Full Transcript
https://www.youtube.com/watch?v=-LDjo7wFEBE
[00:06] so okay so why glass why we are talking.
[00:09] so okay so why glass why we are talking about glass today and here you can see.
[00:13] what we use we use panels we need use.
[00:17] cheats of very sinin glass and we have.
[00:20] inscribed to warm up a little bit all the nice properties but I will show it.
[00:26] in a better way and at first yes we have.
[00:29] a very Locust commercial material and we.
[00:33] use display material we can use that on.
[00:36] panel and on wafer level it is uh steady.
[00:39] under development and it is a very low.
[00:42] fragile material with a high stability.
[00:46] in dimension and that is very nice for.
[00:48] some um applications in photonic and.
[00:52] electronic.
[00:53] assembly but additionally we have very.
[00:57] nice Optical properties one one of.
[01:00] course the optical transparency in comparison to polymers we have a high.
[01:02] transmission uh or a broad wavelength.
[01:08] transmission uh or a broad wavelength range up to the communication.
[01:11] range up to the communication wavelengths as you can see here the 1310.
[01:14] wavelengths as you can see here the 1310 and the.
[01:16] and the 1550 on the other hand we have perfect.
[01:19] 1550 on the other hand we have perfect electrical properties for DC and uh RF.
[01:24] electrical properties for DC and uh RF and we can structure the material and I.
[01:28] and we can structure the material and I will show you later a little bit on.
[01:31] will show you later a little bit on these.
[01:32] these Technologies uh with wires to do uh the.
[01:36] Technologies uh with wires to do uh the interconnect through the.
[01:38] interconnect through the substrate but we have also very high.
[01:42] substrate but we have also very high chemical resistance so we can use it for.
[01:46] chemical resistance so we can use it for uh sensors we can use it in um harsh.
[01:51] uh sensors we can use it in um harsh environments and it is a bio compatible.
[01:56] environments and it is a bio compatible material in the next slide there are.
[01:59] material in the next slide there are some numbers of course explaining the.
[02:02] some numbers of course explaining the mechanical electrical properties the.
[02:04] mechanical electrical properties the optical properties and we use the.
[02:07] optical properties and we use the example.
[02:10] d263 tickle from shot this is a sinless
[02:14] d263 tickle from shot this is a sinless with convinces by Superior Glass
[02:17] with convinces by Superior Glass Properties and we benefit from the uh
[02:22] Properties and we benefit from the uh very good di electric properties you can
[02:25] very good di electric properties you can see that uh here the frequency uh
[02:29] see that uh here the frequency uh depends losses are quite nice as you can
[02:32] depends losses are quite nice as you can see here 1 2 5 24 and 77 gigahertz and
[02:39] we have the Del electric constant as you can see here 1 2 5 24 and 77 gigahertz and
[02:41] we have the Del electric constant as you can see here uh very low loss and on the
[02:45] can see here uh very low loss and on the right hand side again the transmission
[02:48] right hand side again the transmission curve for the wavelength is starting
[02:51] curve for the wavelength is starting here with the UV and blue and then up to
[02:57] here with the UV and blue and then up to the uh telecommunication wavelengths in
[03:01] the uh telecommunication wavelengths in the near infrared the thermal properties
[03:04] the near infrared the thermal properties of course are something special they are
[03:08] of course are something special they are not as good as some Ceramics we have a
[03:12] not as good as some Ceramics we have a quite low thermal conductivity we can uh.
[03:17] quite low thermal conductivity we can uh overcome problems in packaging by that.
[03:21] overcome problems in packaging by that uh or from that with special Thal.
[03:25] uh or from that with special Thal management by Design we apply heat.
[03:29] management by Design we apply heat spreaders we apply thermal wires but.
[03:33] spreaders we apply thermal wires but sometimes it is an advantage to have.
[03:36] sometimes it is an advantage to have these low thermal conductance because we.
[03:39] these low thermal conductance because we can separate different um uh areas on a.
[03:44] can separate different um uh areas on a substrate and that is of advantage for.
[03:47] substrate and that is of advantage for some applications in the higher um Power.
[03:53] some applications in the higher um Power domain we here at frown hover we have a.
[03:56] domain we here at frown hover we have a long history on glass and we started.
[04:00] long history on glass and we started with that what we call electrooptical.
[04:02] with that what we call electrooptical circuit boards that was uh at first uh.
[04:06] circuit boards that was uh at first uh targeted to the optical back planes and.
[04:09] targeted to the optical back planes and we tried to use glass for the optical.
[04:13] We tried to use glass for the optical layer for high bandwidth optical wave.
[04:16] Layer for high bandwidth optical wave guides to um.
[04:19] Guides to um have uh another choice than all the GU.
[04:24] Have uh another choice than all the GU tried with polymer optical wave guides.
[04:28] Tried with polymer optical wave guides because in the polymer optical waveguide.
