# Optica Online Industry Meeting: PIC Manufacturing, Packaging and Testing

https://www.youtube.com/watch?v=nirikI4oGvQ

[00:05] 1 2 3 1 2 3 if you are an investor in.
[00:09] 1 2 3 1 2 3 if you are an investor in photonics you'll recognize where I'm.
[00:10] photonics you'll recognize where I'm standing hello from Frank for mes which.
[00:14] standing hello from Frank for mes which will be the venue for the Eco conference.
[00:17] will be the venue for the Eco conference 2024 and it's the 50th time that the.
[00:20] 2024 and it's the 50th time that the European conference on optical.
[00:22] European conference on optical Communications will be organized now you.
[00:25] Communications will be organized now you may know that Optica is an official.
[00:27] may know that Optica is an official media partner with Eco.
[00:31] media partner with Eco we contribute to the events like the top.
[00:33] we contribute to the events like the top conference in London and they help to.
[00:35] conference in London and they help to support all events around the world and.
[00:39] support all events around the world and when it comes to the Eco conference 2024.
[00:42] when it comes to the Eco conference 2024 in September we have a lot planned for.
[00:45] in September we have a lot planned for the more than 6,000 people and 300.
[00:47] the more than 6,000 people and 300 companies many of then Optica corporate.
[00:50] companies many of then Optica corporate members expected to show up Optica will.
[00:54] members expected to show up Optica will contribute to the sessions we will do.
[00:56] contribute to the sessions we will do the live interviews on the exhibition.
[00:57] the live interviews on the exhibition floor and we will organize the annual.
[01:00] floor and we will organize the annual Optica VIP Eco reception for our.
[01:03] Optica VIP Eco reception for our corporate members but it's going to be a.
[01:06] corporate members but it's going to be a little bit different this year since we.
[01:08] little bit different this year since we are at the financial capital of Europe.
[01:10] are at the financial capital of Europe and many of our corporate members are.
[01:12] and many of our corporate members are looking for investment and investing.
[01:14] looking for investment and investing opportunities let me show you the.
[01:17] opportunities let me show you the spectacular location we have found I am.
[01:20] spectacular location we have found I am at the Austin next to the main river and.
[01:23] at the Austin next to the main river and in front of the European Central Bank.
[01:26] in front of the European Central Bank and this will be the location for the.
[01:29] and this will be the location for the optica executive reception at EO 2024 on.
[01:33] optica executive reception at EO 2024 on September.
[01:36] September 23rd I am in Montreal Canada and behind.
[01:39] 23rd I am in Montreal Canada and behind me is the shum Hospital one of the most.
[01:42] me is the shum Hospital one of the most important hospitals in this country this.
[01:45] important hospitals in this country this will be the host of the Optica Medtech.
[01:49] will be the host of the Optica Medtech industry Summit next 8th of October do.
[01:52] industry Summit next 8th of October do you know that it takes about 10 years to.
[01:54] you know that it takes about 10 years to put photonic Innovation into the medical.
[01:57] put photonic Innovation into the medical Market bringing technology to save lives.
[02:00] Market bringing technology to save lives in photonics is the biggest valy of.
[02:03] in photonics is the biggest valy of death how can we solve this in our.
[02:06] Death, how can we solve this? In our opinion, we need to create a forum of opinion.
[02:08] We need to create a forum of discussion between companies developing photonic technology, medical doctors, policy makers, and regulatory institutions.
[02:13] Let's do that at a different hospital every year, and let's start right now on the 8th and 9th of October.
[02:23] The Shun Hospital will host companies from all over the world at executive level, discussing the photonics technology, the road map towards medical trials, and which companies can play a role to help them get there faster.
[02:35] See you in Montreal on the 8th of October.
[02:53] On Tuesday, August 27th at 10:00 a.m. EST, we start our new season of online industry meetings.
[02:56] This one is focused on the critical aspects for the future of photonic integrated circuits.
[03:08] future of photonic integrated circuits manufacturing packaging and testing as
[03:12] manufacturing packaging and testing as usual our online Gathering will be
[03:14] usual our online Gathering will be divided into two groups integrators of
[03:16] divided into two groups integrators of the technology so-called the buyers and
[03:19] the technology so-called the buyers and solution providers this time we will
[03:22] solution providers this time we will hear the demands of global fundies from
[03:25] hear the demands of global fundies from Vias Gupta Sumitomo electric Industries
[03:29] Vias Gupta Sumitomo electric Industries from yasutaka mitsuno and the European
[03:33] from yasutaka mitsuno and the European pilot line pix up from Peter O'Brien and
[03:36] pilot line pix up from Peter O'Brien and the least today enablers will include
[03:39] the least today enablers will include the leading arand Center imch
[03:42] the leading arand Center imch represented by Philip Susan the oat fix
[03:46] represented by Philip Susan the oat fix represented by Stefan heinan as well as
[03:50] represented by Stefan heinan as well as Simone cardarelli micro align Philip dri
[03:55] Simone cardarelli micro align Philip dri Keystone photonics laa horang Vanguard
[03:59] Keystone photonics laa horang Vanguard automation
[04:00] automation Martin roer fine Alex Vu suruga Seiki
[04:06] Martin roer fine Alex Vu suruga Seiki Alexander Harvick Del Jani pre Vis
[04:11] Alexander Harvick Del Jani pre Vis Robotics and Jor es molinski from.
[04:15] Robotics and Jor es molinski from nanoscribe the meeting will address the.
[04:17] Nanoscribe the meeting will address the unique challenges in Peak assembly and.
[04:20] Unique challenges in Peak assembly and test including number one need for.
[04:23] Precision Alignment number two effective.
[04:27] Thermal management and number three how.
[04:30] Do you test the final result using.
[04:32] Electrical and Optical proving and we.
[04:36] Will discuss the shift towards wafer.
[04:38] level capable processes as well as.
[04:41] Volume ramping up and you can also watch.
[04:43] Live on YouTube later the meeting is on.
[04:46] Tuesday August 27 at 10:00 a.m. EST at.
[04:50] 3: p.m. in London at 400 p.m. here in.
[04:54] Malaga and at any other time in the.
[04:57] World because we are Global we.
[05:18] Optica I hope all of you went to the beach had a great summer and I now looking forward to the start of this industry meeting we are only four weeks away to go back to Malaga where you saw the video a me for the global photonics economic Forum I think most of you will be there thank you very much for the immense support of bringing the industry together most of the main leaders of photon worldwide are going to come to Malaga to discuss the future of our industry we want this event to continue happening so I expect to see many of you I think all of you in Malaga this year and now let's start the meeting this meeting is very important for many reasons I'm back in Washington DC it's sunny outside and we have had a really interesting summer news were coming from companies like Intel we had this huge thing with Microsoft Cisco has something to comment to the last weeks the industry is looking at an impass and we are now at a moment in which photonic inity circuits
[06:19] moment in which photonic inity circuits have to develop and have to make it.
[06:21] have to develop and have to make it there to be the solution for the Next.
[06:23] there to be the solution for the Next Generation semiconductor Industries and.
[06:25] Generation semiconductor Industries and for that we need PS that can be.
[06:27] for that we need PS that can be manufactured package and test and I can.
[06:30] manufactured package and test and I can tell you the people with me in this.
[06:32] tell you the people with me in this meeting room today have the solution so.
[06:35] meeting room today have the solution so let's talk together so we can make it.
[06:37] let's talk together so we can make it all together a reality and I would like.
[06:39] all together a reality and I would like to say I would like to start the meeting.
[06:40] to say I would like to start the meeting by reminding everyone this meeting is.
[06:43] by reminding everyone this meeting is open for everyone to participate all of.
[06:45] open for everyone to participate all of you here today with me all of you here.
[06:47] you here today with me all of you here today with me are participants of an.
[06:50] today with me are participants of an event that is open for everyone so.
[06:52] event that is open for everyone so please at any time when you have a.
[06:54] please at any time when you have a question raise your hand and tell us.
[06:56] question raise your hand and tell us everything that is on your mind do not.
[06:58] everything that is on your mind do not shy away from participating.
[07:00] shy away from participating let's start and I would like to tell you.
[07:02] let's start and I would like to tell you that this meeting is sponsored by three.
[07:06] that this meeting is sponsored by three companies that are corporate member of.
[07:07] companies that are corporate member of optica and they have developed fantastic.
[07:09] optica and they have developed fantastic technology the first one is the one.
[07:11] technology the first one is the one everyone is talking about all the way.
[07:13] everyone is talking about all the way from Israel new photonics they have new.
[07:17] new technology to advance the speed of.
[07:20] technology to advance the speed of silicon photonics bare silicon.
[07:22] silicon photonics bare silicon modulators at ultra high speed enabling.
[07:24] modulators at ultra high speed enabling 200 gig per Lane the second one is optic.
[07:26] 200 gig per Lane the second one is optic wave the software company providing.
[07:28] wave the software company providing simulation and design solutions and they.
[07:31] simulation and design solutions and they are actually here to help us making.
[07:33] are actually here to help us making better designs and send that better GDs.
[07:36] better designs and send that better GDs file to foundries and the last one last.
[07:39] file to foundries and the last one last but definitely not least the European.
[07:41] but definitely not least the European OSAT for the packaging and test of.
[07:44] OSAT for the packaging and test of photonic interet circuits all the way.
[07:46] photonic interet circuits all the way from En in the Netherlands pcks with the.
[07:49] sponsors we built the standard format for the online industry meetings we receive.
[07:53] the online industry meetings we receive fantastic feedback from this one.
[07:55] fantastic feedback from this one we have two group of companies.
[07:57] two group of companies the first one are the integrated s the adopters those.
[07:58] the integrated s the adopters those companies are going to give.
[08:01] companies are going to give presentations of six minutes and tell us.
[08:02] presentations of six minutes and tell us what they need from apps today.
[08:04] what they need from apps today we have pix up Global fundies Sumit Tomo.
[08:06] pix up Global fundies Sumit Tomo electric and fix and then we have the.
[08:09] electric and fix and then we have the enablers those companies who have a.
[08:11] enablers those companies who have a solution that could help this.
[08:13] solution that could help this integrators with their main challenges.
[08:15] integrators with their main challenges and today the companies who register and.
[08:17] and today the companies who register and told us something in advance are micro.
[08:19] micro.
[08:21] told us something in advance are micro line Kon photonics vangard automation IM.
[08:24] line Kon photonics vangard automation IM P surasi de Vis robotics nanoscribe.
[08:27] P surasi de Vis robotics nanoscribe Alvis new photonics and op wave but many.
[08:31] Alvis new photonics and op wave but many more companies register for this meeting.
[08:33] more companies register for this meeting these are the Optica corporate members.
[08:36] these are the Optica corporate members that register for this meeting today.
[08:38] that register for this meeting today either they will be live in the Z room.
[08:41] either they will be live in the Z room or following the meeting YouTube or.
[08:42] or following the meeting YouTube or watching afterwards if you want to get.
[08:44] watching afterwards if you want to get in touch with any any of the.
[08:46] in touch with any any of the participants today all you have to do is.
[08:48] participants today all you have to do is send us an email and Olga and I will be.
[08:50] send us an email and Olga and I will be more than happy to make the introduction.
[08:52] more than happy to make the introduction and before I give the floor to the first.
[08:54] and before I give the floor to the first Speaker I would like to remind everyone.
[08:55] Speaker I would like to remind everyone that this meeting is live stream in.
[08:57] that this meeting is live stream in YouTube so hello Youtubers of the world.
[09:00] YouTube so hello Youtubers of the world if you have a question please WR it in.
[09:01] if you have a question please WR it in the chat and we'll be more than happy to.
[09:02] the chat and we'll be more than happy to read into the room and also please.
[09:04] read into the room and also please remind everyone that if you want to find.
[09:07] remind everyone that if you want to find the slides of these presentations the.
[09:09] the slides of these presentations the slides of any other event or market.
[09:12] slides of any other event or market reports and we got more than 100 market.
[09:14] reports and we got more than 100 market reports available go to opa.gov.
[09:29] but not least let me remind that in a couple of weeks on the 24th of September.
[09:34] our next online industry meeting is on energy on the 22nd of October.
[09:39] we have a fantastic meeting on virtual reality 19 November ligher.
[09:44] and we'll finish this season with Quantum communication.
[09:46] you can already register in your website at opticor industry.
[09:51] register as soon as possible and tell us as soon as possible.
[09:53] it we like to contribute with one slide or you have some challenges that the companies can help you with.
[09:59] and with this I would like to give the floor to the first Speaker today.
[10:03] and the first Speaker comes the way from Ireland.
[10:06] for many years he's being a master of connecting companies and setting up pilot line for the manufacturing.
[10:14] for the packaging for the test of photonic integrated circuits.
[10:16] he really has been working with with me on my previous job.
[10:22] and on this one and it's an honor and a pressure to give the role to give the the floor to the director of pixa coming all the way from the National Institute.
[10:31] all the way from the National Institute Peter O'Brien Peter thank you very much.
[10:33] Peter O'Brien Peter thank you very much for being with us today from Washington.
[10:35] for being with us today from Washington to Cork the floor and the attention 31 is yours.
[10:38] thanks Jose thanks for inviting me and the introduction and thanks to Olga for organizing.
[10:41] so i' share my screen hopefully you can see it.
[10:43] I'll go to full screen um is is is that okay.
[10:45] perfect perfect okay so um as Jose said.
[10:47] uh I i' director of pix up packaging pilot line the European packaging pilot line.
[10:50] we've been running for a number of years.
[10:55] however I want to kind of take a step back a little bit because you may have seen a lot of the services that we provide.
[10:57] uh but really um an important thing is where we're where we're going with new technologies and historically a lot of the Technologies we've developed are very much package level.
[11:00] so by that I mean the pack the the packaging is done in the actual box or the gold box or the package itself and that could be very slow.
[11:01] it a it's a it's a Serial process.
[11:32] slow it a it's a it's a Serial process um and it's not really wafer level so.
[11:34] um and it's not really wafer level so the move to wafer level photonic and.
[11:36] the move to wafer level photonic and electronic can the co- packaging is.
[11:38] electronic can the co- packaging is really really.
[11:39] really really important and you you've probably seen me present this type of uh organic.
[11:44] organogram kind of chart previously so.
[11:47] looking at the different aspects of optical and electrical and integration.
[11:51] optical and electrical and integration using for example hybrid hetrogeneous.
[11:53] using for example hybrid hetrogeneous and the thermal and the mechanical uh uh aspects of all of this and in one way it captures everything pretty well and.
[11:58] captures everything pretty well and especially in Optics you see you've got so many choices it can be very confusing.
[12:02] especially in Optics you see you've got so many choices it can be very confusing for especially for new entrance into the.
[12:06] pck world the integrated photonic world and which way you go which Foundry you use because that really can have big implications on on packaging which which takes a large amount of the cost but.
[12:10] use because that really can have big implications on on packaging which which takes a large amount of the cost but what we're definitely seeing and and.
[12:15] what we're definitely seeing and and this is just one example the actual chips are getting much more complex H.
[12:17] chips are getting much more complex H very large numbers of uh Optical channels uh thousands of electrical channels um and over 100 so in this case it's it's less than 100 but we do see.
[12:23] very large numbers of uh Optical channels uh thousands of electrical channels um and over 100 so in this case it's it's less than 100 but we do see.
[12:25] channels uh thousands of electrical channels um and over 100 so in this case it's it's less than 100 but we do see.
[12:27] channels um and over 100 so in this case it's it's less than 100 but we do see.
[12:30] um and over 100 so in this case it's it's less than 100 but we do see.
[12:32] it's it's less than 100 but we do see cases now where we're we're being asked.
[12:34] cases now where we're we're being asked to look at H packaging hundreds of.
[12:36] to look at H packaging hundreds of channels you know for AI and these types.
[12:39] channels you know for AI and these types of applications the optical and the.
[12:41] of applications the optical and the electrical interconnect density is.
[12:43] electrical interconnect density is really starting to.
[12:44] really starting to increase so um things like fiber arrays.
[12:47] increase so um things like fiber arrays are becoming prohibitive um in in in.
[12:50] are becoming prohibitive um in in in packaging Solutions so um and again in.
[12:53] packaging Solutions so um and again in the large volumes that are required the.
[12:55] the large volumes that are required the package level approach part by part at a.
[12:58] package level approach part by part at a time is really not scalable so we've.
[13:00] time is really not scalable so we've been working um on a number of projects.
[13:03] been working um on a number of projects and one of them I mention here is fonic.
[13:04] and one of them I mention here is fonic Leap um and it's essentially using an.
[13:07] Leap um and it's essentially using an interposer so I I'll talk about glass in.
[13:09] interposer so I I'll talk about glass in particular so essentially where you co-.
[13:11] particular so essentially where you co- package electrical and photonic devices.
[13:14] package electrical and photonic devices uh for example silicon photonic devices.
[13:17] uh for example silicon photonic devices on a common interposer platform and that.
[13:19] on a common interposer platform and that interposer platform then acts as the.
[13:21] interposer platform then acts as the base of the package so for example you.
[13:23] base of the package so for example you use a ball grid array as you see here um.
[13:26] use a ball grid array as you see here um and have out coupling so out of plane op.
[13:29] and have out coupling so out of plane op to coupling using microoptics and.
[13:31] to coupling using microoptics and microoptics are becoming very important.
[13:33] microoptics are becoming very important in terms of um enabling pluggable.
[13:36] in terms of um enabling pluggable connectors.
[13:38] connectors Optical connectors moving away from bonding the fibers directly.
[13:40] away from bonding the fibers directly onto the photonic chip itself so it enables 2D arrays and mass scaling and.
[13:46] enables 2D arrays and mass scaling and also um as I say wafer level kind of parallel uh processing using more.
[13:51] parallel uh processing using more conventional.
[13:52] conventional electrical so I'm limited in time so.
[13:54] electrical so I'm limited in time so I'll just really jump in and show where.
[13:56] I'll just really jump in and show where we are for example in in this in this project photonic leap we work with.
[13:59] project photonic leap we work with partners for example frown Hofer mm Institute in Berlin where we're developing these glass material and the.
[14:05] developing these glass material and the advantage of glass is it's it's also being used in electrical worlds and in.
[14:09] advantage of glass is it's it's also being used in electrical worlds and in this case we're just using it for electrical packaging so essentially.
[14:12] electrical packaging so essentially we're flipping silicon and Indian phosphide devices onto that glass.
[14:16] phosphide devices onto that glass interposer now we're working with fairly small diameter Wafers 200 mm but you can go to very large panels um and here you can see kind of a top down looking at the vas so we got true V ORF DC lines.
[14:27] the vas so we got true V ORF DC lines you can create very high density odl redistribution alerts multi-level um and.
[14:36] redistribution alerts multi-level um and then flip your devices um and I'll show.
[14:38] then flip your devices um and I'll show in a moment how we can achieve that out.
[14:40] of playing coupling so again Glass is very good because of its cost it's a.
[14:42] very good because of its cost it's a very um you know stable material and.
[14:44] very um you know stable material and also um ORF from an RF perspective and.
[14:47] also um ORF from an RF perspective and something we want to do in the future is.
[14:50] something we want to do in the future is you can embed Optical wave guides in glass.
[14:51] you can embed Optical wave guides in glass so you can use different techniques to embed.
[14:53] glass so you can use different techniques to embed so essentially you can have an optical and an electrical interposer at the same time and that's.
[14:55] techniques to embed so essentially you can have an optical and an electrical interposer at the same time and that's really really exciting.
[14:57] really really exciting so you know in in our project and one of the things we we really push in in pix apppp is the development of design rules.
[14:59] so you know in in our project and one of the things we we really push in in pix apppp is the development of design rules.
[15:01] development of design rules so much like a pdk a process design kit we want to develop an adk assembly design kit.
[15:04] a pdk a process design kit we want to develop an adk assembly design kit so layout rules and and and we've been working on that.
[15:06] so layout rules and and and we've been working on that so developing kind of standardized layout uh for vs SI and Via Dimensions H pitch and so forth and and different types of you know mization schemes and 10 solder for flip chip.
[15:08] working on that so developing kind of standardized layout uh for vs SI and Via Dimensions H pitch and so forth and and different types of you know mization schemes and 10 solder for flip chip.
[15:10] standardized layout uh for vs SI and Via Dimensions H pitch and so forth and and different types of you know mization schemes and 10 solder for flip chip.
[15:12] and and different types of you know mization schemes and 10 solder for flip chip.
[15:15] schemes and 10 solder for flip chip another important aspect as you seen in this this particular image here.
[15:17] chip another important aspect as you seen in this this particular image here this is flip chip of an Indian phosphide.
[15:19] seen in this this particular image here this is flip chip of an Indian phosphide.
[15:37] this is flip chip of an Indian phosphide chip out of plane coupling so you know.
[15:39] chip out of plane coupling so you know getting that out of plane coupling and.
[15:41] getting that out of plane coupling and having a columnated expanded beam where.
[15:43] having a columnated expanded beam where we can have a pluggable connector.
[15:44] we can have a pluggable connector basically like a a plugable um.
[15:46] basically like a a plugable um electrical connector we want to do the.
[15:48] electrical connector we want to do the same in the optical domain and as you.
[15:50] same in the optical domain and as you can see it can be a 2d array so.
[15:52] can see it can be a 2d array so increasing the uh the actual of a.
[15:54] increasing the uh the actual of a shoreline density of of optical wave.
[15:57] shoreline density of of optical wave guides so working with focus light who.
[16:00] guides so working with focus light who are formally sus micro Optics you can.
[16:02] are formally sus micro Optics you can see here we developed this outter plane.
[16:05] see here we developed this outter plane um micr lens array so essentially what.
[16:07] um micr lens array so essentially what you see here is a cross-section of that.
[16:09] you see here is a cross-section of that micro lens um so we've got a a micro.
[16:13] micro lens um so we've got a a micro prism a turning prism and that actually.
[16:15] prism a turning prism and that actually is a packaged to the edge of the pick so.
[16:18] is a packaged to the edge of the pick so essentially just slots to the edge of.
[16:19] essentially just slots to the edge of the pick and we get that outter plane.
[16:20] the pick and we get that outter plane coupling so that enables this kind of.
[16:22] coupling so that enables this kind of plugable surface connector and what you.
[16:25] plugable surface connector and what you see here then is working with fch you're.
[16:27] see here then is working with fch you're also here located at Tim Sy um.
[16:30] also here located at Tim Sy um developing automated pickup tools and.
[16:32] developing automated pickup tools and bonding tools so won't won't spend uh.
[16:34] bonding tools so won't won't spend uh all the time in this video but it's.
[16:36] all the time in this video but it's there quite a number of features here.
[16:38] There quite a number of features here for example you see picking up the actual glass interposer.
[16:42] I'll speed through the video um but we've had to modify those machines because for example using laser laser Inu soldering.
[16:50] So coming from the top of the actual uh package so I'm modifying the pickup tools you know the alignment tools.
[16:56] You can see the ordl here and I'll just quickly speed on to the actual soling process itself um so here you see the actual pickup tool um with the window coming from the top.
[17:07] So again you need to design the tools such that they can be compatible with the with the flip chip process and um again working on uh the actual solder Reflow.
[17:17] So here we're bonding the actual pick onto the glass interposer so um and I won't H spend too long here on this particular video but you can see um just towards the end we need to velop the Reflow um and that use an IR camera to to Monitor and give feedback to actual uh the actual uh chip uh so we can Reflow the chip and keep.
