enough it's very important we work with our industry Partners um so we can transfer these processes and enable them to scale so again a key part of this is our Gateway we had the Pix uh pix app Gateway at Tindle we will also have a a PIX Europe Gateway this will be managed by our partner icho in Spain and again following all these standardized um packaging chip and test design rules and that's really the way to engage and as we develop those processes we will transfer those to our industrial Partners so one message I want to give today if people companies are interested in working with us and being part of this scaleup um opportunity please do not hesitate to contact me and or Valerio in icho um so we have a number of partners that you know maybe locally you can you can contact but maybe as a
[14:07] you can you can contact but maybe as a first point to call contact me very happy to talk to you.
[14:11] because this is really an important uh part of our of our pilot line scaling up with industry.
[14:16] just very briefly my last slide what is the um what is the timeline so the pilot line funded the grant period runs for five years but of course we're looking well beyond that.
[14:26] so we're developing things up but very soon we want to engage so working with industry this basically working with our industry partners to scale things up that'll happen almost immediately.
[14:37] we need to speak to you um so we can kind of align what we're doing with what you can offer us and then slowly open our doors halfway through the halfway through the uh the project um but possibly sooner if we can do that um to work with you to offer these services to the many people that need them.
[14:56] so John let's say a quick summary of Europe and um what we're doing some interesting developments in the in the field of uh fonic electronic packaging thanks Peter o Brian.
[15:08] Packaging, thanks Peter O'Brian. Congratulations. Congratulations on what?
[15:10] Congratulations, congratulations on what you are achieving. This is great. I am, I'm a static.
[15:12] We want to make sure that that Europe gets the right position with this pilot line and the work that you and many other institutes have done over the last 12 months and especially during last summer, it paid off.
[15:17] So on behalf of Optica and the whole network, congratulations.
[15:28] We have a lot of questions for you, but I will summarize them into one.
[15:30] You keep proposing glass as the the right substrate for photonic integration.
[15:36] And one comment in the chat is that it is a poor thermal conductor and it's not quite CTE compatible with silicon photonics.
[15:44] How do you address this when actually there's a stress coming from a BGA package?
[15:47] Sure, it's a very interesting point.
[15:50] So I mentioned glass, but we're not only looking at glass, we are looking at organic, we're looking at ceramic, and we're looking at silicon.
[15:59] But a very nice feature of glass is, well, it, it, there is a, a very good CTE match.
[16:04] It's very good at high frequency, a key point here is we can integrate.
[16:09] key Point here is we can integrate Optics into the glass I know for example
[16:12] Optics into the glass I know for example uh Intel have been working on that um
[16:14] uh Intel have been working on that um very successfully um but glass also is
[16:17] very successfully um but glass also is being used in the semiconductor
[16:18] being used in the semiconductor electronics Industry for panel so you
[16:21] electronics Industry for panel so you can make large scale panel um electrical
[16:24] can make large scale panel um electrical interposers so it's becoming an
[16:26] interposers so it's becoming an established technology in the
[16:28] established technology in the electronics world world we want to also
[16:30] electronics world world we want to also bring that leverage that capability um
[16:33] bring that leverage that capability um so there are benefits to Glass but I
[16:35] so there are benefits to Glass but I want to emphasize we're looking Beyond
[16:36] want to emphasize we're looking Beyond glass I mentioned glass but there's real
[16:39] glass I mentioned glass but there's real opportunities to bring that technology
[16:41] opportunities to bring that technology into into the photonics um Electronics
[16:44] into into the photonics um Electronics packaging world I can't agree more with
[16:47] packaging world I can't agree more with you and I'm a huge fan of glass and
[16:49] you and I'm a huge fan of glass and using glass for photonic packaging has
[16:50] using glass for photonic packaging has dramatically reduced the cost and also
[16:52] dramatically reduced the cost and also facilitate the F to chip coupling so
[16:54] facilitate the F to chip coupling so there are many advantages on this point
[16:56] there are many advantages on this point to glass one company that you have been
[16:58] to glass one company that you have been in touch with is the company fto print
[17:02] in touch with is the company fto print it is great to have Rolando ferini with
[17:03] it is great to have Rolando ferini with us today Rolando you joined this meeting
[17:05] us today Rolando you joined this meeting and you just heard from Peter O'Brian
[17:08] and you just heard from Peter O'Brian what is this goal of this pyot line I'm
[17:09] what is this goal of this pyot line I'm sure I'm pretty sure you're excited you.
[17:11] sure I'm pretty sure you're excited you know very well what a pyot line is tell.
[17:14] know very well what a pyot line is tell us what you bring to the.
[17:15] us what you bring to the table thank you Jose for the nice.
[17:18] table thank you Jose for the nice introduction yes I know what a pilot LS.
[17:20] introduction yes I know what a pilot LS are one of them in my past so.
[17:24] are one of them in my past so congratulations to Peter for getting.
[17:25] congratulations to Peter for getting this pilot line that will have impact in.
[17:27] this pilot line that will have impact in Europe so today I'm here to for a.
[17:29] Europe so today I'm here to for a two-minute pitch of to present what.
[17:31] two-minute pitch of to present what fento PR can offer in terms of glass.
[17:34] fento PR can offer in terms of glass micro components for fiber connectivity.
[17:36] micro components for fiber connectivity and integrated photonics uh first of all.
[17:39] and integrated photonics uh first of all let me introduce fento print in one.
[17:41] let me introduce fento print in one second fento print is small is an in.
[17:44] second fento print is small is an in Switzerland existing since more than 10.
[17:46] Switzerland existing since more than 10 years 40 people uh two sites in.
[17:48] years 40 people uh two sites in Switzerland one office in the US and we.
[17:51] Switzerland one office in the US and we are specialized in laser micr Machining.
[17:53] are specialized in laser micr Machining of glass micro components serving.
[17:55] of glass micro components serving several markets going from watchmaking.
[17:57] several markets going from watchmaking to life science Medical Quantum and.
[17:59] to life science Medical Quantum and Optics and photonics and in Optics and.
[18:01] Optics and photonics and in Optics and photonics we focus on fiber to chip.
[18:03] photonics we focus on fiber to chip connectivity so we offer components and.
[18:06] connectivity so we offer components and systems and glass components and glass.
[18:08] systems and glass components and glass systems to serve the packaging and.
[18:10] systems to serve the packaging and assembly industry to help going from assembly industry to help going from pics to the final products.
[18:17] so what we offer are three mainly the combination of three building blocks uh vrps or even more 1D or 2D whole arrays for a very precise fiber positioning with guides for beam routing say converters couplers miniaturize and micro Optics means micro lenses or micro mirrors as Peter was saying and our value proposition is really helping customers going from the engineering phase of concept visibility prototyping where we can offer very rapid prototyping services.
[18:45] rapid means turnaround times of few weeks and we can really help customers to speed up their optimization looks and then we go we can go Hand by hand with the customer into pilot production and upscale into volume production and the offer that we have is really monolithically uh integrated glass components that offer High Precision fiber alignment beam routing and beam shaping all these.
[19:12] and beam shaping all these functionalities can be combined with a
[19:14] functionalities can be combined with a Precision of plus minus one micron in a
[19:16] Precision of plus minus one micron in a monolithic component this offers more
[19:18] monolithic component this offers more functionality to the customer the same
[19:20] functionality to the customer the same price of the component but also helps
[19:22] price of the component but also helps the customer to reduce cost for assembly
[19:25] the customer to reduce cost for assembly and packaging with that and done and
[19:28] and packaging with that and done and ready for
[19:30] ready for questions fantastic thank you Rolando so
[19:33] uh we have a packed agenda today so
[19:34] we're going to move on but we may come back to you if there's a relevant
[19:36] back to you if there's a relevant question so it gives me great pleasure
[19:38] question so it gives me great pleasure to introduce the second keynote speaker
[19:40] to introduce the second keynote speaker uh Nick saor who's the principal
[19:43] uh Nick saor who's the principal engineer and Technology development
[19:44] engineer and Technology development manager at Intel uh Nick is responsible
[19:46] manager at Intel uh Nick is responsible for Next Generation phonic packaging
[19:49] for Next Generation phonic packaging technology development and pathf finding
[19:51] technology development and pathf finding in Optical IO and co-packaged Optics
[19:54] in Optical IO and co-packaged Optics applications Within Intel Foundry nick
[19:57] applications Within Intel Foundry nick uh thank you so much for joining if you
[20:00] uh thank you so much for joining if you could share share your
[20:02] slides the floor and attention of
[20:05] slides the floor and attention of everyone is
[20:12] yours.
[20:15] yours okay okay hopefully you can all see that.
[20:19] okay okay hopefully you can all see that yes clearly thank you okay great well.
[20:21] yes clearly thank you okay great well thank you very much for the invitation.
[20:22] thank you very much for the invitation to to talk today so um today um I want to talk through some of the challenges.
[20:26] to to talk today so um today um I want to talk through some of the challenges and the way we're addressing those.
[20:27] and the way we're addressing those challenges for the scaling of pay.
[20:28] challenges for the scaling of pay packaging specifically from a CPO.
[20:30] packaging specifically from a CPO standpoint specifically lot of this will.
[20:33] standpoint specifically lot of this will CH with what P just talked about in his.
[20:35] CH with what P just talked about in his presentation um first of all I'm going to start off by talking through some of.
[20:38] presentation um first of all I'm going to start off by talking through some of the high level industry development and.
[20:40] to start off by talking through some of the high level industry development and advanced packaging just to set the scene.
[20:42] the high level industry development and advanced packaging just to set the scene where Sonic has to adapt to fit in in.
[20:44] advanced packaging just to set the scene where Sonic has to adapt to fit in in this in this.
[20:46] where Sonic has to adapt to fit in in this in this ecosystem Advanced packaging is not.
[20:49] this in this ecosystem Advanced packaging is not really key under underpins many of the.
[20:50] ecosystem Advanced packaging is not really key under underpins many of the developments supporting the scaling of.
[20:53] really key under underpins many of the developments supporting the scaling of xpu perits so we're really now firmly in.
[20:55] developments supporting the scaling of xpu perits so we're really now firmly in the era of large complex multi chip.
[20:57] xpu perits so we're really now firmly in the era of large complex multi chip packages which are many reticles in size.
[21:00] the era of large complex multi chip packages which are many reticles in size with lots of different kinds of diet.
[21:03] packages which are many reticles in size with lots of different kinds of diet specialist die assembled using more and.
[21:06] with lots of different kinds of diet specialist die assembled using more and more complex assembly FL and with that.
[21:08] specialist die assembled using more and more complex assembly FL and with that.
[21:12] more complex assembly FL and with that the the electrical bump pites are
[21:14] the the electrical bump pites are driving lower and lower as B
[21:16] driving lower and lower as B requirements is going upwards and that's
[21:18] requirements is going upwards and that's putting en TI constraints on die
[21:20] putting en TI constraints on die placement accuracy from the small and
[21:22] placement accuracy from the small and smaller b sizes so following that Bing
[21:26] smaller b sizes so following that Bing technology is rapidly advancing so for
[21:29] technology is rapidly advancing so for example hybrid bonding is now moving
[21:31] example hybrid bonding is now moving into high volume production so there are
[21:32] into high volume production so there are tools available on the market that can
[21:34] tools available on the market that can achieve very high levels of placement
[21:37] achieve very high levels of placement accuracy from D life and a deep sub
[21:39] accuracy from D life and a deep sub Micron in addition to that we're seeing
[21:41] Micron in addition to that we're seeing a long-term Trend to transition the ca
[21:44] a long-term Trend to transition the ca substrate material from organic to Glass
[21:47] substrate material from organic to Glass cor substrates has been mentioned before
[21:49] cor substrates has been mentioned before and this really is aimed providing hand
[21:52] and this really is aimed providing hand performance and metm mechanical
[21:54] performance and metm mechanical stability in the longer term so overall
[21:56] stability in the longer term so overall we're seeing this progression of diet
[21:59] we're seeing this progression of diet processes to high placement accuracies
[22:01] processes to high placement accuracies and this has direct implications for CPO
[22:03] and this has direct implications for CPO ponics really allowing high accuracy H
[22:06] ponics really allowing high accuracy H put placement the kind of Tolerance is
[22:07] put placement the kind of Tolerance is required for low lost SLE mode
[22:11] required for low lost SLE mode coupling what does this mean from a
[22:13] coupling what does this mean from a packaging requirements perspective well
[22:15] packaging requirements perspective well first of all tonics needs to fit into
[22:17] first of all tonics needs to fit into this hm assembly in test flows these
[22:19] this hm assembly in test flows these established assembly flows so this means
[22:22] established assembly flows so this means that we need to make sure we've got
[22:23] that we need to make sure we've got compatibility with the whole chipet
[22:24] compatibility with the whole chipet ecosystem so from a p perspective mean
[22:27] ecosystem so from a p perspective mean for example in common electrical
[22:29] for example in common electrical interfaces such as UCI making sure we've
[22:32] interfaces such as UCI making sure we've got compatibility with W level assembly
[22:34] got compatibility with W level assembly W level test and making sure we adopt
[22:37] W level test and making sure we adopt assembling processes that are compatible
[22:39] assembling processes that are compatible with those used for the rest of the
[22:41] with those used for the rest of the package including the electronic dice um
[22:44] package including the electronic dice um and then the fonic components themselves
[22:46] and then the fonic components themselves need to be able to withstand those
[22:47] need to be able to withstand those assembly environments including Reflow
[22:49] assembly environments including Reflow and in some cases them compression
[22:51] and in some cases them compression bonding this can place quite a wide
[22:52] bonding this can place quite a wide range of different THM profile
[22:54] range of different THM profile requirements on the component now moving
[22:56] requirements on the component now moving to the upore connectivity
[22:59] to the upore connectivity side of things so we need to support
[23:01] side of things so we need to support High Channel counts and high B density
[23:03] High Channel counts and high B density so both spatial and spectral is
[23:05] so both spatial and spectral is important here and crucially we need
[23:07] important here and crucially we need very high yielding and known good
[23:09] very high yielding and known good assemblies in order to support these
[23:11] assemblies in order to support these very very complex package
[23:14] very very complex package architectures coming in on that Optical
[23:16] architectures coming in on that Optical connectivity aspect so in addition to
[23:18] connectivity aspect so in addition to the high bandwith density um the role of
[23:21] the high bandwith density um the role of package yield is actually really
[23:23] package yield is actually really critical and an important consideration
[23:25] critical and an important consideration here so conventional fiber attach
[23:27] here so conventional fiber attach processes are typically carried out
[23:28] processes are typically carried out right at the end of the assembly flight
[23:30] right at the end of the assembly flight so as the final step in the assembly and
[23:33] so as the final step in the assembly and that means any yield failures at that
[23:35] that means any yield failures at that point could be potentially very costly
[23:37] point could be potentially very costly causing the entire package to be to be
[23:39] causing the entire package to be to be lost and then crucially this is
[23:42] lost and then crucially this is compounded by the number of optical
[23:44] compounded by the number of optical attaches per package so for example in a
[23:47] attaches per package so for example in a in a CPO package that maybe has eight
[23:49] in a CPO package that maybe has eight picks on it that final yield is then
[23:52] picks on it that final yield is then proportional to the eighth power of the
[23:55] proportional to the eighth power of the the individual F Shield so in contrast
[23:58] the individual F Shield so in contrast By introducing a detach ability point
[24:00] By introducing a detach ability point the connector and package Edge this
[24:03] the connector and package Edge this really allows both the optical interface
[24:05] really allows both the optical interface and the connector to be tested
[24:06] and the connector to be tested individually and then then committed to
[24:08] individually and then then committed to the package and in good state so that
[24:10] the package and in good state so that really breaks that dependency on the
[24:12] really breaks that dependency on the fiber attach Shield allows for
[24:17] scalability here we have some examples
[24:19] scalability here we have some examples of the kinds of things we've been
[24:20] of the kinds of things we've been working on to address these challenges
[24:21] working on to address these challenges and facilitate scaling so first of all
[24:23] and facilitate scaling so first of all what I'm showing here is a grass breing
[24:25] what I'm showing here is a grass breing connected technology for pick packaging
[24:27] connected technology for pick packaging so we have aass bridge that attaches to
[24:29] so we have aass bridge that attaches to the pick can see threedimensional wave
[24:31] the pick can see threedimensional wave lines allowing for high density IO with
[24:34] lines allowing for high density IO with detachability through mechanical
[24:36] detachability through mechanical connector alignment features and then we
[24:38] connector alignment features and then we have a glass Barrel that's integrated
[24:39] have a glass Barrel that's integrated into the connector which has
[24:40] into the connector which has corresponding mechanical alignment
[24:42] corresponding mechanical alignment features and this provides a fully CTE
[24:45] features and this provides a fully CTE matched Optical interface all the way
[24:46] matched Optical interface all the way from the fiber to the p uh supports both
[24:50] from the fiber to the p uh supports both Edge and plane coupling and you can see
[24:52] Edge and plane coupling and you can see some
[24:53] some examples Parts the lower left hand image
[24:56] examples Parts the lower left hand image there um shows a bridge that contain
[24:58] there um shows a bridge that contain passive alignment features in this case
[25:00] passive alignment features in this case these are cylindrical protrusions which
[25:02] these are cylindrical protrusions which are designed to make directly into an
[25:04] are designed to make directly into an existing Pap that has vs in it and then
[25:07] existing Pap that has vs in it and then in the middle there you can see an
[25:08] in the middle there you can see an example of a reconstituted wafer that's
[25:10] example of a reconstituted wafer that's used for waer level assembly in test um
[25:13] used for waer level assembly in test um a carrier wafer and then lower right
[25:16] a carrier wafer and then lower right hand side you can see fly packaged
[25:17] hand side you can see fly packaged example how the bridge and connects are
[25:19] example how the bridge and connects are all integrated and all relevant mating
[25:21] all integrated and all relevant mating mechanics to make
