IEEE Photonics Journal Club - "Silicon Photonics"

Full Transcript

https://www.youtube.com/watch?v=KQTCoKsJ9ak

[00:01] The information of today's uh set.
[00:03] The information of today's uh set session so we have three speakers uh in total.
[00:07] Session so we have three speakers uh in total um this uh session is hosted by I photo Hong Kong chapter and Professor.
[00:11] Total um this uh session is hosted by I photo Hong Kong chapter and Professor Shen kaai uh will um preside and moderate um this uh joural Club event.
[00:14] Shen kaai uh will um preside and moderate um this uh joural Club event.
[00:18] Moderate um this uh joural Club event um so after each talk uh to a brief Q&A uh for follow each presentation.
[00:23] Event um so after each talk uh to a brief Q&A uh for follow each presentation.
[00:28] Brief Q&A uh for follow each presentation so uh there will be a time for one and two questions uh after all the uh speakers um give their talks.
[00:31] Presentation so uh there will be a time for one and two questions uh after all the uh speakers um give their talks.
[00:33] For one and two questions uh after all the uh speakers um give their talks we will have a panel p uh Q&A U following.
[00:36] The uh speakers um give their talks we will have a panel p uh Q&A U following.
[00:40] Will have a panel p uh Q&A U following so uh with this uh I would like to uh hand over um to Professor.
[00:44] Following so uh with this uh I would like to uh hand over um to Professor.
[00:47] S uhai yeah yeah can over yeah.
[00:54] S uhai yeah yeah can over yeah.
[00:56] Okay great you will yeah thank you very.
[01:02] okay great you will yeah thank you very much for the introduction on this i e.
[01:05] much for the introduction on this i e foron Society Journal club and so our next speaker will be uh Mr fq is that correct.
[01:18] well I thought I'm the third presenter I guess so so do we do we follow the the normal normal order or or so I would uh I would do patri trick first.
[01:30] uh the review of the Silicon fonics technology platform develop okay.
[01:34] so we we just follow the the orig plan order okay great.
[01:38] okay okay so now first speaker will be Dr Patrick low uh the title of his presentation will be review of city fonics technology and platform uh development.
[01:50] so let me um briefly introduce Dr L Dr L received PhD degree in electrical and computer engineering from the University of Texas at Austin.
[02:03] from the University of Texas at Austin in 1992.
[02:04] he was with integrated device technology incorporation USA ON cicon seos Semiconductor manufacturing areas.
[02:10] in process and integration R&D from 2004 to 2017.
[02:17] he was with ime a star Singapore where he was the laboratory director and program directors of Nano electronics and photonic program and sub.
[02:21] subsequently the Deputy executive director of The Institute covering R&D.
[02:30] since 2017 he C founded the company as Advanced Micro Foundry focusing on Silicon photonics manufacturing technology industrialization and commercialization.
[02:43] being the Pres president and now a CTO.
[02:48] he was the recipient of at George E Smith Award for best paper published in ATB electronic device letters in 2007.
[02:55] he has won both Singapore's National technology award.
[03:04] Singapore's National technology award and president technology award for his works on Nano electronics and phon in 2008 and 2010 respectively.
[03:12] So without further Ado let us welcome Dr Low.
[03:18] Yeah, thank you very much. Let me share the slides.
[03:28] First, can see.
[03:34] Yeah, thank you very much, Chairman. We are very honored to participate in this very interesting uh event.
[03:39] As Dr S, Dr Chen has expressed, there are many interest there.
[03:46] There many useful points. I think it's a very good event. Congratulation on this.
[03:52] So we are very honored to participate.
[03:54] Just to discuss a recent published articles on the topic of silicon for elonics technology and platform development.
[03:59] Along with me is Dr Lenu.
[04:06] development along with me is Dr lenu.
[04:08] both of us actually were the the co-founder of the the company of MF.
[04:10] co-founder of the the company of MF.
[04:14] before I start I like to acknowledge the manufacturing team at MF as well as the previous ime AAR teams for many years of hard work for the development of silicon bonics technology.
[04:17] manufacturing team at MF as well as the previous ime AAR teams for many years of hard work for the development of silicon bonics technology.
[04:20] hard work for the development of silicon bonics technology as many of you might have know.
[04:22] bonics technology as many of you might have know we started activities over 16 years ago start from from one of the the technical andd programs in AA and also to our current technical staffs and previous members wherever you are and all the credits are yours.
[04:25] have know we started activities over 16 years ago start from from one of the the technical andd programs in AA and also to our current technical staffs and previous members wherever you are and all the credits are yours.
[04:28] years ago start from from one of the the technical andd programs in AA and also to our current technical staffs and previous members wherever you are and all the credits are yours.
[04:31] technical andd programs in AA and also to our current technical staffs and previous members wherever you are and all the credits are yours.
[04:35] to our current technical staffs and previous members wherever you are and all the credits are yours.
[04:38] previous members wherever you are and all the credits are yours.
[04:40] all the credits are yours so we would like all to thank it's very important.
[04:43] so we would like all to thank it's very important actually we have to acknowledge all the industry partners for building the uh silicon photonics capability demands.
[04:45] like all to thank it's very important actually we have to acknowledge all the industry partners for building the uh silicon photonics capability demands.
[04:47] actually we have to acknowledge all the industry partners for building the uh silicon photonics capability demands.
[04:50] industry partners for building the uh silicon photonics capability demands together throughout this journey with us.
[04:53] silicon photonics capability demands together throughout this journey with us for the patients and also their strategic interest.
[04:55] together throughout this journey with us for the patients and also their strategic interest.
[04:57] for the patients and also their strategic interest so what we see in front today from uh one of the te andd programs all the way carry on to a commercial with the en now.
[05:00] strategic interest so what we see in front today from uh one of the te andd programs all the way carry on to a commercial with the en now.
[05:03] front today from uh one of the te andd programs all the way carry on to a commercial with the en now.
[05:06] programs all the way carry on to a commercial with the en now.
[05:10] commercial with the en now so here's the uh the outline of of the the discussions.
[05:14] uh the outline of of the the discussions so basically over the past decades we.
[05:16] so basically over the past decades we have seen the tremendous and the.
[05:19] have seen the tremendous and the activity and various resulting.
[05:21] activity and various resulting application exploration particularly the.
[05:24] application exploration particularly the product being commercialized based on.
[05:26] product being commercialized based on the Silicon photonics uh technology as.
[05:29] the Silicon photonics uh technology as you see from various uh uh technical.
[05:32] you see from various uh uh technical reports and business reports the.
[05:35] reports and business reports the penetration rate or the adoption rates.
[05:37] penetration rate or the adoption rates of silicon photonics in competing with.
[05:39] of silicon photonics in competing with the the 35 based has been increasing.
[05:43] the the 35 based has been increasing from last couple of years and this.
[05:46] from last couple of years and this actually give a lot of confidence and.
[05:48] actually give a lot of confidence and credits to the uh the other emerging.
[05:52] credits to the uh the other emerging applications because all the application.
[05:54] applications because all the application that we are looking for were eventually.
[05:56] that we are looking for were eventually were aiming for commercial purposes so.
[05:59] were aiming for commercial purposes so it's very important that we see the uh.
[06:02] it's very important that we see the uh the event as the the commercialization.
[06:04] the event as the the commercialization taking places with the increasing.
[06:06] taking places with the increasing adoption this is very important so in.
[06:09] adoption this is very important so in this talk we will'll discuss the the.
[06:10] In this talk, we will discuss the following: Firstly, a brief on the history of the Silicon photonics development.
[06:16] Then, on the present status of the Silicon photonics development commercialization progress with the highlight of various foundry service activity worldwide.
[06:27] Including MF work to the cic phonics community development.
[06:30] Secondly, we will review the typical device library offers, but I will skip the some of the technical contents in detail.
[06:40] Because all of those have been described quite extensively in the manuscript already.
[06:45] So then, next we talk about the quality control systems because this is relating to the testing capabilities in any of the other foundry.
[06:59] Because this is very important beyond from the lab-based experimental lines towards the commercial with the foundry lines.
[07:09] So quality control and
[07:12] Foundry lines so quality control and testing are very important part of it.
[07:14] Testing are very important part of it.
[07:14] The last points I want to touch upon is the we call is the last technical matter.
[07:21] Last smile towards the final prodution.
[07:24] Which is always interesting uh is on the uh technology ionics related with the packaging.
[07:33] So because the C packaging has been a bit Buzz wordss nowadays in the community towards the uh the product.
[07:39] So F disclaimer here so it's not the the purpose of this talk to compare or to control various service providers for who is providing the best.
[07:50] This is not the the purpose neither it is the intention for me to advertise AMF.
[07:55] So excuse me if I inevident introduce some of the am uh in the the sense of marketing but not the the purpose.
[08:04] So I'm only use it for the example to illustrate the the whole cycle and also service around for making.
[08:12] cycle and also service around for making of the Silicon photonics from the design.
[08:14] of the Silicon photonics from the design to materialize it as a meaningful.
[08:19] to materialize it as a meaningful exercise so the Silicon phonics begin.
[08:22] exercise so the Silicon phonics begin with the SAR papers by Sur and all we.
[08:25] with the SAR papers by Sur and all we know know this back to 1987 so describe.
[08:29] know know this back to 1987 so describe very interesting phenomenon very useful.
[08:32] very interesting phenomenon very useful phenomenon is the free carrier.
[08:34] phenomenon is the free carrier dispersion effects in Silicon which.
[08:36] dispersion effects in Silicon which forms the very idea of the first.
[08:38] forms the very idea of the first building blocks of the uh the integrated.
[08:41] building blocks of the uh the integrated photonics circuits which is the phase.
[08:44] photonics circuits which is the phase shifter then subsequently many.
[08:47] shifter then subsequently many University and the research institute.
[08:49] University and the research institute create many type of useful devices.
[08:51] create many type of useful devices towards the full or silicon photonics.
[08:54] towards the full or silicon photonics Pig solution I say a full actually is.
[08:57] Pig solution I say a full actually is quote unquote because every day and now.
[09:00] quote unquote because every day and now uh we start to seeing a new devices.
[09:03] uh we start to seeing a new devices being reported to adding to the overall.
[09:06] being reported to adding to the overall functionality what the cicon phonics PL.
[09:09] functionality what the cicon phonics PL platform can be so the first is always.
[09:12] platform can be so the first is always the the high wave guide the reason I.
[09:14] the the high wave guide the reason I talked about the the whole cycle here is
[09:16] talked about the the whole cycle here is because I think for the interest of
[09:19] because I think for the interest of photonics because they have a different
[09:21] photonics because they have a different wavelengths for any of the the
[09:23] wavelengths for any of the the wavelength that we talk about it will go
[09:25] wavelength that we talk about it will go through that cycle the first one is
[09:27] through that cycle the first one is always the high quality wave guides you
[09:29] always the high quality wave guides you want to getting the uh find the lights
[09:32] want to getting the uh find the lights getting a low loss and what's
[09:34] getting a low loss and what's importantly is that the the high quality
[09:37] importantly is that the the high quality wave gues with the confinment of Lights
[09:39] wave gues with the confinment of Lights in the vertical directions so that
[09:42] in the vertical directions so that theography can Define the wave guide in
[09:44] theography can Define the wave guide in the plane and the original s SOI wave
[09:48] the plane and the original sSOI wave guides were comparatively large in
[09:50] guides were comparatively large in several microns in width and thickness
[09:53] several microns in width and thickness but eventually uh signal s sois for
[09:56] but eventually uh signal s sois for instance the the 220 uh nanom as the def
[10:00] instance the the 220 uh nanom as the def facto was used by majority of the groups
[10:02] facto was used by majority of the groups although we still see a few different
[10:05] although we still see a few different types but B somewhere around 220 or S to
[10:09] types but B somewhere around 220 or S to 170 towards a 500 nanometer in their
[10:12] 170 towards a 500 nanometer in their range all of them give a good uh
[10:15] range all of them give a good uh performance of a lower loss TI bending.
[10:18] performance of a lower loss TI bending radius and many type of other cive devices.
[10:21] radius and many type of other cive devices the choice of the the sickness were purely based on what's the emphasis.
[10:23] devices the choice of the the sickness were purely based on what's the emphasis on the specific application uh purpose.
[10:26] on the specific application uh purpose so meanwhile there was also a great Milestones of the the the Mander interferometer modulat with the first highspeed demonstration in a one gigahertz based on the plasma dispersion effects is reported by Intel and.
[10:30] so meanwhile there was also a great Milestones of the the the Mander interferometer modulat with the first highspeed demonstration in a one gigahertz based on the plasma dispersion effects is reported by Intel and.
[10:32] Milestones of the the the Mander interferometer modulat with the first highspeed demonstration in a one gigahertz based on the plasma dispersion effects is reported by Intel and.
[10:35] interferometer modulat with the first highspeed demonstration in a one gigahertz based on the plasma dispersion effects is reported by Intel and.
[10:39] highspeed demonstration in a one gigahertz based on the plasma dispersion effects is reported by Intel and.
[10:41] highspeed demonstration in a one gigahertz based on the plasma dispersion effects is reported by Intel and.
[10:45] gigahertz based on the plasma dispersion effects is reported by Intel and parallel development was the the Germania integration into the wave guy photo detector skes and also the the wave level high quality Germania was can be a process as we doing now like for instance EMF we doing this routinely now.
[10:49] effects is reported by Intel and parallel development was the the Germania integration into the wave guy photo detector skes and also the the wave level high quality Germania was can be a process as we doing now like for instance EMF we doing this routinely now.
[10:51] parallel development was the the Germania integration into the wave guy photo detector skes and also the the wave level high quality Germania was can be a process as we doing now like for instance EMF we doing this routinely now.
[10:53] Germania integration into the wave guy photo detector skes and also the the wave level high quality Germania was can be a process as we doing now like for instance EMF we doing this routinely now.
[10:56] photo detector skes and also the the wave level high quality Germania was can be a process as we doing now like for instance EMF we doing this routinely now.
[10:58] wave level high quality Germania was can be a process as we doing now like for instance EMF we doing this routinely now.
[11:01] be a process as we doing now like for instance EMF we doing this routinely now.