[17:38] uh so we can Reflow the chip and keep that temperature stable so the message
[17:40] that temperature stable so the message here is designing the equipment hand in hand
[17:42] here is designing the equipment hand in hand with the interposers and the chips
[17:44] hand with the interposers and the chips is really really important and the
[17:46] is really really important and the equipment becomes part of that assembly
[17:48] equipment becomes part of that assembly design kit and here you can see
[17:50] design kit and here you can see cross-section where we're flipping the
[17:52] cross-section where we're flipping the piics and with the eic's and you see the
[17:55] piics and with the eic's and you see the the different multi-level of odl layers
[17:58] the different multi-level of odl layers the the bias and so forth which you can
[18:00] the the bias and so forth which you can incorporate into those interposers and
[18:02] incorporate into those interposers and very importantly near the end of my
[18:04] very importantly near the end of my slides here very importantly one of the
[18:07] slides here very importantly one of the things we've been developing is these
[18:08] things we've been developing is these what we call reference chips so
[18:10] what we call reference chips so essentially these are dummy mechanical
[18:12] essentially these are dummy mechanical electrical samples and Optical samples
[18:14] electrical samples and Optical samples they're not functionally active but they
[18:16] they're not functionally active but they enabled us to flip and package devices
[18:19] enabled us to flip and package devices and look at basic performance looking at
[18:22] and look at basic performance looking at for example we've got Loop backs on the
[18:24] for example we've got Loop backs on the optical chip we have ORF Loop backs
[18:26] optical chip we have ORF Loop backs looking at ORF we have um Heat on the
[18:29] looking at ORF we have um Heat on the chip where we can look at heating so for
[18:31] chip where we can look at heating so for example if you have a power device
[18:33] example if you have a power device you're inducing Heating and again then
[18:35] you're inducing Heating and again then we can test and look at you know pitch
[18:38] we can test and look at you know pitch and so forth on these types of new
[18:40] and so forth on these types of new packaging platforms so these reference
[18:42] packaging platforms so these reference chips are proven to be a very valuable
[18:45] chips are proven to be a very valuable kind of tool in development of packaging
[18:47] kind of tool in development of packaging Solutions so really in summary what we
[18:49] Solutions so really in summary what we see is fonic packages are becoming much
[18:51] see is fonic packages are becoming much more complex really driven by demands
[18:54] more complex really driven by demands like Ai and co- packaging where we see a
[18:56] like Ai and co- packaging where we see a large increase in the number of optical
[18:58] large increase in the number of optical electrical channels for example in
[19:00] electrical channels for example in Optical we need to go over a 100
[19:02] Optical we need to go over a 100 channels well over 100 channels into the
[19:04] channels well over 100 channels into the future so that's becoming really really
[19:06] future so that's becoming really really important co-packaging with electronics
[19:08] important co-packaging with electronics is essential so for example developing a
[19:11] is essential so for example developing a common interposer where we support both
[19:14] common interposer where we support both Optical and electrical is really the way
[19:16] Optical and electrical is really the way forward and the interposer enables wafer
[19:18] forward and the interposer enables wafer level processes glass is ideal because
[19:21] level processes glass is ideal because we can start to integrate Optical wave
[19:23] we can start to integrate Optical wave goodes so besides having electrical odl
[19:26] goodes so besides having electrical odl electrical redistribution lurs we can
[19:28] electrical redistribution lurs we can have Optical redistribution LS as well
[19:31] have Optical redistribution LS as well so Fanning in and Fanning out these
[19:32] so Fanning in and Fanning out these Optical wave goods and critically
[19:35] Optical wave goods and critically developing the packaging equipment to
[19:37] developing the packaging equipment to support these wafer level processes is
[19:39] support these wafer level processes is extremely important so having companies
[19:42] extremely important so having companies like Fon tech for example onsite here at.
[19:44] Fon tech for example onsite here at timle really enables us to achieve some of those goals so Jose thanks very much.
[19:49] I don't know if you want to open it to questions um but uh that's great thank you Peter as usual we have lots of questions but this is a collaboration opportunity also going to be in Malaga in four weeks with us.
[20:00] Sure please tell us what are in your opinion the the the the one or two main challenges you one to companies solutions that you will be very happy to find out during this morning.
[20:11] Sure sure well one of the big areas that we really need to work on is linking up the foundaries the pcks so for example looking at addressing a common Optical interface we see so many.
[20:22] I mentioned this earlier on um I do believe processes like evanes and coupling where we flipped it device onto the interposer and we can evanescently couple into a glass wave guide on a common electrical Optical interposer.
[20:35] I do believe that's that's very very important it really enables us to um address some of these Optical interconnect and co- packaging.
[20:43] interconnect and co- packaging challenges microoptics very very
[20:45] challenges microoptics very very important microoptics enable us to move
[20:48] important microoptics enable us to move away from bonding fibers directly onto
[20:50] away from bonding fibers directly onto the pick so microoptics and you know the
[20:53] the pick so microoptics and you know the Silicon the Indian phosphide pick
[20:56] Silicon the Indian phosphide pick Foundry compatibility with the um with
[20:59] Foundry compatibility with the um with the uh packaging is very two top level
[21:02] the uh packaging is very two top level two top priorities I would say Jose I
[21:04] two top priorities I would say Jose I would have a lot of questions for you
[21:06] would have a lot of questions for you I'm going to go to the question before
[21:07] I'm going to go to the question before that I need to say hello to a very
[21:09] that I need to say hello to a very important person for me hello puya diat
[21:12] important person for me hello puya diat from qci how are you doing today I'm
[21:15] from qci how are you doing today I'm good I'm good hi good to see you was the
[21:18] good I'm good hi good to see you was the director of pig technology at Optica and
[21:20] director of pig technology at Optica and now he is with qci can you tell us what
[21:23] now he is with qci can you tell us what qci is uh yes and if I can quickly put
[21:27] qci is uh yes and if I can quickly put something on the screen
[21:29] something on the screen um but it doesn't seem that my documents
[21:31] um but it doesn't seem that my documents are working anyway qci is actually a
[21:33] are working anyway qci is actually a tifflin Foundry as well as a Quantum
[21:36] tifflin Foundry as well as a Quantum Computing company when we are basically
[21:38] Computing company when we are basically leveraging the nonlinearity in tifflin
[21:40] leveraging the nonlinearity in tifflin to realize Quantum optimization machine
[21:43] to realize Quantum optimization machine and The Foundry actually is available
[21:45] and The Foundry actually is available for the pig Community to use it's a
[21:46] for the pig Community to use it's a us-based foundary and it's coming up
[21:49] us-based foundary and it's coming up later this year so I would be happy to
[21:52] later this year so I would be happy to speak with whoever who wants to use our
[21:54] speak with whoever who wants to use our services or make any uh devices with
[21:56] services or make any uh devices with tifflin and tri us who you did a
[21:59] tifflin and tri us who you did a fantastic job with Optica and and we are
[22:02] fantastic job with Optica and and we are so happy to have you now as a corpor
[22:04] so happy to have you now as a corpor than Opa thank you so much thank you
[22:07] than Opa thank you so much thank you Peter the first question for you comes
[22:09] Peter the first question for you comes all the way from info Jeff R could you
[22:11] all the way from info Jeff R could you tell us what's on your
[22:15] mind yes yeah hey good morning yeah um
[22:18] mind yes yeah hey good morning yeah um good morning so uh we produced an Indian
[22:21] good morning so uh we produced an Indian fosi chip and so I'm just curious uh
[22:24] fosi chip and so I'm just curious uh flip chipping that onto a glass
[22:26] flip chipping that onto a glass interposer for example if I need to
[22:27] interposer for example if I need to interface to the DSP uh how many
[22:30] interface to the DSP uh how many electrical channels can a glass
[22:33] electrical channels can a glass interposer uh
[22:35] interposer uh handle oh well you can have multi levels
[22:37] handle oh well you can have multi levels so you can have many levels so the
[22:39] so you can have many levels so the density pitch density can be you know
[22:41] density pitch density can be you know maybe 100 Micron pitch um so you can it
[22:45] maybe 100 Micron pitch um so you can it depends on the size of your chip so
[22:48] depends on the size of your chip so potentially um thousands uh is is like
[22:51] potentially um thousands uh is is like we've seen we're beginning to see some
[22:53] we've seen we're beginning to see some very large Pig chips like really large
[22:55] very large Pig chips like really large so um there's no limit it's the pitch
[22:59] so um there's no limit it's the pitch density really is the uh I suppose the
[23:02] density really is the uh I suppose the the limit here so you know if you're
[23:04] the limit here so you know if you're looking at maybe 100 Micron pitch so you
[23:06] looking at maybe 100 Micron pitch so you can work it depending on the size of
[23:07] can work it depending on the size of your chip and again it's also how you
[23:09] your chip and again it's also how you lay out those um Bond pads so um really
[23:13] lay out those um Bond pads so um really um you can put thousands down if it's
[23:16] um you can put thousands down if it's needed second question for you Peter
[23:19] needed second question for you Peter comes from Guan house go Stuart mfar
[23:22] comes from Guan house go Stuart mfar what's on your
[23:24] what's on your mind hi uh so we do a number of um
[23:27] mind hi uh so we do a number of um applications which rely on broader
[23:30] applications which rely on broader bandwidth operation um usually somewhere
[23:33] bandwidth operation um usually somewhere around the 100 nanometer range which is
[23:36] around the 100 nanometer range which is sort of Fairly achievable in um Edge
[23:40] sort of Fairly achievable in um Edge couple of structures with mode field
[23:42] couple of structures with mode field converters um what I'm wondering about
[23:45] converters um what I'm wondering about is obviously when you deal with micro
[23:48] is obviously when you deal with micro Optics and um curved glass interfaces
[23:51] Optics and um curved glass interfaces you're going to have some
[23:53] you're going to have some um potentially design complexities
[23:56] um potentially design complexities involved with making that uh giving a
[23:58] involved with making that uh giving a uniform transmission across that same
[24:01] uniform transmission across that same sort of 100 nanometer Optical bandwidth
[24:05] sort of 100 nanometer Optical bandwidth so I'm just wondering about um sort of
[24:07] so I'm just wondering about um sort of what the capabilities of those micro
[24:09] what the capabilities of those micro Optics are in that
[24:12] Optics are in that regard okay an interesting question um
[24:15] regard okay an interesting question um we have not seen that issue ourselves um
[24:18] we have not seen that issue ourselves um we work as I said we work very closely
[24:19] we work as I said we work very closely with some of the micro optic design
[24:21] with some of the micro optic design houses and I would say that the
[24:24] houses and I would say that the tolerances that we see spectral a
[24:26] tolerances that we see spectral a requirements they're fairly tolerant um
[24:28] requirements they're fairly tolerant um we have as I said we haven't seen a
[24:30] we have as I said we haven't seen a major issue there the coupling distances
[24:32] major issue there the coupling distances are fairly short so you may s you're
[24:34] are fairly short so you may s you're talking maybe about some um depth of
[24:38] talking maybe about some um depth of feeli or Focus the depth of focus may
[24:41] feeli or Focus the depth of focus may vary would that be one of your concerns
[24:44] vary would that be one of your concerns yes yeah we're um so we're trying
[24:47] yes yeah we're um so we're trying ideally looking for an absolute minimum
[24:50] ideally looking for an absolute minimum of um coupling loss into the chip um one
[24:54] of um coupling loss into the chip um one of the devices we do is you know um
[24:57] of the devices we do is you know um Opthalmic OC applications so in that
[25:00] Opthalmic OC applications so in that sort of situation you've got very high
[25:02] sort of situation you've got very high return losses that you're trying to deal
[25:04] return losses that you're trying to deal with and maximizing the coupling
[25:07] with and maximizing the coupling particularly fiber into pick um yeah is
[25:11] particularly fiber into pick um yeah is quite a valuable
[25:13] quite a valuable um well the best thing I the best thing
[25:16] um well the best thing I the best thing I can say is if you're interested in
[25:17] I can say is if you're interested in following up we can we can run a zMAX or
[25:20] following up we can we can run a zMAX or a simulation just to make you probably
[25:22] a simulation just to make you probably do it but uh we could check that
[25:24] do it but uh we could check that especially over the the kind of
[25:25] especially over the the kind of wavelength range you're interested in
[25:27] wavelength range you're interested in but as I said we have not seen any major
[25:30] but as I said we have not seen any major problems you know the coupling coupling
[25:32] problems you know the coupling coupling efficiencies will be comparable um very
[25:35] efficiencies will be comparable um very comparable to what we see with direct
[25:36] comparable to what we see with direct fiber
[25:38] fiber packaging okay that's really interesting
[25:40] packaging okay that's really interesting thank you much Stuart and let you know
[25:42] thank you much Stuart and let you know everyone that we have lots of micro
[25:43] everyone that we have lots of micro Optics companies in the room today so
[25:45] Optics companies in the room today so Mark dining from genoptic is here Amos
[25:47] Mark dining from genoptic is here Amos Ms from irant is here please feel free
[25:49] Ms from irant is here please feel free to comment in the chat and please tell
[25:51] to comment in the chat and please tell us we also saw Sandra that commented
[25:53] us we also saw Sandra that commented that 5 micrometer pitch is done today by
[25:55] that 5 micrometer pitch is done today by jalis in Glass Technology so please
[25:58] jalis in Glass Technology so please write that in the chat and let me
[25:59] write that in the chat and let me continue because we have many more
[26:01] continue because we have many more questions for you the next one is coming
[26:03] questions for you the next one is coming from an automotive company Paras from
[26:05] from an automotive company Paras from valo what's on your
[26:07] valo what's on your mind hello yeah so I was just um curious
[26:11] mind hello yeah so I was just um curious to know as I have designed um organic
[26:13] to know as I have designed um organic substrate layouts in past so as I as you
[26:17] substrate layouts in past so as I as you mentioned about um interposer based
[26:20] mentioned about um interposer based substrates so uh interposer based
[26:23] substrates so uh interposer based substrates are expensive as compared to
[26:25] substrates are expensive as compared to organic based substrates and it's also
[26:28] organic based substrates and it's also hard to manufacture so um in in in in in
[26:33] hard to manufacture so um in in in in in currently in European Union area which
[26:36] currently in European Union area which uh have you collaborated with substrate
[26:38] uh have you collaborated with substrate manufacturers who can overcome the
[26:39] manufacturers who can overcome the challenges of manufacturing interposer
[26:42] challenges of manufacturing interposer based
[26:43] based substrates in in glass is it yeah in
[26:47] substrates in in glass is it yeah in glass and also interpos yeah both yeah
[26:49] glass and also interpos yeah both yeah well so um we this is still a fairly
[26:53] well so um we this is still a fairly early stage of development what I will
[26:54] early stage of development what I will say is glass is also being developed for
[26:56] say is glass is also being developed for electrical packaging and the previous
[26:58] electrical packaging and the previous speaker or there was a a comment made
[27:00] speaker or there was a a comment made about very fine pitch so you know two to
[27:03] about very fine pitch so you know two to two to five Micron uh transmission line
[27:06] two to five Micron uh transmission line pitch that that is true in electronics
[27:08] pitch that that is true in electronics so we have seen that what I will say to
[27:10] so we have seen that what I will say to to your question around op organic we
[27:13] to your question around op organic we have seen warpage issues on organic when
[27:17] have seen warpage issues on organic when we flip silicon photonic chips onto an
[27:20] we flip silicon photonic chips onto an organic we've actually seen for example
[27:22] organic we've actually seen for example with Edge couplers typically over a few
[27:25] with Edge couplers typically over a few millimeter edge of a pick we would see a
[27:27] millimeter edge of a pick we would see a couple of microns warpage which is
[27:30] couple of microns warpage which is sufficient to induce you know serious
[27:32] sufficient to induce you know serious coupling losses over a large wave guide
[27:35] coupling losses over a large wave guide or sorry over a large Edge so um
[27:38] or sorry over a large Edge so um Organics do really uh pres pre present
[27:41] Organics do really uh pres pre present severe warpage issues um whereas glass H
[27:45] severe warpage issues um whereas glass H does not necessarily have that but I
[27:47] does not necessarily have that but I think the real opportunity here with a
[27:49] think the real opportunity here with a material like glass is the ability to
[27:51] material like glass is the ability to integrate Optical wave guides if you
[27:53] integrate Optical wave guides if you just think about it if we did not of
[27:55] just think about it if we did not of electrical ordl where would we be um it
[27:58] electrical ordl where would we be um it just we wouldn't be able to do all we
[28:00] just we wouldn't be able to do all we can do with microelectronics so kind of
[28:02] can do with microelectronics so kind of taking that same kind of thought to
[28:04] taking that same kind of thought to elect Optical having Optical waveguard
[28:07] elect Optical having Optical waveguard and the ability to Route um on a on an
[28:10] and the ability to Route um on a on an interposer platform really enables
[28:12] interposer platform really enables applications so you know I think that's
[28:14] applications so you know I think that's a very attractive proposition and as I
[28:17] a very attractive proposition and as I said glass is one of the materials that
[28:19] said glass is one of the materials that is being developed in electronics so we
[28:21] is being developed in electronics so we can Piggyback in a sense by all those
[28:22] can Piggyback in a sense by all those developments in the electronics world as
[28:24] developments in the electronics world as well Peter we talk about the need for
[28:28] well Peter we talk about the need for many channels and we talk about the need
[28:30] many channels and we talk about the need of very low insertion losses and I think
[28:32] of very low insertion losses and I think right now there are few companies who
[28:34] right now there are few companies who are addressing that as you know these
[28:35] are addressing that as you know these are company that matches enablers with
[28:38] are company that matches enablers with integrators so there's a couple of
[28:39] integrators so there's a couple of companies I would like to introduce you
[28:41] companies I would like to introduce you you know them extremely well the first
[28:43] you know them extremely well the first one is coming all the way from
[28:46] one is coming all the way from SIM SIM how are you today we are hearing
[28:49] SIM SIM how are you today we are hearing a lot of new things from micro align and
[28:51] a lot of new things from micro align and you just heard about the demand from
[28:53] you just heard about the demand from Peter so tell us how you can address it
[28:56] Peter so tell us how you can address it hi thanks thanks for this um yeah this
[29:00] hi thanks thanks for this um yeah this organization of the event and this
[29:01] organization of the event and this opportunity thanks everyone um it's an
[29:04] opportunity thanks everyone um it's an interesting um set of slides that I've
[29:07] interesting um set of slides that I've seen and um I can first maybe well uh I
[29:13] seen and um I can first maybe well uh I can ask to Peter a quick question as we
[29:16] can ask to Peter a quick question as we address in micr line high accuracy
[29:18] address in micr line high accuracy alignment uh so that basically fibers
[29:20] alignment uh so that basically fibers can be aligned in a fiber array within
[29:22] can be aligned in a fiber array within 100 nanometers accuracy uh which at the
[29:25] 100 nanometers accuracy uh which at the moment we target AS application for Pon
[29:28] moment we target AS application for Pon Computing for example uh where um also
[29:32] Computing for example uh where um also one percentage of U of cing is important
[29:35] one percentage of U of cing is important uh do you see for the application that
[29:38] uh do you see for the application that is actually uh this glass interposer
[29:41] is actually uh this glass interposer serving do you see a potential match
[29:43] serving do you see a potential match between the two technologies or
[29:45] between the two technologies or basically this uh 1% or n 100 nanometers
[29:49] basically this uh 1% or n 100 nanometers accuracy that we provide in that case uh
[29:52] accuracy that we provide in that case uh is an Overkill uh can they live together
[29:56] is an Overkill uh can they live together uh or if is the high volume glass
[30:00] uh or if is the high volume glass interposer uh aiming more to uh High
[30:04] interposer uh aiming more to uh High throughput
[30:05] throughput fabrication yeah I suppose just from a
[30:07] fabrication yeah I suppose just from a general point of view um and I'm only
[30:09] general point of view um and I'm only picking glass here is one option and
[30:11] picking glass here is one option and it's something we've been looking at we
[30:12] it's something we've been looking at we are we are looking at other materials as
[30:14] are we are looking at other materials as well but really I suppose the motivation
[30:16] well but really I suppose the motivation here is that the more and more we work
[30:19] here is that the more and more we work on this we see that we must align with
[30:21] on this we see that we must align with electronic packaging like we must align
[30:24] electronic packaging like we must align with electronic packaging so the more we
[30:26] with electronic packaging so the more we do around processes at wafer level at
[30:29] do around processes at wafer level at flip chip and so forth and we use the
[30:31] flip chip and so forth and we use the equipment that's already available and
[30:33] equipment that's already available and maybe tune it somewhat uh I think that's
[30:36] maybe tune it somewhat uh I think that's the motivation and there you know uh
[30:38] the motivation and there you know uh there's some fine details in there but
[30:41] there's some fine details in there but really so surface coupling of pics is
[30:43] really so surface coupling of pics is really important because in electrical
[30:45] really important because in electrical it's all on the surface so Optics should
[30:47] it's all on the surface so Optics should similarly be on the surface that's my
[30:49] similarly be on the surface that's my that's my my strong belief the equipment
[30:52] that's my my strong belief the equipment the interposers you know I really
[30:54] the interposers you know I really believe um that's that's really the
[30:57] believe um that's that's really the motivation behind it all of this so it's
[30:59] motivation behind it all of this so it's trying to merge both photonic and
[31:01] trying to merge both photonic and electronic packaging processes equipment
[31:03] electronic packaging processes equipment design rules all of these things I just
[31:05] design rules all of these things I just think that's a good thing um and there's
[31:07] think that's a good thing um and there's going to be ways that it could be better
[31:09] going to be ways that it could be better in using alternative approaches I do
[31:12] in using alternative approaches I do think the package level part by part
[31:14] think the package level part by part package by package it's really not scal
[31:17] package by package it's really not scal well it's not scalable so when we see
[31:19] well it's not scalable so when we see some demands of very large volumes it's
[31:21] some demands of very large volumes it's just too slow um and so I suppose just
[31:25] just too slow um and so I suppose just at a very high level the general
[31:26] at a very high level the general approach is the alignment of the or the
[31:28] approach is the alignment of the or the the merging of the ecosystems of optical
[31:30] the merging of the ecosystems of optical and electrical packaging is is the is
[31:32] and electrical packaging is is the is the fundamental
[31:34] the fundamental motivation and um also just you have you
[31:37] motivation and um also just you have you have one slide to show us oh yes yes I
[31:39] have one slide to show us oh yes yes I have it want to see because we we have
[31:42] have it want to see because we we have heard a lot about your fingers moving
[31:44] heard a lot about your fingers moving and aligning to and you do have the
[31:46] and aligning to and you do have the solution that many of the people in the
[31:47] solution that many of the people in the room are looking for tell us sure uh can
[31:50] room are looking for tell us sure uh can you see the screen crystal
[31:53] you see the screen crystal clear okay here we go uh so basically uh
[31:56] clear okay here we go uh so basically uh in a in a few words my Line is now alive
[31:59] in a in a few words my Line is now alive since 2021 we started as a uh startup
[32:03] since 2021 we started as a uh startup that develops and we are still a startup
[32:05] that develops and we are still a startup of course that develops uh
[32:06] of course that develops uh microactuators to align multiple Optical
[32:08] microactuators to align multiple Optical fibers and as you as you see in this
[32:11] fibers and as you as you see in this video here in the middle of the screen
[32:13] video here in the middle of the screen uh what we have developed until now is
[32:15] uh what we have developed until now is this set of p Electric caners that can
[32:19] this set of p Electric caners that can align each fiber independently in two
[32:21] align each fiber independently in two directions and the reason for this one
[32:23] directions and the reason for this one is basically to uh to achieve active
[32:26] is basically to uh to achieve active alignment per fiber per core based so
[32:30] alignment per fiber per core based so each core we have a system here that can
[32:33] each core we have a system here that can uh if we think to Edge Edge couple these
[32:37] uh if we think to Edge Edge couple these fibers to a chip or to what another
