# EPIC Online Technology Meeting on Hybrid Photonic Integrated Circuits

https://www.youtube.com/watch?v=t8neh8Ur1iU

[00:09] hey
[00:18] hey
[00:33] good time of the day everyone and uh
[00:35] welcome to the series of online technology meetings provided to you by epic
[00:40] and today we discuss the exciting topic of hybrid photonics integrated circuits
[00:45] let me remind you that epic is the largest uh photonics industry Association in the world
[00:51] we have over 800 uh company members all around Europe and outside and we're here to provide you with technology marketing and
[01:02] Business consultations.
[01:03] The agenda of the meeting today is extremely well uh done.
[01:10] And we have exciting speakers to in um to share with us all the aspects and uh views in this area.
[01:19] We'll start with the presentation provided by by prof for hhi and more.
[01:25] It's Kleiner will be the speaker followed by Excel print and rero.
[01:28] Ly the supply chain scientist will tell us about the microt transfer printing techniques.
[01:37] Then presentation by vangard automation.
[01:39] With Laura Horan the staff engineer from Vanguard and York malinsky the business development manager from nanoscribe.
[01:50] After this we hear from chilas BV and Dimitri gesus Chief technology officer and VPI PHS U.
[01:56] Presented by Andre palatini principal.
[02:04] Application engineer, last but not least.
[02:07] We'll hear from the CEO of Alon Photonics, Hima Garcia Romeo Nunes.
[02:14] So welcome everyone, and I'm glad to see so many familiar faces in the room.
[02:20] Uh, just to mention that apart from our speakers, we have a lot of uh participants at the meeting today that represent basically every ring of the supply chain in hybrid integrated circuits.
[02:33] Just take a look at uh this impressive uh picture.
[02:35] We have equipment manufacturers, end users, integrators, contact manufacturers, component modules manufacturers, um, metrology and testing, materials, consultants, software and design, and of course, a lot of R&D and research organizations involved.
[02:54] Which just shows that the topic is uh is uh so exciting.
[02:58] And uh I'm looking forward to hear what's the updates from you now uh.
[03:07] without further delay I would like to invite the first speaker to introduce us to the topic and also tell us the updates uh at frover for hhi so morit Kleiner uh will be the first Speaker.
[03:21] morit whenever you're ready.
[03:23] yep thank you.
[03:28] um but here it tells me that I cannot share while someone else is sharing so I think you need to stop sharing and then like now it should work.
[03:43] okay so can you see the okay yeah okay.
[03:48] perfect yours um yeah uh thank you very much for the kind introduction uh pleasure to be here with you today and uh talk a bit about our activ in hyic integration um and the versatility of hydronic integration Technologies for
[04:08] various applications.
[04:09] So as I'm the first speaker of today, uh, de has asked me, um, sorry, Ian has asked me, uh, to introduce, um, some, uh, aspects of the photonic integration, hited photonic integration, to get everybody, um, here in the workshop up speed of what we are talking about.
[04:32] So that's why I just added, uh, two slides to to my talk.
[04:38] Um, just today, um, so well, I'm sure that everyone is aware that in phonic integration, we want to integrate, uh, lots of, um, optical functionalities, um, um, from bu optics into miniaturized chips, uh, for example, lasers, detectors, wave guides, filters, um, in order to provide, uh, multi-purpose photonic ination platforms.
[05:08] that can cater for a broad array of applications for example transmitters for communications uh um readout units for sensors Photon sources for qu Technologies and the like um there are several integration techniques techniques that are being employed um one of course is monolithic integration where um the actives and the wave guides are on the same die uh so everybody everything has to be fabricated uh in a semiconductor material system mostly inum phosphide because it has a band Gap that is suitable for uh near infrared um light emission detection um and uh one great advantage is that once you have fabricated your chip you have your Optical sub assembly so you do not need to do any uh assembly at this stage just uh some module packaging
[06:10] Fiber coupling, that's it. However, uh, you're intrinsically limited by the properties of the material.
[06:15] For example, if so, you want to say go to, um, wave shorter wavelength for example, indivisible.
[06:23] Um, we want to fabricate a laser that emits, um, indivisible, a tunable laser.
[06:32] Um, then this material would be out of question. Um, so if you want to go to other wavelength regions using a monolithic integration approach, you have to do all the development all over.
[06:47] Um, and a second thing that you need to take care into account in monolithic integration is that even though, um, you might be able to fabricate, for example, lasers and detectors and modulators and waveguides on a single chip, um, there are usually some tradeoffs in the manufacturing between all these different components.
[07:11] So uh usually the specifications that you get from um these elements on monolithic integrated circuit are not as high as you would get from uh components that are fabricated on dedicated W runs.
[07:28] For example dedicated lasers dedic modulators dedic detectors um in hybrid photonic integration.
[07:35] On the other hand we guides and actives are fabricated on separate D um so actives again usually semiconductors.
[07:44] Um this can be inosi for example for lasers but can also be Gallum arenite for laser shorter wavelength or silicon uh detectors um couple to passive waveguides for example in silica silicon n poly State um and nonlinear Optical elements for example periodically called with imate and KTP um here on the top are
[08:12] some examples uh from recent hybrid pic.
[08:17] integrated circuits one from hhi uh then.
[08:20] we have here a hybrid laser from lionic.
[08:23] and I am sure that dimitry will talk a bit more today about hybrid.
[08:30] hybrid lasers um and here one recent example from epfl with the laser at shorter wavelength and.