[25:23] mechanics to make thatw okay and here's another example of
[25:25] thatw okay and here's another example of some components we've been working on in
[25:27] some components we've been working on in this case these are level assembly
[25:29] this case these are level assembly compatible micro Optics in this example
[25:32] compatible micro Optics in this example curve microm so this allows the
[25:34] curve microm so this allows the conversion of an edge coupled pick into
[25:37] conversion of an edge coupled pick into a Broadband vertical expanded beam
[25:39] a Broadband vertical expanded beam architecture supporting both
[25:41] architecture supporting both polarizations so this really helps to
[25:43] polarizations so this really helps to facilitate easy way for level test and
[25:46] facilitate easy way for level test and way for level packaging and in this
[25:48] way for level packaging and in this particular example can also be aligned
[25:51] particular example can also be aligned mechanically from pass alment through
[25:53] mechanically from pass alment through mechanical features but also could be
[25:55] mechanical features but also could be place with using high accuracy D
[25:57] place with using high accuracy D bounding as well so see can see some of
[25:58] bounding as well so see can see some of the examples on this on this page and
[26:00] the examples on this on this page and lower hand side you can see an assembly
[26:02] lower hand side you can see an assembly as well so overall the Glass Technology
[26:05] as well so overall the Glass Technology example components shown over the past
[26:07] example components shown over the past couple of slides gives us a very wider
[26:09] couple of slides gives us a very wider level of flexibility to work with a
[26:11] level of flexibility to work with a whole range of different kind of
[26:12] whole range of different kind of coupling structures and configurations
[26:14] coupling structures and configurations and really allow for scalable assembly
[26:16] and really allow for scalable assembly within
[26:18] within CPO okay well thank you very much for
[26:20] CPO okay well thank you very much for your time I hopefully that gives you
[26:21] your time I hopefully that gives you some insight and examples on what we're
[26:23] some insight and examples on what we're working on to address the challenges and
[26:25] working on to address the challenges and we'll be sharing more over the coming
[26:26] we'll be sharing more over the coming months thanks
[26:31] excellent you very
[26:33] excellent you very much Jose you go all right thank you
[26:37] much Jose you go all right thank you very much for a great presentation it is
[26:38] very much for a great presentation it is always fantastic to hear the point of
[26:40] always fantastic to hear the point of view of Intel Foundry and we also
[26:43] view of Intel Foundry and we also understand that there are many companies
[26:44] understand that there are many companies who want to talk to you and discuss with
[26:46] who want to talk to you and discuss with you could you share with us just maybe
[26:48] you could you share with us just maybe out of the blue one challenge that you
[26:51] out of the blue one challenge that you think the photonics community would help
[26:54] think the photonics community would help you with yeah I would say Obviously we
[26:57] you with yeah I would say Obviously we need the whole ecos system to move
[26:58] need the whole ecos system to move forward and and uh G gain economies of
[27:01] forward and and uh G gain economies of scale for the cpos uh ramping but I
[27:05] scale for the cpos uh ramping but I think one specific example Jose um that
[27:08] think one specific example Jose um that I think needs a lot of focused work on
[27:10] I think needs a lot of focused work on is the driving down the costs of
[27:12] is the driving down the costs of polarization maintaining fiber erase
[27:14] polarization maintaining fiber erase okay this needs to become very highly
[27:17] okay this needs to become very highly automated and low cost and I'm wor some
[27:19] automated and low cost and I'm wor some folks are working on this on this
[27:21] folks are working on this on this problem but I really like to encourage
[27:23] problem but I really like to encourage more people to push this
[27:25] more people to push this forwards when he come to the five race
[27:27] forwards when he come to the five race could you give us on specs in terms of
[27:29] could you give us on specs in terms of how what would be the distance between
[27:31] how what would be the distance between the the fibers and perhaps the accuracy
[27:34] the the fibers and perhaps the accuracy between the with which you comp
[27:37] between the with which you comp position so the accuracy in position
[27:39] position so the accuracy in position accuracy tends to be pretty good from
[27:41] accuracy tends to be pretty good from from fiber R it's more the cost I would
[27:43] from fiber R it's more the cost I would say from polarization maintain fiber
[27:45] say from polarization maintain fiber arrays the fact that they have to be
[27:47] arrays the fact that they have to be individually rotationally aligned to
[27:50] individually rotationally aligned to have the stretch rods aligned to the the
[27:52] have the stretch rods aligned to the the axis um that's that's what is driving PM
[27:56] axis um that's that's what is driving PM fiber eras to be substantially more
[27:58] fiber eras to be substantially more expensive than single mode standard
[28:00] expensive than single mode standard single mode fiber array so that that's
[28:02] single mode fiber array so that that's really the key key problem I'd like the
[28:04] really the key key problem I'd like the industry to to to push
[28:06] industry to to to push forwarding nck we're gonna come back to
[28:08] forwarding nck we're gonna come back to that but I'm pretty sure after this
[28:09] that but I'm pretty sure after this email there will be quite many companies
[28:11] email there will be quite many companies who want to get in touch with you about
[28:13] who want to get in touch with you about this because they actually heavily
[28:15] this because they actually heavily working on this I can see very beautiful
[28:17] working on this I can see very beautiful smiles from people from well from Smart
[28:20] smiles from people from well from Smart act for many others they will reach out
[28:22] act for many others they will reach out to you H I would like to also bring to
[28:25] to you H I would like to also bring to the floor to the discussion some other
[28:26] the floor to the discussion some other companies who have been and want to to
[28:28] companies who have been and want to to get in touch with youi and with the
[28:29] get in touch with youi and with the others one of is one of our sponsors
[28:31] others one of is one of our sponsors today one of the market leaders on
[28:33] today one of the market leaders on equipment for Passive alignment and wire
[28:36] equipment for Passive alignment and wire bonding I'm referring to the company
[28:38] bonding I'm referring to the company fine Tech Travis Scott thank you very
[28:41] fine Tech Travis Scott thank you very much for being with us today tell us
[28:42] much for being with us today tell us what you bring to the table can I ask a
[28:45] what you bring to the table can I ask a question to Nick before you move on
[28:47] question to Nick before you move on sorry who's who's talking right now
[28:50] sorry who's who's talking right now enri Enrique from Cory thank you very
[28:53] enri Enrique from Cory thank you very much and welcome to the meeting H this
[28:55] much and welcome to the meeting H this is not a standard way for us to inter to
[28:57] is not a standard way for us to inter to interview go ahead and ask your question
[29:00] interview go ahead and ask your question uh is this connectors comparable with 3m
[29:03] uh is this connectors comparable with 3m Evo
[29:04] Evo connectors the coupling no this is a
[29:06] connectors the coupling no this is a proprietary Intel connector oh okay
[29:11] proprietary Intel connector oh okay yeah all right thank you very much and
[29:13] yeah all right thank you very much and thank you Henri for being with us today
[29:16] thank you Henri for being with us today Travis Scott from fch the floor is
[29:22] yours hello I hope you can hear me yes
[29:25] yours hello I hope you can hear me yes so I'm here to talk on behalf of fch I'm
[29:27] so I'm here to talk on behalf of fch I'm in the Business Development Department
[29:29] in the Business Development Department but I came through a couple of different
[29:31] but I came through a couple of different departments at fch so I'm here to
[29:33] departments at fch so I'm here to present our systems so fch offers a wide
[29:38] present our systems so fch offers a wide range of manual to fully automated um
[29:42] range of manual to fully automated um SMD uh sorry submicron die bonding and
[29:46] SMD uh sorry submicron die bonding and SMD rework systems as well as the
[29:49] SMD rework systems as well as the customized process development that
[29:50] customized process development that supports that at the customer
[29:53] supports that at the customer site
[29:54] site um we offer a wide range of Technologies
[29:57] um we offer a wide range of Technologies and modules to address various different
[29:59] and modules to address various different types of die attach and die bonding
[30:02] types of die attach and die bonding everything from UT tactic adhesives
[30:04] everything from UT tactic adhesives theral compression hybrid
[30:06] theral compression hybrid bonding sorry um so all these
[30:10] bonding sorry um so all these technologies that address pick to
[30:12] technologies that address pick to interpose the optical side the
[30:14] interpose the optical side the electrical side and the co- package side
[30:17] electrical side and the co- package side um our systems offer for a very flexible
[30:19] um our systems offer for a very flexible and versatile change from different
[30:21] and versatile change from different processes and R&D inside of the same
[30:23] processes and R&D inside of the same system as well as moving on to fully
[30:26] system as well as moving on to fully automated uh production system systems
[30:29] automated uh production system systems um we do for the submicron high accuracy
[30:32] um we do for the submicron high accuracy alignment and placement required for
[30:34] alignment and placement required for pick
[30:35] pick assembly sorry just like everybody in
[30:38] assembly sorry just like everybody in Europe I've been sick the past week so
[30:40] Europe I've been sick the past week so I'm just struggling a little
[30:42] I'm just struggling a little bit um yeah so we also offer the high
[30:45] bit um yeah so we also offer the high accuracy placements required for the
[30:47] accuracy placements required for the pick assembly in these kinds of uh
[30:50] pick assembly in these kinds of uh packages um yeah so we're at fch for die
[30:53] packages um yeah so we're at fch for die packaging die bonding and SMD rework if
[30:56] packaging die bonding and SMD rework if anybody has questions feel free to reach
[30:57] anybody has questions feel free to reach out or we can hang around and answer
[30:59] out or we can hang around and answer some questions later on thank you thank
[31:02] some questions later on thank you thank you thank you very much Travis from fch
[31:05] you thank you very much Travis from fch let's go to Fon Tech and they are now
[31:07] let's go to Fon Tech and they are now enabling a fully automated production
[31:09] enabling a fully automated production line they are the masters of active
[31:11] line they are the masters of active alignment andon vano H thank you very
[31:13] alignment andon vano H thank you very much being with us today please share
[31:15] much being with us today please share your slide and tell us what we can do
[31:17] your slide and tell us what we can do for you and you can do for
[31:19] for you and you can do for us thank you very much Jose let me share
[31:22] us thank you very much Jose let me share my
[31:25] slide so I hope you can see it now
[31:28] slide so I hope you can see it now yes so so as you introduced us so Fon
[31:32] yes so so as you introduced us so Fon Tech has been supporting the photonics
[31:34] Tech has been supporting the photonics industry with automated solutions for
[31:37] industry with automated solutions for assembly and testing since almost 25
[31:38] assembly and testing since almost 25 years now and we have proven to be uh
[31:42] years now and we have proven to be uh and we are well known to be very
[31:43] and we are well known to be very reliable partner for high volume
[31:44] reliable partner for high volume manufacturing supporting the biggest
[31:46] manufacturing supporting the biggest players in the industry with an
[31:48] players in the industry with an installed base of hundreds of machines
[31:49] installed base of hundreds of machines in the Southeast southeast Asia not only
[31:52] in the Southeast southeast Asia not only and a huge and skillful service team
[31:54] and a huge and skillful service team there just just for this uh install base
[31:57] there just just for this uh install base machine
[31:58] machine however what I want to highlight here
[31:59] however what I want to highlight here today is that even though we all want to
[32:01] today is that even though we all want to talk about volumes and that's why we're
[32:04] talk about volumes and that's why we're gathered here today actually uh and
[32:07] gathered here today actually uh and that's where the biggest challenges lie
[32:08] that's where the biggest challenges lie ahead still for many the road to high
[32:11] ahead still for many the road to high volumes can be quite long and bumpy and
[32:14] volumes can be quite long and bumpy and photonics is a very uh Dynamic industry
[32:17] photonics is a very uh Dynamic industry where new ideas are being applied every
[32:20] where new ideas are being applied every day and these ideas usually come come
[32:23] day and these ideas usually come come into the game from University R&D lab
[32:25] into the game from University R&D lab spinoff startups Etc so we here to
[32:28] spinoff startups Etc so we here to support you to start thinking to start
[32:30] support you to start thinking to start your journey thinking about the
[32:31] your journey thinking about the automation from day one by offering
[32:33] automation from day one by offering entry level user friendly flexible and
[32:35] entry level user friendly flexible and modular Solutions with great support and
[32:38] modular Solutions with great support and ad hoc trainings digital twins Etc such
[32:40] ad hoc trainings digital twins Etc such that you can get familiar with industry
[32:42] that you can get familiar with industry level automation from the very early
[32:44] level automation from the very early days so our reminder for this meeting is
[32:46] days so our reminder for this meeting is that we're here to be your
[32:49] that we're here to be your companion during this long road to high
[32:51] companion during this long road to high volumes those our Illustrated portfolio
[32:53] volumes those our Illustrated portfolio in the slides include uh lab systems
[32:56] in the slides include uh lab systems with production capabilities
[32:58] with production capabilities production systems with development
[33:00] production systems with development capabilities and then uh the third
[33:02] capabilities and then uh the third option is automated production system
[33:04] option is automated production system with automated load load uh loading and
[33:07] with automated load load uh loading and unloading and you can you can think of
[33:09] unloading and you can you can think of all these three cells not only for
[33:11] all these three cells not only for assembly but also for testing both in
[33:13] assembly but also for testing both in Die Level and wafer level testing and
[33:15] Die Level and wafer level testing and the the very the very end could be could
[33:18] the the very the very end could be could be thought about automated uh loading
[33:20] be thought about automated uh loading and a loading of wafers in a wafer level
[33:22] and a loading of wafers in a wafer level tester and Fon is quite is working hard
[33:25] tester and Fon is quite is working hard on this as well and is offering very
[33:27] on this as well and is offering very standard Solutions
[33:29] standard Solutions nowadays uh the very the very the very
[33:32] nowadays uh the very the very the very high-end solutions that lies here on the
[33:34] high-end solutions that lies here on the top right side of the slide we talk
[33:36] top right side of the slide we talk about fully automated production lines
[33:38] about fully automated production lines where uh the end the the operator can
[33:41] where uh the end the the operator can really load uh raw material in and get
[33:44] really load uh raw material in and get fully automated assembled and tested
[33:46] fully automated assembled and tested Parts out so that's that's uh just one
[33:50] Parts out so that's that's uh just one slide uh showing what ficon tech can do
[33:54] slide uh showing what ficon tech can do for you and what what you could do for
[33:56] for you and what what you could do for ficon Tech I think I there are quite
[33:58] ficon Tech I think I there are quite some nice examples here in the panel as
[34:00] some nice examples here in the panel as well uh we have quite some nice
[34:02] well uh we have quite some nice collaborations with with instrumentation
[34:04] collaborations with with instrumentation companies like in this case we have Atif
[34:08] companies like in this case we have Atif photonics here we have with laser
[34:09] photonics here we have with laser manufacturers like fum around so uh
[34:12] manufacturers like fum around so uh we're looking for continuous
[34:14] we're looking for continuous collaboration in the photonics industry
[34:16] collaboration in the photonics industry to drive the photonics assembly and
[34:17] to drive the photonics assembly and testing uh forward and to tackle the new
[34:20] testing uh forward and to tackle the new high volume challenges that we're facing
[34:22] high volume challenges that we're facing every day to tackle them together thank
[34:25] every day to tackle them together thank you very much and then we actually have
[34:26] you very much and then we actually have a question for you the question is
[34:27] a question for you the question is coming from estart from gu and how it
[34:29] coming from estart from gu and how it goart go ahe and you unmute and ask the
[34:32] goart go ahe and you unmute and ask the question
[34:33] question yourself hi uh so as you say and on um
[34:38] yourself hi uh so as you say and on um it's important to have a a smooth and
[34:40] it's important to have a a smooth and well up to my scale up process I'm just
[34:42] well up to my scale up process I'm just thinking about you know for example if
[34:45] thinking about you know for example if uh if an organization was to take uh one
[34:48] uh if an organization was to take uh one of your lab systems that you know for
[34:52] of your lab systems that you know for prototyping for early stage development
[34:55] prototyping for early stage development and then optim and alignment and
[34:58] and then optim and alignment and assembly procedure during those um
[35:01] assembly procedure during those um earlier prototyping stages could the
[35:04] earlier prototyping stages could the processes from that like um just be
[35:07] processes from that like um just be directly copied over to the larger scale
[35:09] directly copied over to the larger scale systems are your are your um is a
[35:12] systems are your are your um is a hardware or firmware I suppose and
[35:14] hardware or firmware I suppose and software on your tools directly cross
[35:17] software on your tools directly cross compatible or is it um would it need
[35:21] compatible or is it um would it need Redevelopment translation across thanks
[35:24] Redevelopment translation across thanks thanks thanks a lot for the question so
[35:26] thanks thanks a lot for the question so that's a very good question and that
[35:28] that's a very good question and that that brings me to another topic which
[35:29] that brings me to another topic which because of time I couldn't mention here
[35:31] because of time I couldn't mention here but but thanks for the question so all
[35:33] but but thanks for the question so all the Fon Tech machines that have been
[35:34] the Fon Tech machines that have been installed some far in the market and
[35:36] installed some far in the market and that's around 1,500 machines from single
[35:39] that's around 1,500 machines from single sale machines to the very high volume
[35:41] sale machines to the very high volume manufacturing sales of a production line
[35:43] manufacturing sales of a production line they all around in a in the in a program
[35:46] they all around in a in the in a program uh that is homemade by F cont called PCM
[35:49] uh that is homemade by F cont called PCM so that makes it easy both for the user
[35:51] so that makes it easy both for the user to transfer his own knowledge into into
[35:53] to transfer his own knowledge into into adapting to to the new to the new high
[35:55] adapting to to the new to the new high volume manufacturing uh sales but but
[35:57] volume manufacturing uh sales but but also for allow me to interrupt you here
[36:00] also for allow me to interrupt you here because one of your customers could
[36:02] because one of your customers could actually provide the answer and I prefer
[36:03] actually provide the answer and I prefer if it happen like this Simon K the CTO
[36:06] if it happen like this Simon K the CTO of photonics Foundry Simon you are a
[36:08] of photonics Foundry Simon you are a customer of f cont Tech tell us your
[36:11] customer of f cont Tech tell us your experience of transferring one process