[32:39] fibers to a chip or to what another Optical component uh we have a Clos loop
[32:42] Optical component uh we have a Clos loop system that can align each fiber
[32:44] system that can align each fiber independently uh as we noticed that
[32:47] independently uh as we noticed that there were a lot of questions around how
[32:49] there were a lot of questions around how to fix the fibers how do we fix them to
[32:51] to fix the fibers how do we fix them to a chip uh the the last year we decided
[32:55] a chip uh the the last year we decided to change business strategy and to go
[32:56] to change business strategy and to go from AIP
[32:58] from AIP uh supplier let's say supplier of this
[33:01] uh supplier let's say supplier of this maor to fiber array manufacturer where
[33:03] maor to fiber array manufacturer where basically it's a fiber array highend
[33:06] basically it's a fiber array highend solution uh where the 100 n well the
[33:10] solution uh where the 100 n well the core the pitch accuracy is less than 100
[33:12] core the pitch accuracy is less than 100 nanometers so basically if you go from
[33:15] nanometers so basically if you go from top to down uh now what we are
[33:18] top to down uh now what we are developing is this type of fiber array
[33:19] developing is this type of fiber array very important for Quantum Computing
[33:21] very important for Quantum Computing photonics I'm very happy to understand
[33:23] photonics I'm very happy to understand uh with the people today if there are
[33:25] uh with the people today if there are also other applications for it that you
[33:27] also other applications for it that you seen obvious
[33:28] seen obvious uh for this one or now or in the future
[33:31] uh for this one or now or in the future uh as I said the uniqueness is that each
[33:34] uh as I said the uniqueness is that each fiber is independent realigned and if
[33:37] fiber is independent realigned and if you if you if you look at below we have
[33:39] you if you if you look at below we have a comparison between what we think it's
[33:41] a comparison between what we think it's also our advantage uh today there are
[33:44] also our advantage uh today there are standard VG grp fiber arrays that offer
[33:46] standard VG grp fiber arrays that offer a specific accuracy uh of the of the of
[33:49] a specific accuracy uh of the of the of the pitch of the core and that's
[33:51] the pitch of the core and that's obviously limited uh well defined not
[33:54] obviously limited uh well defined not limited by the VG gr uh pass alignment
[33:57] limited by the VG gr uh pass alignment and what we do is that we do active
[33:59] and what we do is that we do active alignment and that's that's what per
[34:01] alignment and that's that's what per fiber so it will uh that's the advantage
[34:04] fiber so it will uh that's the advantage that we feel that we think it will give
[34:06] that we feel that we think it will give and I'm happy to share on the left this
[34:07] and I'm happy to share on the left this a nice image of one of our first fiber
[34:09] a nice image of one of our first fiber arrays uh so uh this is basically in in
[34:13] arrays uh so uh this is basically in in a in a natural micr line and I have one
[34:16] a in a natural micr line and I have one very much for for being here with us
[34:18] very much for for being here with us today you're going to be also in Malaga
[34:19] today you're going to be also in Malaga I hope to see you there and let me also
[34:21] I hope to see you there and let me also say hello to another person who is
[34:22] say hello to another person who is coming to Malaga as well Frank levenson
[34:25] coming to Malaga as well Frank levenson thank you very much for joining our
[34:26] thank you very much for joining our meeting today
[34:28] meeting today good morning yes I'm going to Mal as
[34:31] good morning yes I'm going to Mal as well Mala as well fun you will be the
[34:33] well Mala as well fun you will be the moderator of one of our panels the
[34:36] moderator of one of our panels the investment panel and talking about the
[34:38] investment panel and talking about the investment panel I would like to give
[34:39] investment panel I would like to give the floor Peter to another company that
[34:42] the floor Peter to another company that is member of optica and has been raising
[34:44] is member of optica and has been raising a lot a lot of awareness on the last
[34:47] a lot a lot of awareness on the last year about the need for Ultra highs
[34:49] year about the need for Ultra highs speeed interconnect coming all the way
[34:50] speeed interconnect coming all the way from Israel dantal new photonics thank
[34:54] from Israel dantal new photonics thank you very much for sponsoring the meeting
[34:56] you very much for sponsoring the meeting today you also have prepar one slide to
[34:58] today you also have prepar one slide to show us now it is your chance to to tell
[35:01] show us now it is your chance to to tell Peter to tell Global foundies to tell
[35:03] Peter to tell Global foundies to tell everyone today what you're doing and how
[35:05] everyone today what you're doing and how they can help you sure Jose can you hear
[35:08] they can help you sure Jose can you hear me okay loud and clear all right let me
[35:11] me okay loud and clear all right let me share the screen
[35:17] here okay great great uh presentation so
[35:21] here okay great great uh presentation so far very relevant um to what we're doing
[35:24] far very relevant um to what we're doing so uh newonics is a fabulous conductor
[35:28] so uh newonics is a fabulous conductor um we designer developer and
[35:31] um we designer developer and manufacturer of pick uh focused uh on
[35:34] manufacturer of pick uh focused uh on the data center connectivity Solutions
[35:37] the data center connectivity Solutions uh we're doing 800 gig and uh 1.6
[35:41] uh we're doing 800 gig and uh 1.6 terabit per second
[35:43] terabit per second transceivers um so as we build uh our
[35:46] transceivers um so as we build uh our chips uh we're implementing Advanced
[35:49] chips uh we're implementing Advanced packaging Technologies working with the
[35:51] packaging Technologies working with the oats and the ecosystem really in all
[35:54] oats and the ecosystem really in all steps of uh the process of the the post
[35:58] steps of uh the process of the the post wafer uh processing the substrate um the
[36:02] wafer uh processing the substrate um the design assembly and test and what uh and
[36:05] design assembly and test and what uh and what we're doing now is uh we're really
[36:07] what we're doing now is uh we're really bringing our expertise in Optics uh to
[36:10] bringing our expertise in Optics uh to innovate in the wafer level testing and
[36:12] innovate in the wafer level testing and solve some of the um our biggest and the
[36:16] solve some of the um our biggest and the industry's biggest uh testing challenges
[36:19] industry's biggest uh testing challenges um really associated with wafer level
[36:21] um really associated with wafer level testing so just to let uh you guys know
[36:24] testing so just to let uh you guys know what we're up to these days
[36:30] D I don't think we can hear you
[36:32] D I don't think we can hear you extremely well now oh would you may
[36:36] extremely well now oh would you may speak closer to the microphone or a B
[36:40] louder can you hear me better now yes a
[36:42] louder can you hear me better now yes a bit better yes all right
[36:45] bit better yes all right good
[36:47] good so um let's go through it again so about
[36:50] so um let's go through it again so about new you so far just to hear better now
[36:54] new you so far just to hear better now yeah okay so that was that was really
[36:56] yeah okay so that was that was really the one slide we've prepared um for for
[37:01] the one slide we've prepared um for for the discussion today thank you very much
[37:04] the discussion today thank you very much doram you shock the war on the last two
[37:07] doram you shock the war on the last two ofcs H what is the next thing that we
[37:09] ofcs H what is the next thing that we should be expecting from new photonics
[37:11] should be expecting from new photonics yeah so we're excited about uh eock uh
[37:15] yeah so we're excited about uh eock uh next month we're looking to connect with
[37:18] next month we're looking to connect with everybody um we'll be showing off our
[37:21] everybody um we'll be showing off our npg 102 chips um that will be sampling
[37:25] npg 102 chips um that will be sampling next year so these are um Coming uh with
[37:30] next year so these are um Coming uh with the Silicon fonics Integrated Solutions
[37:32] the Silicon fonics Integrated Solutions for the data center um some of our
[37:35] for the data center um some of our Optical Equalization technologies that
[37:38] Optical Equalization technologies that are getting integrated on a monolithic
[37:41] are getting integrated on a monolithic die in these chips um this is uh this is
[37:46] die in these chips um this is uh this is going to be very exciting for eock next
[37:48] going to be very exciting for eock next month thank you very much dong back to
[37:51] month thank you very much dong back to you Peter orrian we have a question for
[37:53] you Peter orrian we have a question for you coming all the way from one of the
[37:55] you coming all the way from one of the design houses member of optica the
[37:56] design houses member of optica the company's called
[37:58] company's called Epiphany joh tell us what's in your
[38:01] Epiphany joh tell us what's in your mind yeah again thanks a lot for for
[38:03] mind yeah again thanks a lot for for sharing these new developments and
[38:05] sharing these new developments and packages and um yeah I wonder even if
[38:08] packages and um yeah I wonder even if you makes pick design and free space
[38:10] you makes pick design and free space objects so it's really so how would you
[38:12] objects so it's really so how would you design it yeah so because we as a
[38:14] design it yeah so because we as a designers of course need to think about
[38:17] designers of course need to think about packaging when we when we design the
[38:20] packaging when we when we design the chips so sorry your question again is
[38:22] chips so sorry your question again is how how do you split the design no not
[38:26] how how do you split the design no not split the design but from uh the
[38:29] split the design but from uh the pick uh design and then going to free
[38:32] pick uh design and then going to free space Optics right sure so so how would
[38:35] space Optics right sure so so how would you take care of that in the design
[38:37] you take care of that in the design phase already of the pig right because
[38:39] phase already of the pig right because when we design it we want you also to to
[38:41] when we design it we want you also to to package it in the end so that needs to
[38:43] package it in the end so that needs to be done in the design
[38:44] be done in the design P sure no it's a good point so um they
[38:48] P sure no it's a good point so um they kind of go hand in hand so when you're
[38:50] kind of go hand in hand so when you're laying out your pick you know really it
[38:52] laying out your pick you know really it rais a very important Point um when
[38:54] rais a very important Point um when we're looking at a module or a subsystem
[38:57] we're looking at a module or a subsystem that's being designed we really have to
[38:59] that's being designed we really have to kind of work backwards so in a sense
[39:02] kind of work backwards so in a sense your pick kind of is designed hand in
[39:04] your pick kind of is designed hand in hand with your full module too often we
[39:06] hand with your full module too often we see the pic being designed in isolation
[39:09] see the pic being designed in isolation and it just can't be um assembled and
[39:11] and it just can't be um assembled and packaged even with micro Optics so um
[39:14] packaged even with micro Optics so um it's kind of H it's it's all done from
[39:16] it's kind of H it's it's all done from the from the in a sense work backwards
[39:19] the from the in a sense work backwards and work forwards as well so we work
[39:21] and work forwards as well so we work forwards right yeah you work forwards
[39:23] forwards right yeah you work forwards but we work backwards as a packaging uh
[39:25] but we work backwards as a packaging uh Team
[39:27] Team work you work together and that's really
[39:29] work you work together and that's really really important because if you just
[39:31] really important because if you just work forwards you'll end up with some
[39:32] work forwards you'll end up with some crazy package that you probably can't
[39:34] crazy package that you probably can't build so um so really it's kind of like
[39:37] build so um so really it's kind of like a it's a two it's a two-step approach
[39:40] a it's a two it's a two-step approach and and and being able to visualize your
[39:42] and and and being able to visualize your module before you start You' be
[39:43] module before you start You' be surprised some people don't and being
[39:45] surprised some people don't and being able to do that is so important because
[39:47] able to do that is so important because the other thing is you need the machines
[39:49] the other thing is you need the machines to be able to do it so um working back
[39:51] to be able to do it so um working back in a sense enables you to do that the
[39:53] in a sense enables you to do that the assembly and so forth so as I said uh
[39:56] assembly and so forth so as I said uh working with a a packaging provider that
[39:59] working with a a packaging provider that has the understanding of your pick but
[40:01] has the understanding of your pick but could also can visualize how it's all
[40:03] could also can visualize how it's all going to be assembled what the final
[40:04] going to be assembled what the final package looks like and also something
[40:06] package looks like and also something we're starting to work on is cost
[40:07] we're starting to work on is cost modeling so essentially the design
[40:10] modeling so essentially the design choices you make the materials you use
[40:11] choices you make the materials you use all those kind of things and also
[40:13] all those kind of things and also environmental sustainability is becoming
[40:15] environmental sustainability is becoming very important and supply chain where
[40:16] very important and supply chain where it's coming from all these things in are
[40:19] it's coming from all these things in are have to be included it can't be just a
[40:21] have to be included it can't be just a technical
[40:23] technical exercise yeah so my basically my
[40:25] exercise yeah so my basically my question was where we where do we shake
[40:27] question was where we where do we shake hands right at the start at the start
[40:31] hands right at the start at the start yeah a couple of years ago you and me
[40:34] yeah a couple of years ago you and me are getting a bit of white here already
[40:35] are getting a bit of white here already on the sides a couple of years ago we 20
[40:39] on the sides a couple of years ago we 20 years ago you and me were at photonis
[40:41] years ago you and me were at photonis West and we're very happy that a company
[40:43] West and we're very happy that a company called technov had the first Peak based
[40:47] called technov had the first Peak based interrogator of fiber optical sensors at
[40:49] interrogator of fiber optical sensors at the entrance of photon W package by by
[40:52] the entrance of photon W package by by the community actually Jose I just put a
[40:54] the community actually Jose I just put a question out there for people how are
[40:56] question out there for people how are you going to pack a thousand channels
[40:58] you going to pack a thousand channels Optical channels you know can you do
[41:01] Optical channels you know can you do that so like these are and it's not
[41:03] that so like these are and it's not going to be a fiber array so you know if
[41:05] going to be a fiber array so you know if you think about it back in the 50s and
[41:07] you think about it back in the 50s and so forth the electrical packaging you
[41:09] so forth the electrical packaging you know they're the numbers we're talking
[41:11] know they're the numbers we're talking about and now it's what is it so we
[41:13] about and now it's what is it so we really need to start think where where
[41:15] really need to start think where where this goes because we're kind of painting
[41:16] this goes because we're kind of painting ourselves into a corner using fairly
[41:18] ourselves into a corner using fairly conventional Technologies so looking at
[41:21] conventional Technologies so looking at RDL Optical RDL thousands of channels
[41:24] RDL Optical RDL thousands of channels and and even higher potentially I think
[41:26] and and even higher potentially I think that opens up new new domains for
[41:28] that opens up new new domains for exploitation and that's kind of the
[41:30] exploitation and that's kind of the things we're starting to look at now we
[41:32] things we're starting to look at now we we can afford to look at that so really
[41:34] we can afford to look at that so really you know presenting that type of
[41:36] you know presenting that type of challenge to people where do you go to
[41:38] challenge to people where do you go to get thousands of channels on on a single
[41:40] get thousands of channels on on a single ship I'm talking about and I think we
[41:41] ship I'm talking about and I think we can only address that without with the
[41:43] can only address that without with the new the new community of photonic in
[41:46] new the new community of photonic in circuits that is driven by semiconductor
[41:49] circuits that is driven by semiconductor Giants and with this I would like to
[41:50] Giants and with this I would like to give the floor to the second speaker but
[41:52] give the floor to the second speaker but Peter please stay with us because we
[41:54] Peter please stay with us because we have still a lot of questions for you
[41:56] have still a lot of questions for you but let me allow me to give the floor to
[41:58] but let me allow me to give the floor to our second speaker coming all the way
[42:00] our second speaker coming all the way from Global fund Optica corporate member
[42:02] from Global fund Optica corporate member I'm a big fan of optica because V as you
[42:04] I'm a big fan of optica because V as you have been at many events this year with
[42:06] have been at many events this year with us vas Gupta the floor and the attention
[42:08] us vas Gupta the floor and the attention of everyone I'm so happy every time I
[42:10] of everyone I'm so happy every time I say this goes to Global foundaries
[42:13] say this goes to Global foundaries thank you thank you Jose thank you uh
[42:15] thank you thank you Jose thank you uh let me start sharing my screen can you
[42:17] let me start sharing my screen can you all see my screen I'm going to put it in
[42:19] all see my screen I'm going to put it in clear yeah I'm gonna put uh from the
[42:22] clear yeah I'm gonna put uh from the beginning so okay thank thank you
[42:24] beginning so okay thank thank you everybody uh for this opportunity my
[42:26] everybody uh for this opportunity my name is Cas Gupta I am the product
[42:29] name is Cas Gupta I am the product manager for silicon photonics at Global
[42:31] manager for silicon photonics at Global foundaries and given the time is short
[42:33] foundaries and given the time is short I'm going to just jump in uh I I think
[42:37] I'm going to just jump in uh I I think I'm I'm just going to draw your
[42:38] I'm I'm just going to draw your attention to the two two sort of bullets
[42:41] attention to the two two sort of bullets on the right I think the the growth of
[42:43] on the right I think the the growth of generative
[42:44] generative AI uh and and the power consumption of
[42:48] AI uh and and the power consumption of data centers have sort of fueled uh the
[42:51] data centers have sort of fueled uh the adoption of photonics and more
[42:53] adoption of photonics and more specifically silicon photonics is coming
[42:55] specifically silicon photonics is coming out as sort of the preferred solution
[42:58] out as sort of the preferred solution you know the growth of a generative AI
[43:01] you know the growth of a generative AI uh requires you know fairly large
[43:03] uh requires you know fairly large networks high-speed low power and right
[43:07] networks high-speed low power and right now in terms of power consumptions in
[43:09] now in terms of power consumptions in data centers as the data centers are
[43:11] data centers as the data centers are transitioning to sort of GPU based racks
[43:14] transitioning to sort of GPU based racks these racks are consuming almost two or
[43:17] these racks are consuming almost two or three acts the amount of power uh which
[43:19] three acts the amount of power uh which is of course increasing the footprint
[43:21] is of course increasing the footprint and the power footprint of these data
[43:23] and the power footprint of these data centers so both of these sort of Trends
[43:26] centers so both of these sort of Trends what is driving
[43:27] what is driving uh the photonics industry and more
[43:29] uh the photonics industry and more specifically silicon photonics and so
[43:32] specifically silicon photonics and so from Global foundaries uh we offer a
[43:34] from Global foundaries uh we offer a technology called GF photonics and it is
[43:37] technology called GF photonics and it is a 300 mm technology that integrates both
[43:41] a 300 mm technology that integrates both you know an 45 class 45 nanm class RFC
[43:45] you know an 45 class 45 nanm class RFC mass and you can see the transistors on
[43:47] mass and you can see the transistors on the left and and a fairly Rich portfolio
[43:51] the left and and a fairly Rich portfolio of photonic devices all integrated on a
[43:55] of photonic devices all integrated on a single piece of silicon so you can see
[43:57] single piece of silicon so you can see you know components such as
[43:58] you know components such as modulators uh photo detectors uh wave
[44:01] modulators uh photo detectors uh wave Guides of different kinds and and then
[44:05] Guides of different kinds and and then uh a plan of record uh fiber coupling
[44:07] uh a plan of record uh fiber coupling solution is the the vgroup based uh
[44:11] solution is the the vgroup based uh fiber connector and we do also have a
[44:14] fiber connector and we do also have a technology and a development for laser
[44:16] technology and a development for laser attach but this is as I said a very
[44:19] attach but this is as I said a very flexible technology because it includes
[44:22] flexible technology because it includes uh multiple types of modulators
[44:24] uh multiple types of modulators including Mark xenders uh micro rings
[44:27] including Mark xenders uh micro rings and this also sort of enables the
[44:30] and this also sort of enables the implementation of both cwdm and dwdm
[44:34] implementation of both cwdm and dwdm type of applications without any
[44:36] type of applications without any customization of the technology at all
[44:38] customization of the technology at all and all of this work is of course
[44:40] and all of this work is of course supported by uh an electri optical pdk
[44:44] supported by uh an electri optical pdk uh offered by Leading Eda vendors so
[44:47] uh offered by Leading Eda vendors so it's a fairly Rich technology ready for
[44:50] it's a fairly Rich technology ready for production and available to anybody who
[44:52] production and available to anybody who is interested in transceivers of course
[44:55] is interested in transceivers of course transceivers being the first application
[44:57] transceivers being the first application specifically around co-packaged Optics
[44:59] specifically around co-packaged Optics but the technology we will continue to
[45:01] but the technology we will continue to build over uh for other applications
[45:04] build over uh for other applications such as liar and and and such now I
[45:07] such as liar and and and such now I wanted to just give everybody two slides
[45:10] wanted to just give everybody two slides of updates and then one of the requests
[45:12] of updates and then one of the requests from from the Optica team was you know
[45:15] from from the Optica team was you know where can you know where do we help and
[45:17] where can you know where do we help and what what are we looking for from the
[45:19] what what are we looking for from the industry and so this is sort of where
[45:22] industry and so this is sort of where the section of where we can help I'm
[45:24] the section of where we can help I'm going to give you all two examples of
[45:27] going to give you all two examples of technology entitlement uh so we as i'
[45:29] technology entitlement uh so we as i' already mentioned we have a fairly Rich
[45:31] already mentioned we have a fairly Rich uh set of components already implemented
[45:34] uh set of components already implemented in Silicon nitrite silicon nitrite as a
[45:37] in Silicon nitrite silicon nitrite as a material is a thermal and and so there's
[45:40] material is a thermal and and so there's on the top I'm showing you uh you know
[45:43] on the top I'm showing you uh you know multiple components which are already in
[45:45] multiple components which are already in the pdk uh as part of our portfolio of
[45:48] the pdk uh as part of our portfolio of devices passive devices and on the
[45:51] devices passive devices and on the bottom we've also introduced uh a coost
[45:54] bottom we've also introduced uh a coost wave division multiplexing uh macro also
[45:58] wave division multiplexing uh macro also this is actually built out of our pdk
[46:00] this is actually built out of our pdk components but this has been validated
[46:03] components but this has been validated it meets the cwdm MSA standard and and
[46:08] it meets the cwdm MSA standard and and we will continue to refine uh refine
[46:11] we will continue to refine uh refine these sort of components the other one I
[46:13] these sort of components the other one I wanted to just show you all is I had
[46:15] wanted to just show you all is I had mentioned that the GF photonics has both
[46:18] mentioned that the GF photonics has both electronics and photonics integrated on
[46:21] electronics and photonics integrated on the same piece of silicon and and what
[46:23] the same piece of silicon and and what I'm showing you here is from a
[46:24] I'm showing you here is from a technology entitlement uh We've demon
[46:26] technology entitlement uh We've demon demonstrated a 100 GHz bandwidth uh
[46:29] demonstrated a 100 GHz bandwidth uh transimpedance amplifier uh with some
[46:32] transimpedance amplifier uh with some highq inductors that we've uh
[46:35] highq inductors that we've uh implemented in this technology and and
[46:38] implemented in this technology and and again the the idea is to to sort of
[46:41] again the the idea is to to sort of marry the electronics the analog
[46:44] marry the electronics the analog electronics and the photonics on the
[46:46] electronics and the photonics on the same piece of silicon this alleviates
[46:48] same piece of silicon this alleviates some of the packaging complexity of
[46:50] some of the packaging complexity of having a separate die attached to the
[46:52] having a separate die attached to the pick if you choose to do it that way uh
[46:55] pick if you choose to do it that way uh and and in addition to that we also have
[46:57] and and in addition to that we also have a standard cell library in case you want
[46:59] a standard cell library in case you want to do some uh you know basic digital
[47:02] to do some uh you know basic digital circuitry also so going back to the
[47:05] circuitry also so going back to the previous conversation uh that that uh
[47:08] previous conversation uh that that uh that the speaker was having with one of
[47:10] that the speaker was having with one of the the attendees about sort of the
[47:13] the the attendees about sort of the challenge that we face and where we're
[47:15] challenge that we face and where we're looking for industry collaboration
[47:17] looking for industry collaboration there's always this sort of tops down
[47:19] there's always this sort of tops down bottoms up uh approach uh to building up
[47:23] bottoms up uh approach uh to building up systems so a lot of times the the P
[47:25] systems so a lot of times the the P designer will come from
[47:27] designer will come from uh you know designning the pick going
[47:29] uh you know designning the pick going through you know talking about the the
[47:31] through you know talking about the the mounting of the pick on the board but