[08:39] um for these hybrid integrated circuits uh obviously you need to assemble the different D um.
[08:45] you can do this via butt coupling.
[08:47] you can do this for example also via microtransfer printing that we will probably hear more about in the upcoming talk um but you have the advantage that you can combine um the optic components uh and and Noel functionalities on a single chip without having to redevelop everything from scratch once something changes and um.
[09:13] also you have advantages in terms of yield management because this har integration approach um allows for the use of non good dice that can be combined onto a single pick um.
[09:29] so these were the two um General introductory slides that I wanted to present and um with that I would like to go into some more details of what we are doing at hhi in terms of honic integration so um what we do is uh we combine sing components U semiconductor components such as lasers detectors modulators single detectors and passive wi guiding platforms as I've shown you before but what we also do is we integrate there in micro Optical bench approaches micro Optical elements such as isolators thin filters crystals and
[10:15] lenses and um this I want to introduce briefly to you today.
[10:21] um just a quick overview of what the wave guarding layer looks like um.
[10:27] this is uh based on polymer materials that are commercially available um.
[10:32] fabricated on 4in 6in rfer scale we are have the scaling to 8 in on the road map.
[10:38] uh we use single mode wave guides um with um rather low effective index contrast and uh we can just dice the chips and no coating and polishing is required because the reflective index of the wave guides is quite close to the refractive index of the standard single mode fibers.
[11:01] and um here we have one example of a hybrid integrated functionality on these chips in this case a tunable laser um where we have an in phosphite element here uh that is HR coated on the back.
[11:18] side and um anti-le coed uh on uh the coupling interface.
[11:23] um that is coupled but and coupled towards a polymer based chip uh with a wave guide where we have an inscribed bra grading and this Brack grading acts as the second mirror for the laser cavity and it is uh tunable in by means of uh sorry uh by means of therm Optical tuning and uh in this way we were able to realize tunable seent lasers.
[11:53] um but the same approach can be used for shorter wavelength so this is one of the beauties of the har integration uh concept um so we leave everything as is adapt the parameters here bit exchange gain chip and in this way we can realize tunable lases for 1064 nanometers and for 785 nanom um using other gain elements and
[12:20] um these lasers are then building blocks
[12:23] that can be used to fabricate more
[12:26] complex photonic integrated circuits uh
[12:28] for example for staning for
[12:30] communications and for cor
[12:33] Technologies um one other
[12:36] functionality um that I briefly want to
[12:39] introduce is the use of thinam
[12:41] elements um so despite having Optical
[12:46] filtering functionalities that is wave
[12:49] guide integrated as is usual in photonic
[12:51] integration uh we also have the
[12:54] possibility to use these thin elements
[12:58] these are basically very thin dialectric
[13:00] layer Stacks as you know them from
[13:02] classical Optics where you have coated
[13:05] lenses dial diic mirrors and the like
[13:10] and um in this way we are able to
[13:14] transfer efficient filter
[13:15] characteristics from free space into
[13:17] integrated Optics um on a small
[13:20] footprint and in a temperature and sensitive manner.
[13:22] um here's one example shown for polarization uh beam splitter.
[13:25] um that is quite effective with more than 40 DPS of polarization Extinction ratio and low insertion loss of below 70 pie from fiber to fiber.
[13:29] um here one example from quom Technologies uh where we have um a filter that suppresses the pump light um by more than 60 atbs in the wave guide on the integrated ship um which is very important for the generation of single photons and Photon Pairs and um a third building block on the chip that we use extensively is the um our micro Optical elements um where we have graded index lenses so um short.
[14:22] pieces of gred Ang this fiber that PO polish to an exact length to act as a cating or focusing lens um that are inserted into the pck itself in order to realize fre space sections on the chip where we can insert basically whatever we like for example um isolators as in as here uh with lower than 1 DB on chip loss in forward transmission and more than 40 DB Peak isolation um and um another thing that we can integrate using this approach are perodic old crystals for nonlinear Optics and um yeah with this I already come to some examples that I want to show to you today uh one example here from Communications um as photonic engine for transceivers U this is part of the terrific EU project um where we have um a w ratings as the multiplex and
[15:24] Dem Multiplex um functional building blocks on the chip.
[15:30] And um these are used to couple um arrays of externally modulated lasers and W photo diodes uh in order to realize transceivers for Next Generation data centers.
[15:45] And um here one example with HL photo detectors and HL EML arrays um demonstrating 800 gbit per second capability.
[15:59] And uh in The Next Step um we realized a 16 channel um um transceiver again using the same building blocks that we developed for the smaller versions um using a bigger polyb chip and yeah this is also one great um advantage of the honic.
[16:25] integration technique um is that you can and um have the active elements where you need them.
[16:31] here you see these small rays of active elements and this big chip with just a passive wave guides.
[16:38] which gives you a great cost advantage um compared to monic integration for these kinds of applications.
[16:45] and of course you need to also assemble it and this is something that we are also automatizing together with Partners um in this case with f cont um.
[16:56] where we have automatic contact in of the arrays automatic the fiber insertion here into the chip um active alignment of the emls that you see here.
[17:09] same being done for the photo diet arrays um that are also actively coupled to the chip um cured and then you have the optical sub assemble um.
[17:18] so this is also one important um thing that you need to always take into into account in
[17:27] hyic integration.
[17:30] um here another example from the European project terway which is for microwave Communications.
[17:33] so this is a hyic intergated chip uh that generates um microwave uh radiation for for example 6G networks.