[36:12] experience of transferring one process to another in a p Contex
[36:14] to another in a p Contex system hey everybody thanks for the
[36:17] system hey everybody thanks for the introduction um yeah in general Um this
[36:21] introduction um yeah in general Um this can be done so transferring processes
[36:23] can be done so transferring processes between fire contact system definitely
[36:25] between fire contact system definitely is possible although adaptions from one
[36:28] is possible although adaptions from one system to the other have to be made
[36:30] system to the other have to be made maybe some position renaming or things
[36:33] maybe some position renaming or things like these but in general these
[36:35] like these but in general these processes can be
[36:36] processes can be transferred and S that's something that
[36:38] transferred and S that's something that photonic Foundry can actually assist so
[36:41] photonic Foundry can actually assist so thank you very much for being with us
[36:42] thank you very much for being with us andon yeah Travis stay with me because
[36:45] andon yeah Travis stay with me because we want to come back to you after the
[36:46] we want to come back to you after the presentation by fix but allow me to
[36:48] presentation by fix but allow me to bring somebody else to the table one of
[36:50] bring somebody else to the table one of the key companies at Optica is quantify
[36:54] the key companies at Optica is quantify photonics because they have been working
[36:56] photonics because they have been working with many of our equ manufacturer and
[36:58] with many of our equ manufacturer and they provide test equipment please St by
[37:01] they provide test equipment please St by the boo ATC case postra thank you very
[37:04] the boo ATC case postra thank you very much for being with us today the floor
[37:05] much for being with us today the floor of the attention is yours show us your
[37:07] of the attention is yours show us your slide Al righty good morning good
[37:10] slide Al righty good morning good afternoon uh John and Jose thank you
[37:13] afternoon uh John and Jose thank you very much for organizing this uh this
[37:15] very much for organizing this uh this this webinar you know I think 2025 is
[37:19] this webinar you know I think 2025 is going to be a very uh interesting year
[37:21] going to be a very uh interesting year for our industry because what I'm seeing
[37:24] for our industry because what I'm seeing and I'm sure that a lot of folks in this
[37:26] and I'm sure that a lot of folks in this in this meeting are seeing this same is
[37:28] in this meeting are seeing this same is that people are really planning to go to
[37:30] that people are really planning to go to the next level really scaling to high
[37:32] the next level really scaling to high volumes for photonic IC technology and
[37:35] volumes for photonic IC technology and of course we we play a a key role in
[37:37] of course we we play a a key role in that so we really focus on photonic I at
[37:41] that so we really focus on photonic I at testing as well as the parallel
[37:43] testing as well as the parallel highspeed IO test which is really W for
[37:46] highspeed IO test which is really W for level testing as well as the package
[37:48] level testing as well as the package product uh level testing so let me go to
[37:51] product uh level testing so let me go to my
[37:53] my slides see can you guys see my slide
[37:55] slides see can you guys see my slide yeah I think so yes so obviously we we
[37:58] yeah I think so yes so obviously we we know what's happening in the industry so
[38:00] know what's happening in the industry so I don't want to elaborate too much on it
[38:01] I don't want to elaborate too much on it but really there's a couple of key
[38:03] but really there's a couple of key elements that are really driving the
[38:04] elements that are really driving the requirement so it's the increased beads
[38:07] requirement so it's the increased beads from density multiple channels multiple
[38:09] from density multiple channels multiple wavelengths or a combination of that
[38:11] wavelengths or a combination of that it's like these new Optical
[38:13] it's like these new Optical interconnects are based on photonic IC
[38:15] interconnects are based on photonic IC Technologies so wafer based Technologies
[38:17] Technologies so wafer based Technologies and they have really ultra high speed
[38:19] and they have really ultra high speed interfaces it starts at 32 gig all the
[38:22] interfaces it starts at 32 gig all the way up to 200g per Channel per
[38:24] way up to 200g per Channel per wavelength so you know key Technologies
[38:26] wavelength so you know key Technologies or verify iabs we have passage from
[38:30] or verify iabs we have passage from light matter we have oci from from from
[38:33] light matter we have oci from from from Intel just to name a few examples so
[38:36] Intel just to name a few examples so what are the solutions that we need to
[38:38] what are the solutions that we need to be able to scale these Technologies so
[38:40] be able to scale these Technologies so one of course we need to do W for level
[38:42] one of course we need to do W for level testing and and we also need to look at
[38:44] testing and and we also need to look at the package level testing so let's talk
[38:46] the package level testing so let's talk a little bit about that so photonic IC
[38:48] a little bit about that so photonic IC at test is kind of the equivalent of the
[38:51] at test is kind of the equivalent of the traditional semiconductor ecosystem you
[38:54] traditional semiconductor ecosystem you need to really replicate that to be able
[38:56] need to really replicate that to be able to do that so the idea is really really
[38:58] to do that so the idea is really really you know you have a a box of wavers you
[39:00] you know you have a a box of wavers you feed it into kind of a machine like an
[39:03] feed it into kind of a machine like an advant test a a f cont Tech or terod
[39:06] advant test a a f cont Tech or terod machine and then you get a fully
[39:07] machine and then you get a fully qualified wafer out of there you know
[39:10] qualified wafer out of there you know exactly which Wafers are meeting the
[39:12] exactly which Wafers are meeting the specification or with which devices on
[39:15] specification or with which devices on the waer are meeting that specification
[39:17] the waer are meeting that specification of course it's very critical that you do
[39:19] of course it's very critical that you do that fast and coste effectively so that
[39:21] that fast and coste effectively so that you know which parts which D to use to
[39:25] you know which parts which D to use to go to the next level and you know what
[39:27] go to the next level and you know what we've seen is that you really need to
[39:28] we've seen is that you really need to make sure that you do very rigorous DVT
[39:32] make sure that you do very rigorous DVT and based on that come up with a limited
[39:34] and based on that come up with a limited test set that is sufficient to qualify
[39:37] test set that is sufficient to qualify Wafers at at the wafer level test and
[39:40] Wafers at at the wafer level test and really what it means is our experience
[39:41] really what it means is our experience that you just you need you need some
[39:43] that you just you need you need some some kind of lasers polarization
[39:46] some kind of lasers polarization controllers power meters and and Optical
[39:48] controllers power meters and and Optical Spectrum analyzers and some some uh some
[39:51] Spectrum analyzers and some some uh some equipment like uh attenuators and
[39:53] equipment like uh attenuators and switches to enable that and we have we
[39:55] switches to enable that and we have we have our solution is based around the
[39:57] have our solution is based around the industry standard pxi so it has high
[40:00] industry standard pxi so it has high density is very flexible and you can
[40:02] density is very flexible and you can combine it with other elements such as
[40:05] combine it with other elements such as SMU so that's the first St you know
[40:08] SMU so that's the first St you know really un industrialized waer level
[40:11] really un industrialized waer level testing you know very very fast and and
[40:13] testing you know very very fast and and cost effective so that's you know for
[40:15] cost effective so that's you know for the wafer and then of course you want to
[40:17] the wafer and then of course you want to go to the next steps into your
[40:18] go to the next steps into your manufacturing cycle you know you get
[40:21] manufacturing cycle you know you get your singular die multi- diey
[40:24] your singular die multi- diey combinations or Optical sub assemblies
[40:26] combinations or Optical sub assemblies and and the package level
[40:27] and and the package level uh product so packaging obviously is a
[40:30] uh product so packaging obviously is a very critical step uh in in the
[40:32] very critical step uh in in the manufacturing chain it's it's really the
[40:34] manufacturing chain it's it's really the last step before you ship the product to
[40:37] last step before you ship the product to your end user and before you deploy it
[40:39] your end user and before you deploy it in the system and you really need to
[40:41] in the system and you really need to make sure that it is meeting all the
[40:43] make sure that it is meeting all the requirements and obviously packaging has
[40:46] requirements and obviously packaging has a very significant impact on the product
[40:48] a very significant impact on the product you go from kind of an optical sub
[40:50] you go from kind of an optical sub assembly you put like a package around
[40:52] assembly you put like a package around it wirebonding and so on so it really
[40:54] it wirebonding and so on so it really changes the physic so there is a hard
[40:56] changes the physic so there is a hard need to do at speed validation of the
[40:59] need to do at speed validation of the package product to make sure it meets
[41:01] package product to make sure it meets all the requirements so um in order to
[41:04] all the requirements so um in order to do that cost effectively you need to
[41:06] do that cost effectively you need to really focus on Parallel testing so we
[41:09] really focus on Parallel testing so we have a solution we developed a solution
[41:10] have a solution we developed a solution for that it's the qca series in
[41:12] for that it's the qca series in combination with with the visi Jitter
[41:15] combination with with the visi Jitter and I analysis software so it's it's a
[41:18] and I analysis software so it's it's a fully parallel uh test solution so you
[41:21] fully parallel uh test solution so you can do a really coste effective uh
[41:23] can do a really coste effective uh screening of your package device to be
[41:26] screening of your package device to be able again to scale your manufacturing
[41:29] able again to scale your manufacturing to high volume so that's what we do in a
[41:31] to high volume so that's what we do in a nutshell you know test solutions for
[41:33] nutshell you know test solutions for wafer level testing photonic IC at test
[41:37] wafer level testing photonic IC at test as well as package product testing with
[41:39] as well as package product testing with our parallel highspeed IO test solution
[41:42] our parallel highspeed IO test solution so that that's Quantified photonics in
[41:44] so that that's Quantified photonics in thank you very thank you very much and
[41:46] thank you very thank you very much and we love quantifi photonics all the way
[41:48] we love quantifi photonics all the way from beautiful New Zealand you always
[41:50] from beautiful New Zealand you always have great great boots at ofc we can't
[41:52] have great great boots at ofc we can't wait to visit yours there's a question
[41:54] wait to visit yours there's a question for you in the chat and it's coming all
[41:56] for you in the chat and it's coming all the way from CIA mil from Raven CIA
[41:58] the way from CIA mil from Raven CIA would you like to try to ask
[42:03] yourself not I will ask yes Celia go
[42:06] yourself not I will ask yes Celia go ahead uh sorry yeah can you hear me it's
[42:09] ahead uh sorry yeah can you hear me it's okay yeah yes yes yeah I was just
[42:11] okay yeah yes yes yeah I was just curious when you mentioned that you need
[42:13] curious when you mentioned that you need lasers for testing what type of testing
[42:16] lasers for testing what type of testing what are you testing actually and what
[42:17] what are you testing actually and what type of laser are used it's a great
[42:20] type of laser are used it's a great question so you know i' the key is
[42:22] question so you know i' the key is really that in in R&D and DVT you need
[42:25] really that in in R&D and DVT you need to do a wide variety of of of testing to
[42:27] to do a wide variety of of of testing to make sure that you understand your
[42:29] make sure that you understand your technology obviously that is not you
[42:31] technology obviously that is not you know uh usable in wafer level testing at
[42:34] know uh usable in wafer level testing at scale wer level testing because you need
[42:36] scale wer level testing because you need to really have a limited test Series so
[42:38] to really have a limited test Series so typically what people do is they they do
[42:41] typically what people do is they they do just like insertion L return loss maybe
[42:44] just like insertion L return loss maybe a little bit of wavelength dependent and
[42:46] a little bit of wavelength dependent and polarization dependent loss measurement
[42:47] polarization dependent loss measurement so depending on those requirements
[42:49] so depending on those requirements either a fixed laser or it's it's a it's
[42:51] either a fixed laser or it's it's a it's a tunable laser that you can use for
[42:54] a tunable laser that you can use for this kind of parametric Optical testing
[42:58] this kind of parametric Optical testing but it depends a little on your device
[42:59] but it depends a little on your device but typically it's of course like we we
[43:01] but typically it's of course like we we focus on 1310 old band
[43:04] focus on 1310 old band applications quite way starting the
[43:06] applications quite way starting the meeting what I would like to let
[43:08] meeting what I would like to let everyone know is that the meeting is
[43:09] everyone know is that the meeting is really going on in the chat so please
[43:10] really going on in the chat so please contact each other if you're not doing
[43:12] contact each other if you're not doing so already we started with Intel we had
[43:14] so already we started with Intel we had the tind the tindel pilot line we also
[43:16] the tind the tindel pilot line we also heard about Euro PS and now we're going
[43:18] heard about Euro PS and now we're going to hear about what we love the most in
[43:21] to hear about what we love the most in Optica Optica is a collaboration
[43:23] Optica Optica is a collaboration platform between companies and when two
[43:25] platform between companies and when two companies find a good reason to work
[43:28] companies find a good reason to work together and they make something bigger
[43:29] together and they make something bigger that they could have done by doing it
[43:31] that they could have done by doing it themselves it is our time to tell them
[43:33] themselves it is our time to tell them well done and to give them the
[43:34] well done and to give them the visibility that they deserve I'd like to
[43:36] visibility that they deserve I'd like to introduce a combined presentation
[43:38] introduce a combined presentation between a company enabling the
[43:39] between a company enabling the minorization of photonic system by
[43:41] minorization of photonic system by embedding planner Optical Wave by of
[43:43] embedding planner Optical Wave by of photonic systems with another one that
[43:47] photonic systems with another one that has been doing packaging service and
[43:49] has been doing packaging service and testing all the way from the Netherlands
[43:50] testing all the way from the Netherlands I'm talking about from Switzerland VAR
[43:52] I'm talking about from Switzerland VAR Optics and from the Netherlands chip
[43:55] Optics and from the Netherlands chip integration Technology Center much are
[43:57] integration Technology Center much are known as
[43:58] known as CITC sander dorstein and Nikolas flurry
[44:01] CITC sander dorstein and Nikolas flurry the floor and the attention of everyone
[44:03] the floor and the attention of everyone is
[44:05] is yours hi good afternoon thank you very
[44:08] yours hi good afternoon thank you very much for the introduction um I'm sorry
[44:10] much for the introduction um I'm sorry to tell you that Nicholas flurry is not
[44:13] to tell you that Nicholas flurry is not present but that I will um take over his
[44:16] present but that I will um take over his presentation but Val he looks so good in
[44:19] presentation but Val he looks so good in my video in the opening I cannot believe
[44:20] my video in the opening I cannot believe this happened I'm kidding of course
[44:22] this happened I'm kidding of course thank you so much don't wor don't worry
[44:24] thank you so much don't wor don't worry it's fine um Leah just like me introduce
[44:27] it's fine um Leah just like me introduce you uh quickly so we're going to I'm
[44:30] you uh quickly so we're going to I'm going to talk about P packaging uh away
[44:33] going to talk about P packaging uh away towards uh semiconductor isation very
[44:36] towards uh semiconductor isation very Optics is a based company that is uh
[44:40] Optics is a based company that is uh based in Switzerland and we've been
[44:42] based in Switzerland and we've been around for over 15 years and doing
[44:44] around for over 15 years and doing planner Optical wave guides with a large
[44:48] planner Optical wave guides with a large portfolio from multimode wave guides in
[44:50] portfolio from multimode wave guides in the area of 500 micrometers down to
[44:53] the area of 500 micrometers down to below three micrometer wave guides in
[44:55] below three micrometer wave guides in Silicon uh single mod
[44:58] Silicon uh single mod applications we always try to be very
[45:00] applications we always try to be very close uh with Optical and electrical
[45:03] close uh with Optical and electrical interconnects because we think that is
[45:05] interconnects because we think that is the way uh to go in the
[45:07] the way uh to go in the future now focusing on uh on single mode
[45:11] future now focusing on uh on single mode technology things we're talking about PE
[45:13] technology things we're talking about PE packaging so what we offer is um uh two
[45:17] packaging so what we offer is um uh two kinds of coupling seams because coupling
[45:19] kinds of coupling seams because coupling I think like the packaging is one big um
[45:24] I think like the packaging is one big um like obstacle in the in the high volume
[45:27] like obstacle in the in the high volume manufacturing of electronic devices so
[45:30] manufacturing of electronic devices so what we offer is uh planner wave guides
[45:33] what we offer is uh planner wave guides that will that have a very high um
[45:36] that will that have a very high um confinement and allow therefore a very
[45:39] confinement and allow therefore a very high Channel density with pitches down
[45:42] high Channel density with pitches down to below 10 migrant so the large number
[45:46] to below 10 migrant so the large number of iOS uh is only limited by the pick
[45:50] of iOS uh is only limited by the pick and not uh by our wave CES uh we also do
[45:54] and not uh by our wave CES uh we also do a mode field matching and reducing cou
[45:57] a mode field matching and reducing cou losses for example to the um fibers and
[46:01] losses for example to the um fibers and also we can do a fan out to match um
[46:04] also we can do a fan out to match um standard fiber
[46:06] standard fiber arrays now usually with Edge meting um
[46:10] arrays now usually with Edge meting um devices like um alignment is very
[46:12] devices like um alignment is very critical and often used um active
[46:15] critical and often used um active alignment uh we think passive alignment
[46:18] alignment uh we think passive alignment or at least the semi- passive alignment
[46:20] or at least the semi- passive alignment is the way uh for high volume uh
[46:23] is the way uh for high volume uh Productions and uh we demonstrated that
[46:25] Productions and uh we demonstrated that with using micr mechanical devices and
[46:29] with using micr mechanical devices and um Optical or actually visual based um
[46:32] um Optical or actually visual based um pick and place tools uh with alignment
[46:36] pick and place tools uh with alignment position better than plus minus one
[46:39] position better than plus minus one micrometer so and we got with these uh
[46:42] micrometer so and we got with these uh we got loss insertion losses from Chip
[46:46] we got loss insertion losses from Chip to interposer of of less than a DP and
[46:50] to interposer of of less than a DP and also of course we have some some losses
[46:53] also of course we have some some losses on the glass fiber side but still if we
[46:56] on the glass fiber side but still if we go from glass fiber to Indian phosphide
[46:58] go from glass fiber to Indian phosphide or something else that will still have
[47:01] or something else that will still have higher losses there the other option to
[47:05] higher losses there the other option to do a coupling is um the event field
[47:08] do a coupling is um the event field coupling where we use um pick and
[47:11] coupling where we use um pick and polymer wave cides with open course
[47:14] polymer wave cides with open course bring them in very close contact and
[47:16] bring them in very close contact and having tapered silicon wave guides or