[47:33] mounting of the pick on the board but then from a system perspective there may
[47:35] then from a system perspective there may be you know requirements from a power
[47:38] be you know requirements from a power consumption the the the way these
[47:40] consumption the the the way these systems are cooled how much how much
[47:43] systems are cooled how much how much actually room you have within your
[47:44] actually room you have within your system uh and and there is clearly a lot
[47:47] system uh and and there is clearly a lot of collaboration that is needed between
[47:50] of collaboration that is needed between the designer of the pick and the
[47:52] the designer of the pick and the designer of the system to be able to
[47:54] designer of the system to be able to come up with a solution that as as the
[47:56] come up with a solution that as as the previous speaker talked about you know
[47:58] previous speaker talked about you know is cost effective but is also
[48:00] is cost effective but is also manufacturable so I think these are
[48:02] manufacturable so I think these are areas where from a collaboration
[48:04] areas where from a collaboration perspective uh there is there's a lot of
[48:06] perspective uh there is there's a lot of work to be done in the industry given
[48:09] work to be done in the industry given the T the lack of time there's another
[48:11] the T the lack of time there's another area in terms of test so a lot of times
[48:14] area in terms of test so a lot of times we talk about test as you know being
[48:16] we talk about test as you know being able to test a few picks uh but for high
[48:19] able to test a few picks uh but for high volume manufacturing a lot of the
[48:20] volume manufacturing a lot of the testing has to be done at waer level and
[48:23] testing has to be done at waer level and I would encourage uh test houses and
[48:26] I would encourage uh test houses and test vendors to think of innovative
[48:29] test vendors to think of innovative solutions where you can uh do
[48:31] solutions where you can uh do electrooptical testing you know either
[48:33] electrooptical testing you know either at speed or even low speed uh to be able
[48:38] at speed or even low speed uh to be able to get you know the electrooptical
[48:40] to get you know the electrooptical testing done at wavei level I think that
[48:42] testing done at wavei level I think that would be a a huge benefit for the
[48:45] would be a a huge benefit for the industry uh to make these Technologies
[48:48] industry uh to make these Technologies sort of viable for high volume
[48:50] sort of viable for high volume manufacturing so I think that's that's
[48:53] manufacturing so I think that's that's pretty much my slide set and I I'm open
[48:55] pretty much my slide set and I I'm open to questions uh so I can come out of uh
[48:58] to questions uh so I can come out of uh presentation mode thank you very much
[49:00] presentation mode thank you very much vas I think with your presentation
[49:02] vas I think with your presentation especially with the last last slide you
[49:04] especially with the last last slide you really open the treasure box for all of
[49:07] really open the treasure box for all of the our members and also for all the
[49:09] the our members and also for all the listeners because right we have
[49:11] listeners because right we have representatives of so many companies and
[49:14] representatives of so many companies and you know you've mentioned already some
[49:15] you know you've mentioned already some of the challenges with me design uh
[49:18] of the challenges with me design uh testing and I have to say that we have
[49:21] testing and I have to say that we have solutions for nearly all of them and I
[49:24] solutions for nearly all of them and I would like to actually already introduce
[49:26] would like to actually already introduce you to one of the solution providers for
[49:28] you to one of the solution providers for the wafer level testing it's one of our
[49:31] the wafer level testing it's one of our corporate members Keystone photonics and
[49:33] corporate members Keystone photonics and Philip did Philip please share your
[49:36] Philip did Philip please share your slides and tell us about your
[49:39] slides and tell us about your capabilities thank you yes thank you
[49:42] capabilities thank you yes thank you thank you vi vi for making the
[49:44] thank you vi vi for making the introduction to to um basically our
[49:48] introduction to to um basically our solution we provide and we're keyst for
[49:51] solution we provide and we're keyst for tonics and we provide um Innovative
[49:53] tonics and we provide um Innovative solution for wafer level testing and uh
[49:56] solution for wafer level testing and uh just to motivate why this is so crucial
[49:59] just to motivate why this is so crucial for the whole ecosystem I'd like to
[50:01] for the whole ecosystem I'd like to restate that um that um during the
[50:04] restate that um that um during the manufact you often start from a wafer
[50:07] manufact you often start from a wafer which is the of the project but only
[50:10] which is the of the project but only makes up a small fraction maybe 1% maybe
[50:13] makes up a small fraction maybe 1% maybe more maybe less of the whole conceiver
[50:16] more maybe less of the whole conceiver or whatever product has to be designed
[50:18] or whatever product has to be designed we have a relatively lowcost product in
[50:21] we have a relatively lowcost product in the beginning expensive product maybe
[50:23] the beginning expensive product maybe hundreds or thousands of dollars in the
[50:25] hundreds or thousands of dollars in the end how however the the silic fonic
[50:28] end how however the the silic fonic wafer has not 100% yield it's lower than
[50:31] wafer has not 100% yield it's lower than that so it makes a lot of sense it
[50:33] that so it makes a lot of sense it absolutely essential to do wafer level
[50:36] absolutely essential to do wafer level testing to have known good Di and we uh
[50:39] testing to have known good Di and we uh and that's that's by the way absolute
[50:41] and that's that's by the way absolute standard for electronics Industry the
[50:44] standard for electronics Industry the the market for electrical probe heads
[50:46] the market for electrical probe heads and probe carts is $2.3 billion last
[50:50] and probe carts is $2.3 billion last year uh
[50:52] year uh 2023 and now for Optics that's not the
[50:55] 2023 and now for Optics that's not the case there's no solution available right
[50:57] case there's no solution available right now however we do provide that solution
[51:00] now however we do provide that solution now
[51:01] now and Philip and you have to share it now
[51:04] and Philip and you have to share it now please share your
[51:08] slide uh I believe I do share my screen
[51:12] slide uh I believe I do share my screen no you
[51:14] don't oh you got so excited about the
[51:18] don't oh you got so excited about the testing that you important Point apies
[51:21] testing that you important Point apies apologies yeah so the key key thing is
[51:24] apologies yeah so the key key thing is is waer level testing um and we do
[51:27] is waer level testing um and we do provide that solution and it's based on
[51:29] provide that solution and it's based on 3D printed micro Optics onto fiber
[51:32] 3D printed micro Optics onto fiber arrays these microoptics can adapt to
[51:35] arrays these microoptics can adapt to all situation for waer level testing may
[51:37] all situation for waer level testing may it be trench level testing where we 3D
[51:40] it be trench level testing where we 3D print Optical periscopes that can also
[51:42] print Optical periscopes that can also do go in any angle or Optics micro
[51:46] do go in any angle or Optics micro Optics and fiber rays that are suitable
[51:48] Optics and fiber rays that are suitable to Pro grating couplers lenses on
[51:51] to Pro grating couplers lenses on optical chips we can also prob um beam
[51:54] optical chips we can also prob um beam expanded beam approaches so we do have
[51:56] expanded beam approaches so we do have the solution for all these um these
[51:59] the solution for all these um these challenges and um this solution is is
[52:02] challenges and um this solution is is not entirely new we're doing this since
[52:04] not entirely new we're doing this since 200 um 17 we're in most or a large
[52:10] 200 um 17 we're in most or a large variety of silicon fonic fies especially
[52:12] variety of silicon fonic fies especially in in us we're partnering there with all
[52:15] in in us we're partnering there with all uh more most test W level testing
[52:17] uh more most test W level testing companies including cont fact you can
[52:20] companies including cont fact you can example here but also B Tech MBI and and
[52:24] example here but also B Tech MBI and and a lot of others and and and and that you
[52:26] a lot of others and and and and that you can see here that Public Presentation
[52:28] can see here that Public Presentation from pH factor is exactly electrical
[52:31] from pH factor is exactly electrical Optical testing electrical prob card
[52:33] Optical testing electrical prob card here Optical probad here and and and
[52:36] here Optical probad here and and and that's what we deliver we we deliver
[52:38] that's what we deliver we we deliver this this metal piece with a fiber array
[52:41] this this metal piece with a fiber array fully qualified fully suitable for
[52:43] fully qualified fully suitable for testing of um of 64 channels and more if
[52:47] testing of um of 64 channels and more if needed um production ready we can go to
[52:51] needed um production ready we can go to very narrow pites down to 25 micrometers
[52:54] very narrow pites down to 25 micrometers we can probe with very low reflect back
[52:56] we can probe with very low reflect back AC activity broad wavelength range whole
[52:58] AC activity broad wavelength range whole communication band it's all there we're
[53:01] communication band it's all there we're we're in manufacturing and uh we're
[53:04] we're in manufacturing and uh we're we're have you get in contact with
[53:07] we're have you get in contact with you how how does that sound to you V
[53:10] you how how does that sound to you V something interesting because you've
[53:13] something interesting because you've mentioned that the the wafer level is
[53:16] mentioned that the the wafer level is something that we all um that it was be
[53:19] something that we all um that it was be one of your
[53:20] one of your demands that is correct I'm actually
[53:23] demands that is correct I'm actually going to reach out to the speaker once
[53:25] going to reach out to the speaker once we're done
[53:27] we're done it's actually very important to remind
[53:29] it's actually very important to remind everyone in the meeting that after this
[53:31] everyone in the meeting that after this meeting where you will get the roster
[53:33] meeting where you will get the roster roster of all the uh participants and
[53:36] roster of all the uh participants and please members let us know with whom
[53:38] please members let us know with whom from this meeting you would like to get
[53:39] from this meeting you would like to get in touch and we'll make sure that this
[53:42] in touch and we'll make sure that this will happen yeah this is pretty
[53:44] will happen yeah this is pretty impressive yep thank you thank you so
[53:46] impressive yep thank you thank you so much and actually pet Philip could you
[53:49] much and actually pet Philip could you please stop sharing your
[53:51] please stop sharing your slide I'm better at that excellent um
[53:56] slide I'm better at that excellent um and and then you also mentioned you know
[53:58] and and then you also mentioned you know that the other challenges because when I
[54:00] that the other challenges because when I look at this especially at the design of
[54:02] look at this especially at the design of the schemes right and when you mention
[54:04] the schemes right and when you mention so many challenges or when so many
[54:06] so many challenges or when so many components that are packed on one
[54:09] components that are packed on one certain certain uh circuit it comes to
[54:12] certain certain uh circuit it comes to me always the question how about the
[54:15] me always the question how about the alignment what is you know how precise
[54:18] alignment what is you know how precise do you have to be in which direction you
[54:20] do you have to be in which direction you work would you commend something on this
[54:23] work would you commend something on this because yeah I think so so clearly you
[54:27] because yeah I think so so clearly you know depending upon the mode size of a
[54:28] know depending upon the mode size of a single mode fiber it's about 9 microns
[54:31] single mode fiber it's about 9 microns and you do there are Technologies out
[54:33] and you do there are Technologies out there for mode conversion now the
[54:35] there for mode conversion now the challenge is as you get from the mode
[54:38] challenge is as you get from the mode you know the 9 Micron mode to the
[54:40] you know the 9 Micron mode to the nanometer sized wave guides the smaller
[54:43] nanometer sized wave guides the smaller you make the mode while it it couples
[54:46] you make the mode while it it couples well with the wave guides it just
[54:48] well with the wave guides it just increases the complexity of alignment so
[54:50] increases the complexity of alignment so it's it's a tradeoff between cost and
[54:54] it's it's a tradeoff between cost and and speed for high volume manufactur in
[54:56] and speed for high volume manufactur in and right now you know our base
[54:58] and right now you know our base technology as IID mentioned is sort of
[55:00] technology as IID mentioned is sort of vgrs I think the previous uh I think one
[55:04] vgrs I think the previous uh I think one of the attendees had talked about the
[55:06] of the attendees had talked about the misalignment of the core so those those
[55:09] misalignment of the core so those those are challenges that uh that need to be
[55:12] are challenges that uh that need to be addressed what is not clear to me is
[55:15] addressed what is not clear to me is whether these need to be addressed
[55:17] whether these need to be addressed through design or whether they need to
[55:18] through design or whether they need to be addressed through uh
[55:21] be addressed through uh manufacturability because there will
[55:23] manufacturability because there will always be uh areas I mean as as you go
[55:26] always be uh areas I mean as as you go into high volume manufacturing there
[55:28] into high volume manufacturing there will always be some slop in in accuracy
[55:32] will always be some slop in in accuracy of any production material and and the
[55:35] of any production material and and the question becomes just like we do on the
[55:37] question becomes just like we do on the semiconductor side where C you know uh
[55:40] semiconductor side where C you know uh designers will Design to Corners worst
[55:43] designers will Design to Corners worst case corners and and so uh it's not
[55:46] case corners and and so uh it's not always clear to me where where that line
[55:48] always clear to me where where that line is between designing for the worst case
[55:51] is between designing for the worst case Corner versus making sure that you have
[55:54] Corner versus making sure that you have you know the the best manufactur ing
[55:56] you know the the best manufactur ing alignment capability because that comes
[55:59] alignment capability because that comes at a cost and and and and I think as the
[56:02] at a cost and and and and I think as the previous uh speaker talked about you
[56:05] previous uh speaker talked about you know we it's always it's always
[56:08] know we it's always it's always interesting to come up with the the
[56:09] interesting to come up with the the latest g- Wass technology but if it is
[56:12] latest g- Wass technology but if it is not manufacturable it does not meet the
[56:15] not manufacturable it does not meet the cost targets of a system uh those become
[56:18] cost targets of a system uh those become you know gway Technologies they don't go
[56:20] you know gway Technologies they don't go into high volume manufacturing so as a
[56:22] into high volume manufacturing so as a Foundry what we are looking for are
[56:25] Foundry what we are looking for are solutions that allow us to go into that
[56:28] solutions that allow us to go into that high volume manufacturing capability
[56:30] high volume manufacturing capability otherwise foundaries can't exist but you
[56:33] otherwise foundaries can't exist but you know there are always with the alignment
[56:35] know there are always with the alignment there are hug two big camps that are I
[56:38] there are hug two big camps that are I think a little bit on the more active
[56:40] think a little bit on the more active fight against one another is the passive
[56:42] fight against one another is the passive alignment versus active alignment so as
[56:45] alignment versus active alignment so as a Foundry we have to support both so
[56:47] a Foundry we have to support both so actually a vgrs can do both so we have
[56:50] actually a vgrs can do both so we have Technologies for the vgroup for Passive
[56:52] Technologies for the vgroup for Passive alignment what we don't talk about
[56:54] alignment what we don't talk about openly is that those vgroup grooves if
[56:56] openly is that those vgroup grooves if you make them a little wider can also
[56:58] you make them a little wider can also support passive active alignment so so
[57:02] support passive active alignment so so we we we don't have a preference per se
[57:05] we we we don't have a preference per se a lot of times it depends upon the
[57:07] a lot of times it depends upon the customer based on how they want to Stack
[57:09] customer based on how they want to Stack up their system and build it up V groups
[57:11] up their system and build it up V groups are capable of doing both passive and
[57:14] are capable of doing both passive and active alignment I would actually like
[57:16] active alignment I would actually like to hear about this um this question that
[57:19] to hear about this um this question that you raised from two of our members that
[57:21] you raised from two of our members that are both doing one doing passive
[57:23] are both doing one doing passive alignment and one doing active alignment
[57:26] alignment and one doing active alignment so let's see what they say and if you'll
[57:28] so let's see what they say and if you'll get convinced so I would like to get for
[57:31] get convinced so I would like to get for instance to the floor to call out Martin
[57:33] instance to the floor to call out Martin from
[57:35] from Finch and tell us Martin what do you
[57:37] Finch and tell us Martin what do you think about the passive alignment The
[57:40] think about the passive alignment The Grove and passive alignment for Mass
[57:43] Grove and passive alignment for Mass manufacturing yeah hey hello and share
[57:47] manufacturing yeah hey hello and share your slide yeah thanks for having me and
[57:51] your slide yeah thanks for having me and yeah closely following the discussions
[57:53] yeah closely following the discussions very interesting and um yeah let's
[57:57] very interesting and um yeah let's go for my
[58:02] slide here you
[58:04] slide here you go yeah we
[58:11] are Martin I think the sound
[58:15] are Martin I think the sound disappeared and I think Martin
[58:18] disappeared and I think Martin disappeared well then let's hopefully he
[58:20] disappeared well then let's hopefully he will come back smoothly we have several
[58:22] will come back smoothly we have several of his colleagues in the room but okay
[58:26] of his colleagues in the room but okay let's maybe I'm trying again so I'm in
[58:29] let's maybe I'm trying again so I'm in again Martin you're back give me a
[58:31] again Martin you're back give me a second chance please
[58:34] second chance please okay once again is that working now yes
[58:38] okay once again is that working now yes okay thank you so um welcome from from
[58:41] okay thank you so um welcome from from berin um so we Produce High Precision
[58:44] berin um so we Produce High Precision equipment and uh following the
[58:47] equipment and uh following the discussion um it's it's like chicken and
[58:49] discussion um it's it's like chicken and egg problem so um we built the tools um
[58:53] egg problem so um we built the tools um that are for developing the these kind
[58:56] that are for developing the these kind of Technologies uh finding good and uh
[58:59] of Technologies uh finding good and uh bad ways and also transferring it into a
[59:02] bad ways and also transferring it into a possible fruitful
[59:04] possible fruitful production um yeah passive passive
[59:07] production um yeah passive passive alignment is this is where we come from
[59:09] alignment is this is where we come from and um it is very interesting coming
[59:12] and um it is very interesting coming from the electronics world trying to
[59:13] from the electronics world trying to adapt all these things also in the opto
[59:16] adapt all these things also in the opto electronics when it's about discrete
[59:18] electronics when it's about discrete components U makes sense uh when it's
[59:20] components U makes sense uh when it's about more integration layers um
[59:23] about more integration layers um integrated photonics um
[59:26] integrated photonics um still it's it's good best
[59:29] still it's it's good best alignment is the alignment that you
[59:31] alignment is the alignment that you don't need to do so all kind of self
[59:34] don't need to do so all kind of self alignment um approaches are of course
[59:38] alignment um approaches are of course best but we see that there are
[59:40] best but we see that there are constraints and uh so there's always a
[59:42] constraints and uh so there's always a point where you need to do some coupling
[59:46] point where you need to do some coupling and maybe also combining electrical
[59:48] and maybe also combining electrical connection and uh photonic um coupling
[59:51] connection and uh photonic um coupling in the best way so um following the the
[59:55] in the best way so um following the the what you see is what Tu Bond um
[59:57] what you see is what Tu Bond um philosophy of um aligning structures and
[01:00:01] philosophy of um aligning structures and getting a very good alignment and postm
[01:00:04] getting a very good alignment and postm accuracy um that doesn't work if the
[01:00:07] accuracy um that doesn't work if the light goes a different path than your
[01:00:09] light goes a different path than your Optical key features and I I think this
[01:00:11] Optical key features and I I think this is the point if if you manufacture the
[01:00:14] is the point if if you manufacture the components in a way that you can trust
[01:00:17] components in a way that you can trust in what you see this is reproducible
[01:00:20] in what you see this is reproducible then you can use passive Optical
[01:00:22] then you can use passive Optical alignment and bonding we have a an
[01:00:25] alignment and bonding we have a an intermediate approach as well so if you
[01:00:27] intermediate approach as well so if you know the
[01:00:28] know the offset that you use some helping
[01:00:31] offset that you use some helping structures to get the parts
[01:00:33] structures to get the parts aligned and um you know like known good
[01:00:37] aligned and um you know like known good die testing known offset bonding that
[01:00:40] die testing known offset bonding that you can feed that last nanometers of um
[01:00:43] you can feed that last nanometers of um yeah getting it into The Sweet Spot you
[01:00:45] yeah getting it into The Sweet Spot you can still go with the um Optical
[01:00:48] can still go with the um Optical approach having the um passive alignment
[01:00:52] approach having the um passive alignment and if this doesn't work of course then
[01:00:53] and if this doesn't work of course then last resort would be to use active
[01:00:56] last resort would be to use active alignment and also I wrote it down here
[01:00:58] alignment and also I wrote it down here it is even possible also for us to
[01:01:00] it is even possible also for us to combine passive and active alignment
[01:01:02] combine passive and active alignment doing a perfect
[01:01:03] doing a perfect pre-alignment and um an active alignment
[01:01:07] pre-alignment and um an active alignment that is only pushing the the last the
[01:01:10] that is only pushing the the last the last uh couple of
[01:01:12] last uh couple of manometers and and we are really looking
[01:01:14] manometers and and we are really looking for like the design rules and how these
[01:01:18] for like the design rules and how these components will look like so will it be
[01:01:20] components will look like so will it be Edge or Surface coupled and how you
[01:01:23] Edge or Surface coupled and how you combine the electrical and the optical
[01:01:25] combine the electrical and the optical path
[01:01:27] path and also how it is possible to to make
[01:01:30] and also how it is possible to to make that pre-testing to find out the Matrix
[01:01:33] that pre-testing to find out the Matrix so this with our machines in in the R&D
[01:01:35] so this with our machines in in the R&D world it's it's possible to just test
[01:01:37] world it's it's possible to just test things and um do biasing of um of
[01:01:43] things and um do biasing of um of offsets um in a strategic way and then
[01:01:46] offsets um in a strategic way and then feeding into this in a database and for
[01:01:49] feeding into this in a database and for the production then just use the known
[01:01:51] the production then just use the known offsets so but this is only one single
[01:01:54] offsets so but this is only one single point this is such a
[01:01:56] point this is such a um field and it's it's very interesting
[01:02:00] um field and it's it's very interesting for us to see all this being combined
[01:02:02] for us to see all this being combined and uh yeah using the traditional
[01:02:05] and uh yeah using the traditional bonding
[01:02:06] bonding Technologies so yeah we are part of that
[01:02:08] Technologies so yeah we are part of that game thank you so much Martin I have to
[01:02:11] game thank you so much Martin I have to say you know when you've mentioned that
[01:02:12] say you know when you've mentioned that there's a very exciting field yeah we
[01:02:14] there's a very exciting field yeah we have 240 active participants that are
[01:02:16] have 240 active participants that are listening to us now so it's clearly an
[01:02:19] listening to us now so it's clearly an indication that is a very interesting
[01:02:21] indication that is a very interesting field and before we make our judgments
[01:02:24] field and before we make our judgments let's also hear from the camp of the
[01:02:26] let's also hear from the camp of the passive alignment Johnny what do you
[01:02:29] passive alignment Johnny what do you have to say the vrps and the passive
[01:02:31] have to say the vrps and the passive alignment how does that look and work
[01:02:34] alignment how does that look and work together and please share your
[01:02:37] together and please share your slide yes I try to hi everyone uh first
[01:02:41] slide yes I try to hi everyone uh first of all let me share my
[01:02:45] of all let me share my screen I hope it
[01:02:47] screen I hope it works it
[01:02:49] works it does so basically okay if you need my
[01:02:53] does so basically okay if you need my personal
[01:02:54] personal opinion let's start with this one uh so
[01:02:58] opinion let's start with this one uh so my my opinion is that uh uh what Peter
[01:03:02] my my opinion is that uh uh what Peter presented the integration and the
[01:03:04] presented the integration and the interposer Approach at Ware level I
[01:03:07] interposer Approach at Ware level I think for the next year has to be really
[01:03:10] think for the next year has to be really well developed because uh all the other
[01:03:15] well developed because uh all the other even if it is against V robotics
[01:03:17] even if it is against V robotics expertise let's say because this part of
[01:03:19] expertise let's say because this part of flip shipping die bonding waer
[01:03:23] flip shipping die bonding waer bonding uh also imagining waer Bond I
[01:03:26] bonding uh also imagining waer Bond I think could be a solution for the future
[01:03:29] think could be a solution for the future if some sort of volume will really
[01:03:32] if some sort of volume will really happen and integration as well in
[01:03:35] happen and integration as well in relation to your question V gr not V gr
[01:03:38] relation to your question V gr not V gr you know I I'm from my experience it's