[04:31] Because in the polymer optical waveguide domain people suffered from reliability.
[04:34] Domain people suffered from reliability issues and low loss or higher losses in.
[04:38] Issues and low loss or higher losses in the uh near infrared range so we started.
[04:42] The uh near infrared range so we started with glass with the upcoming um display.
[04:46] With glass more than 20 years ago we use a.
[04:49] Special technology I will explain that a.
[04:52] Little bit later that is the ion.
[04:53] Exchange but today we also started with.
[04:57] FC laser wave guide.
[05:00] Integration into that substrate.
[05:04] Glasses and today we are happy to see.
[05:07] that in September 20 uh 23 Intel has been announced glass for electronic.
[05:13] been announced glass for electronic substrate to enable upcoming uh high.
[05:17] substrate to enable upcoming uh high performance Computing including.
[05:19] performance Computing including photonics maybe you are aware of these.
[05:22] photonics maybe you are aware of these uh press releases uh in your.
[05:26] uh press releases uh in your industry-leading glass substrate to meet.
[05:28] industry-leading glass substrate to meet demand for more powerful compute there.
[05:32] demand for more powerful compute there was a video and they argued uh a lot why.
[05:37] was a video and they argued uh a lot why glass is the future material for ship.
[05:40] glass is the future material for ship packaging on interposes on panel uh with.
[05:45] packaging on interposes on panel uh with very small line space as you can see.
[05:49] very small line space as you can see here uh to reach higher.
[05:51] here uh to reach higher complexity and so we are quite proud.
[05:56] complexity and so we are quite proud that we already started earlier and we.
[05:58] that we already started earlier and we have a lot of Solutions already on the.
[06:01] have a lot of Solutions already on the table to um uh enable.
[06:06] table to um uh enable these electronic and photonic system.
[06:09] these electronic and photonic system integration by using.
[06:12] integration by using glass our motivations before are coming.
[06:15] glass our motivations before are coming from sensing and communication.
[06:18] from sensing and communication applications here on that um slide you can see some data from the data center.
[06:25] uh domain and in the moment everybody is talking about co- packaging co- packaging means uh close assembly of electrical Optical components.
[06:37] transceivers uh very close to the switch acid for instance and what we propose is putting that on a glass interposer a large one that could be centim by centim.
[06:52] and integrate not only the electronics The High Frequency Electronics as you can see here in yellow uh but also the optical interconnects to have a costeffective routing to interconnect that with fiber connectors here maybe only on one end uh and that is the driver from the
[07:16] is the driver from the um uh communication application.
[07:20] um uh communication application another new module concept becomes.
[07:23] another new module concept becomes possible what we call photonic system in.
[07:26] possible what we call photonic system in package P zip using glass allows both.
[07:31] package P zip using glass allows both High design complexity and.
[07:33] High design complexity and miniaturization on the left hand side.
[07:36] miniaturization on the left hand side you can see a quite large fully glass.
[07:41] you can see a quite large fully glass module with uh Optical fibers in uh and.
[07:46] module with uh Optical fibers in uh and out with a lot of components microl.
[07:50] out with a lot of components microlenses all that what you can explain by.
[07:53] lenses all that what you can explain by means of.
[07:54] means of a uh microoptical bench concept for.
[07:57] a uh microoptical bench concept for instance that is in the the centimeter.
[08:00] instance that is in the the centimeter range we have a lot of projects uh.
[08:03] range we have a lot of projects uh realizing that and benefiting from.
[08:06] realizing that and benefiting from electrical Optical and mechanical.
[08:08] electrical Optical and mechanical properties of the glass but more and.
[08:11] properties of the glass but more and more we develop packages to overcome the.
[08:15] more we develop packages to overcome the well-known butterfly packages for.
[08:17] Well-known butterfly packages for instance and put the same functionality.
[08:22] Instance and put the same functionality as you have today in a um metal butterfly package in very small.
[08:25] As you have today in a um metal butterfly package in very small electronic like optical module that is a seat laser module with a uh laser diet.
[08:29] Electronic like optical module that is a seat laser module with a uh laser diet.
[08:32] Seat laser module with a uh laser diet and some optics I will explain that a little bit more in the next slides.
[08:36] And some optics I will explain that a little bit more in the next slides.
[08:39] Little bit more in the next slides and what we gain is a higher degree of miniaturization.
[08:43] What we gain is a higher degree of miniaturization and so in the end we can realize very compact systems.
[08:46] Miniaturization and so in the end we can realize very compact systems that is a seat laser.
[08:50] And so in the end we can realize very compact systems that is a seat laser as I told you it is part of a uh mopa system.
[08:53] Seat laser as I told you it is part of a uh mopa system as you will see later.
[08:57] As I told you it is part of a uh mopa system as you will see later.