[47:20] having tapered silicon wave guides or any other um they will they will force
[47:23] any other um they will they will force the energy out of the core of the um
[47:27] the energy out of the core of the um wave guide into the even Ascent field
[47:29] wave guide into the even Ascent field and thus couple into the wave guides now
[47:33] and thus couple into the wave guides now with this we get much easier um coupling
[47:37] with this we get much easier um coupling because we don't need the very precise Z
[47:39] because we don't need the very precise Z alignment that we use in in but coupling
[47:42] alignment that we use in in but coupling and also the alignment tolerances in X
[47:45] and also the alignment tolerances in X and Y are more relaxed than um than than
[47:49] and Y are more relaxed than um than than with the bu coupling also compared to
[47:52] with the bu coupling also compared to like grading couplers the wave guides um
[47:55] like grading couplers the wave guides um so this coupling is not dependent on the
[47:58] so this coupling is not dependent on the wavelength so independent of any
[48:00] wavelength so independent of any variations there and also with these
[48:03] variations there and also with these aincent field coupling there is a
[48:05] aincent field coupling there is a possibility of wave level testing which
[48:08] possibility of wave level testing which is in The Bu coupling not so easy there
[48:11] is in The Bu coupling not so easy there we would have to do Die Level
[48:14] we would have to do Die Level testing and um so we believe that the
[48:18] testing and um so we believe that the the way do semiconduct iation so meaning
[48:21] the way do semiconduct iation so meaning a high level production using the tools
[48:25] a high level production using the tools that are there from semiconductor
[48:26] that are there from semiconductor industry from PCB industry like flip
[48:29] industry from PCB industry like flip chip bonding die bonding we think that
[48:31] chip bonding die bonding we think that is the way to go also in in photonics
[48:35] is the way to go also in in photonics and uh in the collaboration with CITC um
[48:39] and uh in the collaboration with CITC um we do uh have a project uh where we
[48:42] we do uh have a project uh where we develop and assembly processes and
[48:44] develop and assembly processes and concepts for multichip modules so where
[48:47] concepts for multichip modules so where we put several pcks together on one
[48:50] we put several pcks together on one board uh where we can use any type of
[48:54] board uh where we can use any type of pick and um so meaning silicon nitrate
[48:58] pick and um so meaning silicon nitrate or silicon photonics or inan phosphite
[49:01] or silicon photonics or inan phosphite it doesn't really matter and also uh
[49:04] it doesn't really matter and also uh using completely passive alignment SCH
[49:07] using completely passive alignment SCH schemes and we believe also that we
[49:10] schemes and we believe also that we could show already and in in simulations
[49:13] could show already and in in simulations and also um first test that we could go
[49:16] and also um first test that we could go losses coupling losses from pi to the
[49:19] losses coupling losses from pi to the polymer far below 1 DB and thus reducing
[49:23] polymer far below 1 DB and thus reducing overall losses also we are always
[49:26] overall losses also we are always focused on not only the an optical
[49:28] focused on not only the an optical package but having the electrical side
[49:31] package but having the electrical side very close by and uh further more into
[49:35] very close by and uh further more into detail I think um sander from CITC will
[49:38] detail I think um sander from CITC will go please the stage is yours yeah thank
[49:42] go please the stage is yours yeah thank you thank you for the slide nice
[49:44] you thank you for the slide nice introduction so let me share my
[49:51] slides are they visible or
[49:54] slides are they visible or not yeah yes yeah so first that well I'm
[49:58] not yeah yes yeah so first that well I'm sh donin from the chip integration
[50:00] sh donin from the chip integration Technology Center so we are a nonprofit
[50:02] Technology Center so we are a nonprofit research organization and we focus on
[50:05] research organization and we focus on Advanced packaging for both
[50:06] Advanced packaging for both semiconductor and integrated photonic
[50:10] semiconductor and integrated photonic devices um with that in mind so with our
[50:12] devices um with that in mind so with our semiconductor background in mind we are
[50:15] semiconductor background in mind we are currently working on a uh what we call
[50:18] currently working on a uh what we call semiconductor isation of the integrated
[50:20] semiconductor isation of the integrated photonics and so we would like to make
[50:22] photonics and so we would like to make use of known semiconductor Technologies
[50:24] use of known semiconductor Technologies and tailor them towards integrated
[50:27] and tailor them towards integrated photonic uh products and so we have a
[50:31] photonic uh products and so we have a packaging Concept in mind which is based
[50:34] packaging Concept in mind which is based on panel skill assembly where we rely on
[50:37] on panel skill assembly where we rely on pure passive Optical alignment so we
[50:40] pure passive Optical alignment so we think that is a much faster process than
[50:42] think that is a much faster process than active alignment where by the use of
[50:46] active alignment where by the use of polymer wave guide structures we achieve
[50:47] polymer wave guide structures we achieve a very low uh Optical uh loss
[50:52] a very low uh Optical uh loss interface but be Beyond photonics it
[50:56] interface but be Beyond photonics it also needs an electronic integration so
[50:58] also needs an electronic integration so we are developing relative Manufacturing
[51:00] we are developing relative Manufacturing Technologies uh where we create
[51:02] Technologies uh where we create electrical RDL uh on one side of the
[51:05] electrical RDL uh on one side of the panel where we go uh where we also
[51:08] panel where we go uh where we also achieve very high bandwidth electrical
[51:11] achieve very high bandwidth electrical interconnects so we target Beyond 1 140
[51:13] interconnects so we target Beyond 1 140 gigahertz as uh as data rate and of
[51:17] gigahertz as uh as data rate and of course as also also mentioned in the
[51:18] course as also also mentioned in the previous presentations this package
[51:21] previous presentations this package concept should feature a pluggable
[51:22] concept should feature a pluggable optical
[51:24] optical interconnect so in the core of our um
[51:29] interconnect so in the core of our um package concept is that we start with a
[51:31] package concept is that we start with a glass panel and on one side of the glass
[51:33] glass panel and on one side of the glass panel we create an electrical
[51:35] panel we create an electrical redistribution layer by additive
[51:37] redistribution layer by additive manufacturing and this allows us to
[51:39] manufacturing and this allows us to integrate the electronics on one side of
[51:42] integrate the electronics on one side of the package and then by high aspect
[51:45] the package and then by high aspect ratio vertical interconnect we create
[51:47] ratio vertical interconnect we create the electrical part to the photonic and
[51:49] the electrical part to the photonic and on the photonic side we use the polymer
[51:52] on the photonic side we use the polymer wave guide technology on valo Optics to
[51:55] wave guide technology on valo Optics to make an optical redis distribution layer
[51:57] make an optical redis distribution layer on the opposite side of that
[51:59] on the opposite side of that panel um our mission there is to bring
[52:03] panel um our mission there is to bring these Technologies to a certain uh
[52:05] these Technologies to a certain uh technology Readiness level so that it
[52:07] technology Readiness level so that it can be adapted by the uh by the
[52:11] can be adapted by the uh by the industry um this is showing our first
[52:14] industry um this is showing our first results of the electrical interconnect
[52:16] results of the electrical interconnect uh just some highlights here as so by
[52:18] uh just some highlights here as so by this additive manufacturing process we
[52:20] this additive manufacturing process we achieve a resolution of 15 Micron so 15
[52:23] achieve a resolution of 15 Micron so 15 Micron line width with 15 Micron spacing
[52:27] Micron line width with 15 Micron spacing um bear in mind that this is a pure
[52:29] um bear in mind that this is a pure additive process so we do not do any
[52:32] additive process so we do not do any edging we do not do wash any material
[52:34] edging we do not do wash any material away so we only print what we need and
[52:37] away so we only print what we need and so it's a much more sustainable
[52:40] so it's a much more sustainable technology um and by this technology we
[52:44] technology um and by this technology we are capable of making high aspect ratio
[52:46] are capable of making high aspect ratio vertical interconnects and with certain
[52:48] vertical interconnects and with certain designs we can go beyond 140 gahz so we
[52:51] designs we can go beyond 140 gahz so we can we can really boost up the data rate
[52:54] can we can really boost up the data rate uh from from such kind of Packaging
[53:00] um but we also are working towards this
[53:03] um but we also are working towards this Optical interconnect so here we rely on
[53:05] Optical interconnect so here we rely on the ecent field coupling and we have
[53:08] the ecent field coupling and we have optimized the design from pick to the
[53:11] optimized the design from pick to the polmer wave guide structure where we
[53:12] polmer wave guide structure where we have a significantly less than
[53:16] have a significantly less than 0.2db loss at the interface still having
[53:19] 0.2db loss at the interface still having a relaxed alignment tolerance of two
[53:24] microns and this is then where we
[53:26] microns and this is then where we partner with VAR Optics so they provide
[53:28] partner with VAR Optics so they provide us with the technology we make our own
[53:30] us with the technology we make our own photonic test die to actually
[53:33] photonic test die to actually demonstrate this the technology building
[53:35] demonstrate this the technology building block so this is one of our first
[53:37] block so this is one of our first assemblies where you see the polymer
[53:39] assemblies where you see the polymer wave guides merged together with the uh
[53:41] wave guides merged together with the uh with the photonic circuit and we are
[53:43] with the photonic circuit and we are currently evaluating the performance of
[53:46] currently evaluating the performance of this uh of this
[53:48] this uh of this assembly thank
[53:50] assembly thank you great thank you uh sander and
[53:53] you great thank you uh sander and Valentine I was really excited to bring
[53:55] Valentine I was really excited to bring this collaboration to the meeting very
[53:57] this collaboration to the meeting very much looking forward to following the
[53:59] much looking forward to following the project and how the uh the next
[54:02] project and how the uh the next demonstrators perform um so I'd like to
[54:05] demonstrators perform um so I'd like to uh bring to the meeting now uh another
[54:07] uh bring to the meeting now uh another meeting sponsor new for tonics who are
[54:09] meeting sponsor new for tonics who are enabling higher reliability volum
[54:12] enabling higher reliability volum manufacturer of Pi products for
[54:14] manufacturer of Pi products for transceiver modules through improved
[54:16] transceiver modules through improved system design and novel integration of
[54:18] system design and novel integration of lasers uh Doran tal um please uh share
[54:23] lasers uh Doran tal um please uh share your slide and the floor and the
[54:25] your slide and the floor and the attention of brone is yours thank
[54:31] you uh we don't hear you D you
[54:38] muted can you see the slide John oh yeah
[54:41] muted can you see the slide John oh yeah I can see it now thanks okay
[54:44] I can see it now thanks okay perfect awesome great uh good morning
[54:48] perfect awesome great uh good morning good afternoon everybody it's great uh
[54:50] good afternoon everybody it's great uh to be here to discuss this uh
[54:52] to be here to discuss this uh scalability and uh pick and
[54:55] scalability and uh pick and Manufacturing and test um I I think this
[54:58] Manufacturing and test um I I think this is um one of the industry's most uh
[55:01] is um one of the industry's most uh critical challenges and it's great uh
[55:04] critical challenges and it's great uh that optic is putting this form together
[55:07] that optic is putting this form together I'm learning a lot and uh I see a lot of
[55:10] I'm learning a lot and uh I see a lot of good partners here so NE photonics is
[55:13] good partners here so NE photonics is focused on um high performance um
[55:16] focused on um high performance um integrated photonic um solutions for uh
[55:21] integrated photonic um solutions for uh Next Generation Optical
[55:23] Next Generation Optical interconnects um we are a fabulous
[55:25] interconnects um we are a fabulous semiconductor comp company we're
[55:27] semiconductor comp company we're designer developer manufacturer for
[55:29] designer developer manufacturer for Tonic integrated circuits um for
[55:32] Tonic integrated circuits um for pluggable optical modules in hyperscaler
[55:35] pluggable optical modules in hyperscaler data centers so our uh Solutions include
[55:38] data centers so our uh Solutions include a highly integrated uh 1.6 terabit per
[55:42] a highly integrated uh 1.6 terabit per second pick for um dsb based and lpo
[55:46] second pick for um dsb based and lpo based uh um Optical modules our
[55:50] based uh um Optical modules our Solutions include um integrated lasers
[55:53] Solutions include um integrated lasers modulators and our um Optical signal
[55:56] modulators and our um Optical signal processor um so to fulfill the rapidly
[56:00] processor um so to fulfill the rapidly um Rising um data center Optical
[56:03] um Rising um data center Optical interconnect demand in uh high
[56:06] interconnect demand in uh high performance compute and AI I want to
[56:08] performance compute and AI I want to share with you what we're doing um um to
[56:12] share with you what we're doing um um to innovate and unlock
[56:15] innovate and unlock manufacturability excuse me um scaling
[56:18] manufacturability excuse me um scaling bottlenecks with uh our laser
[56:20] bottlenecks with uh our laser integration techniques
[56:28] so really at um at the core of our
[56:31] so really at um at the core of our product is a novel uh approach to
[56:34] product is a novel uh approach to heterogeneously integrating lasers at uh
[56:37] heterogeneously integrating lasers at uh the wafer level what this really means
[56:40] the wafer level what this really means is that um there's a direct integration
[56:43] is that um there's a direct integration of 35 onto silicon photonic Wafers this
[56:47] of 35 onto silicon photonic Wafers this eliminates um the need for discrete or
[56:50] eliminates um the need for discrete or external lasers uh attach and the
[56:53] external lasers uh attach and the complex alignment steps that are
[56:54] complex alignment steps that are associated with that and
[56:57] associated with that and um um this approach really improves the
[57:00] um um this approach really improves the coupling efficiency by over 90%
[57:04] coupling efficiency by over 90% obviously it reduces the uh OEM u
[57:07] obviously it reduces the uh OEM u manufacturability u manufacturing cost
[57:10] manufacturability u manufacturing cost it accelerates uh production timelines
[57:12] it accelerates uh production timelines and um enhances uh reliability making it
[57:16] and um enhances uh reliability making it a scalable and a coste effective
[57:18] a scalable and a coste effective solution for High um volume pick
[57:21] solution for High um volume pick deployment in data centers so with the
[57:24] deployment in data centers so with the traditional approach uh where external
[57:27] traditional approach uh where external discrete laser sources are placed like
[57:29] discrete laser sources are placed like um emls or picks with external dfbs or
[57:33] um emls or picks with external dfbs or other lasers this requires additional
[57:35] other lasers this requires additional assembly steps um including Optical die
[57:39] assembly steps um including Optical die attach alignment wire bonding and such
[57:42] attach alignment wire bonding and such um that me um method really increases
[57:45] um that me um method really increases manufacturing complexity and capex and
[57:49] manufacturing complexity and capex and uh labor costs associated with slowing
[57:52] uh labor costs associated with slowing uh
[57:53] uh scalability um so uh from a fabrication
[57:58] scalability um so uh from a fabrication perspective um our integration approach
[58:00] perspective um our integration approach really shifts a laser functionality from
[58:02] really shifts a laser functionality from being uh the last manual system level uh
[58:06] being uh the last manual system level uh production stage to more of a seos
[58:09] production stage to more of a seos chip-like manufacturing step and by
[58:12] chip-like manufacturing step and by reducing the need for added components
[58:15] reducing the need for added components we really um uh eliminate points of
[58:18] we really um uh eliminate points of failure and degradation caused by issues
[58:21] failure and degradation caused by issues in Optical coupling um and Optical loss
[58:25] in Optical coupling um and Optical loss so so since the active um alignment in
[58:29] so so since the active um alignment in accuracy requirements uh from external
[58:32] accuracy requirements uh from external lasers um Place really a substantial
[58:35] lasers um Place really a substantial burden on manufacturability and scaling
[58:38] burden on manufacturability and scaling the move to um the integrated laser um
[58:42] the move to um the integrated laser um really represents a significant
[58:44] really represents a significant Improvement in uh in terms of
[58:46] Improvement in uh in terms of fabrication efficiency of uh the
[58:49] fabrication efficiency of uh the production scale and the performance so
[58:52] production scale and the performance so if you have any questions or any more
[58:55] if you have any questions or any more interest in our silicon photonic
[58:57] interest in our silicon photonic integrated laser Solutions um please
[59:00] integrated laser Solutions um please feel free to contact me um check out our
[59:04] feel free to contact me um check out our online uh blog um with about laser
[59:07] online uh blog um with about laser integration and look for a deep dive in
[59:11] integration and look for a deep dive in next month pick
[59:13] next month pick magazine right thank you so much Daran
[59:15] magazine right thank you so much Daran for the slides and for the sponsorship
[59:17] for the slides and for the sponsorship of the meeting um I'd like to to now
[59:20] of the meeting um I'd like to to now move on to another um collaboration uh
[59:25] move on to another um collaboration uh that we've brought for the meeting um
[59:27] that we've brought for the meeting um it's another Netherlands based combined
[59:29] it's another Netherlands based combined presentation between meeting sponsor
[59:32] presentation between meeting sponsor your own DWI at fix and DOW go at
[59:35] your own DWI at fix and DOW go at Brilliance on how Brilliance are
[59:37] Brilliance on how Brilliance are combining their expertise with fix's
[59:40] combining their expertise with fix's One-Stop shop from design to volume
[59:42] One-Stop shop from design to volume production to produce the smallest and
[59:44] production to produce the smallest and most efficient pick based RGB laser chip
[59:48] most efficient pick based RGB laser chip your own and DOW the floor and the
[59:50] your own and DOW the floor and the attention of everyone is yours thank you
[59:54] attention of everyone is yours thank you thank you very much y for the the kind
[59:56] thank you very much y for the the kind introduction I'm trying to share my
[59:58] introduction I'm trying to share my screen but since the other screen is
[01:00:00] screen but since the other screen is still open I'm not allowed to do so so
[01:00:03] still open I'm not allowed to do so so please close off the screen so I can
[01:00:05] please close off the screen so I can share it thank
[01:00:13] you that should do the job great than
[01:00:17] you that should do the job great than okay and I'm not sure if everybody knows
[01:00:20] okay and I'm not sure if everybody knows already fix since we have been around
[01:00:22] already fix since we have been around already for like nearly eight years now
[01:00:24] already for like nearly eight years now uh but we do we are Packaging and a
[01:00:26] uh but we do we are Packaging and a manufacturing company located in the
[01:00:28] manufacturing company located in the Netherlands uh doing all kind of tonics
[01:00:30] Netherlands uh doing all kind of tonics packaging and assembly and as of last
[01:00:33] packaging and assembly and as of last year we moved our own facility and
[01:00:35] year we moved our own facility and really scaling up as contract
[01:00:36] really scaling up as contract manufacturer within Europe doing fiber
[01:00:39] manufacturer within Europe doing fiber attaches hybrid integration and DC rnrf
[01:00:42] attaches hybrid integration and DC rnrf interfacing and to give some product
[01:00:45] interfacing and to give some product examples it's like stuff being done on a