[01:03:41] you know I I'm from my experience it's it's it takes a little bit of time I for
[01:03:45] it's it takes a little bit of time I for volume application I don't think that
[01:03:47] volume application I don't think that this is so
[01:03:49] this is so straightforward our uh so this is my
[01:03:52] straightforward our uh so this is my personal opinion so it's a little bit
[01:03:54] personal opinion so it's a little bit tricky to really do
[01:03:57] tricky to really do volume is not like to say in relation to
[01:04:01] volume is not like to say in relation to Vis robotics that is a different thing
[01:04:04] Vis robotics that is a different thing what these robotics do is essentially
[01:04:07] what these robotics do is essentially try to use as you see here in the slide
[01:04:10] try to use as you see here in the slide different you please share Johnny sorry
[01:04:12] different you please share Johnny sorry I Dr can you please share the slide in
[01:04:14] I Dr can you please share the slide in the presentation mode because I think we
[01:04:17] the presentation mode because I think we know all see it in editing
[01:04:19] know all see it in editing mode uh ah I think I I ah okay yes you
[01:04:25] mode uh ah I think I I ah okay yes you Al got drifted away with the discussion
[01:04:27] Al got drifted away with the discussion of the possibilities and forgot to click
[01:04:29] of the possibilities and forgot to click the button please present us yeah yeah
[01:04:32] the button please present us yeah yeah so so basically you see we have
[01:04:34] so so basically you see we have different tool we are working in uh in
[01:04:36] different tool we are working in uh in many different field lately we are
[01:04:38] many different field lately we are focusing more on photonics for realizing
[01:04:42] focusing more on photonics for realizing systems that can allow uh the alignment
[01:04:45] systems that can allow uh the alignment and the
[01:04:46] and the pigtailing uh so essentially we try to
[01:04:49] pigtailing uh so essentially we try to use our expertise also from different
[01:04:51] use our expertise also from different areas like automation
[01:04:53] areas like automation Robotics and uh you know High Precision
[01:04:57] Robotics and uh you know High Precision design the software we realize our own
[01:04:59] design the software we realize our own software we have different solutions
[01:05:01] software we have different solutions that we develop in the years and we are
[01:05:03] that we develop in the years and we are trying to to uh to to offer to the
[01:05:07] trying to to uh to to offer to the potential customer a dedicated tailored
[01:05:11] potential customer a dedicated tailored solution for this kind of application so
[01:05:15] solution for this kind of application so alignment uh can be fiber array
[01:05:18] alignment uh can be fiber array alignment can be lenses alignment can be
[01:05:20] alignment can be lenses alignment can be interposer in a certain sense and using
[01:05:24] interposer in a certain sense and using the tools that you see here
[01:05:26] the tools that you see here reported so we have different tool boxes
[01:05:29] reported so we have different tool boxes we have a lot of flexibility we are
[01:05:31] we have a lot of flexibility we are small so we are not let's say it's
[01:05:33] small so we are not let's say it's difficult to fight fight against bigger
[01:05:36] difficult to fight fight against bigger and more structured companies but we
[01:05:39] and more structured companies but we offer this tool expertise for um let's
[01:05:44] offer this tool expertise for um let's say um tailored tailored solution if
[01:05:48] say um tailored tailored solution if someone has some specific
[01:05:50] someone has some specific request uh that can be solved together
[01:05:54] request uh that can be solved together we have all these different tool and we
[01:05:55] we have all these different tool and we can realize the machine or the system
[01:05:57] can realize the machine or the system whatever is necessary for serving in
[01:06:00] whatever is necessary for serving in time of course uh we don't need to two
[01:06:03] time of course uh we don't need to two years to realize the system so we are
[01:06:05] years to realize the system so we are quite quick and that this is what Vis
[01:06:08] quite quick and that this is what Vis robotics does um and um so be aware that
[01:06:13] robotics does um and um so be aware that we exist we are flexible and we can
[01:06:17] we exist we are flexible and we can support in a very quick way the
[01:06:19] support in a very quick way the Necessities that can arise we are aware
[01:06:23] Necessities that can arise we are aware thank you so much Jenny you're welcome
[01:06:26] thank you so much Jenny you're welcome yeah so vas so after you've he heard
[01:06:29] yeah so vas so after you've he heard passive active um what's your what are
[01:06:33] passive active um what's your what are your judgments tell us yeah I so as I
[01:06:37] your judgments tell us yeah I so as I said you know as as a Foundry we we are
[01:06:40] said you know as as a Foundry we we are a service provider so a lot of times a
[01:06:42] a service provider so a lot of times a lot of these decisions are made by our
[01:06:44] lot of these decisions are made by our customers however I I I think the more
[01:06:47] customers however I I I think the more important part is as a Foundry we have
[01:06:49] important part is as a Foundry we have technologies that are flexible that that
[01:06:52] technologies that are flexible that that can support you know uh
[01:06:55] can support you know uh passive alignment and active alignment
[01:06:58] passive alignment and active alignment all I can say is you know passive
[01:06:59] all I can say is you know passive alignment becomes an important uh
[01:07:02] alignment becomes an important uh consideration when you start talking
[01:07:04] consideration when you start talking about things like co-packaged Optics
[01:07:07] about things like co-packaged Optics where you know you're talking about
[01:07:09] where you know you're talking about almost 30 40 fibers that are aligned to
[01:07:12] almost 30 40 fibers that are aligned to the edge of the pick and and at that
[01:07:15] the edge of the pick and and at that time you know the time uh that is
[01:07:17] time you know the time uh that is required to do active alignment per
[01:07:20] required to do active alignment per fiber becomes prohibitive so once you
[01:07:22] fiber becomes prohibitive so once you start talking about fairly large fiber
[01:07:25] start talking about fairly large fiber arrays I think the passive alignment
[01:07:26] arrays I think the passive alignment becomes a more attractive option but I
[01:07:29] becomes a more attractive option but I also want to State it's not the only
[01:07:30] also want to State it's not the only option so I I I so that that's sort of
[01:07:33] option so I I I so that that's sort of where where we are uh and uh while vgr
[01:07:37] where where we are uh and uh while vgr continues to be our plan of record uh we
[01:07:40] continues to be our plan of record uh we are open to other other technologies
[01:07:43] are open to other other technologies that customers may need fun
[01:07:45] that customers may need fun fundamentally we are a service provider
[01:07:48] fundamentally we are a service provider and and we need to make sure that our
[01:07:50] and and we need to make sure that our customers needs some M Yeah we actually
[01:07:53] customers needs some M Yeah we actually have a question to you from uh Amir from
[01:07:56] have a question to you from uh Amir from lithium you raised the question so
[01:07:59] lithium you raised the question so please unmute yourself and ask yeah this
[01:08:04] please unmute yourself and ask yeah this was can you hear me yes so this was
[01:08:07] was can you hear me yes so this was actually the question to Philip and then
[01:08:09] actually the question to Philip and then the awesome this prescope technology
[01:08:12] the awesome this prescope technology just one wondering you know how do you
[01:08:14] just one wondering you know how do you handle like polarization I mean can you
[01:08:18] handle like polarization I mean can you PM fibers or yeah we use PM fibers
[01:08:21] PM fibers or yeah we use PM fibers that's that's the easiest way of
[01:08:22] that's that's the easiest way of handling
[01:08:24] handling polarization okay
[01:08:26] polarization okay um 20 DB PR 20 DB PR is then the
[01:08:32] outcome yeah it's enough for most
[01:08:35] outcome yeah it's enough for most application yeah is good okay and I
[01:08:39] application yeah is good okay and I guess that was the similar question from
[01:08:41] guess that was the similar question from uh g& Stuart Stuart I guess you asked
[01:08:45] uh g& Stuart Stuart I guess you asked about polarization manipulation
[01:08:47] about polarization manipulation components but I think this is more for
[01:08:49] components but I think this is more for the uh again for the Keystone or Stuart
[01:08:55] the uh again for the Keystone or Stuart um my my question was I think I sent
[01:08:58] um my my question was I think I sent that question in um while vas was
[01:09:00] that question in um while vas was speaking from Global foundaries when uh
[01:09:03] speaking from Global foundaries when uh you showed the uh showed the list of
[01:09:06] you showed the uh showed the list of components in the
[01:09:08] components in the um that were available so I was just
[01:09:11] um that were available so I was just curious about the sort of
[01:09:14] curious about the sort of um other devices that might be possible
[01:09:17] um other devices that might be possible for um sort of polarization um
[01:09:20] for um sort of polarization um multiplexing or Dem multiplexing right
[01:09:23] multiplexing or Dem multiplexing right so so yeah this because the time was
[01:09:25] so so yeah this because the time was short I I didn't go into all of the
[01:09:27] short I I didn't go into all of the details so we do have psrs uh you know
[01:09:31] details so we do have psrs uh you know polar polarization shifter rotators uh
[01:09:34] polar polarization shifter rotators uh already pre-characterized and in our pdk
[01:09:37] already pre-characterized and in our pdk so if if you're interested uh you know
[01:09:41] so if if you're interested uh you know once we get ndas things like that in
[01:09:43] once we get ndas things like that in place we can we you can have a look in
[01:09:45] place we can we you can have a look in the pdk so all all of these and that's
[01:09:48] the pdk so all all of these and that's the point I was making in my
[01:09:49] the point I was making in my presentation that the the GF photonics
[01:09:52] presentation that the the GF photonics technology is very rich I showed you all
[01:09:54] technology is very rich I showed you all a very small subset of just the passive
[01:09:57] a very small subset of just the passive components uh that that we've included
[01:10:00] components uh that that we've included in the pdk and the cwdm macro as I
[01:10:03] in the pdk and the cwdm macro as I mentioned is is sort of the newer
[01:10:05] mentioned is is sort of the newer component but there is a fairly Rich
[01:10:07] component but there is a fairly Rich component library in the pdk already
[01:10:09] component library in the pdk already which includes uh shifters and rotators
[01:10:13] which includes uh shifters and rotators yeah thank you because and you also
[01:10:16] yeah thank you because and you also mentioned you know that you're also
[01:10:17] mentioned you know that you're also looking at the designs that something
[01:10:19] looking at the designs that something that eventually with which merges the
[01:10:23] that eventually with which merges the manufacturability with actually the D
[01:10:25] manufacturability with actually the D the desires of the customer and we
[01:10:27] the desires of the customer and we actually we have a member which is who
[01:10:29] actually we have a member which is who is op wave Chan Bon Phil is here to
[01:10:32] is op wave Chan Bon Phil is here to maybe show some of their Solutions and
[01:10:35] maybe show some of their Solutions and capabilities Chan please share your
[01:10:37] capabilities Chan please share your slide and mute yourself and present
[01:10:39] slide and mute yourself and present where how you can help of making even
[01:10:41] where how you can help of making even some of the craziest desires of the
[01:10:45] some of the craziest desires of the customers true and
[01:10:48] customers true and manufacturable okay um I hope you can
[01:10:50] manufacturable okay um I hope you can hear me and see my slide okay so uh I am
[01:10:55] hear me and see my slide okay so uh I am the product manager of Opti spice at
[01:10:56] the product manager of Opti spice at Opti wave just I'll give you a brief
[01:10:58] Opti wave just I'll give you a brief introduction of the company and then
[01:11:00] introduction of the company and then talk about um how we deal with
[01:11:02] talk about um how we deal with parameterized compact models um
[01:11:05] parameterized compact models um internally and the products we're going
[01:11:07] internally and the products we're going to be releasing so opave has a wide
[01:11:09] to be releasing so opave has a wide product portfolio of simulation tools uh
[01:11:12] product portfolio of simulation tools uh ranging from device level to Circuit
[01:11:14] ranging from device level to Circuit level to system level um the
[01:11:16] level to system level um the applications include Optics Datacom
[01:11:19] applications include Optics Datacom Telecom Quantum sensors and many more we
[01:11:22] Telecom Quantum sensors and many more we also have a new product called Opti
[01:11:24] also have a new product called Opti instrument which can be used to automate
[01:11:26] instrument which can be used to automate uh test equipment now the topic I would
[01:11:29] uh test equipment now the topic I would like to go over today is the creation
[01:11:30] like to go over today is the creation process of process aware compact models
[01:11:33] process of process aware compact models for pick design we'll be releasing a
[01:11:35] for pick design we'll be releasing a series series of tools to automate this
[01:11:37] series series of tools to automate this process but our initial Focus right now
[01:11:39] process but our initial Focus right now is on the passive devices and we'll be
[01:11:42] is on the passive devices and we'll be adding active device modeling in the
[01:11:43] adding active device modeling in the future now as you can see in the slide
[01:11:46] future now as you can see in the slide we start with a parameterized gds2 mask
[01:11:50] we start with a parameterized gds2 mask um and then combining that with material
[01:11:52] um and then combining that with material definitions em simulation and a design
[01:11:54] definitions em simulation and a design goal now it's possible to
[01:11:57] goal now it's possible to automate the the compact model
[01:11:59] automate the the compact model generation and finding uh the optimal
[01:12:02] generation and finding uh the optimal layout for the Optimal Performance now
[01:12:05] layout for the Optimal Performance now additionally since the layout is
[01:12:06] additionally since the layout is parameterized it is possible to run
[01:12:08] parameterized it is possible to run sweeps to include a solution space
[01:12:10] sweeps to include a solution space around the optimization point and
[01:12:12] around the optimization point and collecting all this data together you
[01:12:15] collecting all this data together you can then create a compact model that
[01:12:18] can then create a compact model that that is process aware through either
[01:12:20] that is process aware through either interpolation parameter fitting you
[01:12:22] interpolation parameter fitting you could even use neural networks and many
[01:12:25] could even use neural networks and many other methods this follows the idea of
[01:12:28] other methods this follows the idea of how you would generate a compact model
[01:12:29] how you would generate a compact model in electronics so we need to repeat the
[01:12:31] in electronics so we need to repeat the same process in Optics as well uh once
[01:12:34] same process in Optics as well uh once the compact model is ready then it can
[01:12:36] the compact model is ready then it can be used in PE layout for circuit level
[01:12:38] be used in PE layout for circuit level simulation uh which can include M first
[01:12:41] simulation uh which can include M first obviously regular design performance
[01:12:42] obviously regular design performance check multical analysis and sensitivity
[01:12:45] check multical analysis and sensitivity analysis this is critical to discover
[01:12:47] analysis this is critical to discover issues in early stages of the design
[01:12:49] issues in early stages of the design process and reduce sensitivity to
[01:12:51] process and reduce sensitivity to variances in fabrication now in the next
[01:12:54] variances in fabrication now in the next few months we are launching a new tool
[01:12:57] few months we are launching a new tool um that automates the generation of s
[01:12:59] um that automates the generation of s parameters from GDs masks or a GDs
[01:13:02] parameters from GDs masks or a GDs generator script um this tool will
[01:13:04] generator script um this tool will include various different solvers
[01:13:06] include various different solvers capable of dealing uh taking advantage
[01:13:08] capable of dealing uh taking advantage of CPU parallelization and GPU
[01:13:11] of CPU parallelization and GPU acceleration um addition additionally
[01:13:13] acceleration um addition additionally these solvers will share a common
[01:13:15] these solvers will share a common platform that automates Port detection
[01:13:18] platform that automates Port detection uh Extrusion and source and monitor
[01:13:20] uh Extrusion and source and monitor placements and will also be supporting
[01:13:22] placements and will also be supporting Port symmetry to speed up the
[01:13:23] Port symmetry to speed up the simulations even further
[01:13:25] simulations even further now just as a summary we're working on
[01:13:28] now just as a summary we're working on accelerating pick creation process by
[01:13:31] accelerating pick creation process by automating the compact model generation
[01:13:34] automating the compact model generation and supporting firsttime uh right design
[01:13:37] and supporting firsttime uh right design our design philosophy can be summarized
[01:13:39] our design philosophy can be summarized as let the computer do the work um we
[01:13:42] as let the computer do the work um we would like to hear about obstacles um
[01:13:44] would like to hear about obstacles um everybody's facing uh during pick device
[01:13:47] everybody's facing uh during pick device design specifically related to compact
[01:13:49] design specifically related to compact model generation because this involves
[01:13:51] model generation because this involves uh Fabs and also people who are
[01:13:53] uh Fabs and also people who are designing pics um and so that we we can
[01:13:56] designing pics um and so that we we can incorporate U real life challenges and
[01:13:59] incorporate U real life challenges and and into um our products so please free
[01:14:02] and into um our products so please free to contact us uh and let me know about
[01:14:04] to contact us uh and let me know about your questions um about the process I'm
[01:14:07] your questions um about the process I'm sure there will be interested ones thank
[01:14:09] sure there will be interested ones thank you so much
[01:14:11] you so much Jim uh because do does design always
[01:14:14] Jim uh because do does design always come from the customers or do you also
[01:14:17] come from the customers or do you also have a say that you can think okay um we
[01:14:21] have a say that you can think okay um we look when you look at a certain request
[01:14:24] look when you look at a certain request and you believe that it can be done
[01:14:27] and you believe that it can be done better yeah I think we we do have a very
[01:14:30] better yeah I think we we do have a very collaborative way of uh working with our
[01:14:33] collaborative way of uh working with our customers clearly there are certain
[01:14:36] customers clearly there are certain designs that are ma more
[01:14:38] designs that are ma more manufacturable than than other designs
[01:14:41] manufacturable than than other designs and so you know F first of all of course
[01:14:44] and so you know F first of all of course uh we do have DRC Decks that allow the
[01:14:47] uh we do have DRC Decks that allow the customer you know the first order of
[01:14:49] customer you know the first order of business to check and make sure that
[01:14:51] business to check and make sure that their their designs are DRC compliant
[01:14:54] their their designs are DRC compliant and the DRC
[01:14:55] and the DRC actually uh comprehends curv linear
[01:14:58] actually uh comprehends curv linear shapes for you know photonic design uh
[01:15:01] shapes for you know photonic design uh but but yes we do collaborate very
[01:15:03] but but yes we do collaborate very closely with our customers we have
[01:15:05] closely with our customers we have capability of doing link budget
[01:15:07] capability of doing link budget simulations our pdks allow for Monte
[01:15:10] simulations our pdks allow for Monte Carlo simulations uh you know across
[01:15:13] Carlo simulations uh you know across devices and process variations so yes we
[01:15:16] devices and process variations so yes we we actually provide feedback to the
[01:15:18] we actually provide feedback to the customers uh in their design phase uh
[01:15:22] customers uh in their design phase uh with respect to you know designs that
[01:15:24] with respect to you know designs that are more manufacturable taking into
[01:15:26] are more manufacturable taking into account you know
[01:15:28] account you know packaging process variability etc etc so
[01:15:32] packaging process variability etc etc so I think that's yes we do work very
[01:15:34] I think that's yes we do work very collaboratively with our customers thank
[01:15:36] collaboratively with our customers thank you thank you so much well and this uh
[01:15:39] you thank you so much well and this uh let's move on and because now from the
[01:15:42] let's move on and because now from the the entire um entire wafer we start to
[01:15:47] the entire um entire wafer we start to go into the small components and I would
[01:15:49] go into the small components and I would like to introduce all the way from Japan
[01:15:52] like to introduce all the way from Japan one of the speakers there actually
[01:15:53] one of the speakers there actually working on the development of the
[01:15:55] working on the development of the integrated circuits and also different
[01:15:58] integrated circuits and also different device based pics for the Telecom data
[01:16:02] device based pics for the Telecom data comp it's my great pleasure to introduce
[01:16:04] comp it's my great pleasure to introduce Sumit Tomo electric and yasan are you
[01:16:08] Sumit Tomo electric and yasan are you here please yes the floor in attention
[01:16:11] here please yes the floor in attention of 230 people belongs to you yeah uh
[01:16:16] of 230 people belongs to you yeah uh thank you very much for the kind
[01:16:21] [Music]
[01:16:22] [Music] introduction please go into the
[01:16:24] introduction please go into the presentation mode
[01:16:27] presentation mode yeah uh can you see the presentation yes
[01:16:32] yeah uh can you see the presentation yes yeah so my name is y
[01:16:36] yeah so my name is y from Electric Industries in rmd
[01:16:40] from Electric Industries in rmd department so today I will talk about
[01:16:43] department so today I will talk about the 3D printed be expanding R for tiip
[01:16:46] the 3D printed be expanding R for tiip to fiber uh partical coupling so this
[01:16:50] to fiber uh partical coupling so this the r images are shown here and we
[01:16:54] the r images are shown here and we demonstrated
[01:16:55] demonstrated low coupling R uh wide arment to and
[01:17:00] low coupling R uh wide arment to and reliable uh Optical coupling
[01:17:05] technology oh uh I will start from
[01:17:08] technology oh uh I will start from background as you know uh Co parage
[01:17:11] background as you know uh Co parage Optics is attracting attention uh
[01:17:13] Optics is attracting attention uh because it can significantly reduce uh
[01:17:17] because it can significantly reduce uh energy
[01:17:18] energy consumption hi2 fiber coupling is a
[01:17:21] consumption hi2 fiber coupling is a essential uh component for CPU and uh
[01:17:25] essential uh component for CPU and uh low profile uh detachable and ref
[01:17:29] low profile uh detachable and ref tolerant technology is
[01:17:31] tolerant technology is desirable so there are two types of
[01:17:34] desirable so there are two types of optical iio for uh silicon honic uh one
[01:17:38] optical iio for uh silicon honic uh one is H cap and the other is par CER the
[01:17:42] is H cap and the other is par CER the example of Ed CER is inverse ster it has
[01:17:46] example of Ed CER is inverse ster it has Superior performance for coupling
[01:17:48] Superior performance for coupling essency and web length spand withd uh
[01:17:52] essency and web length spand withd uh but it is not useful in terms of
[01:17:54] but it is not useful in terms of Packaging
[01:17:55] Packaging because uh alignment stance is very
[01:17:57] because uh alignment stance is very narrow fiber coupling is limited to 1D
[01:18:01] narrow fiber coupling is limited to 1D configuration and the inspection is uh
[01:18:05] configuration and the inspection is uh only done after
[01:18:07] only done after simulation in contrast vertical cap such
[01:18:11] simulation in contrast vertical cap such as grating cap uh is inferior
[01:18:14] as grating cap uh is inferior performance rather than H cap but it is
[01:18:17] performance rather than H cap but it is useful for packaging because uh it could
[01:18:20] useful for packaging because uh it could be arranged in 2D configuration that's
[01:18:23] be arranged in 2D configuration that's increasing the uh beach front density
[01:18:27] increasing the uh beach front density also the inspection of P could be
[01:18:30] also the inspection of P could be done uh in we
[01:18:33] done uh in we state so to take the advantages of both
[01:18:37] state so to take the advantages of both Capas we divid down H CER with free form
[01:18:41] Capas we divid down H CER with free form mirror the concept is simple reflective
[01:18:44] mirror the concept is simple reflective mirrror is formed onto the uh Edge
[01:18:47] mirrror is formed onto the uh Edge capital of peak right is emitted from
[01:18:51] capital of peak right is emitted from HCA to horizontal Direction and then it
[01:18:55] HCA to horizontal Direction and then it is reflected throughout vertical
[01:18:58] is reflected throughout vertical Direction by the mirror there is a
[01:19:01] Direction by the mirror there is a similar mirror on the fiber side so the
[01:19:03] similar mirror on the fiber side so the right is reflected again throughout
[01:19:06] right is reflected again throughout horizontal
[01:19:07] horizontal Direction the key function of this lens
[01:19:10] Direction the key function of this lens is beam expanding by the convex he metor
[01:19:16] is beam expanding by the convex he metor typical H cap has MFD of only three
[01:19:19] typical H cap has MFD of only three micrometer so the alignment sance is
[01:19:22] micrometer so the alignment sance is less than one micrometer
[01:19:25] less than one micrometer however the output beam from this L is
[01:19:28] however the output beam from this L is as large as 40 micrometer so the
[01:19:32] as large as 40 micrometer so the alignment to is broaden to plusus 10
[01:19:36] alignment to is broaden to plusus 10 micrometer so in order to demonstrate uh
[01:19:40] micrometer so in order to demonstrate uh the concept we fabricate this range uh
[01:19:43] the concept we fabricate this range uh with nanoscale 3D printing technology uh
[01:19:46] with nanoscale 3D printing technology uh collaborating with Bard
[01:19:49] collaborating with Bard autom so first uh pick is uh imers in
[01:19:53] autom so first uh pick is uh imers in the anur resist and then 780 nanom Rite
[01:19:59] the anur resist and then 780 nanom Rite was eradiated to the resist to
[01:20:01] was eradiated to the resist to selectively cure the lens shape in this
[01:20:05] selectively cure the lens shape in this time the position of P web guide was
[01:20:08] time the position of P web guide was detected so the lens was formed at its