[09:01] Uh mopa system as you will see later that's the motivation and uh the next is how it looks like on the right hand side.
[09:03] Later that's the motivation and uh the next is how it looks like on the right hand side.
[09:08] Motivation and uh the next is how it looks like on the right hand side you can see such a glass panel and the processes we put uh or we we have to.
[09:11] Looks like on the right hand side you can see such a glass panel and the processes we put uh or we we have to.
[09:17] Can see such a glass panel and the processes we put uh or we we have to.
[09:22] The processes we put, uh, or we, we have to structure that are as follows.
[09:25] We have of course the cutting, we have the waveguide integration structuring for suass wires.
[09:31] For cavities, for the components, we have uh physical, physical vapor deposition by sputtering, lithography, plating.
[09:41] Then assembly, assembly of several components: laser diodes, photo diodes, ICs, fibers, and hermetic ceiling.
[09:56] And these processes, I want to start to explain in a little bit, bit more detail in the next slides.
[10:02] Let us start with the optical wave guides which we integrate in that sing glass.
[10:09] An overview how to realize wave guides, you can see here.
[10:14] Optical wave guides in glass are realized by four technologies today.
[10:18] It is fcond laser writing, we writing, iron implantation.
[10:25] writing you we writing iron implantation and iron.
[10:27] and iron exchange we.
[10:30] exchange we uh have two processes here in our.
[10:33] uh have two processes here in our Institute at first I want to explain the.
[10:36] Institute at first I want to explain the ion exchange and then the F Toc laser.
[10:38] ion exchange and then the F Toc laser writing uh you can see here with the.
[10:41] writing uh you can see here with the color code uh that the iron exchange is.
[10:46] color code uh that the iron exchange is a a process with a very good process.
[10:49] a a process with a very good process stability it is able to be batch.
[10:52] stability it is able to be batch processed and uh have very low cost and.
[10:56] processed and uh have very low cost and very low propagation losses they uh not.
[11:01] very low propagation losses they uh not all of the glasses can be used because.
[11:03] all of the glasses can be used because it is a diffusion process you have to.
[11:05] it is a diffusion process you have to exchange the right um ions and of course.
[11:09] exchange the right um ions and of course it is a planner process so that uh 3D.
[11:13] it is a planner process so that uh 3D processing is not really possible that.
[11:16] processing is not really possible that is possible on the other hand with ftoc.
[11:18] is possible on the other hand with ftoc laser writing and we are quite open for.
[11:23] laser writing and we are quite open for the glasses so that we have uh on our.
[11:28] the glasses so that we have uh on our road map to Bine that together maybe the.
[11:31] road map to Bine that together maybe the F Toc laser writing which is a.
[11:34] F Toc laser writing which is a sequential of course laser writing.
[11:36] sequential of course laser writing process uh maybe more for the interfaces.
[11:39] process uh maybe more for the interfaces more for the short lines more for the.
[11:40] more for the short lines more for the special cases where we need 3D and for.
[11:44] special cases where we need 3D and for the um uh high volume processing where.
[11:49] the um uh high volume processing where we uh have two Dimensions only uh we use.
[11:54] we uh have two Dimensions only uh we use that as a core technology we have.
[11:58] that as a core technology we have developed for more than than 20 years.
[12:01] developed for more than than 20 years how it looks like we start with the.
[12:05] how it looks like we start with the glass uh display glass of 500 700.
[12:09] glass uh display glass of 500 700 whatever uh uh depending on the.
[12:12] whatever uh uh depending on the application micrometers sickness and.
[12:17] application micrometers sickness and then we sputter a metal layer on top as.
[12:20] then we sputter a metal layer on top as you can see here in Gray then we have a.
[12:23] you can see here in Gray then we have a dip coating step and then a laser direct.
[12:27] dip coating step and then a laser direct Imaging to pattern the wave guys or the.
[12:30] Imaging to pattern the wave guys or the Splitters whatever and in the end after.
[12:33] Splitters whatever and in the end after that we put that in a uh Morton salt.
[12:37] that we put that in a uh Morton salt having silver ions uh the silver is uh uh painted red here and these silver ions diffuse into the glass metrix uh uh.
[12:45] ions diffuse into the glass metrix uh uh they will be exchanged by sodium ions.
[12:53] they will be exchanged by sodium ions and G uh cause an increase of the refractive index and and so uh after.
[13:00] refractive index and and so uh after removal of the Mask you have nice um wave guides here with the maximum of the refractive index on the surface that is a good approach for some sensing applications and if you want for data communications if you want to bury the wave guide then you have uh to put that in another um uh Morton salt and so you can red diffuse a lot of the silver and
[13:32] can red diffuse a lot of the silver and uh uh gain a residual very nice graded.
[13:36] uh uh gain a residual very nice graded index wave guide buried uh uh beneath of.
[13:41] index wave guide buried uh uh beneath of the um surface of the glass and then of.