[01:00:48] examples it's like stuff being done on a printed circuit board uh small
[01:00:50] printed circuit board uh small components larger components as uh as
[01:00:52] components larger components as uh as tindel was showing as well so we also do
[01:00:54] tindel was showing as well so we also do wafer level assembly
[01:00:56] wafer level assembly prototyping that out for various markets
[01:00:59] prototyping that out for various markets uh traditional packaging and Butterfly
[01:01:01] uh traditional packaging and Butterfly style interfaces but also the the more
[01:01:04] style interfaces but also the the more Uncommon uh form factors that need to be
[01:01:07] Uncommon uh form factors that need to be scaled up for different
[01:01:09] scaled up for different applications and today I'm going to talk
[01:01:11] applications and today I'm going to talk a little bit about the need for the uh
[01:01:13] a little bit about the need for the uh the hybrid integration that we are
[01:01:15] the hybrid integration that we are working towards as well uh as well as
[01:01:18] working towards as well uh as well as the and the hetrogeneous integration
[01:01:20] the and the hetrogeneous integration that we're doing so when you're looking
[01:01:22] that we're doing so when you're looking to the the current State ofthe art that
[01:01:24] to the the current State ofthe art that we are manufacturing we do a lot of
[01:01:25] we are manufacturing we do a lot of hybrid integration using Edge coupling
[01:01:28] hybrid integration using Edge coupling uh with different material systems and
[01:01:30] uh with different material systems and connecting them to each other as you can
[01:01:31] connecting them to each other as you can see on the bottom left image and the
[01:01:34] see on the bottom left image and the main reason is that we need to integrate
[01:01:36] main reason is that we need to integrate all kind of different material systems
[01:01:37] all kind of different material systems on the most effective way and most
[01:01:40] on the most effective way and most effective for prototyping on the edge
[01:01:42] effective for prototyping on the edge what we're seeing is you have a lot of
[01:01:43] what we're seeing is you have a lot of flexibility also if you have waer runs
[01:01:46] flexibility also if you have waer runs that are failing for the prototyping uh
[01:01:48] that are failing for the prototyping uh you have you're much more flexible in
[01:01:51] you have you're much more flexible in getting dropin Replacements and to
[01:01:53] getting dropin Replacements and to develop your prototypes from there but
[01:01:56] develop your prototypes from there but we're looking further and further down
[01:01:57] we're looking further and further down the line for scaling it's like the edge
[01:01:59] the line for scaling it's like the edge coupling is limited as well when it
[01:02:01] coupling is limited as well when it comes to functionality and the amount of
[01:02:04] comes to functionality and the amount of volume and cost reductions that you're
[01:02:05] volume and cost reductions that you're capable of achieving so uh for flip
[01:02:08] capable of achieving so uh for flip shipping and that's another way of doing
[01:02:10] shipping and that's another way of doing this hybrid integration uh we're looking
[01:02:12] this hybrid integration uh we're looking as well what can we do there uh in terms
[01:02:14] as well what can we do there uh in terms of scaleup so the the setup cost is
[01:02:16] of scaleup so the the setup cost is going to be much higher since there's
[01:02:18] going to be much higher since there's more process development of front you
[01:02:20] more process development of front you need to maybe do dedicated wave runs but
[01:02:22] need to maybe do dedicated wave runs but in the end when you're looking to very
[01:02:24] in the end when you're looking to very high volume the cost is taking out
[01:02:26] high volume the cost is taking out monolithic integration we see as well
[01:02:29] monolithic integration we see as well like it's very in intriguing to see and
[01:02:31] like it's very in intriguing to see and appealing to go in that route so
[01:02:33] appealing to go in that route so multiple research groups are working
[01:02:35] multiple research groups are working towards it but what we are seeing is
[01:02:37] towards it but what we are seeing is there's so much different flavors and
[01:02:39] there's so much different flavors and reasons to integrate materials whether
[01:02:41] reasons to integrate materials whether it's BTO or lithium niobate or from the
[01:02:44] it's BTO or lithium niobate or from the visible wavelengths uh what we are doing
[01:02:47] visible wavelengths uh what we are doing for for Brilliance but also infrared or
[01:02:50] for for Brilliance but also infrared or even mid infrared all these different
[01:02:51] even mid infrared all these different material systems are not compatible and
[01:02:53] material systems are not compatible and directly integratable onto one
[01:02:56] directly integratable onto one platform so what we're seeing is the the
[01:02:59] platform so what we're seeing is the the flip chip integration and uh fch has
[01:03:02] flip chip integration and uh fch has been providing a presentation as well we
[01:03:04] been providing a presentation as well we have some fine Tech tools installed and
[01:03:06] have some fine Tech tools installed and they're uh capable of doing this flip
[01:03:08] they're uh capable of doing this flip chip integration inside the cavity
[01:03:10] chip integration inside the cavity aligning to uh wave guide so what you're
[01:03:12] aligning to uh wave guide so what you're seeing here is a 35 die uh aligned with
[01:03:15] seeing here is a 35 die uh aligned with a uh a wave guide and it could be any
[01:03:18] a uh a wave guide and it could be any kind of chip platform it's not limited
[01:03:20] kind of chip platform it's not limited to Silicon so it's really depending on
[01:03:22] to Silicon so it's really depending on like the the interfacing and
[01:03:24] like the the interfacing and functionality the main criticality is
[01:03:26] functionality the main criticality is about the vertical stops uh that you
[01:03:28] about the vertical stops uh that you need to be able to implement in your in
[01:03:30] need to be able to implement in your in your platform either on the the Silicon
[01:03:33] your platform either on the the Silicon side or on the the carrier side as well
[01:03:35] side or on the the carrier side as well as on the on the the flip chip side that
[01:03:38] as on the on the the flip chip side that you're putting down so for us what's
[01:03:40] you're putting down so for us what's really critical and what we need to
[01:03:42] really critical and what we need to control is the solar composition since
[01:03:44] control is the solar composition since that going to give you the mechanical
[01:03:46] that going to give you the mechanical stability so for example the shear value
[01:03:48] stability so for example the shear value so how strong it will stay there also
[01:03:50] so how strong it will stay there also for electr migration so is it going to
[01:03:53] for electr migration so is it going to be reliable over a large amount of time
[01:03:56] be reliable over a large amount of time in combination with humidity and and
[01:03:58] in combination with humidity and and high temperature thermal management so
[01:04:01] high temperature thermal management so how do you make sure that the heat goes
[01:04:02] how do you make sure that the heat goes out uh on a certain direction and of
[01:04:06] out uh on a certain direction and of course the solar part design so when
[01:04:08] course the solar part design so when you're looking to the alignment and the
[01:04:10] you're looking to the alignment and the optical power output how can you make
[01:04:12] optical power output how can you make sure that when we put a die there that
[01:04:14] sure that when we put a die there that it remains there and what we are seeing
[01:04:16] it remains there and what we are seeing is that this is traditionally driven by
[01:04:18] is that this is traditionally driven by the datao market but we see other
[01:04:20] the datao market but we see other markets now widely evolving and example
[01:04:23] markets now widely evolving and example for that is arvr but also B biomedical
[01:04:27] for that is arvr but also B biomedical light source integration in combination
[01:04:29] light source integration in combination with nitrites and it's really overcoming
[01:04:32] with nitrites and it's really overcoming the the cost of polarization maintaining
[01:04:33] the the cost of polarization maintaining fiber integration and we heard it before
[01:04:36] fiber integration and we heard it before as well today PM from Nick PM fiber
[01:04:39] as well today PM from Nick PM fiber attaches and PM fiber array
[01:04:41] attaches and PM fiber array manufacturing that is going to remain
[01:04:43] manufacturing that is going to remain costly and by doing this kind of
[01:04:44] costly and by doing this kind of integration we can take out the fiber
[01:04:48] integration we can take out the fiber interfacing in this case we have been uh
[01:04:52] interfacing in this case we have been uh uh uh buying a amyra tool so we have
[01:04:55] uh uh buying a amyra tool so we have been working with fine Tech on uh
[01:04:57] been working with fine Tech on uh component level so die to Die Level but
[01:05:00] component level so die to Die Level but for the volume scale up we have been
[01:05:02] for the volume scale up we have been choosing for the amra because of the
[01:05:04] choosing for the amra because of the faster speed that the machine is having
[01:05:05] faster speed that the machine is having and the more advanced waiver level
[01:05:08] and the more advanced waiver level processing that it could do and I think
[01:05:10] processing that it could do and I think that's also giving the strength directly
[01:05:11] that's also giving the strength directly of the whole ecosystem since we need to
[01:05:13] of the whole ecosystem since we need to have machinery and equipment in all kind
[01:05:16] have machinery and equipment in all kind of phases of the of the development
[01:05:18] of phases of the of the development Journey that we're doing so in this case
[01:05:21] Journey that we're doing so in this case we have an 8 in wafer substate Handler
[01:05:23] we have an 8 in wafer substate Handler so we can do the the 8 in wafer hand L
[01:05:26] so we can do the the 8 in wafer hand L uh and also we can do the the 12 in if
[01:05:29] uh and also we can do the the 12 in if required we can put it in there but we
[01:05:31] required we can put it in there but we see that the majority of the integrate
[01:05:33] see that the majority of the integrate phonics right now is on the on the 8 in
[01:05:38] phonics right now is on the on the 8 in Wafers what we also see and and what it
[01:05:41] Wafers what we also see and and what it U what what we get to learn in this
[01:05:43] U what what we get to learn in this whole development cycle is like yes we
[01:05:45] whole development cycle is like yes we want to do a process development but
[01:05:47] want to do a process development but also we need to do Institute testing and
[01:05:49] also we need to do Institute testing and characterization so I think that's again
[01:05:52] characterization so I think that's again also where it's very important how are
[01:05:53] also where it's very important how are we going to do the wafer level corre
[01:05:55] we going to do the wafer level corre rization how do we do the die Shear
[01:05:57] rization how do we do the die Shear testing and how are we in the end going
[01:06:00] testing and how are we in the end going to build a complete production line of
[01:06:01] to build a complete production line of it so for now we have been setting up a
[01:06:03] it so for now we have been setting up a small prototyping line where we can do
[01:06:05] small prototyping line where we can do this whole circle inhouse and validate
[01:06:08] this whole circle inhouse and validate like well what are the process
[01:06:09] like well what are the process parameters can we optimize it to allow
[01:06:12] parameters can we optimize it to allow for an optimal coupling efficiency from
[01:06:15] for an optimal coupling efficiency from the light source into the uh the wave
[01:06:17] the light source into the uh the wave guides and then for phase two we're
[01:06:19] guides and then for phase two we're scaling towards production uh with in
[01:06:21] scaling towards production uh with in situation testing and validation and I
[01:06:24] situation testing and validation and I think this is a nice moment to it over
[01:06:26] think this is a nice moment to it over to Da so he can showcase how we have
[01:06:28] to Da so he can showcase how we have been doing that for
[01:06:36] them great thank you youron uh should we
[01:06:39] them great thank you youron uh should we move now straight
[01:06:42] move now straight to yes I was on mute so I said Thank You
[01:06:46] to yes I was on mute so I said Thank You Yun I will get my
[01:06:51] Yun I will get my presentation ready where is my
[01:06:53] presentation ready where is my presentation here to share it
[01:06:56] presentation here to share it uh with
[01:06:57] uh with you uh here yeah so my name is dbook I'm
[01:07:01] you uh here yeah so my name is dbook I'm CTO of uh
[01:07:04] CTO of uh Brilliance and Brilliance is in a way
[01:07:06] Brilliance and Brilliance is in a way different field than than most of you
[01:07:08] different field than than most of you are with where most of the photonic
[01:07:10] are with where most of the photonic integrated circuit has been uh we are in
[01:07:14] integrated circuit has been uh we are in AR uh fields in augmented reality that's
[01:07:18] AR uh fields in augmented reality that's a field uh that is emerging and uh so I
[01:07:22] a field uh that is emerging and uh so I bring you in this short presentation uh
[01:07:25] bring you in this short presentation uh I I will I will show you what what PX
[01:07:27] I I will I will show you what what PX can bring in this field I think most of
[01:07:29] can bring in this field I think most of the technical part you have heard from
[01:07:31] the technical part you have heard from Yun what what we are working on but why
[01:07:34] Yun what what we are working on but why are we doing this um because we are
[01:07:36] are we doing this um because we are targeting uh yeah basically that
[01:07:38] targeting uh yeah basically that everybody will throw away their
[01:07:40] everybody will throw away their smartphones where they will put it in
[01:07:41] smartphones where they will put it in the bin sounds crazy now right but
[01:07:43] the bin sounds crazy now right but nobody is using a Blackberry anymore you
[01:07:45] nobody is using a Blackberry anymore you also th threw that in the bin so uh the
[01:07:49] also th threw that in the bin so uh the the the classes are are a are are are a
[01:07:52] the the classes are are a are are are a new interface to Computing uh and anyway
[01:07:55] new interface to Computing uh and anyway and and a new interface to uh to the
[01:07:58] and and a new interface to uh to the information that we take onto us and um
[01:08:02] information that we take onto us and um part there are many issues still there
[01:08:05] part there are many issues still there uh to get that actually done uh part of
[01:08:07] uh to get that actually done uh part of it is that the projectors are still too
[01:08:09] it is that the projectors are still too big and too bulky and too power hungry
[01:08:11] big and too bulky and too power hungry and that's where we can
[01:08:13] and that's where we can help um because the technology that uh
[01:08:16] help um because the technology that uh that we bring in we are bringing at one
[01:08:18] that we bring in we are bringing at one of the first uh we bringing a phonic
[01:08:21] of the first uh we bringing a phonic integrated circuit technology into this
[01:08:23] integrated circuit technology into this field uh which has a way more way lower
[01:08:26] field uh which has a way more way lower power consumption is much smaller has
[01:08:29] power consumption is much smaller has much higher Peak brightness so you can
[01:08:31] much higher Peak brightness so you can also use it out outside and what most of
[01:08:34] also use it out outside and what most of our customers like we bring a technology
[01:08:37] our customers like we bring a technology that can actually scale and that that is
[01:08:39] that can actually scale and that that is that is what resonates very well with
[01:08:42] that is what resonates very well with with many of the people that we work
[01:08:44] with many of the people that we work with it is a waiver scale te technology
[01:08:46] with it is a waiver scale te technology that we that we use so one of the
[01:08:49] that we that we use so one of the challenges here is that uh yeah for we
[01:08:53] challenges here is that uh yeah for we work in the visible light right and uh
[01:08:56] work in the visible light right and uh visible uh light is is typically made
[01:08:59] visible uh light is is typically made out of three lasers with red green and
[01:09:01] out of three lasers with red green and blue lasers you want to have lasers
[01:09:03] blue lasers you want to have lasers because it's a high brightness uh very
[01:09:06] because it's a high brightness uh very right the photons that come from from a
[01:09:08] right the photons that come from from a lasers are you get you have many photons
[01:09:11] lasers are you get you have many photons that that you can actually use so you
[01:09:13] that that you can actually use so you like that that's efficient uh but the
[01:09:16] like that that's efficient uh but the three layers need to be combined all on
[01:09:19] three layers need to be combined all on a on a spot that that is as as perfect
[01:09:22] a on a spot that that is as as perfect as possible because you want to scan it
[01:09:24] as possible because you want to scan it or you want to use it as a backlight or
[01:09:26] or you want to use it as a backlight or you want to do a holographic means with
[01:09:28] you want to do a holographic means with it uh it can be done it is being done
[01:09:31] it uh it can be done it is being done with all kind of micro Optics but that
[01:09:32] with all kind of micro Optics but that is a still relatively large uh component
[01:09:37] is a still relatively large uh component with many different components to to be
[01:09:39] with many different components to to be to be placed and aligned precisely uh
[01:09:43] to be placed and aligned precisely uh that can be done all chip so we are
[01:09:45] that can be done all chip so we are using a silicon nitrite chip there where
[01:09:48] using a silicon nitrite chip there where we uh flip chip uh bare visible laser
[01:09:52] we uh flip chip uh bare visible laser diets onto and uh yeah that that's the
[01:09:56] diets onto and uh yeah that that's the that's the that's the product that we
[01:09:57] that's the that's the product that we are working on uh it looks like this
[01:10:00] are working on uh it looks like this it's only 4 by 4 and a half MIM where
[01:10:02] it's only 4 by 4 and a half MIM where you have red green and blue laser diet
[01:10:04] you have red green and blue laser diet flip chipped passively right our Target
[01:10:07] flip chipped passively right our Target is to do it all passively because of the
[01:10:09] is to do it all passively because of the big volumes that we are targeting and
[01:10:10] big volumes that we are targeting and the cost uh that is related to that uh
[01:10:15] the cost uh that is related to that uh and together with fix we are doing the
[01:10:16] and together with fix we are doing the process optimization there with with all
[01:10:18] process optimization there with with all the tools uh I I think there the the the
[01:10:22] the tools uh I I think there the the the the ecosystem is always a good work
[01:10:24] the ecosystem is always a good work there right it's it's an Endeavor that
[01:10:25] there right it's it's an Endeavor that we took take uh with with uh which can
[01:10:29] we took take uh with with uh which can be done now 10 years ago this could not
[01:10:31] be done now 10 years ago this could not be be be be be done right it's all sub
[01:10:34] be be be be be done right it's all sub Micron alignment it's all visible light
[01:10:37] Micron alignment it's all visible light so we don't want to have any epoxies
[01:10:39] so we don't want to have any epoxies close by it is uh it is uh a challenge
[01:10:42] close by it is uh it is uh a challenge but it can be done and and we are
[01:10:45] but it can be done and and we are showing this uh uh this product now and
[01:10:47] showing this uh uh this product now and we are launching this product um we are
[01:10:51] we are launching this product um we are quite ambitious in the scaling part
[01:10:52] quite ambitious in the scaling part there right uh if you if if you read all
[01:10:55] there right uh if you if if you read all the all the third party Market re re
[01:10:58] the all the third party Market re re reports nobody's doubting that it will
[01:11:00] reports nobody's doubting that it will come right the question is when exactly
[01:11:03] come right the question is when exactly all right and maybe we first end up in
[01:11:05] all right and maybe we first end up in in headsup a auto automotive or or we
[01:11:08] in headsup a auto automotive or or we see Closer by industrial applications as
[01:11:11] see Closer by industrial applications as well uh but the the the goal on the end
[01:11:14] well uh but the the the goal on the end is the is the AR glasses uh in in the
[01:11:17] is the is the AR glasses uh in in the big volumes and you will see more and
[01:11:19] big volumes and you will see more and more integration into a waiver scale
[01:11:21] more integration into a waiver scale version of the of of of this coming so