[11:04] instance EMF we doing this routinely now the Silicon photonics chip is almost complete except the the laser so the main approach on the the laser part of is in the the following so laser.
[11:07] the Silicon photonics chip is almost complete except the the laser so the main approach on the the laser part of is in the the following so laser.
[11:10] complete except the the laser so the main approach on the the laser part of is in the the following so laser.
[11:13] main approach on the the laser part of is in the the following so laser.
[11:15] is in the the following so laser integration into the Silicon via.
[11:17] integration into the Silicon via packaging either through on chip or off.
[11:20] packaging either through on chip or off chip of course the choice of the ether.
[11:22] chip of course the choice of the ether is largely determined by the technical.
[11:24] is largely determined by the technical performance needs cost and even.
[11:27] performance needs cost and even availability of the access ability so.
[11:30] availability of the access ability so cic and JIA engineering for lasers has.
[11:34] cic and JIA engineering for lasers has been very hot in the past these are all.
[11:36] been very hot in the past these are all wonderful scientific topics but not so.
[11:39] wonderful scientific topics but not so far being.
[11:41] far being successful lastly as the technology inch.
[11:43] successful lastly as the technology inch towards the uh the.
[11:46] towards the uh the market uh work has began on the next.
[11:49] market uh work has began on the next stage which is the packaging for silicon.
[11:51] stage which is the packaging for silicon photonic product this can be further.
[11:54] photonic product this can be further split into three aspect of it one is the.
[11:56] split into three aspect of it one is the photonics iio or interface interface the.
[12:00] photonics iio or interface interface the electrical iio interface and also the.
[12:02] electrical iio interface and also the integration see the intercompatibility.
[12:05] integration see the intercompatibility of those iio interface can be integrated.
[12:08] of those iio interface can be integrated Al together so all these demands and.
[12:11] Al together so all these demands and support and gradual establishment of a.
[12:13] support and gradual establishment of a long stretch of Supply chains so say fi.
[12:17] long stretch of Supply chains so say fi those are quite very challenge not only
[12:20] those are quite very challenge not only in a simple engineering or science uh
[12:24] in a simple engineering or science uh problem some of them could be a material
[12:25] problem some of them could be a material related because I Dr s mentioned there's
[12:28] related because I Dr s mentioned there's a large communities that in the
[12:30] a large communities that in the attendance here they are students so
[12:34] actually this is very important for the
[12:36] actually this is very important for the students to realize although the Silicon
[12:39] students to realize although the Silicon photonics reach to the the Prada uh uh
[12:43] photonics reach to the the Prada uh uh stage this is only give us confidence I
[12:46] stage this is only give us confidence I mean joking here always us have a great
[12:49] mean joking here always us have a great opportunity to getting a job that's for
[12:50] opportunity to getting a job that's for sure and also long long turn of the uh
[12:54] sure and also long long turn of the uh job Securities but what's also important
[12:56] job Securities but what's also important there's a lot of intellectual curiosity
[12:58] there's a lot of intellectual curiosity in the science topics how we going to do
[13:01] in the science topics how we going to do it differently because as we see more
[13:03] it differently because as we see more and more on the the packaging I I keep
[13:06] and more on the the packaging I I keep on saying the packaging because for
[13:07] on saying the packaging because for product this is a very very important
[13:09] product this is a very very important part of the the piece last step to
[13:12] part of the the piece last step to complete it to make all the me all the
[13:14] complete it to make all the me all the works meaningful because without without
[13:18] works meaningful because without without the the packaging without the the.
[13:19] the the packaging without the the product everything that we are doing.
[13:21] product everything that we are doing will remain in the science to me okay so.
[13:26] will remain in the science to me okay so this is talk talk about the uh silicon.
[13:29] this is talk talk about the uh silicon photonics uh ecosystems although quite a.
[13:32] photonics uh ecosystems although quite a bit of the Silicon photonics activity.
[13:34] bit of the Silicon photonics activity finally reach into a commercial stage it.
[13:37] finally reach into a commercial stage it already has a reasonable ecosystem.
[13:40] already has a reasonable ecosystem because it's heavily large largely.
[13:43] because it's heavily large largely leverage on the traditional silicon.
[13:45] leverage on the traditional silicon industry no ideal or optimized but.
[13:48] industry no ideal or optimized but possible and works to some degree.
[13:51] possible and works to some degree although uh we Face quite of a bit bit.
[13:53] although uh we Face quite of a bit bit of a pains like managing the supply.
[13:56] of a pains like managing the supply chain but it's workable but I think it's.
[13:58] chain but it's workable but I think it's also.
[13:59] also uh in triggering especially in uh in the.
[14:02] uh in triggering especially in uh in the last few years as we facing the uh the.
[14:06] last few years as we facing the uh the the coic situation the Supply Chain.
[14:08] the coic situation the Supply Chain management become a serious issue so.
[14:12] management become a serious issue so it's very important for any of the uh.
[14:14] it's very important for any of the uh the service providers to think about it.
[14:16] the service providers to think about it how we can link up all the uh the supply.
[14:19] how we can link up all the uh the supply chains and make it easier for the final.
[14:25] chains and make it easier for the final product users to to manage it securely.
[14:28] product users to to manage it securely and also easily so already a big players.
[14:31] and also easily so already a big players in the The Stand Datacom and Telecom.
[14:34] in the The Stand Datacom and Telecom space have their own internal cicon.
[14:37] space have their own internal cicon phonics programs and this includes.
[14:39] phonics programs and this includes integrated device manufacturing ID.
[14:42] integrated device manufacturing ID there's also a very healthy space for.
[14:45] there's also a very healthy space for silicon photonic startups design house.
[14:49] silicon photonic startups design house fabul so on so forth which include many.
[14:51] fabul so on so forth which include many in the different levels such as the.
[14:53] in the different levels such as the design house IP uh developers.
[14:57] design house IP uh developers application includes the uh the quantum.
[14:59] application includes the uh the quantum Computing artificial intelligence in.
[15:01] Computing artificial intelligence in various and also like for lighter.
[15:05] various and also like for lighter sensing all those additionally there's.
[15:08] sensing all those additionally there's the healthier infrastructures of.
[15:10] the healthier infrastructures of software part of it which is Ada support.
[15:13] software part of it which is Ada support Optical simulation dedicated for Optics.
[15:16] Optical simulation dedicated for Optics and photonics all those become viable.
[15:19] and photonics all those become viable for silicon photonics companies or
[15:21] for silicon photonics companies or startups with reasonable Investments to design their products with a purpose built software Fe in a commerci fies package the the S Dice and finally launch their products but you can see the the criticality of the prototyping lines to Pilot lines and and to the industrial FBS along with the the so-called broker agent design aggregators who may add their own values link all their activities as much as possible for design support and testings lastly and don't forget the the toolmakers especially uh testers we work a lot with the uh the testing uh de developers on the hardware as well as software so given what I describe above you can see there are many foundations have been set and yet there are huge rooms to be filled to truly link all those whole ecosystem together to form a true photonics product purpos Supply
[16:22] true photonics product purpos Supply chains So currently is more or less is
[16:25] chains So currently is more or less is depend on the the Legacy Supply chains
[16:29] depend on the the Legacy Supply chains or the lifing supply chain based on the
[16:32] or the lifing supply chain based on the seos which is not optimized as I said so
[16:36] seos which is not optimized as I said so we need the true photonics product
[16:38] we need the true photonics product purpose purpose the supply chain for
[16:41] purpose purpose the supply chain for students I will say in the future is
[16:42] students I will say in the future is very bright and exciting calling for
[16:45] very bright and exciting calling for Innovations to go go beyond what the
[16:47] Innovations to go go beyond what the electronic supply chain dominated at
[16:49] electronic supply chain dominated at the present stage so next we will focus on
[16:52] present stage so next we will focus on the What wave of B is about and does
[16:59] yeah so before we survey on various uh
[17:02] yeah so before we survey on various uh platforms offers and pdks I use the MF
[17:07] platforms offers and pdks I use the MF platform as an example purpose just to
[17:10] platform as an example purpose just to describe a typical layers and content so
[17:12] describe a typical layers and content so we can appreciate more what others are
[17:14] we can appreciate more what others are offering in the proper context so for
[17:17] offering in the proper context so for from the bottom up you can see there's s
[17:19] from the bottom up you can see there's s sois silicons
[17:22] sois silicons nitr uh all those so in in those
[17:26] nitr uh all those so in in those platform options and different uh.
[17:29] platform options and different uh differentiating features so you have the.
[17:31] differentiating features so you have the the Silicon nitr on b or silicon nitr in.
[17:34] the Silicon nitr on b or silicon nitr in the front end and germanian S sois all.
[17:37] the front end and germanian S sois all the Silicon nitrate in the back end and.
[17:40] the Silicon nitrate in the back end and Germania all the combination of it so in.
[17:42] Germania all the combination of it so in our case actually we provide the.
[17:44] our case actually we provide the standard npw versions so many probably.
[17:47] standard npw versions so many probably have experienced already that with the.
[17:49] have experienced already that with the denit TR backends and J on SOI so the.
[17:54] denit TR backends and J on SOI so the SOI that we provid majority is based on.
[17:57] SOI that we provid majority is based on the 220 nanometer silicon and also we.
[18:00] the 220 nanometer silicon and also we have two versions of a two two Micron.
[18:02] have two versions of a two two Micron and three Micron bar oxide depend on the.
[18:05] and three Micron bar oxide depend on the specific needs and also the other.
[18:08] specific needs and also the other secondness in processing that can be can.
[18:10] secondness in processing that can be can be uh discussed in the customized flows.
[18:14] be uh discussed in the customized flows so that includ the Silicon phe shifters.
[18:17] so that includ the Silicon phe shifters both in the ring format and also in the.
[18:20] both in the ring format and also in the marander interet formats and germanium F.
[18:23] marander interet formats and germanium F detectors in both in eleral and.
[18:26] detectors in both in eleral and verticals and also one of options can be.
[18:28] verticals and also one of options can be cointegrated is the the wave guided
[18:31] cointegrated is the the wave guided based uh APD device with silicon and
[18:35] based uh APD device with silicon and nitri Edge coupling scin and also with a
[18:38] nitri Edge coupling scin and also with a grading for the uh the wave guy uh the
[18:42] grading for the uh the wave guy uh the wave level testers and also we have the
[18:45] wave level testers and also we have the the theral optical shifters based on the
[18:48] the theral optical shifters based on the B based on the dop the Silicon all the
[18:51] B based on the dop the Silicon all the matter with or without the anut for the
[18:53] matter with or without the anut for the assmo efficiency consideration and also
[18:56] assmo efficiency consideration and also we have the other option for our oxide
[18:58] we have the other option for our oxide clouding removal options because there
[19:00] clouding removal options because there are certain application what demands the
[19:02] are certain application what demands the uh the oxide removal then the last sell
[19:06] uh the oxide removal then the last sell features is on the the vrp and also
[19:09] features is on the the vrp and also laser attachments so those were taking
[19:11] laser attachments so those were taking care the the optical interface and also
[19:16] care the the optical interface and also the last will be the ubm so options for
[19:18] the last will be the ubm so options for the electrical interface so according to
[19:21] the electrical interface so according to the application needs for each of the
[19:23] the application needs for each of the functionality performance so we can
[19:26] functionality performance so we can trace it through the existing So-Cal
[19:28] trace it through the existing So-Cal technology TR TR to identify the the
[19:30] technology TR TR to identify the the right platforms or the combination of
[19:33] right platforms or the combination of each uh devices and Technology to
[19:35] each uh devices and Technology to customiz your own flows own platforms
[19:40] customiz your own flows own platforms that will make it into a
[19:44] product so on the typical Foundry
[19:47] Services there are three different types
[19:50] of uh uh fabrication service that's the
[19:54] most Foundry provides one is on the the
[19:58] multi project with us which we call npw
[20:00] Shadows so this is all based on the
[20:03] fixed integration flow with the cost
[20:05] sharing and also make a lot easier for
[20:08] people have a repeated access uh
[20:10] repeated uh needs on the
[20:12] designs uh and also the the easy to use
[20:16] standard pdk device that we offer then
[20:19] the other one is the customized uh
[20:21] prototyping then be able to customize
[20:24] integration flow as what MF has been
[20:26] providing to our customers to the
[20:28] community so far for the customize
[20:30] integration flow per application needs
[20:33] integration flow per application needs so this may include many things but not
[20:36] so this may include many things but not limited but also very important now is
[20:39] limited but also very important now is the volume production uh steps
[20:42] the volume production uh steps regardless small or big volume it's all
[20:45] regardless small or big volume it's all about production and stay in and out and
[20:48] about production and stay in and out and eventually all the R&D exercise R&D
[20:51] eventually all the R&D exercise R&D practice will eventually get into their
[20:57] modes so on the as a typical aundry
[21:02] modes so on the as a typical aundry service flow as I described in on the
[21:04] service flow as I described in on the left hand side it describes the typical
[21:07] left hand side it describes the typical development steps from Design Concepts
[21:10] development steps from Design Concepts to Silicon chip
[21:12] to Silicon chip materialization this describes clearly
[21:14] materialization this describes clearly the role and the responsibilities of a
[21:16] the role and the responsibilities of a designers Foundry side of design support
[21:20] designers Foundry side of design support M shops and also Foundry fabrication