[17:45] um here again we have these tunable lasers that are introduced.
[17:50] we have the optical isolator on the chip a quite unique functionality.
[17:54] um we have a modulator pick from inosi an Anna pick from Min phosphite and then finally a triex pick from Silicon nitrite from lonic and um I mean even though you see here various in phosphide PS um these are all optimized for their respective functionality.
[18:13] so these modulators optimized for modulation the antennas and the photo diets are optimized for their functionality and the gain ships are optimized to generate photons.
[18:24] um so again underscoring the
[18:32] advantage of H PL integation for these kind of very complex Integrations and uh one last example here from P Technologies um here we make use of the micro Optical bench where we insert a quite large periodically called KTP Crystal um that generates photom pairs uh from an input of 7 75 nanometers um generating Photon pairs at 50 50 nanometers um with orthogonal polarization um that are split by these polarizing Wing splitter that I introduced earlier and the pump light is suppressed by the thin F element with more than 60 atbs supression on the chip and indeed we can demonstrate phot pair Generations using this approach uh in a hybrid photonic integrated way and these Photon pairs are then available for more complex uh processing in the wave guide um on uh on
[19:35] photonic integrated circuits and yeah.
[19:39] with this um I'm already at the end of my talk and I'm looking forward to your questions.
[19:46] okay morit thank you very much for the nice introduction and for the great talk.
[19:53] I mean it's always uh fantastic to see this truly polyvalent poly board that uh you guys are working on at hhi and um indeed now we have time for questions.
[20:04] as as if as after each talk uh please use the the button to raise hand at the bottom of your Zoom screen if you have a question in mind and then I pass you the word.
[20:16] uh and in the meantime I'll just ask moris quickly so what are the limitations of the such platform that we should know about in terms of maybe size terminal budget and these kind of things and what's the overall technology Readiness level for commercial use um so in terms of um um small scale.
[20:39] picks I would say Um this can this is
[20:42] already in the field uh for some
[20:45] applications um I mean the the very
[20:47] complex picks that I've shown you before
[20:49] of course these are these look
[20:51] impressive but they are from research
[20:53] projects right um um uh one one thing to
[20:58] take into care into account on a
[20:59] technical level is of course um in this
[21:02] case
[21:03] for um for these passive wave guides um
[21:07] switching speeds are limited by the
[21:10] therm Optical effect so in the order of
[21:13] kilohertz maximum um so this is
[21:17] something that the applications then
[21:19] have to live with um I've shown um
[21:23] examples where we also coupled then the
[21:25] inum phosphite modulators next to the
[21:27] polybot ship again in order to achieve
[21:30] more highs speed modulation and this can
[21:33] then go up to tens of gahz um so um
[21:37] there are things to keep in mind of
[21:40] course but there are also ways to
[21:42] circumvent it again using the
[21:43] flexibility of the har
[21:46] regulation okay okay I see now uh thank
[21:50] you uh I see there are a couple of uh
[21:52] questions in the chat maybe Amir gimi
[21:55] from lithium would you like to ask one
[21:59] yeah I can unmute yeah
[22:01] can light so
[22:05] yes it's great it's ni again so what was
[22:08] the transparency window of this you know
[22:10] polymer platforms yeah um so
[22:14] transparency is usually um from around
[22:17] 450 nanometers um so blue up
[22:21] to around
[22:24] 1620 um but not not m
[22:29] right no m r not no okay these are
[22:33] polymer for shorter weblinks or the same
[22:36] polymer is is from Blue to
[22:40] 1600 um this is the same polymer
[22:45] yeah I mean of course there there are
[22:47] some um spectral features in the
[22:50] Spectrum if you scan it from the visible
[22:52] up to the infrared um but uh you can
[22:55] consider it transparent rly and in this
[22:58] range okay and the power
[23:02] handling
[23:04] um so we have um high power tests at
[23:09] 1550 nanometers um where we have
[23:13] um used up to 23 uh
[23:17] dbm 23 yeah um so this was okay and we
[23:22] also use it for applications where we
[23:27] have FC
[23:30] pses um and we do not see any issues
[23:34] there so with very high maximum Peak
[23:38] powers and um we do not see any
[23:41] issues thank
[23:44] you okay uh you can raise your hands
[23:47] again if you have questions I think
[23:48] there is one more in the chat from moris
[23:51] from toniki University can the B
[23:55] coupling be used for mass production
[23:57] he's asking
[24:00] um yes I would say so so um that is why
[24:03] we are also closely working together
[24:05] with equipment
[24:07] manufacturers um in order to have
[24:10] processes that are in the end
[24:13] scalable um so the the process that we
[24:17] develop here can then be directly
[24:20] transferred to um machines U that are
[24:24] specifically fabricated uh for uh
[24:28] manufacturing I mean the machines that
[24:30] we have here at of course for for
[24:33] R&D um but the process that we use can
[24:37] be
[24:40] transfered okay uh maybe last question
[24:42] from the chat uh from meat BOS from ex
[24:48] ex provance University do you think you
[24:52] would need the non impr liography
[24:54] technology for future to replace your
[24:57] Technique and
[24:59] yeah
[25:00] um we have it and we are investigating
[25:03] it um and um yeah maybe uh in the next
[25:11] uh meeting in one year's time or so I
[25:13] can uh show some results on