[01:11:25] version of the of of of this coming so uh uh to yeah that is basically also
[01:11:27] uh uh to yeah that is basically also what I want to show here right it's a
[01:11:29] what I want to show here right it's a component that we make uh closest by is
[01:11:33] component that we make uh closest by is a combination with a Ms mirror that you
[01:11:35] a combination with a Ms mirror that you call laser beam scanning uh so a Ms W A
[01:11:39] call laser beam scanning uh so a Ms W A Ms waver scale combined with a a laser
[01:11:42] Ms waver scale combined with a a laser based uh waiver scale uh Co component
[01:11:46] based uh waiver scale uh Co component and also there all the photonic
[01:11:48] and also there all the photonic integrated functionalities that we know
[01:11:51] integrated functionalities that we know from the from the data and
[01:11:53] from the from the data and telecommunication world can can also be
[01:11:56] telecommunication world can can also be of used in this world so as a conclusion
[01:12:00] of used in this world so as a conclusion right phonic integrated circuit for
[01:12:02] right phonic integrated circuit for visible light open new new markets and I
[01:12:04] visible light open new new markets and I think waver scale phonic integrated
[01:12:06] think waver scale phonic integrated circuit assembly is the only route to
[01:12:08] circuit assembly is the only route to reach there and you will all be wearing
[01:12:11] reach there and you will all be wearing glasses thank
[01:12:14] glasses thank you great thank you Dave very exciting
[01:12:17] you great thank you Dave very exciting project and I look forward to seeing you
[01:12:18] project and I look forward to seeing you reach those Milestones um a quick
[01:12:21] reach those Milestones um a quick question from uh sa nazia from do you
[01:12:25] question from uh sa nazia from do you want to
[01:12:27] want to uh uh unmute and ask your
[01:12:31] question hey J I had a question uh
[01:12:35] question hey J I had a question uh regarding free space Optical assembly if
[01:12:38] regarding free space Optical assembly if uh fix had that expertise of providing
[01:12:41] uh fix had that expertise of providing millimeter scale Optical assembly or for
[01:12:44] millimeter scale Optical assembly or for example in the case of a gold box
[01:12:46] example in the case of a gold box package that's fiber pigtailed with
[01:12:48] package that's fiber pigtailed with Optics assembled inside thanks very much
[01:12:50] Optics assembled inside thanks very much for the the question so the the short
[01:12:52] for the the question so the the short answer is yes we have it since we see
[01:12:54] answer is yes we have it since we see more more that people are looking to get
[01:12:57] more more that people are looking to get isolators integrated in between multiple
[01:13:00] isolators integrated in between multiple picks um so I think the most complex
[01:13:02] picks um so I think the most complex module we're doing today is having more
[01:13:04] module we're doing today is having more than uh than five piics into a single
[01:13:07] than uh than five piics into a single box all connected with free space lenses
[01:13:09] box all connected with free space lenses and with isolated components in
[01:13:12] and with isolated components in between great thank you very
[01:13:15] between great thank you very much great thanks um so another um
[01:13:19] much great thanks um so another um collaboration fix have been working on
[01:13:21] collaboration fix have been working on recently is theyve been showcasing
[01:13:23] recently is theyve been showcasing another partnership with RJR
[01:13:25] another partnership with RJR Technologies who are offering Liquid
[01:13:27] Technologies who are offering Liquid Crystal polymer air cavity packages for
[01:13:29] Crystal polymer air cavity packages for integrated photonics uh so we have um
[01:13:33] integrated photonics uh so we have um multiple people from RJR here so Marco
[01:13:35] multiple people from RJR here so Marco kick is here I believe he's struggling
[01:13:37] kick is here I believe he's struggling with his voice so we also have uh will
[01:13:40] with his voice so we also have uh will salana here who's going to speak to the
[01:13:42] salana here who's going to speak to the slides um so thank you please share your
[01:13:45] slides um so thank you please share your slides and uh tell us why this packaging
[01:13:48] slides and uh tell us why this packaging solution is particularly suitable for
[01:13:50] solution is particularly suitable for volume reduction sure thank you so much
[01:13:56] volume reduction sure thank you so much uh can you hear me yes thanks will yeah
[01:13:58] uh can you hear me yes thanks will yeah yeah okay great great thank you so much
[01:14:00] yeah okay great great thank you so much uh and and again good to see both you
[01:14:02] uh and and again good to see both you and Jose virtually as well as Jun uh and
[01:14:06] and Jose virtually as well as Jun uh and sander uh we uh yes we're we're here to
[01:14:09] sander uh we uh yes we're we're here to offer an LCP based package uh a lot of
[01:14:13] offer an LCP based package uh a lot of talk about semiconductor isation of
[01:14:16] talk about semiconductor isation of photonics I think we can definitely help
[01:14:18] photonics I think we can definitely help do that so we're going to introduce our
[01:14:20] do that so we're going to introduce our packages uh RJR is is a privately held
[01:14:24] packages uh RJR is is a privately held technology manufacturing company we've
[01:14:26] technology manufacturing company we've got three locations the first one is in
[01:14:28] got three locations the first one is in Phoenix Arizona where we have our
[01:14:30] Phoenix Arizona where we have our headquarters and our main manufacturing
[01:14:32] headquarters and our main manufacturing facility our second uh is the Hayward
[01:14:35] facility our second uh is the Hayward California where we do R&D and
[01:14:37] California where we do R&D and Manufacturing and then the Philippines
[01:14:39] Manufacturing and then the Philippines where we also have engineering and
[01:14:41] where we also have engineering and Manufacturing uh we also have a presence
[01:14:44] Manufacturing uh we also have a presence in Europe where we have Marco who who uh
[01:14:47] in Europe where we have Marco who who uh unfortunately is sick today but he is
[01:14:49] unfortunately is sick today but he is commanding the uh the slides and Zen
[01:14:51] commanding the uh the slides and Zen Kiper out of out of Germany uh so we
[01:14:55] Kiper out of out of Germany uh so we have a presence there for for people to
[01:14:58] have a presence there for for people to contact us directly in Europe uh we
[01:15:00] contact us directly in Europe uh we deliver Cutting Edge packaging Solutions
[01:15:03] deliver Cutting Edge packaging Solutions through the use of liquid Crystal
[01:15:05] through the use of liquid Crystal polymer our proprietary bage epoxies and
[01:15:08] polymer our proprietary bage epoxies and what we mean by that is we actually
[01:15:09] what we mean by that is we actually formulate the epoxies used in our
[01:15:12] formulate the epoxies used in our packages uh and and we use Precision
[01:15:15] packages uh and and we use Precision injection molding uh down we have three
[01:15:19] injection molding uh down we have three distinct uh uh offerings one is the B
[01:15:22] distinct uh uh offerings one is the B stage epoxy component so we apply the
[01:15:26] stage epoxy component so we apply the EPO the epoxy into the component of of
[01:15:29] EPO the epoxy into the component of of it can be supplied by the customer or it
[01:15:31] it can be supplied by the customer or it can be procured or built by us uh what
[01:15:34] can be procured or built by us uh what we mean by b staging is we advance the
[01:15:37] we mean by b staging is we advance the epoxy to where it goes into a semisolid
[01:15:40] epoxy to where it goes into a semisolid state it can still be further uh uh
[01:15:44] state it can still be further uh uh Advanced when heated to basically make
[01:15:48] Advanced when heated to basically make the Hermetic seal or the near hermetic
[01:15:50] the Hermetic seal or the near hermetic seal uh the second uh portion of our
[01:15:53] seal uh the second uh portion of our pack of our offering is an cavity
[01:15:55] pack of our offering is an cavity plastic package where it all comes
[01:15:57] plastic package where it all comes together with epoxies LCP the injection
[01:16:00] together with epoxies LCP the injection molding and what we've done there is we
[01:16:02] molding and what we've done there is we provided Best in Class performance and
[01:16:04] provided Best in Class performance and time to Market and accompanying that so
[01:16:07] time to Market and accompanying that so that we can uh really help on the on the
[01:16:11] that we can uh really help on the on the assembly side uh we offer the ceiling
[01:16:14] assembly side uh we offer the ceiling equipment to basically attach the
[01:16:16] equipment to basically attach the different package components using our
[01:16:18] different package components using our epoxies and provide you about a 99 plus
[01:16:21] epoxies and provide you about a 99 plus percent yield on these uh now we've done
[01:16:25] percent yield on these uh now we've done what is is uh what is desired in the
[01:16:28] what is is uh what is desired in the photonics industry in terms of bringing
[01:16:31] photonics industry in terms of bringing the
[01:16:32] the IC uh chain into into this uh and so
[01:16:36] IC uh chain into into this uh and so years ago in the in the base stations
[01:16:39] years ago in the in the base stations ceramic was the package of choice it was
[01:16:42] ceramic was the package of choice it was hermetic and uh we saw an opportunity we
[01:16:45] hermetic and uh we saw an opportunity we came in first with our B stage epoxies
[01:16:47] came in first with our B stage epoxies and then with our air air cavity plastic
[01:16:50] and then with our air air cavity plastic packages and we provided to the C to the
[01:16:52] packages and we provided to the C to the customers uh a higher performance device
[01:16:56] customers uh a higher performance device uh we basically improved thermals by 20%
[01:16:59] uh we basically improved thermals by 20% we have a extremely high reliability as
[01:17:01] we have a extremely high reliability as you can imagine in the base stations the
[01:17:03] you can imagine in the base stations the meantime between failure is 20 years uh
[01:17:06] meantime between failure is 20 years uh we provided 80 million ACP packages to
[01:17:09] we provided 80 million ACP packages to that market uh with zero failures
[01:17:11] that market uh with zero failures reported to date uh we also Pro provided
[01:17:15] reported to date uh we also Pro provided short cycle times and low NRE we
[01:17:17] short cycle times and low NRE we basically brought it from months to
[01:17:19] basically brought it from months to weeks and uh and on the lower cost we
[01:17:22] weeks and uh and on the lower cost we brought a 50% cost reduction from using
[01:17:25] brought a 50% cost reduction from using the traditional ceramic to going into
[01:17:28] the traditional ceramic to going into our plastic uh solution um so we're
[01:17:32] our plastic uh solution um so we're trying to do the same in in the
[01:17:33] trying to do the same in in the photonics we've partnered with fix and
[01:17:36] photonics we've partnered with fix and CITC to uh uh two previous presenters
[01:17:40] CITC to uh uh two previous presenters Jun and and sander and and we have now
[01:17:43] Jun and and sander and and we have now defined and brought to Market uh two of
[01:17:46] defined and brought to Market uh two of the butterfly uh type packages uh the
[01:17:50] the butterfly uh type packages uh the first one is the 14 pin which is shown
[01:17:52] first one is the 14 pin which is shown on the top and the second one is a 40
[01:17:55] on the top and the second one is a 40 pin uh pick module and uh this basically
[01:17:58] pin uh pick module and uh this basically provides flexible stru straight and Lead
[01:18:01] provides flexible stru straight and Lead frame design uh we we have the lowest
[01:18:03] frame design uh we we have the lowest cost per unit and lower assembly we can
[01:18:06] cost per unit and lower assembly we can basically assemble this in strip so you
[01:18:08] basically assemble this in strip so you don't have to do individual assembly
[01:18:11] don't have to do individual assembly because you can use the strip that is
[01:18:13] because you can use the strip that is used for the injection molding uh on the
[01:18:16] used for the injection molding uh on the assembly when we say flexible substrate
[01:18:19] assembly when we say flexible substrate and leadframe design we can basically
[01:18:21] and leadframe design we can basically change because the the package is
[01:18:23] change because the the package is brought together with the epoxy we can
[01:18:26] brought together with the epoxy we can use many types of thermal bases that's a
[01:18:29] use many types of thermal bases that's a choice of the customer we can obviously
[01:18:31] choice of the customer we can obviously insert PCB type materials in here and if
[01:18:35] insert PCB type materials in here and if you use the the outline of the of the
[01:18:38] you use the the outline of the of the package you can basically do a turn by
[01:18:41] package you can basically do a turn by just changing the uh lead frame and have
[01:18:44] just changing the uh lead frame and have different types of uh of lead
[01:18:46] different types of uh of lead configurations in your design uh as
[01:18:49] configurations in your design uh as again we've proven the reliability and
[01:18:51] again we've proven the reliability and high volume applications uh in the RF
[01:18:53] high volume applications uh in the RF world and we've got this 14 and and 40
[01:18:57] world and we've got this 14 and and 40 pin packages uh one of the previous
[01:18:59] pin packages uh one of the previous presenters showed a PCB BGA type uh
[01:19:03] presenters showed a PCB BGA type uh we've done that we've done qfn we've
[01:19:05] we've done that we've done qfn we've done BGA so bringing that capability uh
[01:19:09] done BGA so bringing that capability uh to this Market is something we have the
[01:19:11] to this Market is something we have the expertise to
[01:19:13] expertise to do uh next slide so for further context
[01:19:17] do uh next slide so for further context as I mentioned earlier we have two
[01:19:19] as I mentioned earlier we have two individuals one is in in Germany's Sven
[01:19:21] individuals one is in in Germany's Sven and Marco who's in the
[01:19:23] and Marco who's in the Netherlands thank thank you so much will
[01:19:26] Netherlands thank thank you so much will and Marco on the back end uh there's
[01:19:28] and Marco on the back end uh there's been a couple of questions in the chat
[01:19:30] been a couple of questions in the chat that uh Simon Simon kibbon from fonic
[01:19:34] that uh Simon Simon kibbon from fonic foundaries finally answered it was about
[01:19:36] foundaries finally answered it was about the transparency Windows of your
[01:19:39] the transparency Windows of your epoxies
[01:19:40] epoxies um if would you corroborate the answer
[01:19:43] um if would you corroborate the answer that uh they can be used from 700
[01:19:46] that uh they can be used from 700 nanometers and above um because short
[01:19:48] nanometers and above um because short wavelengths will degrade the epoxy
[01:19:51] wavelengths will degrade the epoxy or yes we we don't see any re reason why
[01:19:55] or yes we we don't see any re reason why I can obviously it needs to be proven
[01:19:56] I can obviously it needs to be proven and that's where we're offering the
[01:19:58] and that's where we're offering the technology we've like I said earlier we
[01:20:00] technology we've like I said earlier we we're partnering with CITC and with fix
[01:20:02] we're partnering with CITC and with fix but certainly we're looking for the end
[01:20:04] but certainly we're looking for the end user to demonstrate these capabilities
[01:20:07] user to demonstrate these capabilities uh the the actual lid can be an LCP it
[01:20:11] uh the the actual lid can be an LCP it can be glass we've done many many uh
[01:20:15] can be glass we've done many many uh devices with glass and using our epoy so
[01:20:19] devices with glass and using our epoy so these are all things that the
[01:20:20] these are all things that the application would uh that we need to
[01:20:22] application would uh that we need to prove in the application
[01:20:25] prove in the application okay and and very quickly
[01:20:27] okay and and very quickly Reas we have a a quick question Ian
[01:20:29] Reas we have a a quick question Ian McKenzie did you want to quickly ask
[01:20:32] McKenzie did you want to quickly ask your question
[01:20:34] your question um if you want to
[01:20:36] um if you want to unmute hi yeah just a quick question hi
[01:20:39] unmute hi yeah just a quick question hi it's Ian McKenzie from the European
[01:20:40] it's Ian McKenzie from the European Space Agency hi Jose good to see you hi
[01:20:44] Space Agency hi Jose good to see you hi uh uh just on in terms of this near
[01:20:47] uh uh just on in terms of this near hermetic what does that mean in
[01:20:49] hermetic what does that mean in Practical terms I mean you know is this
[01:20:52] Practical terms I mean you know is this have you got some examples of how this
[01:20:55] have you got some examples of how this near hermetic ceiling
[01:20:58] near hermetic ceiling Works in terms of basically when we say
[01:21:01] Works in terms of basically when we say near hermetic of course uh hermetic
[01:21:04] near hermetic of course uh hermetic basically says that you have to pass
[01:21:06] basically says that you have to pass fine lead test and it's how fast
[01:21:09] fine lead test and it's how fast moisture penetrates into into the
[01:21:11] moisture penetrates into into the package uh we we believe we can go to
[01:21:14] package uh we we believe we can go to about 10 to the minus 8 in terms of uh
[01:21:17] about 10 to the minus 8 in terms of uh of of that so it's it's it's it's a
[01:21:20] of of that so it's it's it's it's a that's what we call it a near hermetic
[01:21:22] that's what we call it a near hermetic we also Define as a highly reliable
[01:21:24] we also Define as a highly reliable device
[01:21:25] device uh so this is where I mean one of the
[01:21:28] uh so this is where I mean one of the questions that that that or one of the
[01:21:30] questions that that that or one of the challenges that the package has which is
[01:21:32] challenges that the package has which is a same challenge we had in the RF world
[01:21:35] a same challenge we had in the RF world is that the if you're trying to go to
[01:21:37] is that the if you're trying to go to high volume and low cost you have to
[01:21:40] high volume and low cost you have to change things so is a hermetic package
[01:21:43] change things so is a hermetic package really required if you require a
[01:21:44] really required if you require a hermetic package then that we're not but
[01:21:46] hermetic package then that we're not but if you want a near which it mean for us
[01:21:49] if you want a near which it mean for us it's good enough that it will comply
[01:21:52] it's good enough that it will comply with the new standards as the industry
[01:21:54] with the new standards as the industry moves to high volume manufacturing then
[01:21:58] moves to high volume manufacturing then yes that's that's where we live so that
[01:22:00] yes that's that's where we live so that is the big that's the inflection point
[01:22:02] is the big that's the inflection point that we're looking for and and in terms
[01:22:05] that we're looking for and and in terms of our the relationships that we built
[01:22:08] of our the relationships that we built so far it looks like the industry is
[01:22:09] so far it looks like the industry is certainly looking for that and and we're
[01:22:12] certainly looking for that and and we're ready great thank you so much from
[01:22:15] ready great thank you so much from um Ian for the question from Issa and
[01:22:18] um Ian for the question from Issa and thanks well and uh Marco in the
[01:22:20] thanks well and uh Marco in the background for RJR Technologies um so i'
[01:22:25] background for RJR Technologies um so i' like like to introduce the final
[01:22:27] like like to introduce the final combined presentation um between summo
[01:22:30] combined presentation um between summo electric who will discuss some of the
[01:22:31] electric who will discuss some of the challenges faced from the customer side
[01:22:34] challenges faced from the customer side and meeting sponsor Vanguard automation
[01:22:36] and meeting sponsor Vanguard automation who will showcase how they're tackling
[01:22:38] who will showcase how they're tackling these challenges and using the
[01:22:40] these challenges and using the opportunities to enable industry
[01:22:42] opportunities to enable industry Partners to go to high volume
[01:22:43] Partners to go to high volume Productions yasaka Mizuno and Laura
[01:22:46] Productions yasaka Mizuno and Laura horen the floor and the attention and
[01:22:48] horen the floor and the attention and verone is
[01:22:51] yours you for kind introduction and
[01:22:54] yours you for kind introduction and thank you Jo and Jose to hold this
[01:22:56] thank you Jo and Jose to hold this excellent
[01:22:58] excellent event my name is yasto fromo electronic
[01:23:02] event my name is yasto fromo electronic Industries today I will talk about the
[01:23:05] Industries today I will talk about the 3D printed micro optics for co- packaged
[01:23:09] 3D printed micro optics for co- packaged Optics first uh let me introduce suo
[01:23:12] Optics first uh let me introduce suo electric we are a manufacturer of both