[13:45] the um surface of the glass and then of course uh laser cutting to have the.
[13:48] course uh laser cutting to have the right uh shape or length or whatever uh.
[13:52] right uh shape or length or whatever uh of the uh substrate on the right hand.
[13:56] of the uh substrate on the right hand side some properties uh we we are uh.
[14:00] side some properties uh we we are uh proud as you know of the uh large.
[14:02] proud as you know of the uh large Optical band WIS and in particular the.
[14:06] Optical band WIS and in particular the very low losses.
[14:09] very low losses 0.05 or six DB per cimeter at the.
[14:15] 0.05 or six DB per cimeter at the 1550 that is not reachable with polymers.
[14:20] 1550 that is not reachable with polymers and uh we have a very high reliability.
[14:24] and uh we have a very high reliability on that if you have the wave guide in.
[14:26] on that if you have the wave guide in the glass then they are stable no.
[14:28] the glass then they are stable no problem with soering processes no.
[14:31] problem with soering processes no problem with aging and uh so you can
[14:35] problem with aging and uh so you can trust on these wave guides there's a low.
[14:38] trust on these wave guides there's a low uh.
[14:39] uh polarization uh dependence and.
[14:42] polarization uh dependence and temperature dependence as uh said and.
[14:44] temperature dependence as uh said and here you can see some um mechanical.
[14:48] here you can see some um mechanical figures the sickness uh down to 300.
[14:52] figures the sickness uh down to 300 microns is possible in our lab um.
[14:55] microns is possible in our lab um generally 500 or 700 uh and the format.
[14:59] generally 500 or 700 uh and the format is 440 by 3.
[15:03] is 440 by 3 uh5 uh mm per square in the moment so.
[15:07] uh5 uh mm per square in the moment so that's quite.
[15:09] that's quite large and uh the mode field so the.
[15:13] large and uh the mode field so the optical mode field of the integrated.
[15:15] optical mode field of the integrated wave guides can be adjusted to Optical.
[15:17] wave guides can be adjusted to Optical fibers that is important of course and.
[15:20] fibers that is important of course and later on I want to explain how we do.
[15:24] later on I want to explain how we do that the iron exchange wave guu.
[15:27] that the iron exchange wave guu technology can be subdivided into.
[15:29] technology can be subdivided into thermal ion exchange and electrical.
[15:32] thermal ion exchange and electrical field assisted processing the thermal.
[15:35] field assisted processing the thermal ion exchange I've already explained in
[15:38] ion exchange I've already explained in the last slide but we can also put an
[15:42] the last slide but we can also put an electrical field on the substrate and
[15:46] electrical field on the substrate and Drive by that electrical field the ions
[15:50] Drive by that electrical field the ions to a deeper uh position we can reach a
[15:55] to a deeper uh position we can reach a higher um difference in refractive index
[15:58] higher um difference in refractive index and so we gain uh uh uh more freedom for
[16:03] and so we gain uh uh uh more freedom for the structures uh later on you will see
[16:06] the structures uh later on you will see that that uh is important for other
[16:10] that that uh is important for other components than only um wife
[16:14] components than only um wife guides the manufacturing process works
[16:17] guides the manufacturing process works on both wafer and panel level uh that is
[16:20] on both wafer and panel level uh that is easy to understand uh What uh what what
[16:25] easy to understand uh What uh what what is possible on panel level on PR using
[16:28] is possible on panel level on PR using printed board uh Technologies of course
[16:31] printed board uh Technologies of course should be possible on wafer level as
[16:33] should be possible on wafer level as well we are proud that we are able to
[16:37] well we are proud that we are able to pattern and to structure and to realize pattern and to structure and to realize these wave guides uh on the higher uh uh or larger panel level so we have cost benefits as I said Optical building blocks uh they are me more and they provide uh more than points to Point wave guides on the left hand side you can see what is possible uh in the passive domain of course tapers to modify the um the the the optical mode but also bands Crossings M multimode interference interference couplers uh ring filters ring resonators other kinds of couplers isolators or uh uh Aid wave guide gratings.
[17:29] that's on the far road map in glass with that technology but a lot of these Tech uh components we have already realized.
[17:39] uh components we have already realized and uh for the optical interconnects the
[17:44] and uh for the optical interconnects the a very nice thing later on you will see
[17:47] a very nice thing later on you will see a uh a little bit uh more detailed slide
[17:51] a uh a little bit uh more detailed slide on that is a coupling scheme uh for the
[17:55] on that is a coupling scheme uh for the outof plane coupling we call that graded
[17:58] outof plane coupling we call that graded index L index surface coupling so coming
[18:01] index L index surface coupling so coming out with the light uh to the top of the
[18:04] surface and then it can be connectorized
[18:07] or uh coupled by an uh the same structure coming from the top there is
[18:11] structure coming from the top there is also the possibility to realize even a
[18:13] also the possibility to realize even a scent coupling to uh Drive the wave
[18:16] scent coupling to uh Drive the wave guide uh to the surface Edge coupling of
[18:19] guide uh to the surface Edge coupling of course and um
[18:23] course and um the uh uh coupling to uh defraction
[18:25] the uh uh coupling to uh defraction ratings on the right side again some um
[18:31] ratings on the right side again some um uh properties uh the Sens as you can see
[18:41] uh properties uh the Sens as you can see here in the moment uh about two 20 uh.