[25:15] that okay okay sounds good looking
[25:18] forward to that okay so with this uh we
[25:20] thank you moris again for the very nice
[25:22] introduction uh always good to have you
[25:24] with us and um I mean the next technique
[25:27] is also very exciting and again serves
[25:29] as a very nice example of the efficient
[25:33] hybrid uh bonics uh so this technology
[25:37] is developed by Excel print and uh rero
[25:40] ly the supply chain scientist from Excel
[25:44] print will tell us more about
[25:45] Ito whenever you're ready thanks for the
[25:48] kind introduction Ian I will start
[25:50] sharing my slides for today
[25:59] you see them yeah just go full screen
[26:02] yeah we go full screen now right so here
[26:06] today I'll try to give you an overview
[26:08] about the last advancements in microt
[26:10] transfer printing and how we're working
[26:13] to bring that technology in uh
[26:17] production so the core technology as you
[26:20] might have heard uh is a microt transfer
[26:22] printing which is a pick and place
[26:24] technique based on the VIS Scholastic uh
[26:27] properties of the pdms of a pdms stamp
[26:31] uh our business model is a licensing of
[26:34] the technology so we sell the technology
[26:37] for you to uh create products with
[26:40] microt transfer printing inside aside of
[26:42] that we provide a few Services uh
[26:46] example uh development of microt
[26:48] transfer printing Solutions which means
[26:50] how to make your components or
[26:52] substrates microt transfer printing
[26:55] compatible and how to develop them
[26:57] microt transfer printing process
[26:59] itself uh we also provide microt
[27:02] transfer printing services we have a few
[27:05] tools at the at our headquarters uh in
[27:09] Ireland in Cork tindal National
[27:12] Institute so we have access to the clean
[27:14] room of the uh research uh institution
[27:19] uh we also have a subsidiary in um in
[27:22] the Research Triangle Park at micros in
[27:26] North Carolina where we have an another
[27:28] few tools and uh the development center
[27:32] for the tools which is actually led by
[27:35] our sister company uh called X display
[27:38] which is also focusing uh on the on the
[27:42] microt transfer printing for displays
[27:44] everything everything else belongs to us
[27:48] um in terms of development in terms of
[27:50] numbers about acceler print we have 700
[27:53] plus patents 100 million plus in
[27:56] development 18 years of uh commercial
[27:58] development 85 customers funded project
[28:01] fund plus many years of experience and
[28:04] 20 plus printers worldwide this number
[28:06] is actually doubling in the last uh 6 12
[28:11] months um as we had many request
[28:14] especially in Europe and by uh new RTO
[28:19] and companies interest in developing new
[28:21] solution onp uh in terms of projects uh
[28:25] we are directly involved in number of EU
[28:29] projects uh example inpire Ambrosia ban
[28:32] the M
[28:33] engine um and we've been involved in a
[28:36] successfully closed project in the past
[28:39] uh there is also a good number of
[28:42] projects where that we support uh from
[28:45] the back but we're not directly involved
[28:47] in them and this is showing how the
[28:50] ecosystem of Partners working on ntp is
[28:54] uh is able to work on their own on that
[28:57] technology and to develop new solution
[29:00] which is also showing how the maturity
[29:02] of the technology is
[29:04] increasing we also uh collaborating with
[29:08] uh pilot lines and or there are there
[29:11] are numbers of EU pilot lines that are
[29:13] adopting MTP as a standard technology uh
[29:16] in their offer uh in particular we have
[29:20] uh recently we have the photonics FB
[29:23] which is actually building a small
[29:26] supply chain for the phosphite uh
[29:29] integration on Silicon nitrate and
[29:32] potentially on uh SOI through microt
[29:35] transfer printing there is also a number
[29:38] uh of projects with industry it's
[29:41] usually about 20 between new projects
[29:45] that come in and projects that
[29:48] close um so how about the microt
[29:51] transfer printing process how that works
[29:54] well for integrated photonics uh we can
[29:57] imagine that we choose the uh Target
[30:00] layout so the peak layout photonic
[30:02] integrated circuit layout starting from
[30:05] that geometry we can uh build or
[30:09] fabricate a source wafer with the
[30:11] devices to be integrated that will have
[30:14] a pitch matching the the you know the
[30:17] the target layout uh after fabrication
[30:21] uh the chips are usually uh released uh
[30:24] by eroding or etching usually a wach a
[30:28] sacrificial layer an anchor system holds
[30:31] them during the undercut holds them to
[30:33] the substrate during the undercut so the
[30:36] final result is a suspended coupon that
[30:39] can be picked up and transfer printed uh
[30:42] through a pdms stamp which also has a
[30:45] it's usually pattern with a layout
[30:48] matching The Source wafer and also the
[30:50] target wafer in this way we can mix and
[30:53] match different materials different
[30:56] device thickness on the same platform
[30:58] uh and uh in particular we can integrate
[31:02] many components in parallel increasing
[31:05] throughput and making the technology
[31:07] particularly suitable for high volume uh
[31:10] heterogeneous integration usually the
[31:13] last step of the process is the
[31:14] electrical interconnection the optical
[31:17] interconnection is achieved by passive
[31:20] alignment and align uh through alignment
[31:23] marks and P
[31:25] recognition so here I just wanted to
[31:27] give you a a visual example of the
[31:32] technology so here we have a source
[31:34] wafer where we pick up uh two coupons