[01:20:10] detected so the lens was formed at its focus position after lat Iration uh the
[01:20:14] focus position after lat Iration uh the lens was formed onto the edge of uh
[01:20:18] lens was formed onto the edge of uh P finally uncured prist was washed away
[01:20:22] P finally uncured prist was washed away by the organic Sol
[01:20:24] by the organic Sol the printing par is a 4 minutes for
[01:20:27] the printing par is a 4 minutes for protype but it could be further reduced
[01:20:30] protype but it could be further reduced by optimizing the printing
[01:20:33] by optimizing the printing condition uh the right side figure shows
[01:20:36] condition uh the right side figure shows the pictures of fabricated Str we can
[01:20:40] the pictures of fabricated Str we can clearly see the very smooth range
[01:20:44] clearly see the very smooth range surface then I will move to the
[01:20:47] surface then I will move to the measurement results at first we measures
[01:20:49] measurement results at first we measures the coupling efficiency between P to
[01:20:52] the coupling efficiency between P to fiber in this measurements the output
[01:20:55] fiber in this measurements the output Port of peak is silicon Nitro SSC uh
[01:20:59] Port of peak is silicon Nitro SSC uh with MFD of 3 micromet and that of fiber
[01:21:03] with MFD of 3 micromet and that of fiber is 10
[01:21:04] is 10 micromet uh
[01:21:06] micromet uh so MFD matching is done by the design of
[01:21:10] so MFD matching is done by the design of this convex
[01:21:11] this convex mirror uh we can clearly see the flat
[01:21:15] mirror uh we can clearly see the flat characteristics over 100 nanometer range
[01:21:18] characteristics over 100 nanometer range and the typical value is minus 1.8 DB at
[01:21:22] and the typical value is minus 1.8 DB at 1550 nanometer the right side table
[01:21:25] 1550 nanometer the right side table shows the coupling essency of nine lens
[01:21:29] shows the coupling essency of nine lens uh before and after theal
[01:21:32] uh before and after theal stress uh we can clearly see that the
[01:21:35] stress uh we can clearly see that the coupling is very stable after Reflow
[01:21:39] coupling is very stable after Reflow also the deviation of uh each length is
[01:21:42] also the deviation of uh each length is very small with a standard deviation of
[01:21:45] very small with a standard deviation of only 0.03
[01:21:47] only 0.03 DB so we fabricated this lens by 3D
[01:21:51] DB so we fabricated this lens by 3D printing but the Repro reproducibility
[01:21:54] printing but the Repro reproducibility and theity are pretty
[01:21:57] and theity are pretty good so next we measure the alignment St
[01:22:01] good so next we measure the alignment St between Pak to fiber uh the left side
[01:22:04] between Pak to fiber uh the left side graph shows the alignment stance along
[01:22:06] graph shows the alignment stance along in plane direction we can see the broad
[01:22:10] in plane direction we can see the broad tolerance and the 1db to is plusus 10
[01:22:14] tolerance and the 1db to is plusus 10 microm as designed the right side graph
[01:22:18] microm as designed the right side graph shows the out of plane alignment stance
[01:22:21] shows the out of plane alignment stance surprisingly the coupling aeny is almost
[01:22:25] surprisingly the coupling aeny is almost constant from 0 micromet to 600 micromet
[01:22:30] constant from 0 micromet to 600 micromet and the excess loss is below 0.5
[01:22:33] and the excess loss is below 0.5 DV so I will show you the pictures
[01:22:35] DV so I will show you the pictures during the measurement in this case the
[01:22:38] during the measurement in this case the distance from uh silicon photonix chip
[01:22:41] distance from uh silicon photonix chip and fi is 600 micromet but the cing is
[01:22:46] and fi is 600 micromet but the cing is less than minus 2 DB so we think that
[01:22:51] less than minus 2 DB so we think that the wi alignment to could be very useful
[01:22:54] the wi alignment to could be very useful for
[01:22:55] for data
[01:22:56] data connection so finally I will summarize
[01:22:59] connection so finally I will summarize my presentation uh we proposed
[01:23:01] my presentation uh we proposed partically cut beam expanding L for p to
[01:23:04] partically cut beam expanding L for p to fiber connection uh proty are fabricated
[01:23:08] fiber connection uh proty are fabricated using 3D printing technology and
[01:23:11] using 3D printing technology and coupling aeny of minus 1.8 DB and 1 DB
[01:23:15] coupling aeny of minus 1.8 DB and 1 DB to of 10 micromet achieved and the
[01:23:19] to of 10 micromet achieved and the performance of this 3D printed L was
[01:23:22] performance of this 3D printed L was unchanged after the SU
[01:23:25] unchanged after the SU so thank you for
[01:23:27] so thank you for listening thank you very much for being
[01:23:29] listening thank you very much for being with us today it is great to have this
[01:23:32] with us today it is great to have this uh showcasing on compatibility when we
[01:23:35] uh showcasing on compatibility when we hear from Sumit micronics and I think
[01:23:37] hear from Sumit micronics and I think the best way to follow up this
[01:23:39] the best way to follow up this presentation is to give the floor to the
[01:23:41] presentation is to give the floor to the representative today from Vanguard
[01:23:43] representative today from Vanguard automation micronic thank you very much
[01:23:45] automation micronic thank you very much for being with us today laa Kang tell us
[01:23:48] for being with us today laa Kang tell us what's on your mind thank you Jose and
[01:23:50] what's on your mind thank you Jose and thank you um yeah for giving ni present
[01:23:54] thank you um yeah for giving ni present ation on our technology let me just
[01:23:56] ation on our technology let me just share my
[01:24:04] screen okay so in presentation mode so I
[01:24:07] screen okay so in presentation mode so I want to thank all the speakers we really
[01:24:10] want to thank all the speakers we really highlighted the key challenges in the
[01:24:12] highlighted the key challenges in the industry for plation and
[01:24:15] industry for plation and packaging and at Vanguard automation we
[01:24:18] packaging and at Vanguard automation we focus on this solution using very low
[01:24:22] focus on this solution using very low Precision taking place a passive
[01:24:23] Precision taking place a passive alignment and Al of manufacturing using
[01:24:26] alignment and Al of manufacturing using 2D laser logy in the last presentation
[01:24:29] 2D laser logy in the last presentation you showed a two example of how this
[01:24:31] you showed a two example of how this works um so we have a range of solutions
[01:24:34] works um so we have a range of solutions to provide Chic insiration using ad and
[01:24:37] to provide Chic insiration using ad and 3D laser photography the first of these
[01:24:39] 3D laser photography the first of these we callic wire
[01:24:43] bonding please
[01:24:45] bonding please continue which is a free form Optical
[01:24:48] continue which is a free form Optical wave guides uh which can be used to
[01:24:50] wave guides uh which can be used to couple different components together you
[01:24:52] couple different components together you can see on the far left hand side this
[01:24:55] can see on the far left hand side this leure work coupling multicore firus
[01:24:58] leure work coupling multicore firus together with a very high interconnect
[01:25:00] together with a very high interconnect density and in the center the solution
[01:25:03] density and in the center the solution for coupling fiber chips we also have a
[01:25:06] for coupling fiber chips we also have a different solution called Fast attached
[01:25:08] different solution called Fast attached micro optic lenses which was shown the
[01:25:10] micro optic lenses which was shown the last slide which can use to relax
[01:25:12] last slide which can use to relax alignment hces all done with 3D printing
[01:25:16] alignment hces all done with 3D printing and Vanguard automation really focuses
[01:25:19] and Vanguard automation really focuses on having low insertion losses but also
[01:25:22] on having low insertion losses but also products with high yield reliability and
[01:25:24] products with high yield reliability and equability and provide us with a
[01:25:26] equability and provide us with a complete energy proven solution
[01:25:28] complete energy proven solution comprising of all the machines sofware
[01:25:31] comprising of all the machines sofware material processes and full customer
[01:25:34] material processes and full customer support that our customers need to bring
[01:25:36] support that our customers need to bring fun integration into their production
[01:25:38] fun integration into their production lines on their service
[01:25:42] lines on their service providers so in this slide like to focus
[01:25:45] providers so in this slide like to focus on the multichip hyrid integration
[01:25:47] on the multichip hyrid integration solution so we've shown many different
[01:25:49] solution so we've shown many different examples over the years how to use the
[01:25:51] examples over the years how to use the technology for T integration and the
[01:25:54] technology for T integration and the slide of bottom you have just three
[01:25:56] slide of bottom you have just three examples first the paper recent paper on
[01:25:59] examples first the paper recent paper on the far left
[01:26:01] the far left from done by R rer in technology PBC in
[01:26:05] from done by R rer in technology PBC in Vanguard this year and they showed for
[01:26:07] Vanguard this year and they showed for the first time a hybrid packaging of an
[01:26:09] the first time a hybrid packaging of an active device intergration they placed
[01:26:12] active device intergration they placed passively lasers onto the aim chip
[01:26:15] passively lasers onto the aim chip reference chip and connected these
[01:26:17] reference chip and connected these lasers to the chip using tonic wire
[01:26:20] lasers to the chip using tonic wire bonding and as the output we also came
[01:26:23] bonding and as the output we also came by Tonic wire bonding they chip to a
[01:26:25] by Tonic wire bonding they chip to a fiber and in total they had for the four
[01:26:27] fiber and in total they had for the four different interfaces so laser to chip
[01:26:29] different interfaces so laser to chip chip to fiber a total of four DB losses
[01:26:32] chip to fiber a total of four DB losses so low loss high high reliability ConEd
[01:26:35] so low loss high high reliability ConEd to using active device integration but
[01:26:38] to using active device integration but also relax face tolerances in the center
[01:26:41] also relax face tolerances in the center is another example from Su electric
[01:26:44] is another example from Su electric where they have tested this technology
[01:26:45] where they have tested this technology proven it for higher liability using the
[01:26:48] proven it for higher liability using the torded testing for D heat soldering
[01:26:52] torded testing for D heat soldering shock testing and high power and lastly
[01:26:54] shock testing and high power and lastly our ecosystem partner Jun tonics has
[01:26:56] our ecosystem partner Jun tonics has been using this technology for years to
[01:26:59] been using this technology for years to do packaging for their customers and
[01:27:01] do packaging for their customers and recently they have announced that they
[01:27:03] recently they have announced that they have got an ad adk with Tower
[01:27:05] have got an ad adk with Tower semiconductor for doing pqu bonding from
[01:27:09] semiconductor for doing pqu bonding from fure I L I am so impressed with the with
[01:27:12] fure I L I am so impressed with the with the phenomenon of two Photon
[01:27:13] the phenomenon of two Photon polymerization today we have in the room
[01:27:16] polymerization today we have in the room I mean we have also a nanoscribe we have
[01:27:18] I mean we have also a nanoscribe we have hetero marage have so many companies
[01:27:20] hetero marage have so many companies really making a revolution on this I
[01:27:21] really making a revolution on this I would like to go back to yasukata S as
[01:27:25] would like to go back to yasukata S as the end user of this technology in the
[01:27:27] the end user of this technology in the semiconductor business what is the next
[01:27:30] semiconductor business what is the next thing that you wish to have from two
[01:27:33] thing that you wish to have from two Photon
[01:27:36] polymerization it's our biggest project
[01:27:39] polymerization it's our biggest project uh biggest problem is the tou time for
[01:27:42] uh biggest problem is the tou time for the micro R because uh we have to uh
[01:27:47] the micro R because uh we have to uh print the micr onto the Silicon photonic
[01:27:50] print the micr onto the Silicon photonic STP uh with as many as the one 100
[01:27:56] STP uh with as many as the one 100 channel uh for one chip so uh so our
[01:28:02] channel uh for one chip so uh so our wish is to write the one lance less than
[01:28:05] wish is to write the one lance less than maybe 10 seconds or only several
[01:28:09] maybe 10 seconds or only several seconds I think we may be thinking about
[01:28:12] seconds I think we may be thinking about a really big research project here I
[01:28:15] a really big research project here I believe that we have some people from
[01:28:17] believe that we have some people from IMC in the room Philip Susan are you
[01:28:19] IMC in the room Philip Susan are you with us
[01:28:21] today yes yes I so much for joining and
[01:28:25] today yes yes I so much for joining and it is great that your CEO is also going
[01:28:27] it is great that your CEO is also going to be in Malaga in four weeks I can't
[01:28:29] to be in Malaga in four weeks I can't wait I really can't wait for the event
[01:28:31] wait I really can't wait for the event in Malaga GL for economic Forum but
[01:28:33] in Malaga GL for economic Forum but today we are talking about packaging
[01:28:34] today we are talking about packaging testing manufacturing of f something
[01:28:37] testing manufacturing of f something that you know at IM really well you also
[01:28:39] that you know at IM really well you also have share you're going to share with us
[01:28:40] have share you're going to share with us one slide tell us how ime can work
[01:28:43] one slide tell us how ime can work together and solve some of these key
[01:28:44] together and solve some of these key challenges that companies like suit and
[01:28:46] challenges that companies like suit and Global are showing
[01:28:48] Global are showing today uh yes so I will I will show one
[01:28:50] today uh yes so I will I will show one slide about what we do and then I can
[01:28:53] slide about what we do and then I can answer your question
[01:28:56] go ahead
[01:29:03] yeah just looking for the right window I
[01:29:06] yeah just looking for the right window I am extremely happy that IM is very
[01:29:09] am extremely happy that IM is very active in our meetings lately and after
[01:29:11] active in our meetings lately and after the meeting that we have in New a few
[01:29:13] the meeting that we have in New a few weeks ago many of the companies have
[01:29:15] weeks ago many of the companies have told us how great was to to discuss with
[01:29:17] told us how great was to to discuss with you and to follow up afterwards so thank
[01:29:19] you and to follow up afterwards so thank you very much for up on all the
[01:29:22] you very much for up on all the leads very good
[01:29:25] leads very good I don't want to put much pressure on you
[01:29:26] I don't want to put much pressure on you but please find the find the window in
[01:29:29] but please find the find the window in the meantime let me say hello to Dan pit
[01:29:31] the meantime let me say hello to Dan pit from Excel print a partner of f as well
[01:29:33] from Excel print a partner of f as well and doing fantastic job on on the microt
[01:29:36] and doing fantastic job on on the microt transfer printing technology great to
[01:29:38] transfer printing technology great to have you with us D I think you're also
[01:29:40] have you with us D I think you're also coming to to Malaga in a few weeks so
[01:29:42] coming to to Malaga in a few weeks so thank you very much for this also great
[01:29:44] thank you very much for this also great to have in the room the company lium and
[01:29:50] to have in the room the company lium and Li Foundry Services you guys are making
[01:29:52] Li Foundry Services you guys are making it strong thank you very much much for
[01:29:54] it strong thank you very much much for that and I it should should come all
[01:29:59] that and I it should should come all right do you see something not yet
[01:30:02] right do you see something not yet bottom of the zoom window Green Arrow up
[01:30:04] bottom of the zoom window Green Arrow up then press it and then select the word
[01:30:06] then press it and then select the word the screen that you want to share with
[01:30:07] the screen that you want to share with the word of photonics now you see it's
[01:30:10] the word of photonics now you see it's thank you so
[01:30:12] thank you so much okay uh so yes packaging and
[01:30:16] much okay uh so yes packaging and testing it's it's a very good point but
[01:30:18] testing it's it's a very good point but first I'll introduce what we do so uh
[01:30:21] first I'll introduce what we do so uh essentially I make we we have an history
[01:30:23] essentially I make we we have an history in a crystalin platform and second
[01:30:25] in a crystalin platform and second nitride we have two version of this
[01:30:26] nitride we have two version of this platform the 200 mm is actually
[01:30:29] platform the 200 mm is actually available today for for Mass
[01:30:31] available today for for Mass manufacturing we are able to demonstrate
[01:30:33] manufacturing we are able to demonstrate up to 200 gab bit uh per Lane uh with
[01:30:38] up to 200 gab bit uh per Lane uh with this technology we are building the 300
[01:30:41] this technology we are building the 300 mm uh that is as well available for
[01:30:44] mm uh that is as well available for prototyping and when we talk about uh
[01:30:46] prototyping and when we talk about uh the upcoming development well first we
[01:30:49] the upcoming development well first we have the next generation of modulator
[01:30:51] have the next generation of modulator technology for 1.6 Tera and above
[01:30:54] technology for 1.6 Tera and above and we do are working on edge couplers
[01:30:56] and we do are working on edge couplers and lasers um so it's actually uh we are
[01:31:01] and lasers um so it's actually uh we are trying to make a Consortium we are using
[01:31:04] trying to make a Consortium we are using uh the Phantom Delta Consortium right
[01:31:06] uh the Phantom Delta Consortium right now uh to build a supply chain to enable
[01:31:09] now uh to build a supply chain to enable the uh flip chip uh integration of
[01:31:12] the uh flip chip uh integration of lasers on our EC platform as well as we
[01:31:16] lasers on our EC platform as well as we are promoting Edge coupling today the
[01:31:19] are promoting Edge coupling today the industry has a baseline for vertical
[01:31:21] industry has a baseline for vertical coupler and it's also very difficult for
[01:31:23] coupler and it's also very difficult for for people to use the real estate to
[01:31:26] for people to use the real estate to make B Gres and other kind of uh area
[01:31:29] make B Gres and other kind of uh area consuming devices but we believe they
[01:31:31] consuming devices but we believe they will be a generation that will come with
[01:31:34] will be a generation that will come with Edge coupling because when it come to
[01:31:37] Edge coupling because when it come to link budget that is the best situation
[01:31:40] link budget that is the best situation so yes we are trying to build this
[01:31:42] so yes we are trying to build this supply chain for heterogenous
[01:31:43] supply chain for heterogenous integration we are in R&D Consortium
[01:31:46] integration we are in R&D Consortium different EU project and will be happy
[01:31:48] different EU project and will be happy to see what uh what we can do uh on that
[01:31:51] to see what uh what we can do uh on that matter I want also to mention to other
[01:31:54] matter I want also to mention to other platforms that we are going to release
[01:31:56] platforms that we are going to release so next year we are going to have the
[01:31:58] so next year we are going to have the lpcd Silicon nitrate platform and the
[01:32:02] lpcd Silicon nitrate platform and the market obviously the first one is driven
[01:32:04] market obviously the first one is driven by that ey I mean there's a large bump
[01:32:07] by that ey I mean there's a large bump and people actually are chasing uh this
[01:32:09] and people actually are chasing uh this type of Technology as well as the power
[01:32:11] type of Technology as well as the power efficiency of this technology but for
[01:32:13] efficiency of this technology but for the for the second one the lpcvd nitr we
[01:32:16] the for the second one the lpcvd nitr we actually are are seeing a lot of
[01:32:18] actually are are seeing a lot of opportunity in Quantum and in sensors
[01:32:20] opportunity in Quantum and in sensors including bio sensors and in that kind
[01:32:23] including bio sensors and in that kind of Technology which is today only
[01:32:25] of Technology which is today only passive we are going to integrate as
[01:32:27] passive we are going to integrate as well the edge coupler and the laser we
[01:32:29] well the edge coupler and the laser we want to actually piggy bag so once the
[01:32:32] want to actually piggy bag so once the supply chain and that's actually I'm
[01:32:34] supply chain and that's actually I'm advocating to for whoever uh and I know
[01:32:38] advocating to for whoever uh and I know fix is online U Can enable the first one
[01:32:41] fix is online U Can enable the first one will also then build the supply chain to
[01:32:44] will also then build the supply chain to enable the later on the lpcvd N Ride
[01:32:48] enable the later on the lpcvd N Ride just for the sake of completeness since
[01:32:50] just for the sake of completeness since it's a peak
[01:32:51] it's a peak manufacturing uh event we do are
[01:32:55] manufacturing uh event we do are producing there are some Public
[01:32:57] producing there are some Public Announcement that we made a few years
[01:32:59] Announcement that we made a few years ago if you brow into the news of IM you
[01:33:02] ago if you brow into the news of IM you will see that we have actually put
[01:33:04] will see that we have actually put silicon nitr technology directly on
[01:33:06] silicon nitr technology directly on simos directly on
[01:33:08] simos directly on imagers and this is something we as a
[01:33:10] imagers and this is something we as a custom development it's for nich
[01:33:12] custom development it's for nich application it's in health so these
[01:33:14] application it's in health so these people today are not really looking into
[01:33:18] people today are not really looking into rationalizing let's call it
[01:33:20] rationalizing let's call it the incoupling of light but we are
[01:33:23] the incoupling of light but we are talking about this ible so the
[01:33:24] talking about this ible so the availability of sources to put the
[01:33:27] availability of sources to put the elephant in the room more visible is
[01:33:30] elephant in the room more visible is also a problem people like to have red
[01:33:33] also a problem people like to have red and green and as you all know here in
[01:33:35] and green and as you all know here in this community green is not easy to find
[01:33:37] this community green is not easy to find so yes it's a bit Niche it's a bit
[01:33:39] so yes it's a bit Niche it's a bit tricky today's Niche and again if one
[01:33:42] tricky today's Niche and again if one day we are figuring out how to put uh
[01:33:46] day we are figuring out how to put uh the light sources directly on the
[01:33:48] the light sources directly on the Silicon there will be as well an
[01:33:50] Silicon there will be as well an opportunity for for cost reduction to
[01:33:53] opportunity for for cost reduction to take this Niche application to a more
[01:33:57] take this Niche application to a more affordable um
[01:33:59] affordable um pricing so that's all I wanted to share
[01:34:02] pricing so that's all I wanted to share with you thank you very much and I can
[01:34:03] with you thank you very much and I can tell you one thing very quickly about
[01:34:05] tell you one thing very quickly about this silicon N simos I would like to
[01:34:07] this silicon N simos I would like to always compliment IM from the work that
[01:34:09] always compliment IM from the work that you're doing with the startups and I
[01:34:12] you're doing with the startups and I think you know who is watching this what
[01:34:14] think you know who is watching this what you're going doing with aotech is really
[01:34:16] you're going doing with aotech is really very very impressive so congratulations
[01:34:18] very very impressive so congratulations on that H one thing you said that you
[01:34:20] on that H one thing you said that you had an answer for sumito
[01:34:24] had an answer for sumito well yes so related to the packaging uh
[01:34:27] well yes so related to the packaging uh we are trying to integrate the the laser
[01:34:31] we are trying to integrate the the laser into our library of components so we
[01:34:33] into our library of components so we need to qualify the the supply chain
[01:34:36] need to qualify the the supply chain right now we are do we can enable that
[01:34:39] right now we are do we can enable that for prototyping for moderate volume uh
[01:34:43] for prototyping for moderate volume uh but the actual uh industrial supply
[01:34:45] but the actual uh industrial supply chain we are also working on
[01:34:47] chain we are also working on it thank you very much for that I can
[01:34:50] it thank you very much for that I can tell you from sumito we were talking
[01:34:52] tell you from sumito we were talking about Lots micro op is going on silicon
[01:34:55] about Lots micro op is going on silicon photonics and there are still many
[01:34:56] photonics and there are still many materials challenge to cover there for
[01:34:58] materials challenge to cover there for that it's very important to have in the
[01:35:00] that it's very important to have in the meeting today Alexander Harvick from Del
[01:35:03] meeting today Alexander Harvick from Del who in the offline have been discussing
[01:35:05] who in the offline have been discussing about the needs for new material with
[01:35:07] about the needs for new material with different refractive index for silicon
[01:35:08] different refractive index for silicon photonics Alexander thank you very much
[01:35:10] photonics Alexander thank you very much for being with us today you have also
[01:35:12] for being with us today you have also one sh one screen to share with us and
[01:35:14] one sh one screen to share with us and with many of the potential partners and
[01:35:16] with many of the potential partners and current Partners down in the room with
[01:35:17] current Partners down in the room with you
[01:35:18] you today thank you very much for the kind
[01:35:20] today thank you very much for the kind and nice introduction Jose so just a I
[01:35:23] and nice introduction Jose so just a I hope you can see the screen does it work
[01:35:25] hope you can see the screen does it work exact nice okay so just a brief
[01:35:28] exact nice okay so just a brief introduction to our company so in
[01:35:30] introduction to our company so in general we are an adhesive supplier
[01:35:32] general we are an adhesive supplier located in the southern part of Germany
[01:35:33] located in the southern part of Germany so close to Munich um but we are
[01:35:36] so close to Munich um but we are worldwide operating having subsidiaries
[01:35:38] worldwide operating having subsidiaries in US Boston um Singapore and in
[01:35:42] in US Boston um Singapore and in Shanghai and um we have a broad product
[01:35:45] Shanghai and um we have a broad product portfolio um which basing on 12
[01:35:49] portfolio um which basing on 12 chemistries that we are using so not
[01:35:51] chemistries that we are using so not just acrylates and epoxies but 10 others
[01:35:54] just acrylates and epoxies but 10 others and um we are using different kinds of
[01:35:57] and um we are using different kinds of um curing mechanisms with our adhesives
[01:36:00] um curing mechanisms with our adhesives but still we are really focusing on
[01:36:01] but still we are really focusing on light curing and this is of course