[18:45] here in the moment uh about two 20 uh millimeter.
[18:47] uh after that there are additional losses but there are also um.
[18:52] uh possibilities by Design to reduce that and here you can see the fiber.
[18:59] that and here you can see the fiber optical uh coupling.
[19:02] optical uh coupling losses the completition of the process.
[19:05] losses the completition of the process Shane and for over ism is a final.
[19:07] Shane and for over ism is a final inspection and that is always a problem.
[19:10] inspection and that is always a problem for new technology you need equipment to.
[19:13] for new technology you need equipment to test it to convince the customers that.
[19:16] test it to convince the customers that the quality and the yield is really good.
[19:20] the quality and the yield is really good enough here on this uh big uh photograph.
[19:24] enough here on this uh big uh photograph you can see a very large uh waveguide.
[19:27] you can see a very large uh waveguide spiral more than 2 m uh and that was a.
[19:32] good example and nice to show uh for a.
[19:36] good example and nice to show uh for a high um homogeneity of the processing.
[19:40] high um homogeneity of the processing over such large um panel and to show.
[19:45] over such large um panel and to show that there's really uh this low loss the.
[19:50] that there's really uh this low loss the uh value of 0.0 six or five uh DB per.
[19:56] uh value of 0.0 six or five uh DB per centimeter uh uh on a large.
[20:00] centimeter uh uh on a large panel so the the equipment is described.
[20:03] panel so the the equipment is described here we have uh the different stations.
[20:07] here we have uh the different stations to to to measure the loss the mode field.
[20:10] to to to measure the loss the mode field the cut off the ractive index the.
[20:12] the cut off the ractive index the coupling losses uh and we can do that.
[20:16] coupling losses uh and we can do that automatically and that is the uh big.
[20:19] automatically and that is the uh big Advantage here it's not a lab uh process.
[20:22] Advantage here it's not a lab uh process where you have to uh ask students for.
[20:26] where you have to uh ask students for hours to um to measure that that is an.
[20:30] hours to um to measure that that is an automated uh inspection.
[20:33] automated uh inspection equipment okay let's uh turn to the next.
[20:37] equipment okay let's uh turn to the next part that is the laser processing of the.
[20:40] part that is the laser processing of the glass of course uh we learned a lot from.
[20:44] glass of course uh we learned a lot from the uh LCD um.
[20:48] the uh LCD um technology uh and so we use carbon
[20:51] technology uh and so we use carbon dioxide lasers to to cut the the large
[20:56] dioxide lasers to to cut the the large panel to to to to to have uh as a result
[21:00] panel to to to to to have uh as a result of this kind of processing uh very smart
[21:06] of this kind of processing uh very smart interfaces very smart edges uh no glass
[21:10] interfaces very smart edges uh no glass particles and the uh for for phonic
[21:14] particles and the uh for for phonic packaging it is important that it is uh
[21:19] packaging it is important that it is uh uh Optical Crack free glass edge quality
[21:22] uh Optical Crack free glass edge quality so uh we don't need any grinding or
[21:26] so uh we don't need any grinding or polishing we have in the end the um
[21:30] polishing we have in the end the um Optical quality directly from the laser
[21:32] Optical quality directly from the laser processing and that is important for a
[21:35] processing and that is important for a packaging approach I want to explain
[21:37] packaging approach I want to explain later on for
[21:40] later on for cavities uh which are not straight or
[21:44] cavities uh which are not straight or have shapes uh uh curved shapes and
[21:47] have shapes uh uh curved shapes and something like that we use a green uh
[21:50] something like that we use a green uh wavelength laser with a uh nice accuracy
[21:55] wavelength laser with a uh nice accuracy both processes the carbon dioxide and
[21:58] both processes the carbon dioxide and the green laser are in the same machine
[22:00] the green laser are in the same machine and more and more we use the F Toc laser
[22:05] and more and more we use the F Toc laser process uh with um
[22:11] sodium hydroxide atching
[22:15] sodium hydroxide atching to uh structure the glass in the
[22:19] to uh structure the glass in the so-called uh selective laser induced
[22:23] so-called uh selective laser induced etching process to to have real
[22:26] etching process to to have real threedimensional uh as
[22:30] threedimensional uh as structuring that is the machine we do
[22:33] structuring that is the machine we do the uh L process the F to uh uh second
[22:38] the uh L process the F to uh uh second laser machine uh but we do not only the
[22:42] laser machine uh but we do not only the uh selective laser indu etching as
[22:44] uh selective laser indu etching as mentioned uh in the morning uh uh in the
[22:49] mentioned uh in the morning uh uh in the last slide we use that machine also for
[22:53] last slide we use that machine also for the glass welding direct glass welding
[22:56] the glass welding direct glass welding uh is possible by F to Second lasers and