[31:38] part of a larger array and through
[31:41] alignment marks position on the Target
[31:43] and on the coupons uh the patter
[31:46] recognition elaborate the correct
[31:48] alignment and then we go down with this
[31:51] uh transparent stamp made by pdms and
[31:55] we're able to release the coupons on the
[31:58] target pick up and release are basically
[32:02] dependent on the speed of the stamp uh
[32:05] the speed that the stamp is spilled off
[32:08] the substrate so basically at high speed
[32:10] we're able to generate strong addision
[32:12] to the coupon and pick them up and uh by
[32:16] peeling off slowly the stamp we're able
[32:18] to release them in the in the Target
[32:20] cell
[32:21] stre so why using microt transfer
[32:24] printing for integrated photonics what
[32:27] the main features and benefits in
[32:29] particular for the starting waer uh we
[32:32] can accommodate usually it's a 35 so
[32:35] pretty expensive material we can AC
[32:37] accommodate a highly dense array of
[32:40] components so we can increase the source
[32:43] wafer
[32:44] exploitation uh we can also pre uh
[32:47] fabricate the devices completely before
[32:50] transfer which allows non good ey uh but
[32:53] it's also possible to integrate coupons
[32:56] of material and then postprocess them on
[32:59] the target
[33:00] wer in terms of transfer as I said the
[33:04] technology allow parallel integration of
[33:06] many devices H and we can also Mi mix
[33:10] and match different materials and stock
[33:12] uh giving the technology I throughput
[33:15] and
[33:16] flexibility uh in terms of printing we
[33:18] work with passive alignment uh we can
[33:21] reach below 0.5 Micron uh we already
[33:25] working on a a strategy to to reach
[33:28] 01 Micron alignment so 100 nanometer we
[33:32] already demonstrate that for a single
[33:34] post and small arrays but still it's
[33:37] it's R&D level this technology is not
[33:40] used uh in production
[33:43] yet so in terms of microt transfer
[33:46] printing uh integration of uh photonic
[33:52] device over substrate we did that again
[33:54] for operational devices or just material
[33:57] single post or or as AR Ray uh the type
[34:01] of substrate where we integrate these
[34:04] three five or other components are
[34:07] silicon silicon dioxide glass
[34:09] arenium phosphite also SOI silicon
[34:12] nitride on insulator as well te filing
[34:15] lithium niobate uh basically for the
[34:20] integration you can proceed in two main
[34:22] ways by integrating the components uh
[34:25] directly on the platform or through or
[34:28] enhancing the Addis through a thin layer
[34:31] of adhesive which is usually around 30
[34:34] nanometer but it can be Ain as 5
[34:36] nanometer uh the light coupling scheme
[34:39] that we can reach with this technology
[34:40] is uh Edge coupling evanescent coupling
[34:43] and GR in coupling the interesting thing
[34:45] is that we have these small devices uh
[34:49] that can very thin because we only
[34:51] transfer the AP and um we we can
[34:55] basically integrate them on ship with
[34:57] this light coupling scheme so you can
[34:59] have an an edge couple laser on ship I
[35:02] will show you some uh example now so
[35:05] here we have a laser inum phosphate
[35:07] integrated in a recess boot couple to a
[35:10] polymer wave guide and then a vanent
[35:13] transfer the light to to an SOI uh here
[35:17] you can see the laser lighten up and the
[35:19] light coming out of the SOI um wave
[35:25] guide on the at the other end we also
[35:28] show that we can integrate in electronic
[35:31] integrated
[35:32] circuits uh photo diodes
[35:35] pixels uh we can create interconnects
[35:38] with uh Lads PDS uh and polymer weight
[35:44] guides we integrated PD cells uh some
[35:48] more recent uh nice results from the
[35:51] lumos project we had some Edge couple
[35:54] different components like PDS or
[35:57] modulators amplifiers Etc another nice
[36:01] example from the kaladan project um
[36:04] integrated circuits on the Silicon
[36:07] photonic platform from IMC uh where is
[36:11] also integrated uh with Quantum do
[36:14] lasers that is also integrated with
[36:16] quantum dot lasers and so this enable a
[36:20] so-called coage Optics uh layout for
[36:24] specific
[36:25] application uh also we we uh we had a
[36:28] nice example of uh some of the partners
[36:31] in the ecosystem we're trying to build a
[36:33] value chain for or build uh this supply
[36:36] chain for microt transfer printing where
[36:39] partners are tindal and corstone
[36:41] integrate these photo diodes coming from
[36:43] tindel into the corstone platform with
[36:46] three different uh light coupling
[36:49] schemes the three main one that I
[36:51] mention here we have uh one of the first
[36:54] laser integrated uh boot cup on ship
[36:58] with an SOI wave guide with less than
[37:02] 100 nanometer overlay uh this last
[37:06] example here is the laser integrated by
[37:09] Rockley a very high TRL in this case we
[37:12] are at about 8 n uh so the laser was uh
[37:17] close to go or ready to go in production
[37:19] as you may know Rockley had to shut down
[37:22] the research center for obvious reason
[37:25] so this project was start St but you
[37:28] know we're working to to move forward on
[37:31] uh on this activity as well U some last
[37:36] result in the in the last two three
[37:39] months uh IMX shown or the photonic
[37:42] research group actually shown a nice
[37:45] approach to integrate the same SOA 35
[37:48] over different uh photonic platform in
[37:52] particular C nitride and lithium niobate
[37:55] uh by integrating in the tre5 over a
[37:58] silicon photonic interface so with a
[38:01] double uh Integra erogeneous integration
[38:04] of silicon photonic interface and5 you