[01:36:04] light curing and this is of course because uh catching up the production
[01:36:06] because uh catching up the production speeds you typically have for for mass
[01:36:08] speeds you typically have for for mass production products and um we have a
[01:36:12] production products and um we have a very intense I would say dual curing
[01:36:15] very intense I would say dual curing adhesive portfolio means that all of
[01:36:17] adhesive portfolio means that all of these um curing mechanisms can be
[01:36:21] these um curing mechanisms can be combined with light so that for example
[01:36:23] combined with light so that for example a 2K curing adhesive or a heat curing
[01:36:27] a 2K curing adhesive or a heat curing adhesive can be light fixed in an a
[01:36:30] adhesive can be light fixed in an a previous step which makes the process
[01:36:32] previous step which makes the process very fast and our experience um lies
[01:36:36] very fast and our experience um lies really in in Optical bonding so we do a
[01:36:39] really in in Optical bonding so we do a lot of optical bonding for example
[01:36:41] lot of optical bonding for example bonding of camera modules where an
[01:36:43] bonding of camera modules where an highly precised active alignment is used
[01:36:46] highly precised active alignment is used so we are talking about consumer camera
[01:36:48] so we are talking about consumer camera but also Automotive cameras with high
[01:36:50] but also Automotive cameras with high reliability
[01:36:52] reliability requirements um ouris can be used also
[01:36:55] requirements um ouris can be used also for the production of optical elements
[01:36:58] for the production of optical elements like doe or mlas where we are typically
[01:37:01] like doe or mlas where we are typically using Nano imprint litography as a
[01:37:04] using Nano imprint litography as a process then of course we also have um
[01:37:07] process then of course we also have um yeah broad applications in the
[01:37:08] yeah broad applications in the electronic packaging business and with
[01:37:11] electronic packaging business and with this expertise um we design products
[01:37:15] this expertise um we design products also of course for the pig packaging and
[01:37:18] also of course for the pig packaging and doing that um we mainly concentrating on
[01:37:21] doing that um we mainly concentrating on the optical coupling so means uh
[01:37:24] the optical coupling so means uh by by use of edge coupler grating
[01:37:26] by by use of edge coupler grating couplers also use of micr lenses um we
[01:37:31] couplers also use of micr lenses um we um also do passive alignment with the we
[01:37:34] um also do passive alignment with the we grp bonding or we deliver systems which
[01:37:36] grp bonding or we deliver systems which enable the passive alignment this is the
[01:37:39] enable the passive alignment this is the right term to say um but also let me say
[01:37:43] right term to say um but also let me say more or less standard packaging
[01:37:45] more or less standard packaging processes um like strain relief or diage
[01:37:48] processes um like strain relief or diage for example and um I just wanted to
[01:37:52] for example and um I just wanted to highlight that um we always try to to
[01:37:55] highlight that um we always try to to develop together with the customer uh
[01:37:57] develop together with the customer uh really the best technical solution so we
[01:37:59] really the best technical solution so we have a big engineering department and um
[01:38:03] have a big engineering department and um um try to to um collaborate on a deep
[01:38:06] um try to to um collaborate on a deep technical level with the customers and
[01:38:10] technical level with the customers and um in a lot of cases we then design
[01:38:12] um in a lot of cases we then design really a customized product for the
[01:38:14] really a customized product for the customers's need and this is um which I
[01:38:17] customers's need and this is um which I wanted to conclude that we are very open
[01:38:19] wanted to conclude that we are very open to collaborations and if you see
[01:38:22] to collaborations and if you see anything Technic challenging where you
[01:38:24] anything Technic challenging where you think that adhesives can can solve the
[01:38:26] think that adhesives can can solve the problem please let us know just get in
[01:38:29] problem please let us know just get in touch and we can see what we can do for
[01:38:30] touch and we can see what we can do for you Alex we have received lots of good
[01:38:32] you Alex we have received lots of good feedback from companies who have
[01:38:34] feedback from companies who have interacted with Del sharing their needs
[01:38:36] interacted with Del sharing their needs for materials and the way that
[01:38:38] for materials and the way that confidentially things have been treated
[01:38:40] confidentially things have been treated is you're a great partner with the
[01:38:41] is you're a great partner with the material side yes suukat s do you have
[01:38:44] material side yes suukat s do you have any any any question or any wish for a
[01:38:48] any any any question or any wish for a Material
[01:38:49] Material Company like do in terms of Rel IND
[01:38:53] Company like do in terms of Rel IND yeah we have many types of adhes for the
[01:38:57] yeah we have many types of adhes for the optical device however almost all the ad
[01:39:02] optical device however almost all the ad for Optics is very weak for the high
[01:39:05] for Optics is very weak for the high temperature so we
[01:39:11] needes which can toate to ref
[01:39:14] needes which can toate to ref temperature uh maybe 260 de uh is it
[01:39:19] temperature uh maybe 260 de uh is it possible for you yes yes it is possibly
[01:39:22] possible for you yes yes it is possibly and currently this is I would say the
[01:39:24] and currently this is I would say the the the the how to say the most
[01:39:27] the the the how to say the most important um requirement in terms of
[01:39:29] important um requirement in terms of reliability we are focusing on really to
[01:39:31] reliability we are focusing on really to be Reflow compatible we have already
[01:39:33] be Reflow compatible we have already certain products which are already
[01:39:35] certain products which are already tested for example also in collaboration
[01:39:37] tested for example also in collaboration with Peter O'Brien's group yeah where we
[01:39:40] with Peter O'Brien's group yeah where we have focused really on Reflow
[01:39:42] have focused really on Reflow compatibility so there are offthe shelf
[01:39:45] compatibility so there are offthe shelf products yeah so we can get in
[01:39:48] products yeah so we can get in contact oh yeah very interesting uh I
[01:39:52] contact oh yeah very interesting uh I would try to get some some
[01:39:54] would try to get some some samples
[01:39:56] samples yes I I I gladly pay for the shipping
[01:39:59] yes I I I gladly pay for the shipping expenses of those samples from Munich to
[01:40:02] expenses of those samples from Munich to Tokyo let me let me come back to to the
[01:40:06] Tokyo let me let me come back to to the revolution of two Photon polymerization
[01:40:08] revolution of two Photon polymerization another company from this revolution is
[01:40:10] another company from this revolution is a nanoscribe York thank you very much
[01:40:12] a nanoscribe York thank you very much joining the meeting today you also have
[01:40:14] joining the meeting today you also have one slide to share here with the
[01:40:16] one slide to share here with the semiconductor and photonic into the
[01:40:18] semiconductor and photonic into the circuit companies the floor and the
[01:40:20] circuit companies the floor and the attention of everyone goes to K ran
[01:40:24] attention of everyone goes to K ran yes hello everybody I'm happy to be
[01:40:26] yes hello everybody I'm happy to be again in this pick
[01:40:28] again in this pick meeting uh it's been a long time can you
[01:40:30] meeting uh it's been a long time can you hear me loud and clear okay it's been a
[01:40:33] hear me loud and clear okay it's been a long time that I that there were no
[01:40:35] long time that I that there were no meeting on picket I'm missing it I
[01:40:37] meeting on picket I'm missing it I missed it a little bit over the summer
[01:40:39] missed it a little bit over the summer so nice to be back again so the indeed
[01:40:41] so nice to be back again so the indeed nanoscript is 15 years old we introduced
[01:40:44] nanoscript is 15 years old we introduced the two Photon polymerization technology
[01:40:46] the two Photon polymerization technology to the market and in the last years we
[01:40:49] to the market and in the last years we developed it further to be able to print
[01:40:52] developed it further to be able to print reliable and precisely optics for
[01:40:55] reliable and precisely optics for photonic integrated circuits with our 3D
[01:40:57] photonic integrated circuits with our 3D printing equipment um so uh we also uh
[01:41:04] printing equipment um so uh we also uh made a big focus on enhancing the
[01:41:06] made a big focus on enhancing the usability of the system reducing the
[01:41:09] usability of the system reducing the losses of the Optics which are printed
[01:41:12] losses of the Optics which are printed um uh as you can see here on the slides
[01:41:15] um uh as you can see here on the slides there different examples of elements
[01:41:17] there different examples of elements printed with our system so you have an
[01:41:19] printed with our system so you have an example of different geometries I'll
[01:41:21] example of different geometries I'll just have to highlight the laser pointer
[01:41:24] just have to highlight the laser pointer examples of geometri which can printed
[01:41:26] examples of geometri which can printed from periscopes any kind of periscopes
[01:41:29] from periscopes any kind of periscopes cating lenses focusing lenses similar to
[01:41:32] cating lenses focusing lenses similar to what Yas takasan showed here are direct
[01:41:35] what Yas takasan showed here are direct Edge couplers for example for free space
[01:41:38] Edge couplers for example for free space or this is V level production of several
[01:41:41] or this is V level production of several hundreds of broad Bond coupler for
[01:41:43] hundreds of broad Bond coupler for Quantum
[01:41:44] Quantum applications and we have received some
[01:41:48] applications and we have received some Peak Performance of less than 0.80 D
[01:41:50] Peak Performance of less than 0.80 D coupling five micr tolerances so this
[01:41:53] coupling five micr tolerances so this this are all parts printed with our
[01:41:55] this are all parts printed with our systems we are not a Job Shop we are
[01:41:57] systems we are not a Job Shop we are microfabrication system supplier um we
[01:42:01] microfabrication system supplier um we can print quite fast so I I
[01:42:04] can print quite fast so I I think 10 seconds is an interesting
[01:42:07] think 10 seconds is an interesting challenge we will take it depends on the
[01:42:10] challenge we will take it depends on the design so again design is important at
[01:42:13] design so again design is important at the design you define the packaging I
[01:42:15] the design you define the packaging I think this came up during the meeting
[01:42:17] think this came up during the meeting couple of times and especially also for
[01:42:19] couple of times and especially also for these Optical interconnects if you
[01:42:21] these Optical interconnects if you design the mode field diameter correctly
[01:42:24] design the mode field diameter correctly on the chip already then you can also I
[01:42:26] on the chip already then you can also I think go to 10 seconds of print time for
[01:42:28] think go to 10 seconds of print time for example for these kind of things um yeah
[01:42:32] example for these kind of things um yeah so anytime uh if you have questions or
[01:42:35] so anytime uh if you have questions or if you if you want to do a print test
[01:42:37] if you if you want to do a print test come come contact me uh meet us eock we
[01:42:40] come come contact me uh meet us eock we will be there have a boo we'll have a
[01:42:42] will be there have a boo we'll have a short training uh our Hands-On training
[01:42:44] short training uh our Hands-On training after eock so I can send you an invite
[01:42:47] after eock so I can send you an invite invitation out to everybody as in the
[01:42:49] invitation out to everybody as in the PDF which we say Shar there's a link to
[01:42:51] PDF which we say Shar there's a link to this and you're also coming to reception
[01:42:53] this and you're also coming to reception AOK in a couple of weeks I'm looking
[01:42:55] AOK in a couple of weeks I'm looking forward to seeing you there I would like
[01:42:56] forward to seeing you there I would like to say to everyone thank you so much we
[01:42:58] to say to everyone thank you so much we are of course sold out for that
[01:43:00] are of course sold out for that reception thank you for the interest the
[01:43:02] reception thank you for the interest the whole industry to being with us today
[01:43:04] whole industry to being with us today but allow me now to shift gears jukan
[01:43:07] but allow me now to shift gears jukan for in this meeting we have been talking
[01:43:10] for in this meeting we have been talking a lot about the packaging of materials
[01:43:12] a lot about the packaging of materials but very often we also need integration
[01:43:15] but very often we also need integration with the components and for that we
[01:43:16] with the components and for that we wanted to have a company that has been
[01:43:18] wanted to have a company that has been leading the development of detectors in
[01:43:21] leading the development of detectors in our industry Alis thank you very much
[01:43:23] our industry Alis thank you very much being with us today tell us how you supp
[01:43:27] being with us today tell us how you supp the industry
[01:43:28] the industry Kristoff hi thank you thank you for
[01:43:32] Kristoff hi thank you thank you for hosting us uh just I can maybe share the
[01:43:35] hosting us uh just I can maybe share the the the window that I
[01:43:39] the the window that I prepare maybe you can tell me if you see
[01:43:41] prepare maybe you can tell me if you see it
[01:43:44] very you you see
[01:43:47] very you you see it I S for a mill can you see the screen
[01:43:50] it I S for a mill can you see the screen let's wait let's yeah start pitching and
[01:43:52] let's wait let's yeah start pitching and I will you one is here yeah
[01:43:59] okay well we don't see your
[01:44:02] okay well we don't see your yet not yet not yet oh I have some
[01:44:08] yet not yet not yet oh I have some connection
[01:44:10] connection difficulties in the meantime allow me to
[01:44:12] difficulties in the meantime allow me to say that after this presentation we will
[01:44:15] say that after this presentation we will understand what our friends from SE do
[01:44:19] understand what our friends from SE do and then we will go finish the meeting
[01:44:20] and then we will go finish the meeting with fix with the European
[01:44:23] with fix with the European o and understand a bit how we all can
[01:44:27] o and understand a bit how we all can hel them with the packaging and test can
[01:44:29] hel them with the packaging and test can we TR again
[01:44:31] we TR again Kristoff uh will try
[01:44:33] Kristoff uh will try again sorry for the delay seem an
[01:44:38] again sorry for the delay seem an internet connection issue now it's here
[01:44:41] internet connection issue now it's here tell
[01:44:41] tell us it's here perfect so I I want to
[01:44:46] us it's here perfect so I I want to present you Al be S electronic for the
[01:44:48] present you Al be S electronic for the person who does not know us we are
[01:44:50] person who does not know us we are designer and man manufacturer of s
[01:44:53] designer and man manufacturer of s photo diot and Avalanche photo diot and
[01:44:56] photo diot and Avalanche photo diot and our products range from the high Quantum
[01:44:58] our products range from the high Quantum efficiency photo diode up to the high
[01:45:01] efficiency photo diode up to the high speed 200g photo diets we have 20 years
[01:45:05] speed 200g photo diets we have 20 years of experience and we have sold 40
[01:45:07] of experience and we have sold 40 millions of photo diet we on the field
[01:45:09] millions of photo diet we on the field for a long time and the message I want
[01:45:12] for a long time and the message I want to share is that the AL sofware is
[01:45:15] to share is that the AL sofware is mostly top performances but also uh
[01:45:18] mostly top performances but also uh connected to the pig uh foundies and pig
[01:45:21] connected to the pig uh foundies and pig platform if we have a lot of of various
[01:45:24] platform if we have a lot of of various Optical and electrical interface that
[01:45:26] Optical and electrical interface that can really fit the application that you
[01:45:30] can really fit the application that you need and for this I pick two example
[01:45:33] need and for this I pick two example just to show you we have this photo
[01:45:35] just to show you we have this photo diode on the left that is with a back
[01:45:38] diode on the left that is with a back side in integrated the lens that really
[01:45:41] side in integrated the lens that really facilitates the the the optical coupling
[01:45:44] facilitates the the the optical coupling so it could be a passive alignment in
[01:45:46] so it could be a passive alignment in that case as it has been mentioned
[01:45:47] that case as it has been mentioned before and we have another kind of photo
[01:45:50] before and we have another kind of photo diot that is more trendy right now is
[01:45:53] diot that is more trendy right now is the mass transfer photo diode that goes
[01:45:55] the mass transfer photo diode that goes to microt transfer printing for instance
[01:45:58] to microt transfer printing for instance which is targeting eye volume and ey
[01:46:00] which is targeting eye volume and ey integration directly onto the wave guide
[01:46:03] integration directly onto the wave guide so with even C for instance and as it
[01:46:07] so with even C for instance and as it has been mentioned and everybody is
[01:46:09] has been mentioned and everybody is aware I think uh everything goes to the
[01:46:13] aware I think uh everything goes to the the end application and we have usually
[01:46:15] the end application and we have usually a solution for each customer but to have
[01:46:18] a solution for each customer but to have to to help the customer to find the
[01:46:20] to to help the customer to find the right product on on our folio which is
[01:46:23] right product on on our folio which is quite broad so please contact us if you
[01:46:26] quite broad so please contact us if you have any application and we'll discuss
[01:46:30] have any application and we'll discuss what thank you very much for that and
[01:46:33] what thank you very much for that and thank you for being here and all your
[01:46:34] thank you for being here and all your support I'm also going to see you at EO
[01:46:36] support I'm also going to see you at EO in a couple of weeks and allow me to
[01:46:39] in a couple of weeks and allow me to finish this round of quick introductions
[01:46:41] finish this round of quick introductions to our end users
[01:46:44] to our end users to meet Alex who from suruga Seiki Alex
[01:46:48] to meet Alex who from suruga Seiki Alex thank you very much for being with us
[01:46:49] thank you very much for being with us today and before we get the floor to fix
[01:46:52] today and before we get the floor to fix could you tell us what you do and how
[01:46:53] could you tell us what you do and how you can support Su and the other
[01:46:57] you can support Su and the other users thank you yeah uh good morning and
[01:47:01] users thank you yeah uh good morning and good good afternoon uh for because I'm
[01:47:04] good good afternoon uh for because I'm located in the taipe Taiwan yeah so my
[01:47:06] located in the taipe Taiwan yeah so my time zone will be almost midnight but no
[01:47:09] time zone will be almost midnight but no problem yeah so let me share my slides
[01:47:12] problem yeah so let me share my slides and also keep the quick update for you
[01:47:15] and also keep the quick update for you uh ladies and gentlemen so
[01:47:23] I love when a meeting is global and you
[01:47:24] I love when a meeting is global and you have people in every time zone we have
[01:47:26] have people in every time zone we have people in California today and we have
[01:47:28] people in California today and we have people in Tokyo like Yukata it's really
[01:47:31] people in Tokyo like Yukata it's really great to have a meeting like
[01:47:33] great to have a meeting like this yes yeah
[01:47:50] uhi we getting your slide
[01:47:54] uhi we getting your slide uh yeah I'm sorry I'm I'm searching for
[01:47:57] uh yeah I'm sorry I'm I'm searching for my slides
[01:48:05] or can you please uh can you please use
[01:48:09] or can you please uh can you please use the use the slides that I shared to you
[01:48:12] the use the slides that I shared to you previously yes of course I can do that
[01:48:15] previously yes of course I can do that yeah sorry for that yeah because I'm
[01:48:17] yeah sorry for that yeah because I'm using my mobile phone uh long me you
[01:48:21] using my mobile phone uh long me you want to go ahead and share or would you
[01:48:22] want to go ahead and share or would you like battery was yeah running out of the
[01:48:25] like battery was yeah running out of the you know battery so I use my mobile
[01:48:27] you know battery so I use my mobile phone right now my te will share them so
[01:48:30] phone right now my te will share them so if Grace or Tanya is sharing them with
[01:48:34] if Grace or Tanya is sharing them with us and yeah appreciate SL after every
[01:48:38] us and yeah appreciate SL after every slide thank you very much
[01:48:44] Tanya go ahead okay yeah thanks again
[01:48:47] Tanya go ahead okay yeah thanks again yeah sorry for waiting uh ladies and
[01:48:48] yeah sorry for waiting uh ladies and gentlemen yeah uh this is surasi alexu
[01:48:52] gentlemen yeah uh this is surasi alexu speaking
[01:48:53] speaking uh I'm located in t Taiwan um Taiwanese
[01:48:57] uh I'm located in t Taiwan um Taiwanese but basically uh we are 60 years old
[01:49:00] but basically uh we are 60 years old Japanese bestas the company so what is
[01:49:02] Japanese bestas the company so what is St uh doing that we are new member to
[01:49:05] St uh doing that we are new member to the Optica and also appreciate the
[01:49:08] the Optica and also appreciate the invitation uh from my my good friend Dr
[01:49:11] invitation uh from my my good friend Dr Jose poo uh basically shuga we provide
[01:49:15] Jose poo uh basically shuga we provide from the six Aces alignment key
[01:49:17] from the six Aces alignment key components to the entire uh pic system
[01:49:22] components to the entire uh pic system so this is for the call package Optics
[01:49:25] so this is for the call package Optics or Fiber array unit assembly machine so
[01:49:28] or Fiber array unit assembly machine so simply speaking uh we provide the key
[01:49:31] simply speaking uh we provide the key components or the six Aces alignment
[01:49:34] components or the six Aces alignment stage uh this is quite uh similar with
[01:49:38] stage uh this is quite uh similar with the Germany based company Pi so as
[01:49:41] the Germany based company Pi so as everybody know that you know Pi they are
[01:49:42] everybody know that you know Pi they are doing the they are providing the uh H
[01:49:45] doing the they are providing the uh H part the STA model good 6 AC part so uh
[01:49:50] part the STA model good 6 AC part so uh they their structured the motion control
[01:49:53] they their structured the motion control is different from our company but
[01:49:55] is different from our company but basically we are using the motorize
[01:49:58] basically we are using the motorize stage plus our algorithm and also plus
[01:50:02] stage plus our algorithm and also plus our controller so that we can do the
[01:50:03] our controller so that we can do the motion uh motion control and you know to
[01:50:07] motion uh motion control and you know to develop the similar function with the uh
[01:50:09] develop the similar function with the uh Pi but other than that we are not only
[01:50:12] Pi but other than that we are not only providing the key components we can use
[01:50:14] providing the key components we can use our uh stage and also uh controller and
[01:50:18] our uh stage and also uh controller and then we can make into a you know uh
[01:50:21] then we can make into a you know uh waiver tester or the uh pic fiber array
[01:50:26] waiver tester or the uh pic fiber array unit machine for the advanced package
[01:50:28] unit machine for the advanced package for the CPO or the optical IO Moder uh
[01:50:32] for the CPO or the optical IO Moder uh so this one will be very similar with as
[01:50:34] so this one will be very similar with as you might be also very familiar uh
[01:50:37] you might be also very familiar uh because from the first Speaker we know
[01:50:39] because from the first Speaker we know we also uh saw that a lot of the system
[01:50:43] we also uh saw that a lot of the system introduction related to the Fe contct
[01:50:45] introduction related to the Fe contct that's also a very uh I think they're
[01:50:47] that's also a very uh I think they're also you know honorable complaint from
[01:50:50] also you know honorable complaint from the gery and also uh yes our competition
[01:50:54] the gery and also uh yes our competition but also our partner because some of the
[01:50:56] but also our partner because some of the Fe Contex system they start to use
[01:50:59] Fe Contex system they start to use surasi uh stage starting uh you know for
[01:51:03] surasi uh stage starting uh you know for from Recently so basically uh I for Thea
[01:51:09] from Recently so basically uh I for Thea we provide components into the entire
[01:51:12] we provide components into the entire system so this is for the photonics
[01:51:15] system so this is for the photonics industry and you can see for the uh FR
[01:51:18] industry and you can see for the uh FR chart that I draw here from the chip
[01:51:21] chart that I draw here from the chip design for wer
[01:51:23] design for wer and then for the wafer so and burn in
[01:51:26] and then for the wafer so and burn in for the functional test uh and also for
[01:51:29] for the functional test uh and also for the pi pic modu uh assembly as you know
[01:51:34] the pi pic modu uh assembly as you know this is kind of the wro that everybody
[01:51:38] this is kind of the wro that everybody know that will be uh conducted or
[01:51:40] know that will be uh conducted or Implement in the offet so for the EIC
[01:51:45] Implement in the offet so for the EIC system we can provide motion parts for
[01:51:47] system we can provide motion parts for most of the global uh EIC machine makers
[01:51:52] most of the global uh EIC machine makers such as even the asore or ASM or apply
[01:51:55] such as even the asore or ASM or apply material this time company this is for
[01:51:58] material this time company this is for EIC chip and for PICC as I say we
[01:52:02] EIC chip and for PICC as I say we provide the machine and also the
[01:52:03] provide the machine and also the alignment systems from the R&D for the
[01:52:06] alignment systems from the R&D for the mes production and uh sorry about that
[01:52:09] mes production and uh sorry about that uh but you can see from the uh right
[01:52:13] uh but you can see from the uh right button side of this slides actually I
[01:52:15] button side of this slides actually I should room in or I should provide uh
[01:52:18] should room in or I should provide uh Optica our friends a bigger uh chart
[01:52:21] Optica our friends a bigger uh chart later on
[01:52:23] later on this is uh you know uh design also draw
[01:52:26] this is uh you know uh design also draw by myself this is to tell everybody if
[01:52:29] by myself this is to tell everybody if you are interested to cowork with the
[01:52:32] you are interested to cowork with the taiwan's uh ecosystem for the photonics
[01:52:35] taiwan's uh ecosystem for the photonics pic ecosystem you can feel free to come
[01:52:38] pic ecosystem you can feel free to come to us because that uh uh we are working
[01:52:42] to us because that uh uh we are working from the Fab to fun to the oet uh and
[01:52:47] from the Fab to fun to the oet uh and also to the uh modu label and also to
[01:52:51] also to the uh modu label and also to the uh end users such as uh people will
[01:52:54] the uh end users such as uh people will use the C fonics chip uh for their AI