[21:22] M shops and also Foundry fabrication typical uh testing so designers is on
[21:26] typical uh testing so designers is on the concept schematics simulation design
[21:29] the concept schematics simulation design and GDs layout although we provides the
[21:32] and GDs layout although we provides the the initial found we provide do provides
[21:35] the initial found we provide do provides the uh the cic Improvement standard PD
[21:38] the uh the cic Improvement standard PD case process design rules and also the
[21:41] case process design rules and also the DC check on the DC make sure the DC
[21:45] DC check on the DC make sure the DC cleanness and process
[21:47] cleanness and process compatibilities or at least to flag out
[21:49] compatibilities or at least to flag out if anything not compatible or any PR the
[21:52] if anything not compatible or any PR the mistakes so fine tuning and DRC recheck
[21:56] mistakes so fine tuning and DRC recheck and final hand shcks to be with for the
[21:59] and final hand shcks to be with for the tape B the M shop will just do the the
[22:01] tape B the M shop will just do the the mass making and then to the fabrication
[22:04] mass making and then to the fabrication as you can see and also probably have
[22:07] as you can see and also probably have experienced before the longest cycle
[22:08] experienced before the longest cycle time is always in the whole exercise and
[22:12] time is always in the whole exercise and the most expensive ones is the
[22:14] the most expensive ones is the fabrication so these four steps
[22:16] fabrication so these four steps constitute a full iteration cycles for
[22:19] constitute a full iteration cycles for any of the designs towards a silicon
[22:21] any of the designs towards a silicon chip so any steps
[22:23] chip so any steps within has to be done very very
[22:25] within has to be done very very carefully because any flaws in any of
[22:28] carefully because any flaws in any of those steps even minus can be fatal and
[22:32] those steps even minus can be fatal and also can be a very C catastrophic to all
[22:35] also can be a very C catastrophic to all your project managements this is why
[22:37] your project managements this is why it's very important for us to be a very
[22:40] it's very important for us to be a very patient espe especially in the first uh
[22:43] patient espe especially in the first uh stage on the uh on the GDs designs
[22:46] stage on the uh on the GDs designs because without the the right GDs
[22:49] because without the the right GDs everything's off fabrication although
[22:51] everything's off fabrication although you can refabricate it take time but if
[22:53] you can refabricate it take time but if it's a design FR everything is off so
[22:57] it's a design FR everything is off so this is why for any of the the
[22:58] this is why for any of the the production preparation design mask has
[23:00] production preparation design mask has to be tested out more than once to
[23:03] to be tested out more than once to ensure we can freeze the designs and
[23:06] ensure we can freeze the designs and process on all Corners managing and
[23:09] process on all Corners managing and Manufacturing the variabilities before
[23:11] Manufacturing the variabilities before committing a large quantity of Wafers
[23:14] committing a large quantity of Wafers become a very expensive Journey so this
[23:17] become a very expensive Journey so this table provides the information on the
[23:19] table provides the information on the the available Open Access silicon
[23:22] the available Open Access silicon phonics technology platforms globally
[23:24] phonics technology platforms globally based on the public information so again
[23:27] based on the public information so again the purpose is not to servey who is the
[23:29] the purpose is not to servey who is the best and so on so forth but I'm just to
[23:32] best and so on so forth but I'm just to describe it here uh uh what what what
[23:35] describe it here uh uh what what what what is available there because I think
[23:37] what is available there because I think all the smart users uh today they are
[23:40] all the smart users uh today they are smart enough to choose what we are what
[23:42] smart enough to choose what we are what they are looking for and detail
[23:43] they are looking for and detail information has been already documented
[23:46] information has been already documented in the manuscript already so again one
[23:49] in the manuscript already so again one of disclaimer is the table is not
[23:52] of disclaimer is the table is not exhaustive in case I miss out anyone you
[23:55] exhaustive in case I miss out anyone you think it's important here I I apologize
[23:57] think it's important here I I apologize here
[24:01] okay we we list the the npw design areas
[24:04] okay we we list the the npw design areas for different foundaries the chip size
[24:07] for different foundaries the chip size so on so forth say the the minimum unit
[24:09] so on so forth say the the minimum unit or the minimum orders the cost tends to
[24:12] or the minimum orders the cost tends to be around
[24:14] be around thousand US dollars per millimeter
[24:16] thousand US dollars per millimeter squares for most of the uh the standard
[24:19] squares for most of the uh the standard active offerings so as it showing in the
[24:22] active offerings so as it showing in the table most of Foundry adopt the uh the
[24:24] table most of Foundry adopt the uh the sing sis in the range of 170 to 500 and
[24:28] sing sis in the range of 170 to 500 and the majority of the 220 NM with the wave
[24:32] the majority of the 220 NM with the wave guiding of silicon layers not exceeding
[24:34] guiding of silicon layers not exceeding a 500 nmet in thickness so this is
[24:37] a 500 nmet in thickness so this is therefore will support the most size in
[24:40] therefore will support the most size in the sub Micron range which is ideal for
[24:43] the sub Micron range which is ideal for most of application that needs a compact
[24:45] most of application that needs a compact and highspeed devices well of course
[24:48] and highspeed devices well of course there are some
[24:49] there are some organizations that offer the c c sis
[24:53] organizations that offer the c c sis which is like stre m s SOI so on so
[24:56] which is like stre m s SOI so on so forth so of course they have their own
[24:58] forth so of course they have their own special need and special advantage to it
[25:02] special need and special advantage to it but one of the things like for instance
[25:03] but one of the things like for instance the modulation formations can be quite
[25:06] the modulation formations can be quite difficult but has been demonstrated
[25:08] difficult but has been demonstrated possible also so those those you can see
[25:11] possible also so those those you can see at the pH from so before I go on for the
[25:14] at the pH from so before I go on for the next stage I want to share you a little
[25:15] next stage I want to share you a little bit about the uh which I I'm not sure
[25:18] bit about the uh which I I'm not sure that I describe in the the manuscript is
[25:21] that I describe in the the manuscript is on the the visible platform so we and
[25:23] on the the visible platform so we and partners have been working on this for
[25:25] partners have been working on this for quite some times to develop a sizeable
[25:28] quite some times to develop a sizeable device libraries for Visible wavelength
[25:30] device libraries for Visible wavelength based on the Silicon nitrite the
[25:33] based on the Silicon nitrite the application of silicon nitr in the S SOI
[25:36] application of silicon nitr in the S SOI for O and C has been described in the
[25:39] for O and C has been described in the manuscript already but this one is on
[25:42] manuscript already but this one is on the the visible so because because more
[25:45] the the visible so because because more and more the application I think will
[25:47] and more the application I think will include for like
[25:49] include for like optogenetics for res exitation sensing
[25:52] optogenetics for res exitation sensing Spectra SP and even for Quantum
[25:55] Spectra SP and even for Quantum integrated photonics due to the source
[25:57] integrated photonics due to the source difference the old Demands a different
[26:00] difference the old Demands a different type of wavelengths and also we have
[26:03] type of wavelengths and also we have seen very near distance Communications
[26:05] seen very near distance Communications fre space sensing as lighter so all
[26:08] fre space sensing as lighter so all those will
[26:09] those will require the platforms goes beyond what
[26:12] require the platforms goes beyond what the the oband or cband so this is what
[26:15] the the oband or cband so this is what we are working on on the the visible now
[26:18] we are working on on the the visible now I think this is probably is interesting
[26:20] I think this is probably is interesting to the student Community also because
[26:22] to the student Community also because there was all Heavy Explorations in the
[26:26] there was all Heavy Explorations in the application domains what the the
[26:28] application domains what the the integrated Circ circuit can do so this
[26:30] integrated Circ circuit can do so this is certainly is not limited to Oben and
[26:33] is certainly is not limited to Oben and cben because these are two are pretty
[26:36] cben because these are two are pretty dominant in the data center per se but I
[26:39] dominant in the data center per se but I think the application more emerging
[26:41] think the application more emerging actually Beyond
[26:48] those yeah so this slides provides a
[26:50] those yeah so this slides provides a typical view of the uh typ of devices
[26:53] typical view of the uh typ of devices include a pdk library for designers to
[26:56] include a pdk library for designers to access on to putting it to together into
[26:59] access on to putting it to together into integrated circuits for their functional
[27:01] integrated circuits for their functional needs so this using uh using MF example
[27:05] needs so this using uh using MF example again for providing for 400g ready
[27:09] again for providing for 400g ready design kits of course the you know the
[27:11] design kits of course the you know the modulated and F detectors are important
[27:13] modulated and F detectors are important active devices for coding and decoding
[27:16] active devices for coding and decoding information for the optical and
[27:18] information for the optical and electrical signals converting back and
[27:20] electrical signals converting back and force and also there are very various
[27:23] force and also there are very various passive devices that perform the optical
[27:25] passive devices that perform the optical functions for filtering delay lines base
[27:28] functions for filtering delay lines base control so on so forth now also
[27:31] control so on so forth now also important is the photonic
[27:34] important is the photonic iOS uh coupling the devices were
[27:36] iOS uh coupling the devices were required to couple the light in and out
[27:39] required to couple the light in and out from the external laser and the fiber
[27:41] from the external laser and the fiber right so let's go on the next next steps
[27:44] right so let's go on the next next steps on the
[27:46] on the typical pdk I think the
[27:49] typical pdk I think the detail uh description is in the
[27:51] detail uh description is in the manuscript again on this
[27:56] manuscript again on this so let me
[28:00] yeah so let me just say a little bit
[28:02] yeah so let me just say a little bit words about how what the pdk that means
[28:05] words about how what the pdk that means so in here we report the performance for
[28:09] so in here we report the performance for both gradient Ed cplus wherever they are
[28:12] both gradient Ed cplus wherever they are available and then conventionally to
[28:14] available and then conventionally to ensure the performance of such like a
[28:16] ensure the performance of such like a pdk device libraries to be successful
[28:19] pdk device libraries to be successful implement the day in day out the end
[28:21] implement the day in day out the end users needs a very stable integrated
[28:24] users needs a very stable integrated photonic Lin as well as several rounds
[28:26] photonic Lin as well as several rounds of or trials prior to actual production
[28:29] of or trials prior to actual production to simplify the development routines for
[28:32] to simplify the development routines for all the users typical fies that includes
[28:34] all the users typical fies that includes MF provides pdk device libraries which
[28:38] MF provides pdk device libraries which been tested and developed on the design
[28:40] been tested and developed on the design of experiment approach with a process
[28:43] of experiment approach with a process Corner checked with plus minus variation
[28:45] Corner checked with plus minus variation checked and optimal designs that was
[28:48] checked and optimal designs that was presented so on so the device as I
[28:52] presented so on so the device as I mentioned it typically has a passive
[28:53] mentioned it typically has a passive device both in the silicon and nitr and
[28:56] device both in the silicon and nitr and active device is a modulation and F
[28:58] active device is a modulation and F detector then all those were as I listed
[29:02] detector then all those were as I listed in the DU colums here so typically those
[29:05] in the DU colums here so typically those are the components can be putting
[29:07] are the components can be putting together to satisfy most of the
[29:10] together to satisfy most of the application needs for various type of
[29:12] application needs for various type of functions that realized in the photonic
[29:15] functions that realized in the photonic inte
[29:16] inte circuits so this
[29:20] circuits so this slides demonstrates the efforts in the
[29:23] slides demonstrates the efforts in the development of our technology platforms
[29:25] development of our technology platforms with few versions of the pdk release the
[29:27] with few versions of the pdk release the last version the latest being the early
[29:30] last version the latest being the early 2022 have been released at already we
[29:33] 2022 have been released at already we call is the pdk
[29:36] call is the pdk 3.2 so MF pdk contains the six uh
[29:40] 3.2 so MF pdk contains the six uh libraries we can trace through the
[29:42] libraries we can trace through the technology trade structures to Define
[29:44] technology trade structures to Define what's the uh the right platform for
[29:46] what's the uh the right platform for what application but what's list here is
[29:49] what application but what's list here is the MF platform contains the six sets of
[29:51] the MF platform contains the six sets of the device libraries that can be
[29:54] the device libraries that can be implemented on the AMF five integration
[29:57] implemented on the AMF five integration platform
[29:58] platform in all those mutations so again each of
[30:01] in all those mutations so again each of the PDQ cell will exempt with Corners
[30:04] the PDQ cell will exempt with Corners manufacturing the variation polance and
[30:06] manufacturing the variation polance and updated with multiple runs upon each new
[30:10] updated with multiple runs upon each new release so on the design
[30:14] release so on the design sites upon the availability of the the
[30:16] sites upon the availability of the the pdk device in our case we have been
[30:19] pdk device in our case we have been working with multiple pdk vendors for
[30:22] working with multiple pdk vendors for providing an ecosystem for silicon
[30:25] providing an ecosystem for silicon photonic ped development as well as the
[30:28] photonic ped development as well as the the pck designs from the the physical
[30:31] the pck designs from the the physical views of the layoff to The Logical view
[30:33] views of the layoff to The Logical view of the schematics for GDs generation
[30:36] of the schematics for GDs generation typical fundry will make the pdk
[30:38] typical fundry will make the pdk availables on more than one uh Eda tools
[30:42] availables on more than one uh Eda tools for instance on the kout M Graphics Lua