[01:23:16] electric we are a manufacturer of both active and passive optical devices for
[01:23:19] active and passive optical devices for active device we fabricate in The Hite
[01:23:22] active device we fabricate in The Hite weer dfb laser t
[01:23:25] weer dfb laser t uh Optical sub assembly like tosar Rosa
[01:23:29] uh Optical sub assembly like tosar Rosa and a tunable laser
[01:23:31] and a tunable laser module and for Passive devices uh we
[01:23:34] module and for Passive devices uh we fabricate uh optical fiber and its
[01:23:37] fabricate uh optical fiber and its related products uh such as optical
[01:23:40] related products uh such as optical cable connector and
[01:23:43] cable connector and spices so next uh I will explain about
[01:23:47] spices so next uh I will explain about uh co- packaged Optics
[01:23:50] uh co- packaged Optics CPO so as you know data traffic is
[01:23:53] CPO so as you know data traffic is growing rapidly due to the progress of
[01:23:55] growing rapidly due to the progress of AI and machine learning CPO is
[01:23:59] AI and machine learning CPO is attracting attention because it can
[01:24:01] attracting attention because it can improve uh transmission speed and reduce
[01:24:04] improve uh transmission speed and reduce power
[01:24:05] power consumption in CP uh electron electronic
[01:24:09] consumption in CP uh electron electronic IC photonic IC and fibers are integrated
[01:24:14] IC photonic IC and fibers are integrated in this small package uh we should pay
[01:24:17] in this small package uh we should pay attention that eight or 16 Optical
[01:24:21] attention that eight or 16 Optical channels are accommodated inside this
[01:24:23] channels are accommodated inside this small pack G so the density is quite
[01:24:28] small pack G so the density is quite High also if the number of channels get
[01:24:31] High also if the number of channels get fter larger the size of optical coupling
[01:24:34] fter larger the size of optical coupling part would be the bottleneck for the be
[01:24:37] part would be the bottleneck for the be front
[01:24:39] front density so to achieve high density chip
[01:24:42] density so to achieve high density chip to fiber optical coupling uh micro
[01:24:45] to fiber optical coupling uh micro Optics is a promising technology so one
[01:24:48] Optics is a promising technology so one example is uh haet attaches micro lens
[01:24:52] example is uh haet attaches micro lens uh f m the ment is directly attached on
[01:24:56] uh f m the ment is directly attached on the device facet through 3D printing and
[01:25:00] the device facet through 3D printing and the 90° band or beam expander could be
[01:25:04] the 90° band or beam expander could be uh achieved like this
[01:25:06] uh achieved like this picture another example is a photonic wi
[01:25:09] picture another example is a photonic wi bone the two devices are directly
[01:25:13] bone the two devices are directly connected by the resin web guide uh
[01:25:16] connected by the resin web guide uh which is written through 3D
[01:25:18] which is written through 3D printing uh in this the important thing
[01:25:21] printing uh in this the important thing is that the positional misalignment
[01:25:24] is that the positional misalignment between these two devices could be
[01:25:27] between these two devices could be compensated by the resing wave
[01:25:32] guide I will show uh one use case of
[01:25:36] guide I will show uh one use case of microland uh namely vertically coupled
[01:25:39] microland uh namely vertically coupled beam expanding lens the concept is shown
[01:25:43] beam expanding lens the concept is shown here a free form lens is directly
[01:25:46] here a free form lens is directly attached on Peak and fiber the light is
[01:25:51] attached on Peak and fiber the light is horizontally emitted from Peak h Capa
[01:25:55] horizontally emitted from Peak h Capa and it is reflected uh by the mirror
[01:25:59] and it is reflected uh by the mirror toward vertical
[01:26:00] toward vertical Direction uh the light is reflected
[01:26:03] Direction uh the light is reflected Again by the mirror on the fiber side
[01:26:06] Again by the mirror on the fiber side and the light is coupled to the
[01:26:08] and the light is coupled to the fiber in this case the output beam is
[01:26:12] fiber in this case the output beam is expanded by the convex shaped mirror so
[01:26:16] expanded by the convex shaped mirror so the alignment tolerance is
[01:26:19] the alignment tolerance is enlarged the right side graph shows the
[01:26:22] enlarged the right side graph shows the measurement results the alignment stance
[01:26:25] measurement results the alignment stance is as large as 10
[01:26:28] is as large as 10 micromet and also the low insertion loss
[01:26:31] micromet and also the low insertion loss and flat wavelength characteristic is
[01:26:33] and flat wavelength characteristic is observed over 100 nanometer wavelength
[01:26:37] observed over 100 nanometer wavelength range so this range will be very useful
[01:26:41] range so this range will be very useful so for detachable connection between
[01:26:44] so for detachable connection between Peak and
[01:26:46] Peak and fiber so finally I will talk about the
[01:26:49] fiber so finally I will talk about the challenges of micro optics for mass
[01:26:52] challenges of micro optics for mass production one of the Challen Cheng is
[01:26:55] production one of the Challen Cheng is uh
[01:26:56] uh reliability for CPO uh we should comply
[01:26:59] reliability for CPO uh we should comply two types of reliability
[01:27:02] two types of reliability specifications uh one is for
[01:27:05] specifications uh one is for telecommunication so long-term reli
[01:27:07] telecommunication so long-term reli reliability is required uh such as
[01:27:11] reliability is required uh such as temperature
[01:27:12] temperature cycling dump heat uh mechanical shock
[01:27:15] cycling dump heat uh mechanical shock and
[01:27:17] and vibration and another uh requirement is
[01:27:21] vibration and another uh requirement is for
[01:27:22] for semiconductors and the severe condition
[01:27:24] semiconductors and the severe condition for packaging is required uh such as uh
[01:27:29] for packaging is required uh such as uh 260° C
[01:27:31] 260° C ref uh so we have already demonstrated
[01:27:34] ref uh so we have already demonstrated that the 3D printed R uh can satisfy
[01:27:38] that the 3D printed R uh can satisfy this
[01:27:40] this specification another challenge is uh T
[01:27:43] specification another challenge is uh T time so assumes that the total
[01:27:46] time so assumes that the total production uh is uh 10,000 cpos per
[01:27:51] production uh is uh 10,000 cpos per month and each CPO has 16 channel in one
[01:27:55] month and each CPO has 16 channel in one package in that case uh total amount of
[01:27:59] package in that case uh total amount of is uh 160 uh thousand lens uh per month
[01:28:04] is uh 160 uh thousand lens uh per month so the T time per one L should be uh as
[01:28:09] so the T time per one L should be uh as short as uh 17
[01:28:12] short as uh 17 seconds so this is a big hard work for
[01:28:15] seconds so this is a big hard work for mass production through 3D printing uh
[01:28:18] mass production through 3D printing uh so uh we are working on the these two
[01:28:21] so uh we are working on the these two challenges right now
[01:28:25] challenges right now oh that's all from my
[01:28:27] oh that's all from my presentation thank you very much uh we
[01:28:30] presentation thank you very much uh we always love to hear sumito talking
[01:28:31] always love to hear sumito talking because you take the photonics
[01:28:33] because you take the photonics technology to a semiconductor business
[01:28:35] technology to a semiconductor business one of your partners is Vanguard
[01:28:38] one of your partners is Vanguard Automation and Laura is here with us
[01:28:40] Automation and Laura is here with us Laura take please take it over and I
[01:28:42] Laura take please take it over and I know you have something very big to
[01:28:45] know you have something very big to announce I thank you very much and thank
[01:28:47] announce I thank you very much and thank you aaku for at Landing the challenges
[01:28:50] you aaku for at Landing the challenges you're facing with going to volume
[01:28:52] you're facing with going to volume production cach Optics um
[01:28:59] here so you you'll see the
[01:29:04] here so you you'll see the presentation now on your screens um yep
[01:29:06] presentation now on your screens um yep so I want to talk to you today about um
[01:29:09] so I want to talk to you today about um our Vanguard automation is trying to
[01:29:11] our Vanguard automation is trying to solve the challenges that going to
[01:29:13] solve the challenges that going to higher attack times and right now we're
[01:29:16] higher attack times and right now we're looking at um W for level and batch
[01:29:19] looking at um W for level and batch processing for photonic integration so
[01:29:22] processing for photonic integration so you can see on the right hand inside
[01:29:24] you can see on the right hand inside screen a video playe and this is showing
[01:29:27] screen a video playe and this is showing you how our systems and solutions are
[01:29:30] you how our systems and solutions are being used to process uh wafer level
[01:29:34] being used to process uh wafer level this also be uh elevated to batch
[01:29:37] this also be uh elevated to batch processing what we do say are you saying
[01:29:39] processing what we do say are you saying that you have a wafer level process now
[01:29:41] that you have a wafer level process now for photonic wire
[01:29:43] for photonic wire bonding uh yes you can see here in the
[01:29:45] bonding uh yes you can see here in the screen you have on the screen this
[01:29:47] screen you have on the screen this actually the other system they priz
[01:29:49] actually the other system they priz doing the pre and postd development of
[01:29:52] doing the pre and postd development of our systems and then we do the
[01:29:54] our systems and then we do the encapsulation of the tonic wire bonds
[01:29:57] encapsulation of the tonic wire bonds but in the clip in the next clip you
[01:29:59] but in the clip in the next clip you will see we'll come back soon you'll see
[01:30:01] will see we'll come back soon you'll see the Sonata which is responsible for 3D
[01:30:04] the Sonata which is responsible for 3D printing of um of tonic wire bonds at
[01:30:08] printing of um of tonic wire bonds at wafer level here's the way it's being
[01:30:10] wafer level here's the way it's being put under the theography objective going
[01:30:13] put under the theography objective going into um addtive production of tonic
[01:30:17] into um addtive production of tonic bonds and then back to the um reprise
[01:30:19] bonds and then back to the um reprise system for the pre and post development
[01:30:22] system for the pre and post development um so the benefits of going to Vanguard
[01:30:24] um so the benefits of going to Vanguard automation for the solution it's of
[01:30:26] automation for the solution it's of course the ability to integrate active
[01:30:28] course the ability to integrate active devices into hybrid multi assembles um
[01:30:31] devices into hybrid multi assembles um you have high relability and low loss as
[01:30:34] you have high relability and low loss as shown by is T in his presentation um
[01:30:37] shown by is T in his presentation um damp heat and also the um the um Reflow
[01:30:41] damp heat and also the um the um Reflow soling tests are passed with its
[01:30:43] soling tests are passed with its processes and you can do mold field
[01:30:45] processes and you can do mold field matching for low loss Optical
[01:30:47] matching for low loss Optical connections and also by having a path
[01:30:50] connections and also by having a path Lear process and add manufacturing you
[01:30:52] Lear process and add manufacturing you got to relax pick and place time is
[01:30:54] got to relax pick and place time is really simplifying the production
[01:30:56] really simplifying the production processes congratulations this is really
[01:30:59] processes congratulations this is really big this is huge I I am very impressed
[01:31:02] big this is huge I I am very impressed we finally have a wafer level process
[01:31:03] we finally have a wafer level process for a technology that in many other
[01:31:05] for a technology that in many other meetings we've been discussing whether
[01:31:06] meetings we've been discussing whether it's suitable for volume production or
[01:31:08] it's suitable for volume production or not this is fantastic we have a few
[01:31:10] not this is fantastic we have a few questions for you the first one is
[01:31:11] questions for you the first one is coming from Chris from iponic how is the
[01:31:13] coming from Chris from iponic how is the dispense of the resine handled for wafer
[01:31:15] dispense of the resine handled for wafer level testing for wafer level printing
[01:31:18] level testing for wafer level printing how do you handle the res how do
[01:31:21] how do you handle the res how do you the res we have an ultimate
[01:31:24] you the res we have an ultimate dispenser inside this system for Point
[01:31:27] dispenser inside this system for Point dispensing of resist you can also use
[01:31:29] dispensing of resist you can also use the EUR prise system for putting resist
[01:31:32] the EUR prise system for putting resist onto the entire wafer level we have a
[01:31:35] onto the entire wafer level we have a lot of questions for you Laura but I
[01:31:37] lot of questions for you Laura but I want to go to one of the people who are
[01:31:38] want to go to one of the people who are using the technology of Anga automation
[01:31:40] using the technology of Anga automation I want to go to Keystone photonics
[01:31:42] I want to go to Keystone photonics Philip dri you with us right now please
[01:31:45] Philip dri you with us right now please share your slide and let us know how
[01:31:48] share your slide and let us know how from a wafer level process
[01:31:49] from a wafer level process congratulations Laura this is fantastic
[01:31:51] congratulations Laura this is fantastic to wafer level testing enabled by the
[01:31:53] to wafer level testing enabled by the same technology how can you do it yes so
[01:31:56] same technology how can you do it yes so thank you very much for the kind
[01:31:58] thank you very much for the kind introduction so yes K fonics we're did
[01:32:01] introduction so yes K fonics we're did you see Laura just presented phip yes of
[01:32:05] you see Laura just presented phip yes of course yes I know I'm super happy you
[01:32:08] course yes I know I'm super happy you know you know no this is a this is feels
[01:32:12] know you know no this is a this is feels almost like a newborn chat just saying
[01:32:16] almost like a newborn chat just saying um no I mean keonics is also a Vanguard
[01:32:19] um no I mean keonics is also a Vanguard customer we're using our the technology
[01:32:21] customer we're using our the technology for a very specific use case so what you
[01:32:24] for a very specific use case so what you can see here demonstrates the basic um
[01:32:27] can see here demonstrates the basic um um technology and and what we do we
[01:32:30] um technology and and what we do we create optical components like this
[01:32:32] create optical components like this micro
[01:32:34] micro Optical combination on
[01:32:37] Optical combination on optical component you move your
[01:32:40] optical component you move your microphone down keep it close to your
[01:32:42] microphone down keep it close to your mouth um and that allows us to tackle
[01:32:45] mouth um and that allows us to tackle one of the biggest challenge in uh
[01:32:48] one of the biggest challenge in uh photonics manufacturing that is W for
[01:32:50] photonics manufacturing that is W for level tasting there are two flavors of
[01:32:52] level tasting there are two flavors of this one is surface coupling we can do
[01:32:54] this one is surface coupling we can do gring coupling we can do lens coupling
[01:32:57] gring coupling we can do lens coupling so we can also test C interfaces
[01:32:59] so we can also test C interfaces meanwhile and we can do Ed coupling and
[01:33:03] meanwhile and we can do Ed coupling and what Keystone has done has moved the
[01:33:05] what Keystone has done has moved the technology in this particular use case
[01:33:07] technology in this particular use case to state where it is production ready we
[01:33:11] to state where it is production ready we are um delivering to um to to all major
[01:33:14] are um delivering to um to to all major wafer level testing companies form
[01:33:17] wafer level testing companies form factor F contct MPI and others we Supply
[01:33:20] factor F contct MPI and others we Supply to a majority of um silicon photonic
[01:33:23] to a majority of um silicon photonic countries uh and that's have made um the
[01:33:27] countries uh and that's have made um the the step to to to production Readiness
[01:33:30] the step to to to production Readiness and we're happy to engage with more
[01:33:32] and we're happy to engage with more Partners we're happy to um enable the
[01:33:34] Partners we're happy to um enable the industry to do waer level testing and to
[01:33:37] industry to do waer level testing and to solve that particular challenge thank
[01:33:39] solve that particular challenge thank you very much Philip so let's go to one
[01:33:40] you very much Philip so let's go to one of the market leaders of w level testing
[01:33:42] of the market leaders of w level testing I'm really more than happy to bring to
[01:33:44] I'm really more than happy to bring to the floor one of our corporate members
[01:33:45] the floor one of our corporate members one of more passionate corporate members
[01:33:47] one of more passionate corporate members Aldo gutier from Expo please tell us
[01:33:51] Aldo gutier from Expo please tell us about the multitude of solutions you
[01:33:53] about the multitude of solutions you provide for Peak a modu
[01:33:56] provide for Peak a modu testing hi Jose thank you I will start
[01:33:59] testing hi Jose thank you I will start sharing my screen um I've got an issue
[01:34:02] sharing my screen um I've got an issue okay there we go go ahead don't worry
[01:34:05] okay there we go go ahead don't worry any issue can be
[01:34:08] any issue can be solved all right can you see my
[01:34:11] solved all right can you see my screen yes perfect well hello everyone
[01:34:16] screen yes perfect well hello everyone my name is Alo I'm business development
[01:34:19] my name is Alo I'm business development manager at XO so today I'm excited to
[01:34:23] manager at XO so today I'm excited to present the XO Peak testing solution
[01:34:26] present the XO Peak testing solution it's a comprehensive ecosystem designed
[01:34:29] it's a comprehensive ecosystem designed to streamline the characterization of
[01:34:31] to streamline the characterization of photonic integrated circuits this
[01:34:33] photonic integrated circuits this solution includes the opal automated Pro
[01:34:36] solution includes the opal automated Pro station stead ofth art test equipment
[01:34:39] station stead ofth art test equipment and the pilot software platform so let's
[01:34:43] and the pilot software platform so let's start with the opal automated station so
[01:34:46] start with the opal automated station so this station is built around a motorized
[01:34:49] this station is built around a motorized positioning stage with thermal control
[01:34:52] positioning stage with thermal control ensuring precise and stable measurements
[01:34:55] ensuring precise and stable measurements it features a high resolution top Vision
[01:34:58] it features a high resolution top Vision system and a telecentric side Vision
[01:35:01] system and a telecentric side Vision system providing Accurate Alignment and
[01:35:04] system providing Accurate Alignment and inspection capabilities the opal station
[01:35:07] inspection capabilities the opal station can accommodate up to four probing heads
[01:35:11] can accommodate up to four probing heads for both Optical and electrical probes
[01:35:14] for both Optical and electrical probes offering High flexibility for various
[01:35:16] offering High flexibility for various testing
[01:35:17] testing needs depending on the model the opal
[01:35:19] needs depending on the model the opal product line supports wafer multi-d or
[01:35:23] product line supports wafer multi-d or single D testing all models are
[01:35:26] single D testing all models are compatible with surface and Edge
[01:35:28] compatible with surface and Edge coupling including Tren Edge coupling
[01:35:31] coupling including Tren Edge coupling technique for
[01:35:33] technique for wafers next the test equipment relies on
[01:35:36] wafers next the test equipment relies on the ctp1 and the chable laser product
[01:35:39] the ctp1 and the chable laser product lines to perform comprehensive Peak
[01:35:43] lines to perform comprehensive Peak characterization these tools measure
[01:35:45] characterization these tools measure critical parameters such as insertion
[01:35:47] critical parameters such as insertion lws return losss polarization dependent
[01:35:50] lws return losss polarization dependent laws and
[01:35:52] laws and photocurrent operating within the
[01:35:54] photocurrent operating within the Telecom bands from 1240 nanom all the
[01:35:57] Telecom bands from 1240 nanom all the way up to 1680 nanom this instrument
[01:36:01] way up to 1680 nanom this instrument sweep wavelength at a high speed of 200
[01:36:04] sweep wavelength at a high speed of 200 nanometer per second with exceptional
[01:36:06] nanometer per second with exceptional Spectrum resolution up to 20 fom meter
[01:36:10] Spectrum resolution up to 20 fom meter this high performance makes it ideal for
[01:36:13] this high performance makes it ideal for tasks such as microing resonator
[01:36:17] tasks such as microing resonator characterization finally the pilot