[01:52:58] use the C fonics chip uh for their AI server as well yes uh so yes next uh
[01:53:01] server as well yes uh so yes next uh slide please so the second slid will be
[01:53:05] slide please so the second slid will be also the last one I want to share with
[01:53:06] also the last one I want to share with all our friends uh this is a little bit
[01:53:10] all our friends uh this is a little bit of self-
[01:53:11] of self- introduction uh that uh also share with
[01:53:14] introduction uh that uh also share with you a good news that we will have a uh
[01:53:17] you a good news that we will have a uh International semiconductor Exposition
[01:53:19] International semiconductor Exposition starting at the beginning of September
[01:53:21] starting at the beginning of September in taipe
[01:53:22] in taipe so I believe many of our friends maybe
[01:53:25] so I believe many of our friends maybe will come to Taiwan to join the big
[01:53:27] will come to Taiwan to join the big semiconductor
[01:53:28] semiconductor Exposition uh as well as that suruka
[01:53:31] Exposition uh as well as that suruka siki we cowork with all of the major uh
[01:53:36] siki we cowork with all of the major uh government industry inarch industry such
[01:53:39] government industry inarch industry such as E3 in Taiwan and also uh basically we
[01:53:42] as E3 in Taiwan and also uh basically we are Japanese based company so we are
[01:53:44] are Japanese based company so we are working with the Singapore a a star and
[01:53:47] working with the Singapore a a star and also the Japan even uh I see the m is
[01:53:51] also the Japan even uh I see the m is also on the line so we are working with
[01:53:52] also on the line so we are working with the shumo with fuju or NT or the other
[01:53:56] the shumo with fuju or NT or the other Japan's big comps as well uh so we host
[01:54:01] Japan's big comps as well uh so we host a silicon uh we call that is the uh
[01:54:04] a silicon uh we call that is the uh heterogeneous integrated silicon
[01:54:06] heterogeneous integrated silicon photonics Alliance the shortterm phone
[01:54:08] photonics Alliance the shortterm phone is hipa hisp so this uh I'm a co-founder
[01:54:14] is hipa hisp so this uh I'm a co-founder and also the vice chairman of this
[01:54:16] and also the vice chairman of this Alliance and you know it will be our big
[01:54:20] Alliance and you know it will be our big honor to work with the optic car because
[01:54:22] honor to work with the optic car because that this is the you know the
[01:54:25] that this is the you know the domestic uh pic Alliance uh we are also
[01:54:29] domestic uh pic Alliance uh we are also you know seeking for the opportunity to
[01:54:30] you know seeking for the opportunity to working with the Optica uh to try to
[01:54:33] working with the Optica uh to try to link the ecosystem and also whenever you
[01:54:36] link the ecosystem and also whenever you need a business Upstream business from
[01:54:38] need a business Upstream business from Taiwan or whenever you need the mass
[01:54:41] Taiwan or whenever you need the mass production capacity in Taiwan or in
[01:54:44] production capacity in Taiwan or in Japan or in APAC region that which I am
[01:54:47] Japan or in APAC region that which I am a escort right now you can just feel
[01:54:50] a escort right now you can just feel free to come to us uh so because of the
[01:54:54] free to come to us uh so because of the time limitation YouTube I would like to
[01:54:56] time limitation YouTube I would like to let you know that I hereby welcome and
[01:54:59] let you know that I hereby welcome and accept the opportunity to partner with
[01:55:02] accept the opportunity to partner with hispa so we will but expect big news
[01:55:06] hispa so we will but expect big news between Optica and this heterogeneously
[01:55:08] between Optica and this heterogeneously integrated silicon photonics Alliance
[01:55:11] integrated silicon photonics Alliance expect big news with this this meeting
[01:55:12] expect big news with this this meeting is global and many things have happen
[01:55:15] is global and many things have happen with Asia as you just heard from Taiwan
[01:55:17] with Asia as you just heard from Taiwan I would like to say something else as
[01:55:19] I would like to say something else as well for everyone in the meeting room
[01:55:21] well for everyone in the meeting room and before I give the floor to final
[01:55:22] and before I give the floor to final speaker uh as you know we are very
[01:55:25] speaker uh as you know we are very active with the chips act and I know
[01:55:31] active with the chips act and I know because many of you have asked me
[01:55:33] because many of you have asked me questions over summer and they saw
[01:55:34] questions over summer and they saw linked in post that the beginning of
[01:55:37] linked in post that the beginning of Summer July 9th we have a notice of
[01:55:40] Summer July 9th we have a notice of intent for the different tools for the
[01:55:43] intent for the different tools for the packaging of chiplets and this includes
[01:55:46] packaging of chiplets and this includes the packaging of photonics we have some
[01:55:49] the packaging of photonics we have some people of n in the room we can also make
[01:55:52] people of n in the room we can also make introductions but have a look at the
[01:55:55] introductions but have a look at the website of the chips for America and
[01:55:57] website of the chips for America and have a look at all the different R&D
[01:55:59] have a look at all the different R&D activities for which they are demanding
[01:56:01] activities for which they are demanding they are asking for notice of intent and
[01:56:04] they are asking for notice of intent and notice there is 1.6 billion Euro on F on
[01:56:08] notice there is 1.6 billion Euro on F on Innovation for this R&D projects this is
[01:56:10] Innovation for this R&D projects this is for us-based companies as well as
[01:56:13] for us-based companies as well as companies who have the possibility of
[01:56:16] companies who have the possibility of being active in United States and this
[01:56:19] being active in United States and this is a major opportunity and one of these
[01:56:21] is a major opportunity and one of these compan
[01:56:23] compan the next speaker today I'm going all the
[01:56:25] the next speaker today I'm going all the way to both en as well as to Montana I'm
[01:56:31] way to both en as well as to Montana I'm going to welcome fix thank you very much
[01:56:34] going to welcome fix thank you very much Marcel for being with us today this is
[01:56:36] Marcel for being with us today this is an oat please let us know what you can
[01:56:39] an oat please let us know what you can do for others what others can do for you
[01:56:40] do for others what others can do for you the floor and the attention of everyone
[01:56:42] the floor and the attention of everyone goes to
[01:56:43] goes to fix J I hope you can hear me loud and
[01:56:46] fix J I hope you can hear me loud and clear CH clear yeah loud and clear very
[01:56:49] clear CH clear yeah loud and clear very good hey uh thank you so much um I also
[01:56:51] good hey uh thank you so much um I also have some slides and uh thank you for
[01:56:54] have some slides and uh thank you for giving me the opportunity to present
[01:56:58] giving me the opportunity to present that so and check do you see the
[01:57:02] that so and check do you see the slide yes okay good hey we as fix we are
[01:57:07] slide yes okay good hey we as fix we are full focused on packaging of all kind of
[01:57:11] full focused on packaging of all kind of integrated photonic or free form optic
[01:57:13] integrated photonic or free form optic Solutions and we love to do that in
[01:57:16] Solutions and we love to do that in large scale and I will also go to our
[01:57:19] large scale and I will also go to our next page so we let say are Loc in the
[01:57:22] next page so we let say are Loc in the in the Netherlands uh and we have a
[01:57:25] in the Netherlands uh and we have a little bit above 50 people uh but also
[01:57:28] little bit above 50 people uh but also currently we have an an us office fix
[01:57:31] currently we have an an us office fix Inc and also uh giv us the possibility
[01:57:34] Inc and also uh giv us the possibility of supporting let's say our us customers
[01:57:36] of supporting let's say our us customers also directly from the us and we also
[01:57:39] also directly from the us and we also see that that that uh we as a company we
[01:57:42] see that that that uh we as a company we have globally a lot of customers in all
[01:57:45] have globally a lot of customers in all domains uh but also for us the US market
[01:57:48] domains uh but also for us the US market is is a very important one uh you also
[01:57:51] is is a very important one uh you also see in my opinion nice picture of our
[01:57:54] see in my opinion nice picture of our new facility so some months ago we were
[01:57:56] new facility so some months ago we were able to open our new facility and that
[01:57:58] able to open our new facility and that gives us the possibility of growing
[01:58:00] gives us the possibility of growing further uh so there has a lot of clean
[01:58:03] further uh so there has a lot of clean room space but also uh a lot of uh space
[01:58:06] room space but also uh a lot of uh space for the proper equipment to uh to make
[01:58:09] for the proper equipment to uh to make automatic automatic production possible
[01:58:13] automatic automatic production possible and this this production activity we do
[01:58:15] and this this production activity we do this for let's say all domains which are
[01:58:18] this for let's say all domains which are related to uh integrated photonics we
[01:58:20] related to uh integrated photonics we see a lot of customers active in life
[01:58:22] see a lot of customers active in life in Quantum in in biop photonics in data
[01:58:25] in Quantum in in biop photonics in data com in sensors you name it and we also
[01:58:29] com in sensors you name it and we also see them let's say for example maybe an
[01:58:32] see them let's say for example maybe an liar application we see also solutions
[01:58:34] liar application we see also solutions that uh in all different uh yeah um um
[01:58:39] that uh in all different uh yeah um um uh let's say um three five domains
[01:58:42] uh let's say um three five domains active some TR in Silicon nitrate some
[01:58:44] active some TR in Silicon nitrate some in phosphite uh you name it and we
[01:58:48] in phosphite uh you name it and we package everything uh on customer
[01:58:51] package everything uh on customer request and that's also what we are we
[01:58:54] request and that's also what we are we are an say a service provider to say and
[01:58:56] are an say a service provider to say and we are uh definitely performing the the
[01:58:59] we are uh definitely performing the the activity of uh of of packaging and
[01:59:02] activity of uh of of packaging and everything what is involved in the
[01:59:04] everything what is involved in the packaging
[01:59:05] packaging activity um the the photonic pick itself
[01:59:09] activity um the the photonic pick itself this our opinion is not a product so
[01:59:11] this our opinion is not a product so that you need a lot of things to make it
[01:59:12] that you need a lot of things to make it functional so all the optical things
[01:59:14] functional so all the optical things need to be connected to photonic chip a
[01:59:16] need to be connected to photonic chip a lot of wi bonding is typically
[01:59:18] lot of wi bonding is typically applicable toal management is needed and
[01:59:21] applicable toal management is needed and the the end of the day you want to have
[01:59:22] the the end of the day you want to have a module which can be used on on a
[01:59:24] a module which can be used on on a higher level and that's let's say our
[01:59:27] higher level and that's let's say our activity all things of assembling and
[01:59:30] activity all things of assembling and coming to a final product that's uh
[01:59:32] coming to a final product that's uh that's what we uh that's what we do and
[01:59:35] that's what we uh that's what we do and I have also another example how this
[01:59:37] I have also another example how this could look like you see a little bit of
[01:59:38] could look like you see a little bit of animation of an an gold box butterfly
[01:59:41] animation of an an gold box butterfly some termal preparation of thermal
[01:59:43] some termal preparation of thermal management you see here an a laser
[01:59:45] management you see here an a laser module positions on on a substrate uh
[01:59:48] module positions on on a substrate uh this is for example in Silicon nitrate
[01:59:50] this is for example in Silicon nitrate chip polished to in certain angle uh we
[01:59:54] chip polished to in certain angle uh we also able to flip chip all kind of
[01:59:56] also able to flip chip all kind of things on it uh yeah we strongly believe
[01:59:58] things on it uh yeah we strongly believe in active alignment and you see by six
[02:00:00] in active alignment and you see by six fre degrees the optimization of this
[02:00:02] fre degrees the optimization of this laser module to the Silicon nitrate chip
[02:00:04] laser module to the Silicon nitrate chip and also way the the proper epoxies and
[02:00:07] and also way the the proper epoxies and they are let say attached glute together
[02:00:10] they are let say attached glute together uh on the other side an example of a
[02:00:12] uh on the other side an example of a fiber Ray could be with a lot of
[02:00:14] fiber Ray could be with a lot of channels and also freedom freedom
[02:00:16] channels and also freedom freedom degrees optimize finding the spot with
[02:00:19] degrees optimize finding the spot with the low losses and then it will also be
[02:00:21] the low losses and then it will also be attached
[02:00:22] attached so then we have the entire chain uh
[02:00:25] so then we have the entire chain uh optimized and hopefully also with low
[02:00:27] optimized and hopefully also with low losses and which then be say die
[02:00:29] losses and which then be say die attached into the
[02:00:31] attached into the package um some preparation for hermetic
[02:00:34] package um some preparation for hermetic sealing um and then the wire bonding as
[02:00:37] sealing um and then the wire bonding as did which is if it applicable will be
[02:00:39] did which is if it applicable will be done and in this case also a hermetic
[02:00:42] done and in this case also a hermetic ceiling this was an example where let's
[02:00:44] ceiling this was an example where let's say two chips were connected to each
[02:00:46] say two chips were connected to each other but we see a massive diversity uh
[02:00:50] other but we see a massive diversity uh sometimes it is an number of chiplets
[02:00:52] sometimes it is an number of chiplets which me need to be connected sometimes
[02:00:55] which me need to be connected sometimes an high density of fiber Rays some times
[02:00:57] an high density of fiber Rays some times an really high density of of electrical
[02:01:00] an really high density of of electrical wire bonds we see of course also for the
[02:01:02] wire bonds we see of course also for the quantum applications for low
[02:01:03] quantum applications for low temperatures for example on full Kelvin
[02:01:06] temperatures for example on full Kelvin and also all the technology and process
[02:01:09] and also all the technology and process knowledge is needed to make applications
[02:01:10] knowledge is needed to make applications for for Kelvin uh that's that's what we
[02:01:13] for for Kelvin uh that's that's what we typically
[02:01:14] typically do our position in the value chain uh so
[02:01:19] do our position in the value chain uh so uh some companies of course do the
[02:01:21] uh some companies of course do the development activity ities uh let's say
[02:01:23] development activity ities uh let's say uh some companies of course let's say
[02:01:25] uh some companies of course let's say they are the front end foundaries of
[02:01:26] they are the front end foundaries of making the the waivers uh could be in
[02:01:29] making the the waivers uh could be in all kind of formats and and Technologies
[02:01:33] all kind of formats and and Technologies and we as a company do all the the
[02:01:34] and we as a company do all the the packaging relating activities and uh T
[02:01:37] packaging relating activities and uh T soon agree we do the validation and then
[02:01:39] soon agree we do the validation and then we can ship let's say the the package
[02:01:41] we can ship let's say the the package assemblies to our customers which then
[02:01:43] assemblies to our customers which then they use on a higher
[02:01:45] they use on a higher level and one remark I like to make
[02:01:47] level and one remark I like to make about the say the picture and that's
[02:01:48] about the say the picture and that's also Our advice of early involvement um
[02:01:51] also Our advice of early involvement um we still see that that some companies uh
[02:01:54] we still see that that some companies uh they come to us at a very late moment
[02:01:56] they come to us at a very late moment and they want to package the thing and
[02:01:58] and they want to package the thing and our advice is if you involve us uh or
[02:02:01] our advice is if you involve us uh or during the development we can help you
[02:02:02] during the development we can help you to bring your design to good packageable
[02:02:05] to bring your design to good packageable solution and also for this we uh We
[02:02:08] solution and also for this we uh We believe We are one of the only companies
[02:02:10] believe We are one of the only companies who also have an packaging design tool
[02:02:13] who also have an packaging design tool kit which can help you also uh let's say
[02:02:16] kit which can help you also uh let's say uh designing your uh your pick in such a
[02:02:19] uh designing your uh your pick in such a way that at the end of the day is also
[02:02:20] way that at the end of the day is also packageable and this packaging design uh
[02:02:23] packageable and this packaging design uh kit you can freely pick it up from our
[02:02:26] kit you can freely pick it up from our website uh so my advice is strongly do
[02:02:29] website uh so my advice is strongly do that because it makes you say uh Your
[02:02:32] that because it makes you say uh Your Design easier it also involves some DDS
[02:02:34] Design easier it also involves some DDS layers which also can help you uh during
[02:02:36] layers which also can help you uh during your process and at the end of the day
[02:02:39] your process and at the end of the day uh the total cost for your packaging
[02:02:41] uh the total cost for your packaging will be lower in higher
[02:02:45] will be lower in higher qualities this is an example everybody's
[02:02:47] qualities this is an example everybody's talking about let's say uh maybe hybrid
[02:02:49] talking about let's say uh maybe hybrid integration and this is also a form what
[02:02:51] integration and this is also a form what we see quite often you see an high
[02:02:53] we see quite often you see an high number of chiplets which need to be
[02:02:55] number of chiplets which need to be connected to each other some of the the
[02:02:58] connected to each other some of the the the the chiplets are say then also
[02:03:00] the the chiplets are say then also directly chipto chip let's say connected
[02:03:02] directly chipto chip let's say connected and optimized for low losses you see
[02:03:05] and optimized for low losses you see different platforms silicon nitrite inum
[02:03:07] different platforms silicon nitrite inum fosite all the chiplets uh in their
[02:03:10] fosite all the chiplets uh in their specific area of
[02:03:12] specific area of expertise but also um what is growing by
[02:03:15] expertise but also um what is growing by time of course the need for high
[02:03:17] time of course the need for high frequencies uh so we also have packaging
[02:03:19] frequencies uh so we also have packaging forms up to 64 GHz
[02:03:22] forms up to 64 GHz um on the top side you see also a fiber
[02:03:25] um on the top side you see also a fiber aray sometimes see in density of fiber
[02:03:27] aray sometimes see in density of fiber Rays um yeah that could be all
[02:03:29] Rays um yeah that could be all wavelength and you name it so uh let's
[02:03:33] wavelength and you name it so uh let's say this is also an an an complexity
[02:03:35] say this is also an an an complexity form which uh which suits us very well
[02:03:38] form which uh which suits us very well so uh um and the interconnection of a
[02:03:42] so uh um and the interconnection of a lot of optical
[02:03:44] lot of optical components this is by the way is a form
[02:03:46] components this is by the way is a form of course of directly interconnect but
[02:03:48] of course of directly interconnect but we see also forms where say it's more
[02:03:50] we see also forms where say it's more free space Optics where let's say you
[02:03:52] free space Optics where let's say you have more uh let's say standing separate
[02:03:54] have more uh let's say standing separate standing components like like lenses
[02:03:56] standing components like like lenses isolators you name it also fits us very
[02:04:00] isolators you name it also fits us very well this is my last slide and give you
[02:04:02] well this is my last slide and give you a little bit of an overview about maybe
[02:04:04] a little bit of an overview about maybe the diversity of uh let's say uh
[02:04:07] the diversity of uh let's say uh packaging Solutions we see by coming by
[02:04:10] packaging Solutions we see by coming by um we serve customers let's say from uh
[02:04:13] um we serve customers let's say from uh from low volume to the beginning to high
[02:04:15] from low volume to the beginning to high volume production uh the low volumes
[02:04:17] volume production uh the low volumes also we have a number of
[02:04:18] also we have a number of characterization packages if you have
[02:04:20] characterization packages if you have your chip you comply to certain set we
[02:04:22] your chip you comply to certain set we also have all the materials for easy
[02:04:24] also have all the materials for easy packaging your chip and that you can
[02:04:26] packaging your chip and that you can validate them uh let's say on uh on your
[02:04:29] validate them uh let's say on uh on your bench to to an high level you see maybe
[02:04:31] bench to to an high level you see maybe also on the top row the second one from
[02:04:33] also on the top row the second one from the right is one of the characterization
[02:04:35] the right is one of the characterization packages uh very easy for your first
[02:04:38] packages uh very easy for your first let's say multi project waiver chips
[02:04:41] let's say multi project waiver chips coming off uh you see also a number of
[02:04:44] coming off uh you see also a number of them where you see maybe from two sides
[02:04:46] them where you see maybe from two sides you see fiber arrays uh could be Edge
[02:04:48] you see fiber arrays uh could be Edge coupled could be of course Fe grading
[02:04:50] coupled could be of course Fe grading couplers use see um sometimes also a
[02:04:53] couplers use see um sometimes also a very high density of uh of of
[02:04:56] very high density of uh of of interconnects um maybe the middle row
[02:04:59] interconnects um maybe the middle row the second one on on the left I mean for
[02:05:01] the second one on on the left I mean for example has uh uh has 3,300 wirebonds so
[02:05:05] example has uh uh has 3,300 wirebonds so very high uh uh wirebond densities we
[02:05:07] very high uh uh wirebond densities we definitely see coming by and yeah also
[02:05:12] definitely see coming by and yeah also some other things uh let's say like like
[02:05:14] some other things uh let's say like like termal Management Solutions and other
[02:05:16] termal Management Solutions and other things you see also some examples if the
[02:05:18] things you see also some examples if the the volumes really come go up uh and we
[02:05:21] the volumes really come go up uh and we have to produce uh let's say uh products
[02:05:23] have to produce uh let's say uh products in in higher volumes we have the the
[02:05:26] in in higher volumes we have the the equipment we have the knowledge to do
[02:05:29] equipment we have the knowledge to do that thank you so much Marcel this is
[02:05:31] that thank you so much Marcel this is great and I really would like to
[02:05:33] great and I really would like to congratulate you on the success that you
[02:05:35] congratulate you on the success that you are having with fix the entire team of f
[02:05:38] are having with fix the entire team of f but one question what can we do to help
[02:05:41] but one question what can we do to help you now um now what what what of course
[02:05:46] you now um now what what what of course we uh let's say would be
[02:05:48] we uh let's say would be pleased um is is is is so of course
[02:05:53] pleased um is is is is so of course Solutions uh of of products which come
[02:05:55] Solutions uh of of products which come to higher volumes uh I think we have a
[02:05:57] to higher volumes uh I think we have a specialty on that and you see still a
[02:05:59] specialty on that and you see still a lot of uh let's say solutions they are
[02:06:02] lot of uh let's say solutions they are in the ramping up phase uh this is of
[02:06:05] in the ramping up phase uh this is of course also a matter of time and
[02:06:06] course also a matter of time and products are really ready of doing that
[02:06:08] products are really ready of doing that but we love to serve more customers to
[02:06:10] but we love to serve more customers to higher volumes so that's that's one
[02:06:12] higher volumes so that's that's one thing we uh we can can be helped
[02:06:15] thing we uh we can can be helped with I we have been today discussing
[02:06:19] with I we have been today discussing many many of the Technologies I would
[02:06:20] many many of the Technologies I would like to actually sumar with this slide
[02:06:23] like to actually sumar with this slide this SL was shown by vas Gupta from from
[02:06:26] this SL was shown by vas Gupta from from Global fundra and he told us on two
[02:06:29] Global fundra and he told us on two sides on one we all need to work
[02:06:31] sides on one we all need to work together to solve a still some of the
[02:06:33] together to solve a still some of the key challenges in a in a bottom up
[02:06:35] key challenges in a in a bottom up approach on the other hand we are
[02:06:37] approach on the other hand we are getting lots of pressure from end users
[02:06:39] getting lots of pressure from end users on addressing reliability concerns as
[02:06:41] on addressing reliability concerns as well as price concerns and on the next
[02:06:44] well as price concerns and on the next year the next year we have a really big
[02:06:46] year the next year we have a really big opportunity because today you have seen
[02:06:48] opportunity because today you have seen that around us we have companies like
[02:06:50] that around us we have companies like look at the chat like NASA like valo
[02:06:53] look at the chat like NASA like valo looking at us and asking us their
[02:06:55] looking at us and asking us their demands we need to work together to
[02:06:57] demands we need to work together to offer them those demands I would like to
[02:06:58] offer them those demands I would like to let you know that this last two hours
[02:07:00] let you know that this last two hours have been a pressure for all of us so on
[02:07:02] have been a pressure for all of us so on behalf on behalf of optica 184 staff on
[02:07:07] behalf on behalf of optica 184 staff on behalf of our management or behalf our
[02:07:09] behalf of our management or behalf our board we are here to Ser you please
[02:07:12] board we are here to Ser you please share with us your challenges the
[02:07:14] share with us your challenges the technical directors like drar Ras like
[02:07:16] technical directors like drar Ras like Dr heras their job is to understand your
[02:07:19] Dr heras their job is to understand your technology and find for you ways to show
[02:07:22] technology and find for you ways to show it showcase it and connect with
[02:07:25] it showcase it and connect with potential Partners customers and
[02:07:28] potential Partners customers and talent your demand of course if you like
[02:07:31] talent your demand of course if you like what we're doing there's only one thing
[02:07:33] what we're doing there's only one thing you can do to support us if you want us
[02:07:35] you can do to support us if you want us to continue having a
[02:07:36] to continue having a [Music]
[02:07:40] [Music] job next
[02:07:42] job next time to serve you
[02:07:47] byebye all right so I'm going to ask