[30:45] for instance on the kout M Graphics Lua synopsis so at least these are the
[30:48] synopsis so at least these are the available in our case so furthermore in
[30:50] available in our case so furthermore in particular on the K layout we have
[30:52] particular on the K layout we have developed integrative flows between the
[30:55] developed integrative flows between the K and numerical interconnect after the
[30:58] K and numerical interconnect after the GDs generation in k a net list can be
[31:02] GDs generation in k a net list can be extracted by using this integration flow
[31:04] extracted by using this integration flow and then import it into a a numerical
[31:08] and then import it into a a numerical interconnect then the optical circuits
[31:10] interconnect then the optical circuits can be automatically build by connecting
[31:12] can be automatically build by connecting the schematics in the numerical
[31:13] the schematics in the numerical interconnect and ready for circuit
[31:16] interconnect and ready for circuit simulation so this flow is also called
[31:19] simulation so this flow is also called as a layout driven schematic which is
[31:21] as a layout driven schematic which is essential for high efficiency designs of
[31:26] essential for high efficiency designs of large scale silicon
[31:29] large scale silicon ciruits so for f one of the key criteria
[31:33] ciruits so for f one of the key criteria very important is the quality control
[31:36] very important is the quality control systems so for full implementation for
[31:39] systems so for full implementation for quality control and quality assurance
[31:42] quality control and quality assurance inline inspection and data collections
[31:45] inline inspection and data collections FB mainly on the the classes SPC
[31:48] FB mainly on the the classes SPC controls like for instance the Silicon I
[31:50] controls like for instance the Silicon I TR CD controls a sickness so on and so
[31:53] TR CD controls a sickness so on and so forth and layer to layer overlay
[31:55] forth and layer to layer overlay specification control so PR prior to any
[31:58] specification control so PR prior to any of shipping there always been a wafer
[32:01] of shipping there always been a wafer level testing on electrical and Optical
[32:03] level testing on electrical and Optical performance as an example showing the
[32:06] performance as an example showing the the channel wave gu propagation loss for
[32:08] the channel wave gu propagation loss for instance and also for the Y Improvement
[32:10] instance and also for the Y Improvement along with the electrical testing and
[32:13] along with the electrical testing and Optical testing and data correlations
[32:15] Optical testing and data correlations with specific U Maps data defect
[32:19] with specific U Maps data defect inspection has been also inserted in the
[32:21] inspection has been also inserted in the process steps at the necessary stage to
[32:24] process steps at the necessary stage to make sure the process lines clean any of
[32:26] make sure the process lines clean any of the issues can be C much earlier in the
[32:29] the issues can be C much earlier in the lines so of course we need a various
[32:33] lines so of course we need a various type of tools one of the very important
[32:35] type of tools one of the very important tool other than the deta instuction is
[32:38] tool other than the deta instuction is the the testing so in our case we have
[32:41] the the testing so in our case we have the inline W level testing and towards
[32:45] the inline W level testing and towards the the final w w out then n good dies
[32:50] the the final w w out then n good dies in the chip level in The Wave levels
[32:53] in the chip level in The Wave levels then the other one is on the chip level
[32:54] then the other one is on the chip level as well as the packaging for the
[32:56] as well as the packaging for the reliabilities
[32:58] reliabilities so this is the uh the slides is very
[33:00] so this is the uh the slides is very similar to what I described previously
[33:02] similar to what I described previously again the last box is always the last
[33:05] again the last box is always the last level of quality assurance which is a
[33:07] level of quality assurance which is a very important one to touch upon the Y
[33:10] very important one to touch upon the Y understanding and the Y
[33:13] understanding and the Y Improvement so for as I mentioned the
[33:16] Improvement so for as I mentioned the last smile is always the uh the most
[33:19] last smile is always the uh the most important one you talk about 10% or 5%
[33:22] important one you talk about 10% or 5% you probably will take equal amount of
[33:24] you probably will take equal amount of time but what's competing on you 90% of
[33:27] time but what's competing on you 90% of it so for packaging purposes so this is
[33:31] it so for packaging purposes so this is what all the tool boxes and device
[33:32] what all the tool boxes and device library that we provides so on the edge
[33:36] library that we provides so on the edge coupler structures we set we also set up
[33:38] coupler structures we set we also set up the the modules for integrated vle for
[33:42] the the modules for integrated vle for Passive fiber array assemblies fibers
[33:46] Passive fiber array assemblies fibers even for a single fiber assemblies for
[33:49] even for a single fiber assemblies for similarly for laser and amplifiers so
[33:52] similarly for laser and amplifiers so routinely we provid support to customer
[33:55] routinely we provid support to customer with UVM bom and a couple p
[33:59] with UVM bom and a couple p so here's the example of what we did
[34:02] so here's the example of what we did previously to simulate what the
[34:04] previously to simulate what the electronics and photonics uh integration
[34:08] electronics and photonics uh integration this one has the Interpol design in in
[34:12] this one has the Interpol design in in uh uh and fabricated down belows and
[34:15] uh uh and fabricated down belows and with the both photonics integrated
[34:17] with the both photonics integrated circuit and several of the the
[34:18] circuit and several of the the electronic circuits all of those are
[34:21] electronic circuits all of those are being flipped onto the inos sub itself
[34:25] being flipped onto the inos sub itself so what the picture you have seen
[34:26] so what the picture you have seen actually we have done many years ago
[34:28] actually we have done many years ago back to uh
[34:30] back to uh 2016 is the the Demi Electronics chip
[34:34] 2016 is the the Demi Electronics chip flip CH chip flip over a photonics based
[34:40] flip CH chip flip over a photonics based interos so this device itself already
[34:44] interos so this device itself already shows the the 56 gaball uh modulation
[34:48] shows the the 56 gaball uh modulation rates so it's well set for the 400g
[34:52] rates so it's well set for the 400g device so f are in the conclusions so f
[34:57] device so f are in the conclusions so f should be your most trusted bonics
[35:00] should be your most trusted bonics production Partners so for examples like
[35:04] production Partners so for examples like we have been in the business for this
[35:07] we have been in the business for this being for many years being a pioneers of
[35:09] being for many years being a pioneers of silicon photonics the development this
[35:11] silicon photonics the development this we we are spin off from the EA we have
[35:14] we we are spin off from the EA we have the complete manufacturing lines and
[35:16] the complete manufacturing lines and also being processing products actually
[35:19] also being processing products actually in the field deployment for last five
[35:22] in the field deployment for last five years or so so we with all the pdks as I
[35:25] years or so so we with all the pdks as I mentioned with full silicon proven and
[35:28] mentioned with full silicon proven and also we continuously develop and improve
[35:30] also we continuously develop and improve the pdk and also the custom uh design
[35:34] the pdk and also the custom uh design supports and multiple platforms that I
[35:36] supports and multiple platforms that I mention in the
[35:38] mention in the technologes in offerings so Focus now is
[35:42] technologes in offerings so Focus now is on the the fat capacity ramping up that
[35:45] on the the fat capacity ramping up that will taking care the uh the business for
[35:48] will taking care the uh the business for the the volume manufacturing
[35:49] the the volume manufacturing particularly on the online stability and
[35:52] particularly on the online stability and quality and also cycle time the old the
[35:55] quality and also cycle time the old the students are probably very curious about
[35:57] students are probably very curious about the the cycle time for instance because
[35:59] the the cycle time for instance because all the PHD tations more or less it
[36:02] all the PHD tations more or less it depend on where the chips being
[36:03] depend on where the chips being available and tested so supports various
[36:06] available and tested so supports various application and markets and also the
[36:09] application and markets and also the more capacity and advanced capabilities
[36:12] more capacity and advanced capabilities is in the progress in our
[36:15] is in the progress in our case okay so in here I'd like to uh
[36:18] case okay so in here I'd like to uh acknowledge all our customers for their
[36:21] acknowledge all our customers for their long time support and Trust to build
[36:24] long time support and Trust to build this Industries all together and also
[36:27] this Industries all together and also thank for all the student communities
[36:29] thank for all the student communities that whoever the being the the shadow
[36:32] that whoever the being the the shadow runs in our npws that give us a lot of
[36:36] runs in our npws that give us a lot of Inspirations and encouragements to our
[36:38] Inspirations and encouragements to our teams to understand there are many many
[36:41] teams to understand there are many many Explorations on the applications that
[36:43] Explorations on the applications that people have not thought about it five or
[36:46] people have not thought about it five or 10 years ago so this is the very
[36:48] 10 years ago so this is the very encouraging yeah thank
[36:52] you thank you so much Dr L for your
[36:55] you thank you so much Dr L for your wonderful presentation on review s
[36:58] wonderful presentation on review s aonics and also the capability of AMF
[37:01] aonics and also the capability of AMF Foundry services so um due to the time
[37:06] Foundry services so um due to the time limitation is probably we just move on
[37:10] limitation is probably we just move on to the next speaker so our next speaker
[37:13] to the next speaker so our next speaker would be Dr mongu her title of
[37:17] would be Dr mongu her title of presentation is highspeed modulator with
[37:20] presentation is highspeed modulator with integrate Terminator resistor based on
[37:23] integrate Terminator resistor based on hybrid cicon and Lisa N
[37:25] hybrid cicon and Lisa N platform and brief introduction for Dr
[37:29] platform and brief introduction for Dr Shu so she received a PhD degree from s
[37:32] Shu so she received a PhD degree from s yasan University her research is mainly
[37:36] yasan University her research is mainly focused on integrate them film Nisa n
[37:39] focused on integrate them film Nisa n photonics and hetrogeneous syon tfln
[37:42] photonics and hetrogeneous syon tfln photonics uh without further Ado let's
[37:45] photonics uh without further Ado let's welcome the second speaker Dr Shu
[37:48] welcome the second speaker Dr Shu please uh hi everyone I'm Mo from
[37:52] please uh hi everyone I'm Mo from University um today I'm like to talk
[37:56] University um today I'm like to talk about the high phone hyers and Le Bay
[37:59] about the high phone hyers and Le Bay Electro optim
[38:01] Electro optim mators uh with the dment of Next
[38:04] mators uh with the dment of Next Generation uh communication technology
[38:07] Generation uh communication technology modern Optical communication networks uh
[38:10] modern Optical communication networks uh comes a bandwidth crisis caused by The
[38:13] comes a bandwidth crisis caused by The Continuous growth of global IP traffic
[38:16] Continuous growth of global IP traffic and the energy crisis uh caused by the
[38:20] and the energy crisis uh caused by the increasing uh electral consumption
[38:22] increasing uh electral consumption therefore we are challenging to exploit
[38:25] therefore we are challenging to exploit the speed and capacity of also reducing
[38:29] the speed and capacity of also reducing power
[38:32] consumption
[38:35] and oh oh sorry wait wait a minute I
[38:39] and oh oh sorry wait wait a minute I think I have some problem with my p uh
[38:45] slides uh Hi H can can you share my
[38:49] slides uh Hi H can can you share my slides uh for me I think I can't move
[38:54] slides uh for me I think I can't move the uh slide forwards
[38:58] the uh slide forwards um okay
[39:01] um okay um so let me uh can you except uh can
[39:07] um so let me uh can you except uh can you cancel um slide share I also um
[39:11] you cancel um slide share I also um recommend maybe just uh don't show it in
[39:14] recommend maybe just uh don't show it in slideshow view just show it uh from
[39:17] slideshow view just show it uh from your okay and then that's probably
[39:20] your okay and then that's probably what's happening due to band with so I
[39:22] what's happening due to band with so I would share your slides just don't click
[39:24] would share your slides just don't click slideshow view Advance them that way way
[39:28] slideshow view Advance them that way way that's just an
[39:29] that's just an option um long do you want to try yeah
[39:34] option um long do you want to try yeah uh just exit the I think it work now
[39:39] uh just exit the I think it work now okay okay s sorry no worries it happens
[39:43] okay okay s sorry no worries it happens no worries okay op moderator uh is
[39:47] no worries okay op moderator uh is responsible for encoding data from the
[39:49] responsible for encoding data from the electric domate to the optical domain
[39:52] electric domate to the optical domain with high fertility and E modulator
[39:56] with high fertility and E modulator usually are the originate of e
[39:58] usually are the originate of e performance botet at a transmitter in
[40:01] performance botet at a transmitter in Optical links in a typical commercial
[40:03] Optical links in a typical commercial coherent transer the moderator donates
[40:06] coherent transer the moderator donates over uh 70% of power consumption uh
[40:10] over uh 70% of power consumption uh introduce half of the insertion loss and
[40:13] introduce half of the insertion loss and occupies about our front of the area
[40:16] occupies about our front of the area obviously the biggest Bonet of the trans
[40:19] obviously the biggest Bonet of the trans module is the modulator so we are
[40:21] module is the modulator so we are looking uh for a integrated platform
[40:25] looking uh for a integrated platform that can provide high performance
[40:27] that can provide high performance overall Electro
[40:29] overall Electro performance uh second photonis can uh
[40:32] performance uh second photonis can uh Leverage The mature SOS processing
[40:36] Leverage The mature SOS processing techniques uh high density integration
[40:39] techniques uh high density integration and with level fabrication and may a
[40:43] and with level fabrication and may a much lower cost in the very beginning
[40:46] much lower cost in the very beginning wirus second devices are developed one
[40:48] wirus second devices are developed one by one uh after that res start to
[40:51] by one uh after that res start to integrate second devices into hybrid
[40:53] integrate second devices into hybrid modu with the maturity of second photon
[40:58] modu with the maturity of second photon uh s chips can compatible with
[41:00] uh s chips can compatible with multifunctional Photon device and
[41:03] multifunctional Photon device and electronic
[41:05] electronic circuits um but the second is uh since
[41:09] circuits um but the second is uh since symmetric Crystal and leg linear e