[23:00] uh is possible by F to Second lasers and we use that machine from light FB for
[23:04] we use that machine from light FB for the uh 3D wave guide writing that is the
[23:08] the uh 3D wave guide writing that is the F Toc laser writing as I explained in my
[23:12] F Toc laser writing as I explained in my first uh one of my first slides that is
[23:16] first uh one of my first slides that is a good working horse uh in our group in
[23:20] a good working horse uh in our group in the moment and uh completes like that
[23:23] the moment and uh completes like that the uh process chain of
[23:26] the uh process chain of our uh glass processing uh beside the
[23:30] our uh glass processing uh beside the lithography and the um ion exchange and
[23:34] lithography and the um ion exchange and other
[23:36] other processes next is the fine structuring
[23:40] processes next is the fine structuring of the glass and uh so we use or we we
[23:46] of the glass and uh so we use or we we what we need is uh
[23:50] what we need is uh uh sass wires and we need um uh
[23:59] uh sass wires and we need um uh yeah or holes cavities for uh for for D
[24:04] yeah or holes cavities for uh for for D placing and for that we use the same
[24:08] placing and for that we use the same machine uh the the the F second uh laser
[24:13] machine uh the the the F second uh laser machine from light fap and this
[24:15] machine from light fap and this selective laser etching process uh for
[24:18] selective laser etching process uh for the tgv the through glass wires in the
[24:21] the tgv the through glass wires in the Moment The Wire diameter is about 50 uh
[24:25] Moment The Wire diameter is about 50 uh microns as smaller as possible
[24:28] microns as smaller as possible but of course you have to uh fill that
[24:32] but of course you have to uh fill that with with a good Gonic
[24:35] with with a good Gonic process uh and that is a basic
[24:38] process uh and that is a basic technology we need to estab or establish
[24:43] technology we need to estab or establish and and and enable the glass for the
[24:46] and and and enable the glass for the electrical Optical substrates of course
[24:50] electrical Optical substrates of course we use also here uh the
[24:54] d263 uh as I mentioned for the optical
[24:59] d263 uh as I mentioned for the optical wave guides but here also other glasses
[25:02] wave guides but here also other glasses are uh possible to use uh that is
[25:07] are uh possible to use uh that is important to mention maybe on that point
[25:09] important to mention maybe on that point uh there are different glasses uh on the
[25:12] uh there are different glasses uh on the market some works for different
[25:15] market some works for different processes and of course uh the selection
[25:19] processes and of course uh the selection of the right glass is the first step for
[25:25] of the right glass is the first step for uh a design of packaging um
[25:28] uh a design of packaging um if customer ask for certain
[25:33] if customer ask for certain functionalities metalization of the
[25:36] functionalities metalization of the glass is the next point of my talk and
[25:40] glass is the next point of my talk and uh we use for all the
[25:43] uh we use for all the metallizations um commercial equipment
[25:46] metallizations um commercial equipment what you can find on the market and uh
[25:49] what you can find on the market and uh so we have the already mentioned CO2
[25:51] so we have the already mentioned CO2 laser cutting sputtering dip coating for
[25:54] laser cutting sputtering dip coating for these large uh panels and then laser d
[25:57] these large uh panels and then laser d direct Imaging because uh a large mask
[26:00] direct Imaging because uh a large mask would be too expensive you end up with a
[26:04] would be too expensive you end up with a Metalized uh surface and then of course
[26:07] Metalized uh surface and then of course after the structuring you have um uh
[26:12] after the structuring you have um uh line spaces in the moment uh we have
[26:15] line spaces in the moment uh we have five microns and uh below we do that uh
[26:20] five microns and uh below we do that uh on wafer level here for for for that and
[26:24] on wafer level here for for for that and then for the surface finishing uh
[26:26] then for the surface finishing uh inequal it processes for the
[26:30] inequal it processes for the Couer I need to speed up uh a little bit
[26:35] Couer I need to speed up uh a little bit here in the next you can see the
[26:37] here in the next you can see the metallization of the glass uh for higher
[26:40] metallization of the glass uh for higher currence termal management uh can be
[26:43] currence termal management uh can be different different uh Metals different
[26:47] different different uh Metals different patterns uh all is possible and you can
[26:51] patterns uh all is possible and you can see here other applications that was the
[26:54] see here other applications that was the lighter system system on the right and
[26:57] lighter system system on the right and on the left an amplifier so uh to give
[27:01] on the left an amplifier so uh to give you an idea uh of the bright broad
[27:06] you an idea uh of the bright broad range last part is precision assembly of
[27:08] range last part is precision assembly of electrical micro Optical components and
[27:12] electrical micro Optical components and uh for that because we have a lot of uh