[38:07] can basically integrate the ent5 over
[38:10] different different platform and get the
[38:13] same uh functionality or similar
[38:16] functionality another nice example is
[38:18] the collab come from the collaboration
[38:21] between tindal and Intel so they
[38:24] integrate a a no band dbr laser on a
[38:27] silicon photonics so they basically
[38:29] integrate a coupon of material and then
[38:32] postprocess them after
[38:34] printing similar to uh other work made
[38:38] by Intel uh so the results is very
[38:41] promising and it's moving forward as
[38:43] being published recently another nice
[38:45] example is the E uh evanescent e shown
[38:49] by kle uh more recently as well so and
[38:53] finally uh to close we are as as I
[38:56] mentioned we are working to create uh a
[38:59] Supply Chain by working with uh all our
[39:03] partners uh in the ecosystem that are
[39:06] focusing on microt transfer printing so
[39:08] the main goal uh again is to accelerate
[39:11] microt transfer printing in production
[39:13] why because of our business model which
[39:15] is licensing we we will get more Revenue
[39:20] as more devices or products will include
[39:23] a microt transer printing in production
[39:27] uh so the supply chain was built Again
[39:30] by leveraging on Partners already
[39:32] working on ntp but is not excluding uh
[39:37] um companies that are interest into
[39:39] adding MTP uh to their
[39:42] portfolio um so the main activities at
[39:45] the moment consist in monitoring
[39:48] supporting the the the suppliers and
[39:51] facilitate networking between them to
[39:54] satisfy uh customer needs as you see
[39:57] from this um uh diagram at the bottom we
[40:01] have eight main areas uh at the moment
[40:03] we include about 50 active suppliers but
[40:06] we classified about 150 in total the
[40:10] main areas are components subrate mty
[40:14] print MTP printing sites for example xab
[40:18] is going to be the site to scale Up the
[40:20] Volume once we will have enough volume
[40:23] for integrated photonics uh we are or
[40:27] also working with Team film interconnect
[40:29] partner design Partners packaging
[40:31] Partners testing and Equipment provider
[40:34] so if you're interest in joining this uh
[40:38] micro in using uh microt transfer
[40:40] printing and be part of the value chain
[40:44] for it feel free to get in touch and uh
[40:47] we will see what's the best way to to to
[40:50] work together as we move forward so
[40:53] finally ntps abling technology for
[40:56] integrated photonics is demonstrating to
[40:58] be quite valid and promising for it we
[41:01] have multiple lensy moving in
[41:04] commercialization at the moment we
[41:06] should have the first product out in 20
[41:10] end of 2024 beginning of uh
[41:13] 25 so with that I think I'm done for
[41:17] today uh for this presentation and I'm
[41:20] happy to take
[41:25] questions can see
[41:35] even iance you're still muted think
[41:38] you're muted oh yeah sorry yeah so
[41:41] thanks uh for the presentation rero uh
[41:43] great technology nice
[41:45] presentation um I'm sure there will be
[41:47] questions uh please just push the harand
[41:50] button at the bottom of your screen um
[41:53] there is one already from Yorn from
[41:55] Epiphany yor would you like to ask it
[41:58] yourself yes sure so thanks again for
[42:01] your presentation it really looks like
[42:03] you have a nice mix and match of
[42:05] technology that you could enable yeah so
[42:08] yeah we as Epiphany are a photonic
[42:10] designer so the question would be what
[42:12] restrictions do we have when we need to
[42:14] design for your
[42:16] technology yeah I mean main restrictions
[42:19] uh well at the moment we're working on
[42:21] standardization because as you can
[42:23] imagine this a not topic uh but main
[42:26] restriction are in the printing spot
[42:30] characteristics or parameters so the
[42:32] area on the PE for example where you
[42:34] like to integrate a laser or a photo
[42:36] diode uh there might be some geometry
[42:39] restrictions but nothing fancy is all
[42:42] standard processing and uh main
[42:46] restrictions for devices uh is that uh
[42:50] it might seems obvious but you have to
[42:52] to think about the device as a coupon
[42:55] which means you have a a perimeter for
[42:58] all the parts of your device to be
[43:01] included so that means
[43:03] that if the coupon let's say is long 1
[43:06] mm and 80 Micron wide means you have to
[43:09] arrange contacts wave guides and and
[43:13] facets maybe all in this in within that
[43:16] profile and with it within that
[43:21] geometry all right hope this answer the
[43:24] the question and how do you supply for
[43:26] example the the the designers with uh
[43:30] these
[43:31] restrictions we have a yeah we have a
[43:34] set of documentation we can work
[43:36] together with designers and uh
[43:40] Fabricators so that's the idea as well
[43:42] for the supply chain to to bridge uh the
[43:46] Gap you know and put in contact all the
[43:48] partners that are working with microt
[43:50] transer Printing and accelerate the
[43:53] whole
[43:54] development um yeah I mean in terms of
[43:58] what we provide to designers we there is
[44:01] no special rules as you know these are
[44:04] photonics devices and photonic
[44:06] integrated circuits so Standard Process
[44:10] apply again we we have a few
[44:12] restrictions but we have guidelines and
[44:14] documentation that we can provide to
[44:16] design partners for for de developing uh
[44:20] building Standard Building Blocks or
[44:23] eventually pdks or adks as well yeah
[44:26] yeah
[44:29] thanks okay I hope that ANW your
[44:32] question um anyone
[44:36] else um if not I guess we think hello
[44:41] yeah yeah I have a question