[01:36:19] characterization finally the pilot software platforms ties everything
[01:36:22] software platforms ties everything together by orchestrating the complete
[01:36:25] together by orchestrating the complete flow of P
[01:36:27] flow of P characterization it handles test
[01:36:29] characterization it handles test preparation executes fully automated
[01:36:32] preparation executes fully automated navigation alignment and measurements at
[01:36:35] navigation alignment and measurements at a high throughput it also manage
[01:36:38] a high throughput it also manage analysis and data of results with pilot
[01:36:42] analysis and data of results with pilot you can ensure efficient and accurate
[01:36:44] you can ensure efficient and accurate testing increasing the efficiency of
[01:36:46] testing increasing the efficiency of your Pak development process so in
[01:36:50] your Pak development process so in summary the Expo testing solution
[01:36:52] summary the Expo testing solution combines advanced hardware and software
[01:36:55] combines advanced hardware and software to deliver a sance and high performance
[01:36:58] to deliver a sance and high performance testing experience whether you're
[01:37:00] testing experience whether you're working with wers multi-d or single D
[01:37:03] working with wers multi-d or single D test this solution is designed to meet
[01:37:06] test this solution is designed to meet your needs with precision and efficiency
[01:37:09] your needs with precision and efficiency thank you for your attention thank you
[01:37:12] thank you for your attention thank you for your presentation and thank you for
[01:37:13] for your presentation and thank you for being with us so engaged and I know very
[01:37:16] being with us so engaged and I know very much that we need to make a an event
[01:37:18] much that we need to make a an event like this one only on testing because
[01:37:20] like this one only on testing because there are so many things to to discuss
[01:37:23] there are so many things to to discuss especially on the standardized solutions
[01:37:25] especially on the standardized solutions for testing I I see that Philip got
[01:37:27] for testing I I see that Philip got really happy with what he just said
[01:37:29] really happy with what he just said let's continue and this is the final
[01:37:31] let's continue and this is the final presentation of this fantastic session
[01:37:32] presentation of this fantastic session we always want to keep the best for the
[01:37:34] we always want to keep the best for the last because 269 of you stay till the
[01:37:37] last because 269 of you stay till the end and this presentation is coming from
[01:37:40] end and this presentation is coming from a center that is supporting optic I like
[01:37:43] a center that is supporting optic I like no one else I'm talking of course about
[01:37:45] no one else I'm talking of course about imch in Belgium and we want to welcome
[01:37:48] imch in Belgium and we want to welcome Le shaming who's going to talk about
[01:37:50] Le shaming who's going to talk about recent developments on volume
[01:37:52] recent developments on volume Manufacturing in a im but most important
[01:37:55] Manufacturing in a im but most important how they can work with all of you and
[01:37:57] how they can work with all of you and what challenges they have for you thank
[01:37:59] what challenges they have for you thank you very much l for being with us thank
[01:38:01] you very much l for being with us thank you for closing the meeting style the
[01:38:03] you for closing the meeting style the floor and the attention of everyone goes
[01:38:06] floor and the attention of everyone goes to you hello um do you hear me loud and
[01:38:10] to you hello um do you hear me loud and clear okay uh so I'm Le shamin portfolio
[01:38:15] clear okay uh so I'm Le shamin portfolio manager at iMac uh so I will cover the
[01:38:20] manager at iMac uh so I will cover the uh silicon photonics platform offering
[01:38:22] uh silicon photonics platform offering so we are
[01:38:24] so we are uh Peak provider that will be uh part of
[01:38:28] uh Peak provider that will be uh part of my presentation but also ongoing
[01:38:30] my presentation but also ongoing development that will include the
[01:38:33] development that will include the heterogenous integration and also the
[01:38:36] heterogenous integration and also the work that we have started in the
[01:38:39] work that we have started in the packaging site so looking to the
[01:38:42] packaging site so looking to the shortage interconnect Landscapes we uh
[01:38:46] shortage interconnect Landscapes we uh look at to the edgeband with density and
[01:38:48] look at to the edgeband with density and Energy Efficiency versus the
[01:38:51] Energy Efficiency versus the interconnect distance we see that
[01:38:54] interconnect distance we see that uh for the optical uh in with Optical
[01:38:57] uh for the optical uh in with Optical interconnects we can cover quite longer
[01:39:01] interconnects we can cover quite longer distance while these are uh uh distance
[01:39:05] distance while these are uh uh distance agnostic they are uh performance limited
[01:39:08] agnostic they are uh performance limited uh
[01:39:10] uh together in this uh regime we can cover
[01:39:14] together in this uh regime we can cover 800g or even 1.6 1.6 uh T products but
[01:39:21] 800g or even 1.6 1.6 uh T products but uh we always want to push uh toward uh
[01:39:24] uh we always want to push uh toward uh uh the left side and upper side of the
[01:39:27] uh the left side and upper side of the graph means uh toward shorter uh
[01:39:30] graph means uh toward shorter uh interconnection in iMac platform in 200
[01:39:33] interconnection in iMac platform in 200 mm platform we have F uh some number of
[01:39:36] mm platform we have F uh some number of uh components that it can start from uh
[01:39:41] uh components that it can start from uh simple uh spiral wave guides here in the
[01:39:44] simple uh spiral wave guides here in the middle of the image uh last year we have
[01:39:47] middle of the image uh last year we have uh in
[01:39:49] uh in ofc uh we have shown the 32 Channel wdm
[01:39:53] ofc uh we have shown the 32 Channel wdm pters this is uh the results that we
[01:39:57] pters this is uh the results that we have done we have achieved in 300
[01:40:00] have done we have achieved in 300 platform but uh the design is compatible
[01:40:02] platform but uh the design is compatible with 200 mm as well then other uh
[01:40:06] with 200 mm as well then other uh components passive devices silicon
[01:40:08] components passive devices silicon nutrite lpcvd silicon not
[01:40:11] nutrite lpcvd silicon not pcvd then vertical gring couplers or uh
[01:40:15] pcvd then vertical gring couplers or uh Edge couplers for horizontal coupling in
[01:40:18] Edge couplers for horizontal coupling in the active devices we have
[01:40:20] the active devices we have germanium photo high speed photo diot
[01:40:24] germanium photo high speed photo diot and silicon based modulators or
[01:40:27] and silicon based modulators or germanium silicon e for the trans
[01:40:32] germanium silicon e for the trans transmitter side are uh working up to 56
[01:40:36] transmitter side are uh working up to 56 gab per second so uh this can
[01:40:40] gab per second so uh this can enable uh 800g or uh even 1.6 uh t
[01:40:46] enable uh 800g or uh even 1.6 uh t plugable uh Optics uh uh products
[01:40:49] plugable uh Optics uh uh products looking further um a bit more detail in
[01:40:52] looking further um a bit more detail in the
[01:40:53] the platform we have started uh with uh iip
[01:40:57] platform we have started uh with uh iip uh 50g and then uh it was uh the basic
[01:41:02] uh 50g and then uh it was uh the basic devices that I
[01:41:03] devices that I mentioned moving forward we added other
[01:41:06] mentioned moving forward we added other functionality like pcvd Silicon NR UT
[01:41:11] functionality like pcvd Silicon NR UT for efficient heers and more recent
[01:41:14] for efficient heers and more recent platform uh is I 200n that V are we have
[01:41:18] platform uh is I 200n that V are we have added lpcvd silicon nide for uh uh CW DM
[01:41:23] added lpcvd silicon nide for uh uh CW DM filter or low loss wave guide or low
[01:41:26] filter or low loss wave guide or low loss Edge cers uh this platform in
[01:41:30] loss Edge cers uh this platform in combination with highspeed German photo
[01:41:33] combination with highspeed German photo detector uh is uh under development but
[01:41:37] detector uh is uh under development but for low speed photo detector it is
[01:41:39] for low speed photo detector it is already uh available so in they looking
[01:41:44] already uh available so in they looking to to uh road map and uh making
[01:41:48] to to uh road map and uh making connection with the with the technology
[01:41:52] connection with the with the technology and also um um the G 100 G or 200 g
[01:41:59] and also um um the G 100 G or 200 g perline um uh road map that we have uh
[01:42:03] perline um uh road map that we have uh uh put it here our technology can
[01:42:06] uh put it here our technology can provide up to this uh this uh step but
[01:42:10] provide up to this uh this uh step but for going further 3 uh uh T 3.2t and uh
[01:42:17] for going further 3 uh uh T 3.2t and uh means 400 G per Lane application that
[01:42:20] means 400 G per Lane application that will require uh that will require new uh
[01:42:23] will require uh that will require new uh material integration in the platform so
[01:42:27] material integration in the platform so those that I showed you um they are
[01:42:30] those that I showed you um they are Basics but we need to add new materials
[01:42:33] Basics but we need to add new materials like elome lithium Nate or in the
[01:42:37] like elome lithium Nate or in the detector side 35 devices or uh tsv for
[01:42:40] detector side 35 devices or uh tsv for the uh in the in the 3D stacking so we
[01:42:44] the uh in the in the 3D stacking so we see that this um heterogeneous
[01:42:47] see that this um heterogeneous integration it is in the critical pass
[01:42:50] integration it is in the critical pass for realization of 400g uh products and
[01:42:54] for realization of 400g uh products and today we are busy with integration metal
[01:42:58] today we are busy with integration metal selection and also uh supply chain
[01:43:01] selection and also uh supply chain enablement so that means in this graph
[01:43:05] enablement so that means in this graph we are uh bringing this uh blue tail of
[01:43:08] we are uh bringing this uh blue tail of the graph B in the higher side higher
[01:43:11] the graph B in the higher side higher hband with density we are uh making it
[01:43:15] hband with density we are uh making it uh efficient energy efficient and also
[01:43:18] uh efficient energy efficient and also going toward the uh shorter uh uh
[01:43:22] going toward the uh shorter uh uh distances however it is uh under
[01:43:25] distances however it is uh under development and it is uh uh something
[01:43:28] development and it is uh uh something that we need to tackle quite some
[01:43:30] that we need to tackle quite some challenges to uh to reach to uh that
[01:43:35] challenges to uh to reach to uh that point uh how we are doing this uh it is
[01:43:38] point uh how we are doing this uh it is using transfer printing technology that
[01:43:41] using transfer printing technology that um we are taking small pieces of
[01:43:44] um we are taking small pieces of material lithium Nate from Source wafer
[01:43:46] material lithium Nate from Source wafer to and transfer to the uh Target Vaper
[01:43:51] to and transfer to the uh Target Vaper uh we have shown that in the
[01:43:53] uh we have shown that in the Pro of concept phase we have
[01:43:56] Pro of concept phase we have demonstrated uh lithium liate modulators
[01:43:59] demonstrated uh lithium liate modulators integrated on uh ic200 platform uh
[01:44:03] integrated on uh ic200 platform uh working uh in the B with bandwidth of
[01:44:06] working uh in the B with bandwidth of more than uh 55 gahz and I diagram that
[01:44:09] more than uh 55 gahz and I diagram that we have measured is 70 gab bit per
[01:44:13] we have measured is 70 gab bit per second so this is a good uh results but
[01:44:17] second so this is a good uh results but uh there is room also for improvement we
[01:44:19] uh there is room also for improvement we are uh working on the design of
[01:44:23] are uh working on the design of optimization and also processing
[01:44:25] optimization and also processing optimization to uh go toward higher uh
[01:44:28] optimization to uh go toward higher uh band bits because lithium Nate on its
[01:44:31] band bits because lithium Nate on its own it is quite uh uh enabler Mater
[01:44:35] own it is quite uh uh enabler Mater material and in pure lithium Nate
[01:44:39] material and in pure lithium Nate platform it can go beyond 100 gahz
[01:44:45] Bandits so uh in so that was the new
[01:44:49] Bandits so uh in so that was the new developments that we are doing in the
[01:44:51] developments that we are doing in the platform s but also we are um we have um
[01:44:56] platform s but also we are um we have um uh seen request uh uh that uh from
[01:44:59] uh seen request uh uh that uh from customers they want to uh go beyond One
[01:45:03] customers they want to uh go beyond One Step Beyond the only silicon photonics
[01:45:07] Step Beyond the only silicon photonics die testing that means uh we need to add
[01:45:10] die testing that means uh we need to add uh some uh functionalities uh some um
[01:45:15] uh some uh functionalities uh some um features around the die to um uh make it
[01:45:19] features around the die to um uh make it uh more uh robust in in terms of test
[01:45:23] uh more uh robust in in terms of test and also uh it is one step further
[01:45:27] and also uh it is one step further toward the full packaging of course it
[01:45:30] toward the full packaging of course it it is uh something that we have started
[01:45:33] it is uh something that we have started uh recently together with a fix that we
[01:45:37] uh recently together with a fix that we are working on this it is uh starting uh
[01:45:40] are working on this it is uh starting uh it has been started with uh basic uh
[01:45:44] it has been started with uh basic uh devices in the platform on the uh
[01:45:47] devices in the platform on the uh silicon Edge couplers silicon notri U
[01:45:50] silicon Edge couplers silicon notri U cut Edge couplers also silicon uh
[01:45:53] cut Edge couplers also silicon uh grating couplers that we have designed
[01:45:57] grating couplers that we have designed uh based on fixed uh design guideline
[01:46:00] uh based on fixed uh design guideline and also assembly design kit uh from
[01:46:02] and also assembly design kit uh from them we have designed a specific test
[01:46:05] them we have designed a specific test sites that we are going to put in this
[01:46:08] sites that we are going to put in this uh uh characterization uh package uh of
[01:46:12] uh uh characterization uh package uh of fix key parameters that we need to
[01:46:16] fix key parameters that we need to monitor for Edge couplers are the
[01:46:18] monitor for Edge couplers are the insertion loss and grating couplers uh
[01:46:21] insertion loss and grating couplers uh insertion loss and big fa and Optical
[01:46:23] insertion loss and big fa and Optical Bandit that we uh need to monitor to
[01:46:27] Bandit that we uh need to monitor to ideally keep um as close as possible to
[01:46:30] ideally keep um as close as possible to the uh D level and wafer level uh
[01:46:35] the uh D level and wafer level uh performance before packaging so this is
[01:46:38] performance before packaging so this is uh an ongoing development um and we are
[01:46:41] uh an ongoing development um and we are working with uh fix to to uh make uh
[01:46:45] working with uh fix to to uh make uh make it happen uh and
[01:46:48] make it happen uh and ultimately this uh we need to um make it
[01:46:52] ultimately this uh we need to um make it a bit more mature to uh include as part
[01:46:55] a bit more mature to uh include as part of offering to uh to our
[01:46:59] of offering to uh to our customers yeah that's it from my side
[01:47:01] customers yeah that's it from my side thank you very much l thank you so much
[01:47:03] thank you very much l thank you so much and it's so great to have Excel print
[01:47:06] and it's so great to have Excel print Kev in the room hit you you want to know
[01:47:09] Kev in the room hit you you want to know more about this fantastic technology me
[01:47:11] more about this fantastic technology me printing please contact contact Kevin
[01:47:14] printing please contact contact Kevin contact Le because this technology can
[01:47:16] contact Le because this technology can really revolutionize heterogeneous
[01:47:18] really revolutionize heterogeneous integration but the question is very
[01:47:19] integration but the question is very clear and Milan milosovic from fix is
[01:47:21] clear and Milan milosovic from fix is asking the right question
[01:47:23] asking the right question when do you expect to have a fully
[01:47:26] when do you expect to have a fully developed and qualified microing
[01:47:28] developed and qualified microing printing process and I will add at wafer
[01:47:33] printing process and I will add at wafer level yeah so we are working on uh on
[01:47:36] level yeah so we are working on uh on that toward uh making a path uh uh
[01:47:41] that toward uh making a path uh uh available for production today it is not
[01:47:44] available for production today it is not closed yet I don't have um immediately
[01:47:47] closed yet I don't have um immediately answer for that but indeed today it is
[01:47:50] answer for that but indeed today it is in proof of concept phase uh uh and that
[01:47:54] in proof of concept phase uh uh and that itself has its own challenges to to
[01:47:58] itself has its own challenges to to tackle but uh we are in parallel working
[01:48:01] tackle but uh we are in parallel working uh toward uh preparing supply chain and
[01:48:05] uh toward uh preparing supply chain and making a production path ready uh for
[01:48:08] making a production path ready uh for that technology also it is a discussion
[01:48:11] that technology also it is a discussion that we are doing with different
[01:48:14] that we are doing with different uh sub different uh companies but uh
[01:48:18] uh sub different uh companies but uh today that's that discussion is not
[01:48:20] today that's that discussion is not closed yet you know what is close what
[01:48:23] closed yet you know what is close what is close is the meeting because we are
[01:48:25] is close is the meeting because we are 16 minute after the time I would like to
[01:48:27] 16 minute after the time I would like to say that this meeting has been fantastic
[01:48:29] say that this meeting has been fantastic fascinating after the roll out credits
[01:48:32] fascinating after the roll out credits all of you who want to stay for a drink
[01:48:34] all of you who want to stay for a drink and network with each other you can stay
[01:48:36] and network with each other you can stay here in the Z room for those who have to
[01:48:37] here in the Z room for those who have to go please feel free to go with the
[01:48:39] go please feel free to go with the satisfaction of a work well done because
[01:48:41] satisfaction of a work well done because it was young PE it was a great great
[01:48:44] it was young PE it was a great great meeting let me say goodbye to the people
[01:48:47] meeting let me say goodbye to the people in YouTube
[01:48:53] [Music]
[01:49:21] I don't know how many presentation we
[01:49:23] I don't know how many presentation we did in 1 hour and 47 minutes go record
[01:49:27] did in 1 hour and 47 minutes go record of attendance as well 1,000 people in
[01:49:29] of attendance as well 1,000 people in the zoom room at well register for this
[01:49:31] the zoom room at well register for this meeting at some point really crazy great
[01:49:33] meeting at some point really crazy great job John great job everyone

https://www.youtube.com/watch?v=eoD1nyFnhY4

Summary

TL;DR — This Optica online industry meeting focused on the challenges and advancements in photonic integrated circuit (PIC) packaging for volume production. Key discussions revolved around integrating photonics with electronics, moving towards chiplet-style packaging, and the role of pilot lines in scaling up manufacturing. The event highlighted the need for collaboration between industry players to overcome hurdles in cost reduction, standardization, and automation.

Key points

• The industry is shifting towards advanced, complex packaging solutions, mirroring trends in the microelectronics sector, with a move towards chiplet-style integration and Ball Grid Array (BGA) packages.

• Heterogeneous integration is crucial, enabling the co-packaging of electronic and photonic components to improve data bandwidth and efficiency, particularly for AI and AR/VR applications.

• Pilot lines, such as the new PIX Europe initiative, are essential for developing and transferring advanced packaging technologies, design rules, and enabling industry access to facilities.

• Key challenges include precision alignment, thermal management, co-packaging with electronics, and the cost-effective integration of components like polarization-maintaining fiber arrays.

• Advancements in materials like glass interposers, additive manufacturing for micro-optics, and novel laser integration techniques are paving the way for scalable and cost-effective PIC solutions.

• Standardization in assembly, testing, and design kits (ADKs/PDKs) is vital for seamless integration across the ecosystem, from design to volume production.

Takeaway — Overcoming the challenges in PIC packaging for volume production requires a collaborative ecosystem approach, leveraging pilot lines, advanced materials, and standardized processes to meet the growing demand for high-performance optical interconnects.