[27:15] uh for that because we have a lot of uh photonic assembly uh demands we use
[27:19] photonic assembly uh demands we use special bonding equipment so here on the
[27:22] special bonding equipment so here on the right hand side you can see ficon stages
[27:25] right hand side you can see ficon stages we have several of that for optical
[27:29] we have several of that for optical active alignment uh and that are
[27:31] active alignment uh and that are industrial pick in place machines they
[27:34] industrial pick in place machines they have a very high
[27:37] have a very high accuracy uh as you can see here accuracy
[27:41] accuracy uh as you can see here accuracy uh below 200 nanometers in the uh XY Z
[27:46] uh below 200 nanometers in the uh XY Z stages and two arccs around three
[27:50] stages and two arccs around three rotational uh
[27:53] rotational uh AIS so we use that for the uh assembly
[27:59] AIS so we use that for the uh assembly of uh opto electronic electronic but
[28:03] of uh opto electronic electronic but also micro optic components also fibers
[28:07] also micro optic components also fibers uh can be uh assembled using that kind
[28:11] uh can be uh assembled using that kind of
[28:14] machines last uh
[28:17] machines last uh slides um touch a little bit the other
[28:20] slides um touch a little bit the other interconnects so of course we need fiber
[28:23] interconnects so of course we need fiber to ship interconnects with high fiber
[28:25] to ship interconnects with high fiber counts and low cost uh uh here you can
[28:28] counts and low cost uh uh here you can see
[28:29] see glass uh substrates with wave guides in
[28:32] glass uh substrates with wave guides in for a special application uh applied
[28:35] for a special application uh applied with um
[28:38] with um fiber uh Aries on the uh MTP standard
[28:42] fiber uh Aries on the uh MTP standard that is one possibility I have already
[28:45] that is one possibility I have already already mentioned the so-called uh
[28:48] already mentioned the so-called uh graded index um uh surface coupling that
[28:53] graded index um uh surface coupling that is the uh G principle with um Iron
[28:59] is the uh G principle with um Iron exchange wave guides here in a special
[29:01] exchange wave guides here in a special manner to couple out the light and into
[29:04] manner to couple out the light and into the wave guide and then that can be
[29:07] the wave guide and then that can be fiber
[29:09] coupled and we use that uh for highly
[29:13] coupled and we use that uh for highly SCA packaging Solutions using that glass
[29:17] SCA packaging Solutions using that glass here you can see uh and uh as I already
[29:22] here you can see uh and uh as I already told you this idea to make or to to
[29:26] told you this idea to make or to to avoid uh butterfly packages to bring
[29:30] avoid uh butterfly packages to bring that into smaller packages and that can
[29:33] that into smaller packages and that can you see here on the right hand side a
[29:36] you see here on the right hand side a little bit better in the next slide uh
[29:41] little bit better in the next slide uh is uh with an explosion uh figure that
[29:45] is uh with an explosion uh figure that is the bottom layer here the bottom
[29:47] is the bottom layer here the bottom layer with uh all the metalizations I've
[29:51] layer with uh all the metalizations I've uh told you uh all the uh etching for
[29:55] uh told you uh all the uh etching for and then the laser assembly through gas
[29:58] and then the laser assembly through gas wires the frame the next with an optical
[30:02] wires the frame the next with an optical window uh without any grinding that is
[30:05] window uh without any grinding that is an optical window made by this uh carbon
[30:09] an optical window made by this uh carbon dioxide laser process fibers can be uh
[30:13] dioxide laser process fibers can be uh fused on that and then of course a
[30:15] fused on that and then of course a capping with uh the possibility
[30:20] capping with uh the possibility of uh hermetic ceiling and all these
[30:24] of uh hermetic ceiling and all these things are uh assem
[30:27] things are uh assem on panel level that you can see a little
[30:30] on panel level that you can see a little bit better here
[30:32] bit better here uh before capping before the last uh cap
[30:37] uh before capping before the last uh cap these modules can be assembled on a
[30:41] these modules can be assembled on a large panel in a five contact machine as
[30:43] large panel in a five contact machine as I already told you that is uh here the
[30:46] I already told you that is uh here the moment where the lens is applied on the
[30:50] moment where the lens is applied on the right hand side you can see this seat
[30:54] right hand side you can see this seat laser uh as an example uh of such a very
[30:58] laser uh as an example uh of such a very small package realized by this
[31:03] small package realized by this glass for the fiber uh coupling on this
[31:08] glass for the fiber uh coupling on this Optical window we use laser welding that
[31:11] Optical window we use laser welding that is a adhesive free interconnect approach
[31:16] is a adhesive free interconnect approach again o a f contct machine o is high
[31:18] again o a f contct machine o is high Precision but uh using laser technique