[44:43] sorry can can you hear me yes yes yeah
[44:47] yeah oh okay uh in fact I wrote the
[44:50] question in the in the discussion but it
[44:54] doesn't show so so I uh thank you for
[44:57] the talk so I'm Johan from Huawei
[44:59] technology France I have a question so
[45:02] about the micro printing uh uh transfer
[45:07] is this really uh I mean a
[45:10] universal uh technology for all kinds of
[45:13] chips with different materials and size
[45:17] uh I mean for dice of different sizes
[45:19] and
[45:20] materials is uh do the parameters of the
[45:24] coupons uh grabbing moving and releasing
[45:28] for example the strengthen or the or the
[45:32] uh moving speed Etc all kinds of
[45:35] parameters require a lot of adaptation
[45:38] tests to be stable so this is my
[45:42] question or uh or still need complicated
[45:46] parameters calibration every time Case
[45:49] by
[45:50] case question yeah for integrated
[45:53] photonics uh we have developed uh microt
[45:57] transfer printing process for most of
[45:59] the materials and devices so in that
[46:02] sense you know we have an advantage we
[46:04] we don't start from scratch so you know
[46:07] we can leverage on the experience of our
[46:09] partners and of our company to to
[46:12] support quick uh deployment of for
[46:15] example the rockl laser was developed
[46:18] starting from the tinda laser and you
[46:21] know in uh in a short period of time we
[46:25] were able to to have it in production I
[46:28] I would say the main adaptation usually
[46:30] goes between transferring the process
[46:32] developed in a research center into a
[46:35] production line which has usually more
[46:37] constraints but you know we're working
[46:40] towards that as well especially in the
[46:42] for the indium phosphate in the inspired
[46:44] project uh smart photonics is developing
[46:48] devices and you know their process is
[46:51] going to be suited for a production line
[46:54] so you know okay yeah okay okay okay
[46:57] I'll just thank you no
[47:00] problem all right if there no further
[47:04] questions we thank rero again for a
[47:06] great presentation and yes if you feel
[47:09] like you need the help of excel print
[47:11] feel free to contact him or
[47:14] me um yes so the next uh presentation
[47:18] will be given by laa Horan the staff
[47:20] engineer and product management
[47:22] management lead at vangard
[47:25] automation thank you Ian
[47:27] yes when hope you can I hope you can see
[47:30] my screen yes floor is yours great so
[47:33] I'm representing Vanguard Automation and
[47:36] Vanguard automation work on the phonic
[47:38] connectivity side of hybrid integration
[47:41] and in this talk I want to show you H
[47:43] integration foric connectivity using
[47:46] tonic wire bonding and fast attached
[47:48] micro lenses so tonic wirebonds are
[47:52] freeform Optical wave guides which can
[47:54] connect two Optical components together
[47:57] and from the mode matching and con any
[48:00] alignment and mismatches and fast
[48:03] attached lenses are lenses that are
[48:05] printed onto the surface or edge of your
[48:08] phic components and this is all done by
[48:11] 3D printing so vard we believe in
[48:14] passive alignment of components using
[48:17] adive manufacturing with 3D printing to
[48:20] perform theity and assure L losses
[48:27] yes okay this slide shows our motivation
[48:30] at Vanguard and we want to tackle st's
[48:32] packaging and assembly challenges this
[48:35] diagram on the right hand side pretty
[48:38] much symbolizes the challenges So Def
[48:41] find my pointer so you see here the
[48:43] large mod field size of a single mode
[48:46] fiber 10 Micron and then in the middle
[48:48] here the smaller mod field size single
[48:51] of a silic phonics wave guide or
[48:53] elliptical mod of Fifi wave guide to
[48:57] lots of different materials different
[48:58] mode fields and to get low loss you want
[49:00] to match your mode Fields uh you need in
[49:04] some cases to have the loss High
[49:06] position assembly alignment you also
[49:09] need fast rep for packaging to make it
[49:11] manufacturable and to be reliable under
[49:13] various conditions such as T cord
[49:16] Environmental Testing because of this
[49:19] range of criteria we see that over 30%
[49:22] of the cost of your product is really
[49:24] driven byic Packaging
[49:28] integration so Vanguard automation
[49:31] supplies solutions for for performing
[49:34] tonic integration uh by additive 3D
[49:37] printing uh so we have two solutions as
[49:40] mentioned earlier on the left hand side
[49:42] theic wire bombs which are the fre form
[49:46] 3D free form Optical wave guides that
[49:48] can connect two components together
[49:50] foring mod field matching and
[49:52] compensating for any offsets in your
[49:55] assemblies you also have a very dense
[49:57] Integrations the other solution is the
[50:00] fast attached micro lenses which can be
[50:02] printed onto the edge or Surface of your
[50:05] Optical components and allow for a
[50:08] relaxation of alignment TS the T wi
[50:11] bands can compensate this alignments up
[50:13] to plus 30 microns whereas fast fast
[50:16] attached lenses can relax your alignment
[50:20] to plus minus 15
[50:23] mic so I want to show in the next few
[50:26] slides some recent applications from our
[50:29] partners and ecosystems where they did a
[50:32] hybrid integration using ton bonds and
[50:35] lenses this slide tackles the son boms
[50:39] you can see here on the top here a
[50:41] recent paper from Rochester Institute of
[50:44] Technology which was published at EC
[50:46] this year where they did hybrid
[50:48] integration onto an a reference chip on
[50:52] this a reference chip they place two um
[50:55] GP lasers