[41:12] symmetric Crystal and leg linear e effect so uh second moderator rely on
[41:15] effect so uh second moderator rely on the plasma dispersion effect for
[41:17] the plasma dispersion effect for modation the modation bandwidth is
[41:20] modation the modation bandwidth is limited by the time of strapping the
[41:23] limited by the time of strapping the carrier and the uh capacitance of face
[41:26] carrier and the uh capacitance of face shifter um besides the E moderation
[41:29] shifter um besides the E moderation process of C is inch nonlinear and
[41:33] process of C is inch nonlinear and absorptive uh Li is one of the most
[41:36] absorptive uh Li is one of the most popular e material due to uh is linear e
[41:40] popular e material due to uh is linear e fat with fat second time uh time scale
[41:43] fat with fat second time uh time scale response and large e coefficient also
[41:47] response and large e coefficient also the wide transparence window uh however
[41:50] the wide transparence window uh however transitional if a n moderator rely on
[41:53] transitional if a n moderator rely on the Titania FS or product exchange wave
[41:56] the Titania FS or product exchange wave guys on B Crystal uh this weekly
[41:59] guys on B Crystal uh this weekly confided with gun made the traditional
[42:02] confided with gun made the traditional leing I impossible to enhance the
[42:05] leing I impossible to enhance the performance of the moderation efficiency
[42:07] performance of the moderation efficiency uh F pain and uh e bandwidth in the
[42:10] uh F pain and uh e bandwidth in the future um in recent years um the Le n uh
[42:17] future um in recent years um the Le n uh F Le platform has uh come to uh
[42:23] F Le platform has uh come to uh the uh uh
[42:27] the uh uh hard research and we can find the uh you
[42:32] hard research and we can find the uh you can broke the botton net and diage the
[42:34] can broke the botton net and diage the potential for L skill high density and
[42:38] potential for L skill high density and high density integration and you also
[42:41] high density integration and you also the B for the moderation efficiency and
[42:43] the B for the moderation efficiency and device L also the E
[42:45] device L also the E bandwidth uh therefore we we want to
[42:48] bandwidth uh therefore we we want to combine s with
[42:50] combine s with f uh explain the progress effects the
[42:54] f uh explain the progress effects the hybrid s and material system enjoys the
[42:58] hybrid s and material system enjoys the scity of second photonics with the uh
[43:02] scity of second photonics with the uh excellent modulation performance of
[43:05] excellent modulation performance of leit a few demonstration of hybrid and
[43:09] leit a few demonstration of hybrid and Li Hy Optical moderator has been
[43:11] Li Hy Optical moderator has been reported um all of which rely on the ri
[43:15] reported um all of which rely on the ri loaded with guy or S SOI bonded with guy
[43:18] loaded with guy or S SOI bonded with guy with
[43:19] with unpatterned membrin so the light is Rec
[43:23] unpatterned membrin so the light is Rec confided in this hyper W guide and there
[43:27] confided in this hyper W guide and there is uh limiting overlap between Optical
[43:30] is uh limiting overlap between Optical mode and active moderation
[43:32] mode and active moderation material so we demonstrate a h modity in
[43:37] material so we demonstrate a h modity in 2019 the high speed moderation uh
[43:40] 2019 the high speed moderation uh happens at the top Le membrane uh the
[43:43] happens at the top Le membrane uh the stre def wave guide are J and highly
[43:47] stre def wave guide are J and highly confided uh which is the key to reling
[43:50] confided uh which is the key to reling high modation efficiency uh the bottom
[43:53] high modation efficiency uh the bottom second layer includes all passive
[43:55] second layer includes all passive components such as MI
[43:57] components such as MI and greting
[43:58] and greting culus the vertical diabetic culus um
[44:02] culus the vertical diabetic culus um were formed by C inverse tapers and
[44:06] were formed by C inverse tapers and Super impos Wave guyses which serve as
[44:09] Super impos Wave guyses which serve as an interface to uh couple line up and
[44:12] an interface to uh couple line up and down between the two layer uh we can see
[44:16] down between the two layer uh we can see in the profile C the moderation region
[44:19] in the profile C the moderation region it is a uh Li wave gu showing High
[44:23] it is a uh Li wave gu showing High overlap between the optical moves and uh
[44:26] overlap between the optical moves and uh the acal material
[44:27] the acal material uh the leit the optical power transfer
[44:31] uh the leit the optical power transfer from the uh second r with Guide to the
[44:35] from the uh second r with Guide to the uh LIF W guide forc and the CATE C
[44:40] uh LIF W guide forc and the CATE C efficiency is larger than 19 uh
[44:43] efficiency is larger than 19 uh 99% uh we can see the uh width of the wi
[44:47] 99% uh we can see the uh width of the wi TI can be further increased to be more
[44:50] TI can be further increased to be more than 200er and also there is a large
[44:53] than 200er and also there is a large alignment Arrow which means uh uh our
[44:57] alignment Arrow which means uh uh our technique is compatible with standard
[44:59] technique is compatible with standard theography
[45:01] theography choose uh a standard o processing
[45:04] choose uh a standard o processing include uh the eing uh liography and
[45:07] include uh the eing uh liography and joing process was used to fabricate the
[45:10] joing process was used to fabricate the Silicon photonics uh and uh F Li samples
[45:14] Silicon photonics uh and uh F Li samples with cic substrates was free bonded to
[45:18] with cic substrates was free bonded to the SOI rivers with using the BB
[45:21] the SOI rivers with using the BB adhesive B process uh then the substrate
[45:24] adhesive B process uh then the substrate of the F Le Li once removed by
[45:28] of the F Le Li once removed by mechanical grading and ging uh then the
[45:32] mechanical grading and ging uh then the with patterns were trans transferred to
[45:35] with patterns were trans transferred to uh
[45:36] uh fit with uh optimized Aran plasma Hing
[45:41] fit with uh optimized Aran plasma Hing uh finally the ching with electrod or
[45:45] uh finally the ching with electrod or pattern through a Lial
[45:48] pattern through a Lial process Optical loss is inessential for
[45:51] process Optical loss is inessential for the moderator to meet the tie budget uh
[45:55] the moderator to meet the tie budget uh here we measure the pro loss of the fif
[45:59] here we measure the pro loss of the fif W guide and the car efficiency of VC
[46:03] W guide and the car efficiency of VC using the carbon matter uh we can see uh
[46:06] using the carbon matter uh we can see uh the loss of our V is estimated to be 0
[46:11] the loss of our V is estimated to be 0 point um and 4 DB and uh linear fitting
[46:17] point um and 4 DB and uh linear fitting showing shows a propagation loss of 0 98
[46:22] showing shows a propagation loss of 0 98 per CM uh and now we have uh reduced
[46:26] per CM uh and now we have uh reduced this Rue to about 0.1 DB per
[46:29] this Rue to about 0.1 DB per cimer um with Master hybd second Andor
[46:34] cimer um with Master hybd second Andor with on shap a 50 ohm Terminator the
[46:37] with on shap a 50 ohm Terminator the onchip Terminator made um make makes the
[46:41] onchip Terminator made um make makes the Terminator measuring with comp Panic
[46:43] Terminator measuring with comp Panic easier uh especially for multi Channel
[46:46] easier uh especially for multi Channel moderator it can also reduce complexity
[46:50] moderator it can also reduce complexity of packing and testing and uh we also
[46:54] of packing and testing and uh we also use the uh formal optic b control
[46:57] use the uh formal optic b control uh is pattern in the same fat process uh
[47:01] uh is pattern in the same fat process uh as on as the on chip Terminator um
[47:05] as on as the on chip Terminator um besides def is well know for is uh DS in
[47:08] besides def is well know for is uh DS in the DC by electr film uh so here we use
[47:12] the DC by electr film uh so here we use the formal Optics effect for stable b
[47:16] the formal Optics effect for stable b control uh the nickel communion metal is
[47:20] control uh the nickel communion metal is on one side of the second wave guide to
[47:23] on one side of the second wave guide to induce face difference between the two
[47:26] induce face difference between the two um
[47:27] um the uh t f shifter is designed for high
[47:30] the uh t f shifter is designed for high efficiency and high fusing current in
[47:33] efficiency and high fusing current in this work we can tuning uh we can tune
[47:37] this work we can tuning uh we can tune the modulator between the on and off
[47:40] the modulator between the on and off stay with a power distribution of 24
[47:45] stay with a power distribution of 24 Ms and for a high band with def
[47:49] Ms and for a high band with def modulator we should uze the low AR
[47:52] modulator we should uze the low AR attenuation good velocity matching and
[47:55] attenuation good velocity matching and good impedance matching at the same time
[47:58] good impedance matching at the same time the simulative result for this work are
[48:00] the simulative result for this work are show here uh we can see we have M these
[48:03] show here uh we can see we have M these three
[48:05] three matters um we fabricate a 12 mm long
[48:11] matters um we fabricate a 12 mm long moderator featuring a we Pi of 2.2 Watt
[48:15] moderator featuring a we Pi of 2.2 Watt and the uh and theor which 3 DB
[48:19] and the uh and theor which 3 DB bandwidth of 60 uh GHz and a low
[48:23] bandwidth of 60 uh GHz and a low reflection uh when using the on on 50
[48:28] reflection uh when using the on on 50 Terminator we have confined that using
[48:30] Terminator we have confined that using our onip Terminator can uptain a descent
[48:34] our onip Terminator can uptain a descent high frequency response as commercial of
[48:36] high frequency response as commercial of STP load uh through
[48:39] STP load uh through props this modulator can support the 100
[48:43] props this modulator can support the 100 GB okay and uh 60 G P4 the data rate is
[48:49] GB okay and uh 60 G P4 the data rate is up to uh 20 G per second however we use
[48:54] up to uh 20 G per second however we use an electrical empy here because the Wei
[48:57] an electrical empy here because the Wei is still not low enough for driverless
[48:59] is still not low enough for driverless performance
[49:01] performance and we can achieve simal compartible J
[49:05] and we can achieve simal compartible J voltage by increasing the device length
[49:07] voltage by increasing the device length to about uh 2 cm but such a standard
[49:11] to about uh 2 cm but such a standard modulator is not suitable for uh package
[49:14] modulator is not suitable for uh package modules therefore we propose uh through
[49:18] modules therefore we propose uh through the MGM to balance the tradeoff among uh
[49:21] the MGM to balance the tradeoff among uh device length y band width and driving
[49:25] device length y band width and driving voltage uh here the the uh Optical arms
[49:28] voltage uh here the the uh Optical arms of MGM and Ching wave electric under
[49:31] of MGM and Ching wave electric under goes uh to uh 180 degree uton uh thereby
[49:36] goes uh to uh 180 degree uton uh thereby reducing the length of the uh pH
[49:39] reducing the length of the uh pH moderation region by nearly uh
[49:42] moderation region by nearly uh 60% and to avoid the face shifter in the
[49:47] 60% and to avoid the face shifter in the uh Le arms being consoled out after the
[49:50] uh Le arms being consoled out after the UTS the second wave guide before and
[49:54] UTS the second wave guide before and after UT uh the second wave need to
[49:57] after UT uh the second wave need to cross Coss here to ensure that uh face
[50:01] cross Coss here to ensure that uh face differ continue to
[50:03] differ continue to accumulate by matching the time delay of
[50:07] accumulate by matching the time delay of the optical and microwave UT are perfect
[50:10] the optical and microwave UT are perfect relastic match uh between the optical
[50:12] relastic match uh between the optical wave and the moderation microwave can be
[50:16] wave and the moderation microwave can be achieved over the entire moderation
[50:18] achieved over the entire moderation region uh leading to a large modulation
[50:21] region uh leading to a large modulation bandwidth uh we can obser the uh the eel
[50:25] bandwidth uh we can obser the uh the eel response of the fro and is only slightly
[50:28] response of the fro and is only slightly worse than that of the non Fred one uh
[50:33] worse than that of the non Fred one uh once the time delay
[50:35] once the time delay match and to further reduce the Wei we
[50:39] match and to further reduce the Wei we fabricate the flo froed wise with a
[50:42] fabricate the flo froed wise with a total moderation length of uh 21 mm with
[50:46] total moderation length of uh 21 mm with uh whose actual device length is uh 8.7
[50:50] uh whose actual device length is uh 8.7 mm and measure reply is uh 1 24 W and
[50:56] mm and measure reply is uh 1 24 W and and the 3db bandwidth is 40
[50:59] and the 3db bandwidth is 40 gz uh we relized the
[51:03] gz uh we relized the 56 uh G uh pum for moderation and uh
[51:07] 56 uh G uh pum for moderation and uh dver okay moderation uh we uh to uh we
[51:15] dver okay moderation uh we uh to uh we uh moderated the device without the
[51:17] uh moderated the device without the electrical amplifier and the driving
[51:19] electrical amplifier and the driving pick to pick wattage is as low as uh 350
[51:24] pick to pick wattage is as low as uh 350 M the was also features a low on chip
[51:28] M the was also features a low on chip loss of only uh 2.90 bits uh in summary
[51:33] loss of only uh 2.90 bits uh in summary with the a hybrid and
[51:37] with the a hybrid and F with good overall performance we also
[51:41] F with good overall performance we also investigate the froy moderator with a
[51:44] investigate the froy moderator with a short length but maintain good BWI
[51:47] short length but maintain good BWI wattage performance the froy structure
[51:50] wattage performance the froy structure provides great uh design flexibility
[51:53] provides great uh design flexibility especially for building uh uh compress C
[51:58] especially for building uh uh compress C and cic and Def phon integrated circuits
[52:02] and cic and Def phon integrated circuits because most of the cic device are
[52:04] because most of the cic device are really compa in
[52:06] really compa in phine uh uh that's all my presentation
[52:09] phine uh uh that's all my presentation thank thank you for your
[52:18] attention right thank you so much for
[52:20] attention right thank you so much for your presentation Dr
[52:23] your presentation Dr Shu do we have
[52:26] Shu do we have quick questions from the
[52:34] audience let's wait for say 10 or 15
[52:39] audience let's wait for say 10 or 15 seconds if no then we'll proceed to to
[52:42] seconds if no then we'll proceed to to the third speaker
[52:44] the third speaker okay
[52:55] okay K be may I have a
[52:57] okay K be may I have a question yes please um thank you very
[53:00] question yes please um thank you very much for your nice talk I'm wondering
[53:02] much for your nice talk I'm wondering the maximum band with that you can
[53:04] the maximum band with that you can achieve with this MCM
[53:07] achieve with this MCM modulator what's the limit of the
[53:09] modulator what's the limit of the maximum band withd you show The 100
[53:12] maximum band withd you show The 100 gab uh for the uh okay modulation but uh
[53:17] gab uh for the uh okay modulation but uh what's the
[53:23] maximum Dr Shu the the one of the
[53:27] maximum Dr Shu the the one of the audience ask you about the maximum
[53:30] audience ask you about the maximum bandwidth of your
[53:33] bandwidth of your modulator uh the
[53:35] modulator uh the bandwidth
[53:37] bandwidth uh okay uh for the uh simal uh