[31:22] Precision but uh using laser technique so that we don't need any adhesive
[31:24] so that we don't need any adhesive gluing and have a high reliability low
[31:28] gluing and have a high reliability low loss we can use that for the substrates
[31:32] loss we can use that for the substrates but also for as you can see here that is
[31:35] but also for as you can see here that is such kind of wave guide substrate with
[31:38] such kind of wave guide substrate with uh fibers at the edge but we can use
[31:40] uh fibers at the edge but we can use that of course also for microlens
[31:45] that of course also for microlens Aras uh the Hermetic ceiling uh is um
[31:51] Aras uh the Hermetic ceiling uh is um maybe a little bit late to explain that
[31:54] maybe a little bit late to explain that in more detail to you uh only this slide
[31:58] in more detail to you uh only this slide we have different processes we have the
[32:01] we have different processes we have the fto as already mentioned the fto uh
[32:05] fto as already mentioned the fto uh second laser based direct glass welding
[32:07] second laser based direct glass welding we have also bonding Technologies where
[32:09] we have also bonding Technologies where we use the wave guides or uh C or
[32:14] we use the wave guides or uh C or similar similar technology where we use
[32:17] similar similar technology where we use iron exchange to integrate uh structures
[32:21] iron exchange to integrate uh structures for the uh welding process to to to to
[32:25] for the uh welding process to to to to have the heat at the right position and
[32:27] have the heat at the right position and we use also glass metal uh glass bonding
[32:31] we use also glass metal uh glass bonding Solutions all with lasers uh they have
[32:35] Solutions all with lasers uh they have uh pros and cons as you can see here and
[32:38] uh pros and cons as you can see here and it depends on the design so we use that
[32:43] it depends on the design so we use that on demand uh what is the best uh
[32:47] on demand uh what is the best uh approach let me skip these three uh
[32:51] approach let me skip these three uh slides with more detail the uh end of my
[32:55] slides with more detail the uh end of my talk will show you a new offer uh and
[32:59] talk will show you a new offer uh and that is a generic packaging platform
[33:02] that is a generic packaging platform based on glass for customized Quantum
[33:05] based on glass for customized Quantum photonic integrated circuits so uh and
[33:10] photonic integrated circuits so uh and uh Quantum um photonic integrated
[33:14] uh Quantum um photonic integrated circuit is in some uh extent uh similar
[33:19] circuit is in some uh extent uh similar to other pics but the problem is that
[33:21] to other pics but the problem is that these picks sometimes are of uh not
[33:25] these picks sometimes are of uh not really def good defined properties and
[33:28] really def good defined properties and so at first we apply all of our
[33:32] so at first we apply all of our characterization techniques to find or
[33:34] characterization techniques to find or to to measure to characterize the mod
[33:37] to to measure to characterize the mod fields of the Silicon nitrite or uh
[33:40] fields of the Silicon nitrite or uh silicon pics and then we uh offer a
[33:46] silicon pics and then we uh offer a generic package so that is that what you
[33:48] generic package so that is that what you can see here using all the Technologies
[33:50] can see here using all the Technologies you have um heard about in that torque
[33:55] you have um heard about in that torque the laser welding the selective laser
[33:58] the laser welding the selective laser etching the iron exchange the Hermetic
[34:00] etching the iron exchange the Hermetic sealing the metallizations but the
[34:04] sealing the metallizations but the package itself is more generic uh it is
[34:07] package itself is more generic uh it is some big uh something bigger maybe uh
[34:11] some big uh something bigger maybe uh for some customers a test platform to
[34:15] for some customers a test platform to start with the first pick to go to some
[34:19] start with the first pick to go to some redesign
[34:21] redesign um
[34:23] um uh uh rounds and then if this approach
[34:28] uh uh rounds and then if this approach is successful then we end up with a
[34:33] is successful then we end up with a package with a more uh specific more
[34:37] package with a more uh specific more miniaturized more complex system for the
[34:41] miniaturized more complex system for the customer uh but that is uh the first
[34:45] customer uh but that is uh the first step and very very um uh yeah convenient
[34:50] step and very very um uh yeah convenient for the customers to have the results
[34:53] for the customers to have the results and the
[34:55] and the testability uh in a very short time
[34:58] testability uh in a very short time that's it a little bit late but uh as
[35:03] that's it a little bit late but uh as you can see here we have a lot of
[35:06] you can see here we have a lot of experience with glass use to use it as a
[35:10] experience with glass use to use it as a substrate and in the end and every day
[35:13] substrate and in the end and every day in glass retrust thank you everybody for
[35:17] in glass retrust thank you everybody for your
[35:22] attention