Optica Online Industry Meeting: Photonics Packaging, Assembly and Testing. Recording 29 August 2022.

https://www.youtube.com/watch?v=zAjkGhkjppA

Summary

TL;DR — Optica's first online industry meeting focused on photonics packaging, assembly, and testing, bringing together key players from across the supply chain to discuss current challenges and future opportunities. The event highlighted the increasing demand for advanced packaging solutions driven by higher data rates, miniaturization, and new applications like lidar and co-packaged optics.

Key points

• The meeting emphasized the critical need for collaboration between different stages of the supply chain, from chip manufacturers to transceiver vendors, to optimize for cost, performance, and reliability.

• Discussions covered advancements in packaging technologies, including 3D chiplets, wafer-level assembly, and novel bonding techniques like direct bonding, aiming to reduce parasitics and improve integration.

• Specific application areas like lidar and co-packaged optics present unique challenges in thermal management, optical coupling, and high-volume manufacturing.

• The importance of standardization in components, assembly processes, and testing methodologies was stressed to enable wider adoption and innovation in photonics.

• Emerging initiatives from DARPA and industry collaborations aim to foster the development of advanced packaging capabilities and address the growing demands of the photonics industry.

Takeaway — To accelerate photonics innovation and market growth, the industry must prioritize standardization, cross-functional collaboration, and the development of cost-effective, high-volume manufacturing and testing solutions.