[53:42] uh okay uh for the uh simal uh compatitive driv voltage if you want to
[53:44] compatitive driv voltage if you want to achieve uh one words uh half Wei the
[53:49] achieve uh one words uh half Wei the bandwidth may be um can achieve over uh
[53:53] bandwidth may be um can achieve over uh 50 GHz and we have a new design now now
[53:57] 50 GHz and we have a new design now now and but it's not a hybrid uh Second and
[54:00] and but it's not a hybrid uh Second and Le ey Bas uh platform we demonstrate uh
[54:04] Le ey Bas uh platform we demonstrate uh over 100 gz uh 3db bandwidth in a uh
[54:09] over 100 gz uh 3db bandwidth in a uh monic
[54:10] monic liate uh
[54:12] liate uh perform and uh one word voltage uh sh
[54:16] perform and uh one word voltage uh sh wattage thank you so uh a followup
[54:19] wattage thank you so uh a followup question on that so what's the
[54:21] question on that so what's the limitation for that bandwidth like can
[54:23] limitation for that bandwidth like can it go beyond 100 GHz like is it limited
[54:26] it go beyond 100 GHz like is it limited by the the RF circuits or
[54:30] by the the RF circuits or what okay I think I can sh share one
[54:34] what okay I think I can sh share one more uh slides to show
[54:47] that
[54:49] that uh if we can have uh to remove the uh
[54:54] uh if we can have uh to remove the uh substrate below the
[54:57] substrate below the um the uh ching with electrc then we can
[55:01] um the uh ching with electrc then we can reduce the uh dialectric loss and we we
[55:05] reduce the uh dialectric loss and we we can replace the regular shing with
[55:08] can replace the regular shing with electrc uh to the uh capacitance loaded
[55:12] electrc uh to the uh capacitance loaded shing with electrc then we can have uh
[55:14] shing with electrc then we can have uh lower uh conductor loss in this way we
[55:18] lower uh conductor loss in this way we can Sally improve the uh bandwidth uh
[55:21] can Sally improve the uh bandwidth uh wattage performance uh we have
[55:24] wattage performance uh we have demonstrate uh this work in uh ofc we
[55:27] demonstrate uh this work in uh ofc we can see this world we have a a one W WEP
[55:31] can see this world we have a a one W WEP and we can see at the 50 gz uh the low
[55:36] and we can see at the 50 gz uh the low of is only uh 2 debits and the is is 3D
[55:40] of is only uh 2 debits and the is is 3D uh here we can see it's only the 1.5 DB
[55:44] uh here we can see it's only the 1.5 DB and the 3db E BWI is larger than 100
[55:48] and the 3db E BWI is larger than 100 gz yep so basically it's the RC time
[55:52] gz yep so basically it's the RC time constant of the RF
[55:54] constant of the RF circuits uh yes maybe uh we need to uh
[55:58] circuits uh yes maybe uh we need to uh do more uh uh techniques to remove the
[56:04] do more uh uh techniques to remove the uh SEC
[56:05] uh SEC substrate yep thank you that's
[56:12] clear okay so if we do not have more
[56:16] clear okay so if we do not have more questions for the speaker then I had a
[56:19] questions for the speaker then I had a question second don't if there is time
[56:20] question second don't if there is time so uh the loss from Silicon to nitrite
[56:24] so uh the loss from Silicon to nitrite transition
[56:26] transition uh I think you showed very low loss is
[56:28] uh I think you showed very low loss is that measured because my understanding
[56:31] that measured because my understanding is that um you're tapering the Silicon
[56:34] is that um you're tapering the Silicon but the lithium n it's not tapered so
[56:37] but the lithium n it's not tapered so there will be some loss have you
[56:40] there will be some loss have you measured the loss from the transition in
[56:44] measured the loss from the transition in between nitr yes lii uh yes thank you
[56:47] between nitr yes lii uh yes thank you for your question uh we measured the uh
[56:50] for your question uh we measured the uh what call at diabetic cul uh is uh 0 uh
[56:55] what call at diabetic cul uh is uh 0 uh 14 bits for per
[56:59] 14 bits for per VC uh the second it has the inverse uh
[57:03] VC uh the second it has the inverse uh papers and the if wave guide is a a
[57:07] papers and the if wave guide is a a single mode wave guide so the efficiency
[57:11] single mode wave guide so the efficiency is very high
[57:16] here okay thank
[57:21] you okay so I guess due to time
[57:24] you okay so I guess due to time limitation we had to proceed to to the
[57:26] limitation we had to proceed to to the third presentation um we may come back
[57:29] third presentation um we may come back to further details during the Q&A
[57:32] to further details during the Q&A session afterwards all right so the our
[57:36] session afterwards all right so the our third speaker will be Mr Tao Fuki the
[57:41] third speaker will be Mr Tao Fuki the title of his presentation is single
[57:42] title of his presentation is single Pixel Imaging using multi mode fiber and
[57:45] Pixel Imaging using multi mode fiber and second photonic phe array uh Mr B re
[57:51] second photonic phe array uh Mr B re received the be degree in electrical
[57:53] received the be degree in electrical electronic engineering and Ms degrees in
[57:56] electronic engineering and Ms degrees in electrical engineering and information
[57:58] electrical engineering and information systems from the University of
[58:00] systems from the University of Tokyo in 2018 and 2020 respectively he's
[58:05] Tokyo in 2018 and 2020 respectively he's currently working towards his PhD degree
[58:09] currently working towards his PhD degree in the same department at the University
[58:10] in the same department at the University of Tokyo he has been working on cic
[58:13] of Tokyo he has been working on cic fonic optical pH arrays for optical
[58:16] fonic optical pH arrays for optical sensing his current research interest
[58:19] sensing his current research interest include op electronic devices and Photon
[58:21] include op electronic devices and Photon inish circuits for optical sensing and
[58:24] inish circuits for optical sensing and Optical communication as well as Photon
[58:25] Optical communication as well as Photon device is based on met Services since
[58:28] device is based on met Services since 2021 he's a research fellow of the Japan
[58:32] 2021 he's a research fellow of the Japan Society of the promotion of science he's
[58:35] Society of the promotion of science he's a student member of i e Optica and Japan
[58:39] a student member of i e Optica and Japan Society of Applied Physics he received
[58:41] Society of Applied Physics he received the a mention award in the calling
[58:44] the a mention award in the calling outstanding student paper competition at
[58:47] outstanding student paper competition at optical fiber and communication
[58:48] optical fiber and communication conference 2020 uh without further Ado
[58:51] conference 2020 uh without further Ado let's welcome the speaker so Mr Fuki
[58:54] let's welcome the speaker so Mr Fuki please go ahead yeah thank you very much
[58:57] please go ahead yeah thank you very much for a very kind introduction do you hear
[59:00] for a very kind introduction do you hear me yes yes please go ahead okay yeah
[59:03] me yes yes please go ahead okay yeah great okay thank you um yeah so I am
[59:06] great okay thank you um yeah so I am tair Hui from the University of Soo and
[59:09] tair Hui from the University of Soo and I'm uh yeah first I'd like to thank the
[59:12] I'm uh yeah first I'd like to thank the organizers of this great event uh for
[59:15] organizers of this great event uh for giving me this great opportunity to
[59:18] giving me this great opportunity to share about our work on which is
[59:20] share about our work on which is published in the JT and uh yeah um uh
[59:25] published in the JT and uh yeah um uh yeah and I also like to thank my
[59:27] yeah and I also like to thank my colleagues for uh this work so um uh let
[59:32] colleagues for uh this work so um uh let me first briefly introduce about our lab
[59:35] me first briefly introduce about our lab um I'm in this uh I uh PhD student in
[59:38] um I'm in this uh I uh PhD student in this nakano and T lab and uh basically
[59:41] this nakano and T lab and uh basically it's head by uh these two professors
[59:44] it's head by uh these two professors professor nakano and professor tanura
[59:46] professor nakano and professor tanura and we have we're basically working on
[59:48] and we have we're basically working on these you know integrated photonic
[59:49] these you know integrated photonic device and uh for uh Optical
[59:53] device and uh for uh Optical communication Optical sensing and
[59:54] communication Optical sensing and Optical information processing
[59:56] Optical information processing and uh yeah so we have these uh we we
[59:59] and uh yeah so we have these uh we we are like basically working on these
[01:00:01] are like basically working on these Optical characterization and device
[01:00:03] Optical characterization and device fabrication sometimes but uh yeah
[01:00:05] fabrication sometimes but uh yeah recently you know due to the uh uh the
[01:00:09] recently you know due to the uh uh the sil photonic uh foundaries available
[01:00:12] sil photonic uh foundaries available more kind of a complex system like
[01:00:14] more kind of a complex system like experiment is possible now and we
[01:00:16] experiment is possible now and we working on so this is like some example
[01:00:18] working on so this is like some example of our
[01:00:19] of our works um so today I'm going to talk
[01:00:22] works um so today I'm going to talk about our paper JT paper on this um
[01:00:24] about our paper JT paper on this um single Pixel Imaging using multi mode
[01:00:26] single Pixel Imaging using multi mode fiber and silic photonic face array um
[01:00:29] fiber and silic photonic face array um yeah if you have any interest um you can
[01:00:32] yeah if you have any interest um you can uh refer to our paper which I think the
[01:00:35] uh refer to our paper which I think the uh organizers have sent you in the
[01:00:37] uh organizers have sent you in the invitation mail and uh so let me briefly
[01:00:40] invitation mail and uh so let me briefly introduce about the background um so you
[01:00:43] introduce about the background um so you know Imaging through multi mode fibers
[01:00:45] know Imaging through multi mode fibers is like kind of seen as the enabling
[01:00:46] is like kind of seen as the enabling technology in the field of the inal
[01:00:49] technology in the field of the inal Imaging like so um basically this is
[01:00:53] Imaging like so um basically this is this compare this diagram Compares um
[01:00:55] this compare this diagram Compares um the multim mode fibers with conventional
[01:00:58] the multim mode fibers with conventional um endoscopes so compared to the
[01:01:00] um endoscopes so compared to the conventional micro objective based or
[01:01:03] conventional micro objective based or Rod lens based um Optical microscopes
[01:01:06] Rod lens based um Optical microscopes the multim mode fibers are very um thin
[01:01:09] the multim mode fibers are very um thin and they can like they like kind of have
[01:01:12] and they can like they like kind of have a very minimal invasiveness while like
[01:01:14] a very minimal invasiveness while like maintaining sufficient number of uh
[01:01:16] maintaining sufficient number of uh spatial resolution so uh they are very
[01:01:19] spatial resolution so uh they are very useful for observing like deep uh neural
[01:01:23] useful for observing like deep uh neural like activ activities and the deep brain
[01:01:26] like activ activities and the deep brain or something like that and this is like
[01:01:27] or something like that and this is like a very nice example of like a inval
[01:01:31] a very nice example of like a inval Imaging using multimode fibers so um
[01:01:34] Imaging using multimode fibers so um yeah so due to their very minimal
[01:01:37] yeah so due to their very minimal invasiveness and the uh high spatial
[01:01:40] invasiveness and the uh high spatial resolution um multi fibers are very um
[01:01:45] resolution um multi fibers are very um you know a great candidate for
[01:01:46] you know a great candidate for endoscopic Imaging and so um this
[01:01:50] endoscopic Imaging and so um this briefly reviews the um you know how we
[01:01:53] briefly reviews the um you know how we acquire images through multie fibers so
[01:01:56] acquire images through multie fibers so basically um many of the methods that uh
[01:02:00] basically um many of the methods that uh is used to acquire images through multi
[01:02:02] is used to acquire images through multi mode fare is classified as single Pixel
[01:02:04] mode fare is classified as single Pixel Imaging um basically what we do is we
[01:02:07] Imaging um basically what we do is we get a light source and uh you know we
[01:02:10] get a light source and uh you know we modulate the wavefront of the input
[01:02:12] modulate the wavefront of the input lights and couple that to the multi mode
[01:02:14] lights and couple that to the multi mode fiber and at the distal end of the fiber
[01:02:17] fiber and at the distal end of the fiber you illuminate the Target by like set of
[01:02:19] you illuminate the Target by like set of Illumination patterns basically um the
[01:02:22] Illumination patterns basically um the most intuitive pattern is the raster
[01:02:24] most intuitive pattern is the raster scanning but you can also use the
[01:02:25] scanning but you can also use the speckle patterns uh to uh but anyway you
[01:02:30] speckle patterns uh to uh but anyway you kind of switch the uh input wavefront
[01:02:32] kind of switch the uh input wavefront and get like a variety of um output
[01:02:36] and get like a variety of um output wfront and illuminate that to the Target
[01:02:38] wfront and illuminate that to the Target and uh you get like a return signal from
[01:02:41] and uh you get like a return signal from the target like for example fluoresence
[01:02:43] the target like for example fluoresence or reflection and then you collect that
[01:02:45] or reflection and then you collect that through the same multi mode fiber and
[01:02:47] through the same multi mode fiber and detect that by a photo detector to uh
[01:02:50] detect that by a photo detector to uh get the power corresponding to the
[01:02:52] get the power corresponding to the illumination patterns and you can
[01:02:53] illumination patterns and you can reconstruct the image by um Signal doing
[01:02:57] reconstruct the image by um Signal doing signal processing combining the detected
[01:02:59] signal processing combining the detected power and the
[01:03:01] power and the illuminations and uh so anyway um you
[01:03:04] illuminations and uh so anyway um you need to um kind of have some kind of a
[01:03:06] need to um kind of have some kind of a modul wavefront modulator to um uh get
[01:03:11] modul wavefront modulator to um uh get like these variety of output wavefront
[01:03:13] like these variety of output wavefront but uh uh in current systems um uh they
[01:03:16] but uh uh in current systems um uh they use this um so-called spatial light
[01:03:18] use this um so-called spatial light modulators to uh you know uh modulate
[01:03:23] modulators to uh you know uh modulate the wavefront and basically uh
[01:03:26] the wavefront and basically uh well-known devices include like dmds uh
[01:03:29] well-known devices include like dmds uh additional micr devices based on Ms or
[01:03:33] additional micr devices based on Ms or uh Liquid Crystal based devices um and
[01:03:35] uh Liquid Crystal based devices um and basically their operation speed is
[01:03:37] basically their operation speed is limited to 1 to 10 of kilohertz and
[01:03:41] limited to 1 to 10 of kilohertz and currently that is limiting the uh frame
[01:03:44] currently that is limiting the uh frame rate of the Imaging system because
[01:03:47] rate of the Imaging system because basically um you need to modulate the
[01:03:50] basically um you need to modulate the wavefront many times to acquire a single
[01:03:52] wavefront many times to acquire a single image because a single wavr pattern
[01:03:55] image because a single wavr pattern corresponds to uh one pixel of the image
[01:03:58] corresponds to uh one pixel of the image so uh we uh so in order to improve uh
[01:04:03] so uh we uh so in order to improve uh the modulation bandwidth um we uh the
[01:04:07] the modulation bandwidth um we uh the frame rate we need to get a device with
[01:04:09] frame rate we need to get a device with a higher modulation bandwidth and so our
[01:04:12] a higher modulation bandwidth and so our approach is to use the optical phe
[01:04:15] approach is to use the optical phe arrays to generate the WF frame patterns
[01:04:18] arrays to generate the WF frame patterns and you know basically um this Optical
[01:04:21] and you know basically um this Optical face area is very uh study uh widely
[01:04:24] face area is very uh study uh widely studied in the field of integrated
[01:04:26] studied in the field of integrated photonics and you know they are very
[01:04:29] photonics and you know they are very high speeed but potentially high speed
[01:04:31] high speeed but potentially high speed because they can operate Beyond gahs by
[01:04:34] because they can operate Beyond gahs by employing the electrooptic phe shifters
[01:04:35] employing the electrooptic phe shifters available and uh also they're Ultra
[01:04:39] available and uh also they're Ultra compact um like you know it can be uh
[01:04:43] compact um like you know it can be uh smaller than a centimet squar to uh with
[01:04:46] smaller than a centimet squar to uh with integration potential integration with
[01:04:48] integration potential integration with light sources and detectors and uh
[01:04:50] light sources and detectors and uh although these kind of devices are very
[01:04:53] although these kind of devices are very actively studied and uh the beam
[01:04:55] actively studied and uh the beam steering field um uh you know we want
[01:05:00] steering field um uh you know we want here we show that this kind of device
[01:05:02] here we show that this kind of device can Al uh also be used for um like
[01:05:05] can Al uh also be used for um like Imaging through multim mode fibers and
[01:05:07] Imaging through multim mode fibers and uh in this work we experimentally
[01:05:09] uh in this work we experimentally demonstrated such feasibility so this is
[01:05:12] demonstrated such feasibility so this is the schematic of the proposed Imaging
[01:05:14] the schematic of the proposed Imaging scheme um basically you have Optical
[01:05:16] scheme um basically you have Optical face area you couple input light to the
[01:05:18] face area you couple input light to the Chip And we distribute the light to n
[01:05:20] Chip And we distribute the light to n wave Glides through one byn splitter and
[01:05:24] wave Glides through one byn splitter and then we phase modulate the
[01:05:26] then we phase modulate the uh light in each wave guide to face
[01:05:29] uh light in each wave guide to face shifters and
[01:05:32] shifters and uh and it couples to 3D wave guide and
[01:05:35] uh and it couples to 3D wave guide and this 3D wave guide is like a kind of a
[01:05:38] this 3D wave guide is like a kind of a uh you know um it's like a 3D wave guide
[01:05:42] uh you know um it's like a 3D wave guide fabricated by which is inscribed inside
[01:05:44] fabricated by which is inscribed inside glass Ship by Optical pulse strain this
[01:05:47] glass Ship by Optical pulse strain this kind of a chip is available from this uh
[01:05:49] kind of a chip is available from this uh company called alut scribe and uh and
[01:05:53] company called alut scribe and uh and then this 1D array is rearranged the two
[01:05:55] then this 1D array is rearranged the two array to efficiently cou the multim mode
[01:05:58] array to efficiently cou the multim mode fiber and uh through the multi mode
[01:06:01] fiber and uh through the multi mode fiber uh we this um uh wavefront is uh
[01:06:06] fiber uh we this um uh wavefront is uh kind of uh distorted and we get these
[01:06:08] kind of uh distorted and we get these kind of random Speckles at the output
[01:06:11] kind of random Speckles at the output and we uh I should note that these
[01:06:12] and we uh I should note that these random speckles are sufficient for
[01:06:15] random speckles are sufficient for acquiring image anyway and um yeah we
[01:06:18] acquiring image anyway and um yeah we can switch these illumination patterns
[01:06:21] can switch these illumination patterns by mod uh changing the driving signals
[01:06:24] by mod uh changing the driving signals of the phase shifters and we illuminate
[01:06:26] of the phase shifters and we illuminate this uh pattern to the Target and then
[01:06:29] this uh pattern to the Target and then we collect the transmitted light through
[01:06:31] we collect the transmitted light through the uh Target and
[01:06:35] the uh Target and uh and detect the power that transmits
[01:06:38] uh and detect the power that transmits through the uh Target and uh yeah here
[01:06:42] through the uh Target and uh yeah here we show the use of uh the transmitted
[01:06:45] we show the use of uh the transmitted light for the EAS of experiment but uh
[01:06:49] light for the EAS of experiment but uh uh we can do the same Imaging uh we can
[01:06:52] uh we can do the same Imaging uh we can perform Imaging using the reflected
[01:06:54] perform Imaging using the reflected light uh a similar Manner and so we once
[01:06:58] light uh a similar Manner and so we once we detect the uh transmitted Optical
[01:07:01] we detect the uh transmitted Optical Powers uh we can reconstruct the image
[01:07:04] Powers uh we can reconstruct the image uh by computation and um yeah by AC by
[01:07:09] uh by computation and um yeah by AC by you know uh pre-acquired these um
[01:07:12] you know uh pre-acquired these um illumination patterns so we basically uh
[01:07:16] illumination patterns so we basically uh in a calibration set we acquire these
[01:07:18] in a calibration set we acquire these illumination patterns and uh we kind of
[01:07:22] illumination patterns and uh we kind of use the suo inverse Matrix to uh uh get
[01:07:26] use the suo inverse Matrix to uh uh get the uh original image so let me uh uh
[01:07:31] the uh original image so let me uh uh briefly explain the image reconstruction
[01:07:33] briefly explain the image reconstruction process um the transmitted Optical power
[01:07:36] process um the transmitted Optical power is given by the inner product of the
[01:07:39] is given by the inner product of the illumination intensity distribution and
[01:07:41] illumination intensity distribution and the transmittance distribution of the
[01:07:42] the transmittance distribution of the target so here you can see that
[01:07:44] target so here you can see that basically the total power of the light
[01:07:47] basically the total power of the light that transmits through the target is
[01:07:48] that transmits through the target is like an integration of the illumination
[01:07:50] like an integration of the illumination intensity and the target transmittance
[01:07:52] intensity and the target transmittance distribution and when you discretize it
[01:07:54] distribution and when you discretize it you get B means that um you get like
[01:07:57] you get B means that um you get like inner product of it the transmitted
[01:07:59] inner product of it the transmitted Optical power is the inner product of
[01:08:00] Optical power is the inner product of the illumination intensity and the uh
[01:08:03] the illumination intensity and the uh Target transmittance pattern so uh once
[01:08:06] Target transmittance pattern so uh once you get like a bunch of um uh
[01:08:10] you get like a bunch of um uh illumination patterns and the
[01:08:11] illumination patterns and the corresponding uh signal Powers U you get
[01:08:14] corresponding uh signal Powers U you get a like if you get K patterns then you
[01:08:17] a like if you get K patterns then you get a k simultaneous equations and you
[01:08:19] get a k simultaneous equations and you can solve this equation by using a
[01:08:21] can solve this equation by using a pseudo inverse Matrix and uh yeah so
[01:08:25] pseudo inverse Matrix and uh yeah so basically you get these illumination
[01:08:27] basically you get these illumination patterns which you know beforehand of
[01:08:29] patterns which you know beforehand of the Imaging step and you illuminate the
[01:08:32] the Imaging step and you illuminate the Target and you get the signals and you
[01:08:34] Target and you get the signals and you do you solve some kind of an invers
[01:08:36] do you solve some kind of an invers inversion problem to get the image so um
[01:08:39] inversion problem to get the image so um this is the Silicon Optical face area
[01:08:41] this is the Silicon Optical face area chip that we have fabricated um I mean
[01:08:44] chip that we have fabricated um I mean of course the chip is fabricated by a
[01:08:45] of course the chip is fabricated by a Foundry um basically it has the input
[01:08:48] Foundry um basically it has the input light and uh uh it distributes light to
[01:08:52] light and uh uh it distributes light to uh 128 weave guides and uh
[01:08:56] uh 128 weave guides and uh yeah and this is uh so each wave guide
[01:08:59] yeah and this is uh so each wave guide has a 250 Micron long uh uh firm optic
[01:09:04] has a 250 Micron long uh uh firm optic pH shifter and um yeah and yeah here we
[01:09:08] pH shifter and um yeah and yeah here we use the firm optic pH shifter due to
[01:09:10] use the firm optic pH shifter due to like the um limited resources but of
[01:09:14] like the um limited resources but of course in the future we can use the um
[01:09:16] course in the future we can use the um PN Junction phe shifters to get a very
[01:09:19] PN Junction phe shifters to get a very high modulation speed so yeah we
[01:09:22] high modulation speed so yeah we fabricated this kind of a optical pH
[01:09:25] fabricated this kind of a optical pH array and uh so this is like the
[01:09:28] array and uh so this is like the schematic of the uh 3D wave guide and
[01:09:31] schematic of the uh 3D wave guide and basically we have 128 input wave gues
[01:09:34] basically we have 128 input wave gues and it's like a 1D array while through
[01:09:37] and it's like a 1D array while through the 3D wave guide It's converted to uh
[01:09:40] the 3D wave guide It's converted to uh 2D pattern uh to to the array to be
[01:09:43] 2D pattern uh to to the array to be efficiently coupled to the multimode
[01:09:45] efficiently coupled to the multimode fiber and uh this fiber supports 557
[01:09:48] fiber and uh this fiber supports 557 modes per
[01:09:49] modes per polarization and the uh this is the
[01:09:53] polarization and the uh this is the experimental setup um
[01:09:56] experimental setup um um so basically you have a laser light
[01:09:59] um so basically you have a laser light source and then we polarization control
[01:10:02] source and then we polarization control it to T mode and amplify pre amplify it
[01:10:06] it to T mode and amplify pre amplify it and uh we got Optical band P pass filter
[01:10:09] and uh we got Optical band P pass filter and then uh we couple it through lens
[01:10:11] and then uh we couple it through lens fiber to the chip and then um uh we
[01:10:15] fiber to the chip and then um uh we align the optical face array to the 3D
[01:10:17] align the optical face array to the 3D wave guide and of course this Optical
[01:10:19] wave guide and of course this Optical face are is controlled through the uh
[01:10:21] face are is controlled through the uh driver circuit and uh through the
[01:10:23] driver circuit and uh through the multimo fiber we get the output light
[01:10:26] multimo fiber we get the output light and we image this relay this uh near
[01:10:29] and we image this relay this uh near field pattern the near field pattern of
[01:10:31] field pattern the near field pattern of the multi mode fiber output uh through
[01:10:33] the multi mode fiber output uh through two cascaded for systems and we
[01:10:36] two cascaded for systems and we illiminate this to the Target and get
[01:10:37] illiminate this to the Target and get the transmitted Optical power and we
[01:10:40] the transmitted Optical power and we monitor the far field pattern uh sorry
[01:10:43] monitor the far field pattern uh sorry sorry the near field pattern of the
[01:10:44] sorry the near field pattern of the multim fiber simultaneously using the
[01:10:46] multim fiber simultaneously using the INX
[01:10:47] INX camera and yeah here we can see that we
[01:10:51] camera and yeah here we can see that we have experimentally acquired these
[01:10:53] have experimentally acquired these illumination patterns and we can see
[01:10:55] illumination patterns and we can see that by tuning the phase shifter
[01:10:57] that by tuning the phase shifter condition we can finally modulate the
[01:10:59] condition we can finally modulate the output
[01:11:00] output wfront and uh yeah this is the Imaging
[01:11:03] wfront and uh yeah this is the Imaging result you can see that the uh by
[01:11:06] result you can see that the uh by increasing the number of patterns of the
[01:11:08] increasing the number of patterns of the illuminations um uh you can get a fine
[01:11:11] illuminations um uh you can get a fine image of the Target and uh yeah and one
[01:11:15] image of the Target and uh yeah and one interesting thing is that this nice
[01:11:17] interesting thing is that this nice quite nice image was obtained just by
[01:11:20] quite nice image was obtained just by using only 128 phase shifters uh which
[01:11:22] using only 128 phase shifters uh which is uh uh
[01:11:25] is uh uh you know so given that this uh image has
[01:11:28] you know so given that this uh image has a pretty nice uh resolution um we uh
[01:11:33] a pretty nice uh resolution um we uh despite using only 128 phase shifters
[01:11:36] despite using only 128 phase shifters and to uh qu
[01:11:39] and to uh qu quantitatively uh evaluate the number of
[01:11:41] quantitatively uh evaluate the number of reservable points we derive the uh point
[01:11:44] reservable points we derive the uh point spread function of the
[01:11:47] spread function of the uh um you know the system by numerically
[01:11:52] uh um you know the system by numerically Imaging the uh infinite symol
[01:11:55] Imaging the uh infinite symol um Target using the experimentally
[01:11:58] um Target using the experimentally acquired um elimination patterns and you
[01:12:00] acquired um elimination patterns and you can see that um the uh full W half
[01:12:03] can see that um the uh full W half maximum was approx 3.3 Micron and this
[01:12:06] maximum was approx 3.3 Micron and this was um almost uniform over the entire
[01:12:09] was um almost uniform over the entire multim mode fiber core and the number of
[01:12:11] multim mode fiber core and the number of resumable points was uh estimated to be
[01:12:14] resumable points was uh estimated to be around th000 points from here so around
[01:12:18] around th000 points from here so around so like 1,000 points can be resolved
[01:12:20] so like 1,000 points can be resolved despite using only 128 phase shifters
[01:12:22] despite using only 128 phase shifters and this is like a kind of an
[01:12:24] and this is like a kind of an interesting point and we also confirmed
[01:12:26] interesting point and we also confirmed this point through the uh singular value
[01:12:29] this point through the uh singular value analysis of the illumination patterns
[01:12:31] analysis of the illumination patterns that we got so this kind of uh um yeah
[01:12:37] that we got so this kind of uh um yeah and um the singular value like you know
[01:12:40] and um the singular value like you know the singular value of this illumination
[01:12:42] the singular value of this illumination Matrix actually corresponds describes
[01:12:44] Matrix actually corresponds describes like the spatial resolution of the or
[01:12:46] like the spatial resolution of the or like the number of independent patterns
[01:12:48] like the number of independent patterns involved in The Matrix and uh you know
[01:12:52] involved in The Matrix and uh you know we derived the singular value uh uh DEC
[01:12:55] we derived the singular value uh uh DEC composition of
[01:12:57] composition of the experimentally acquired illumination
[01:13:00] the experimentally acquired illumination Matrix and uh basically um you know we
[01:13:03] Matrix and uh basically um you know we got like a very large number of uh the
[01:13:06] got like a very large number of uh the singular value index uh with have a
[01:13:09] singular value index uh with have a non-zero value
[01:13:11] non-zero value um uh although and this purple line
[01:13:15] um uh although and this purple line corresponds to like a uh using a one
[01:13:17] corresponds to like a uh using a one uniform Optical pH R and uh this is
[01:13:21] uniform Optical pH R and uh this is pretty limited and by using the multim
[01:13:24] pretty limited and by using the multim fiber and in fact fact we can enhance
[01:13:26] fiber and in fact fact we can enhance spatial resolution so and uh um due to
[01:13:30] spatial resolution so and uh um due to the time limitation maybe I'll omit this
[01:13:32] the time limitation maybe I'll omit this point omit this slide but uh uh we did
[01:13:34] point omit this slide but uh uh we did some more detailed theoretical and
[01:13:38] some more detailed theoretical and uh um numerical study on the number of
[01:13:42] uh um numerical study on the number of resolvable points available through
[01:13:44] resolvable points available through system in this uh Jo uh joft paper so
[01:13:47] system in this uh Jo uh joft paper so you can also read that paper you have if
[01:13:49] you can also read that paper you have if you have any interest so as a summary we
[01:13:51] you have any interest so as a summary we have demonstr experimentally
[01:13:53] have demonstr experimentally demonstrated single Pixel Imaging
[01:13:54] demonstrated single Pixel Imaging through
[01:13:55] through uh a multimode fiber using an integrated
[01:13:57] uh a multimode fiber using an integrated silicon photonic Optical phary chip and
[01:14:01] silicon photonic Optical phary chip and uh yeah so we fabricated this 128
[01:14:04] uh yeah so we fabricated this 128 element from
[01:14:05] element from optic uh Optical face array and we
[01:14:09] optic uh Optical face array and we combined that uh with 3D wave guide to
[01:14:12] combined that uh with 3D wave guide to generate illumination patterns through a
[01:14:14] generate illumination patterns through a multim mode fiber and we using that
[01:14:16] multim mode fiber and we using that illumination patterns we have
[01:14:18] illumination patterns we have experimentally acquired uh very nice
[01:14:20] experimentally acquired uh very nice image and uh the also the interesting
[01:14:24] image and uh the also the interesting point is that you can get a quite large
[01:14:27] point is that you can get a quite large number of visable points uh with only
[01:14:30] number of visable points uh with only 128 phase shifters and um that's very
[01:14:33] 128 phase shifters and um that's very nice because um so first you need to
[01:14:36] nice because um so first you need to have a very densely uh uh so if you need
[01:14:40] have a very densely uh uh so if you need a very large number of op uh phe
[01:14:42] a very large number of op uh phe shifters that's uh pretty challenging to
[01:14:46] shifters that's uh pretty challenging to control and so yeah in that sense we are
[01:14:50] control and so yeah in that sense we are so this uh this is a very nice feature
[01:14:52] so this uh this is a very nice feature of this scheme so yeah this work based
[01:14:55] of this scheme so yeah this work based way towards you to highspeed uh and
[01:14:57] way towards you to highspeed uh and compact multi mode fiber based Imaging
[01:14:59] compact multi mode fiber based Imaging systems yeah so thank you for your nice
[01:15:02] systems yeah so thank you for your nice uh kind
[01:15:06] attention all right thank you so much
[01:15:08] attention all right thank you so much for this wonderful presentation
[01:15:11] for this wonderful presentation and do we have questions from the
[01:15:14] and do we have questions from the audience
[01:15:25] actually I I saw um question in the chat
[01:15:29] actually I I saw um question in the chat box um yeah so one question is related
[01:15:32] box um yeah so one question is related to your research why we use multi mode
[01:15:37] to your research why we use multi mode fiber over single mode fiber for This
[01:15:39] fiber over single mode fiber for This research can you can you answer this
[01:15:41] research can you can you answer this question for for the audience okay yeah
[01:15:44] question for for the audience okay yeah thank you for the nice question um so
[01:15:46] thank you for the nice question um so basically the point of using the multim
[01:15:48] basically the point of using the multim mode fiber is like the number of spal
[01:15:50] mode fiber is like the number of spal modes that's available through like a
[01:15:54] modes that's available through like a same diameter so if you use the uh so of
[01:15:58] same diameter so if you use the uh so of course you can use a uh bundle of single
[01:16:02] course you can use a uh bundle of single mode fibers but that will end up with a
[01:16:05] mode fibers but that will end up with a a very large endoscope and uh that's not
[01:16:10] a very large endoscope and uh that's not applicable for um like a that that will
[01:16:14] applicable for um like a that that will not give a sufficient number of
[01:16:15] not give a sufficient number of reservable points with a available um
[01:16:18] reservable points with a available um diameter for example so you can see that
[01:16:20] diameter for example so you can see that uh for example in our work we use like a
[01:16:24] uh for example in our work we use like a uh multi mode fiber with a quarter
[01:16:26] uh multi mode fiber with a quarter diameter of 0.125 and that gives like a
[01:16:30] diameter of 0.125 and that gives like a uh 557 modes uh spatial modes but if you
[01:16:35] uh 557 modes uh spatial modes but if you so given that you know um if you use a
[01:16:38] so given that you know um if you use a single mode fiber then like the core
[01:16:40] single mode fiber then like the core diameter is several microns with only
[01:16:42] diameter is several microns with only one spatial mode so even though you
[01:16:44] one spatial mode so even though you densely pack them with a
[01:16:48] densely pack them with a uh uh and bundle make a m bundle with
[01:16:51] uh uh and bundle make a m bundle with them um you cannot get like a uh comp
[01:16:54] them um you cannot get like a uh comp varable spatial
[01:16:58] resolution okay thank you so so
[01:17:00] resolution okay thank you so so basically you just want to make the the
[01:17:03] basically you just want to make the the Imaging system more compact yes yeah
[01:17:07] Imaging system more compact yes yeah yeah that that's the advantage of the
[01:17:09] yeah that that's the advantage of the multi fiber over other methods okay
[01:17:12] multi fiber over other methods okay thank you yeah thank you very
[01:17:15] thank you yeah thank you very much uh do we have more questions for
[01:17:18] much uh do we have more questions for for this speaker
[01:17:27] that there was one um from Professor MTI
[01:17:31] that there was one um from Professor MTI but I'm not sure if that was already
[01:17:35] but I'm not sure if that was already answered let me
[01:17:37] answered let me see
[01:17:45] first um so it's so all of the
[01:17:48] first um so it's so all of the parameters for the fibers are considered
[01:17:51] parameters for the fibers are considered as optimized
[01:17:53] as optimized values oh thank you very much for the
[01:17:56] values oh thank you very much for the question so in that sense um yeah um
[01:18:01] question so in that sense um yeah um that's uh interesting question
[01:18:04] that's uh interesting question so um and he did follow it was followed
[01:18:08] so um and he did follow it was followed up that I believe it had been answered
[01:18:11] up that I believe it had been answered as it was mentioned in the more compact
[01:18:13] as it was mentioned in the more compact Imaging system if you have way to
[01:18:16] Imaging system if you have way to elaborate on
[01:18:18] elaborate on that um yeah so maybe one uh maybe
[01:18:22] that um yeah so maybe one uh maybe another thing to add to the previous
[01:18:25] another thing to add to the previous answer is that maybe we can uh uh get a
[01:18:28] answer is that maybe we can uh uh get a higher numerical aperture fiber so that
[01:18:31] higher numerical aperture fiber so that we can improve the number of um you know
[01:18:35] we can improve the number of um you know uh spatial modes with the same diameter
[01:18:38] uh spatial modes with the same diameter but we haven't done yet done that yet so
[01:18:40] but we haven't done yet done that yet so in that sense yeah this is uh it's like
[01:18:43] in that sense yeah this is uh it's like a proof of concept demonstration so we
[01:18:45] a proof of concept demonstration so we haven't like kind of truly optimized
[01:18:48] haven't like kind of truly optimized like the uh configuration uh in depth I
[01:18:52] like the uh configuration uh in depth I mean yeah uh we just chose it
[01:18:55] mean yeah uh we just chose it um uh due to some balance of like the
[01:18:58] um uh due to some balance of like the available Optical face array and
[01:19:00] available Optical face array and available 3D wave guides and so
[01:19:04] on all right I I I see one more question
[01:19:07] on all right I I I see one more question coming from the chat box what was the
[01:19:11] coming from the chat box what was the future work for this study oh yeah thank
[01:19:14] future work for this study oh yeah thank you for the nice question as well um so
[01:19:17] you for the nice question as well um so uh so like the one few the one thing we
[01:19:21] uh so like the one few the one thing we have to do is like we need to image
[01:19:23] have to do is like we need to image through the fiber using
[01:19:25] through the fiber using the reflected light because of course as
[01:19:27] the reflected light because of course as an endoscope it needs to use the
[01:19:29] an endoscope it needs to use the reflected light so yeah that's one thing
[01:19:32] reflected light so yeah that's one thing we haven't uh achieved yet but uh yeah
[01:19:36] we haven't uh achieved yet but uh yeah one uh natural step to go forward is to
[01:19:40] one uh natural step to go forward is to uh use the reflected light and I believe
[01:19:43] uh use the reflected light and I believe that that's possible by using like a
[01:19:44] that that's possible by using like a micr lens system at the uh input side of
[01:19:47] micr lens system at the uh input side of the fiber and also another step is to
[01:19:50] the fiber and also another step is to use the um carrier depletion type or
[01:19:53] use the um carrier depletion type or Carrier injection type Optical Spas
[01:19:54] Carrier injection type Optical Spas shifters so that we can you know uh
[01:19:58] shifters so that we can you know uh clearly outperform the um the
[01:20:02] clearly outperform the um the conventional spatial light modulators uh
[01:20:04] conventional spatial light modulators uh in uh in terms of this uh frame
[01:20:16] rate okay thank you very much all right
[01:20:19] rate okay thank you very much all right thank you so probably since you were
[01:20:22] thank you so probably since you were finish your presentation you can
[01:20:24] finish your presentation you can probably
[01:20:25] probably uh look at this chat box directly so one
[01:20:28] uh look at this chat box directly so one more question uh would using p laser in
[01:20:31] more question uh would using p laser in such M fiber Imaging be helpful for
[01:20:34] such M fiber Imaging be helpful for arranging in addition to recovering the
[01:20:38] arranging in addition to recovering the face mask or will it lead to issues with
[01:20:43] face mask or will it lead to issues with reconstruction um wait a moment so so
[01:20:47] reconstruction um wait a moment so so thank you for the question um yeah the
[01:20:50] thank you for the question um yeah the use of pulse laser is actually very
[01:20:52] use of pulse laser is actually very interesting but um uh one thing we have
[01:20:56] interesting but um uh one thing we have to be careful or to treat about is like
[01:20:59] to be careful or to treat about is like that the uh modal dispersion and the or
[01:21:06] that the uh modal dispersion and the or like the dispersion of the transfer
[01:21:07] like the dispersion of the transfer Matrix of the multi mode fiber is uh
[01:21:09] Matrix of the multi mode fiber is uh pretty large so it depends I think on
[01:21:12] pretty large so it depends I think on the length of the multim mode fiber but
[01:21:15] the length of the multim mode fiber but uh um we need
[01:21:18] uh um we need to um kind of be careful about that
[01:21:22] to um kind of be careful about that point and in fact I I know some papers
[01:21:26] point and in fact I I know some papers that uses
[01:21:28] that uses uh uh short post lasers uh couple to a
[01:21:32] uh uh short post lasers uh couple to a multi mode fire to generate like a
[01:21:34] multi mode fire to generate like a series of uh like a speckle patterns
[01:21:39] series of uh like a speckle patterns because you know by through model
[01:21:41] because you know by through model dispersion you get like these um bunch
[01:21:44] dispersion you get like these um bunch of uh different output bites uh with the
[01:21:47] of uh different output bites uh with the same input input due to the dispersion
[01:21:51] same input input due to the dispersion so in that sense if we want to use like
[01:21:55] so in that sense if we want to use like a really short post laser we need to be
[01:21:57] a really short post laser we need to be careful about that point but of course I
[01:22:00] careful about that point but of course I think you know uh by using like a uh
[01:22:04] think you know uh by using like a uh moderate short pulse laser and also the
[01:22:07] moderate short pulse laser and also the use of the very short multi mode fiber
[01:22:09] use of the very short multi mode fiber because the fiber doesn't have to be
[01:22:12] because the fiber doesn't have to be ultra long Ultra long I mean because we
[01:22:14] ultra long Ultra long I mean because we just want to use it as endoscope so yeah
[01:22:17] just want to use it as endoscope so yeah in that in that sense uh it could be
[01:22:21] in that in that sense uh it could be useful I mean because for example if you
[01:22:23] useful I mean because for example if you want want to use use it for uh nonlinear
[01:22:26] want want to use use it for uh nonlinear image angle something like that then we
[01:22:27] image angle something like that then we need a high PE power and so
[01:22:32] on okay yeah thank you very much for for
[01:22:35] on okay yeah thank you very much for for answering so we are actually running

https://www.youtube.com/watch?v=KQTCoKsJ9ak

Summary

TL;DR — This IEEE Photonics Journal Club session, hosted by the I photo Hong Kong chapter, features three speakers discussing silicon photonics technology and its development. The presentations cover the review of silicon photonics technology platforms, high-speed modulators, and single-pixel imaging applications. The event highlights the progress, challenges, and future directions in silicon photonics, emphasizing its commercialization and integration with other technologies.

Key points

• The session begins with a review of silicon photonics technology platforms, tracing its development from research programs to commercialization, with a focus on foundry services and manufacturing industrialization.

• A presentation details advancements in high-speed modulators, particularly hybrid silicon and lithium niobate platforms, addressing challenges in bandwidth, power consumption, and integration.

• The third talk explores single-pixel imaging techniques using multimode fibers and silicon photonic phase arrays, demonstrating a compact and high-resolution imaging system.

• Discussions touch upon the importance of packaging, quality control, supply chains, and the growing ecosystem supporting silicon photonics development.

• The potential applications of silicon photonics are highlighted, including data centers, telecommunications, quantum computing, AI, and sensing.

• The session emphasizes the ongoing innovation required to overcome current limitations and build a robust photonics supply chain, especially for students entering the field.

Takeaway — Silicon photonics is a rapidly advancing field with a maturing ecosystem, offering significant opportunities for innovation and commercialization across various applications, driven by integrated photonic platforms and advanced manufacturing.