[50:57] and connected these laser to the chip by
[51:00] wire bonds and then again coupled out
[51:02] from this chip to a fiber also using wi
[51:05] bonds this entire assembly has an
[51:08] insertion loss of less than 4 around 4
[51:10] GB so you have four different interfaces
[51:13] to connect with 4db
[51:15] loss then being you do not need to
[51:18] active alignment for your Active
[51:20] Components with low loss and also
[51:23] because you use the same interface on
[51:25] either side will make chip or chip def
[51:28] you use same pdk for your
[51:31] connectivity our ecosystem partner
[51:33] dreams tonics have also been providing
[51:36] the same service for a number of years
[51:38] where they do hyrid integration of Las
[51:41] on chips and chipu fivr I think recently
[51:45] they announced they have an ATK with
[51:47] Tara semiconductor where they're
[51:48] providing this service with taric
[51:50] conductor
[51:54] chips another example is our recent
[51:57] collaboration with poet Technologies and
[51:59] manard automation so in this
[52:02] collaboration we are printing 3D um micr
[52:07] lenses onto the PO interposer to
[52:10] maximize the coupling efficiency between
[52:11] the interposer and the relat is Place
[52:15] onto the p
[52:16] interposers uh these Technologies couple
[52:19] and compliment other very nicely because
[52:21] here poet really focuses on having
[52:25] passive passive um WF level scaling and
[52:29] processes for the for the product so
[52:32] here the lasers are placed passively
[52:34] onto the poses and the lenses work
[52:38] to maximize the cting efficiency meaning
[52:41] reduce power consumption and also using
[52:44] less
[52:46] um sorry using less materials to create
[52:49] Theos so really reducing material
[52:55] costs and finally an example of simut
[52:58] Tomo electric the last year simut Tomo
[53:01] showed at ofc the very first
[53:03] demonstration where commercial Optical
[53:05] module had benefited or had a 3D pinted
[53:09] component inside the IM FY
[53:13] devices and so with this paper they
[53:16] they've printed the three lenses inside
[53:17] the component and really test show they
[53:20] indry proven and passive Tel Cordia 4
[53:24] standards which means going through
[53:26] environment testing Reflow soldering D
[53:28] bonding shock testing and higher power
[53:31] operation we see to most of the benefit
[53:33] here is to improve cing efficiency where
[53:37] they able to reduce their losses by 1.5
[53:39] DB per lens pretty significant also
[53:42] relax their alignment T to 1.6 microns
[53:45] and really reduced their chip size they
[53:48] didn't need the spot size converters
[53:49] anymore on chips they could use these 3D
[53:51] printer senses for this and make their
[53:53] chips 25% smaller
[53:58] so we shown a wide um we shown
[54:00] capibility with a wide range of
[54:02] materials and platforms of different
[54:04] foundies it's not all one it's a simple
[54:07] selection so each of these examples to
[54:10] three here you'll see fiber on the left
[54:12] hand side and chip on the right for AMF
[54:16] similar for L Tech chips on the left
[54:19] here five sorry fiber on the left and
[54:21] chip on the right and in this examp you
[54:24] with M China you have fi here and the DI
[54:28] on the right hand side and for each of
[54:30] these connects we have 1.5 DV loss for
[54:34] fiber to chip actually the LI results
[54:37] are new from today since you hear the
[54:40] the range of losses for transmission for
[54:42] these BL on
[54:44] chips on average 1.5 DB
[54:49] loss so we have a path to implement fun
[54:51] integration with f phography for for
[54:54] customers and partners and we do this
[54:57] slowly to really implement the
[54:58] technology into industry so the first
[55:01] step we recommend that um the industry
[55:04] keeps their their standard production
[55:07] process steps and simply adds 3D printed
[55:10] elements with active alignment into
[55:12] their products and the idea here is to
[55:15] prove coupling in deals those to prove
[55:18] the components for all different testing
[55:21] and requirements the that the customer
[55:22] might have in the second step we remove
[55:26] active alignment necessary and do 3D
[55:30] printing with passive alignment with
[55:32] relaxed alignment T to plusus 15 microns
[55:35] so showing the customer passive assembly
[55:38] is a
[55:39] viable and in the third step we move to
[55:41] T bonding and really gets full benefit
[55:44] of relaxed face tolerances of plus minus
[55:47] 30 microns with a very compact coupling
[55:50] very high yield and a high
[55:54] packaging this is all done with the
[55:57] Vanguard SYM which comprises of an array
[56:00] of machines for the 3D printing and
[56:03] pre-imposed
[56:04] processing of your chips full software
[56:08] for machine Control process development
[56:10] and management of your processes full
[56:12] Suite of materials to do the 3D printing
[56:15] and encapsulation and All Professional
[56:17] Services training visibility
[56:20] collaboration process development and
[56:22] support in
[56:24] meetings and finally I just want Tuesday
[56:27] that next week we meet us at eock in
[56:29] Frankfurt at boot c104 also we have the
[56:32] market progress talk where you'll hear
[56:34] much more detail about next Generation F
[56:37] integration froms the of and uh lastly
[56:42] questions but also in terms of what we
[56:44] can do for ethic members what ethic
[56:47] members can do for us we're looking for
[56:49] collaboration and opportunities where we
[56:51] can really show them that technology is
[56:53] industry viable and works for wide range
[56:56] of customers to bring this technology
[56:58] from where it stands into a viable indry
[57:02] proving production of
[57:04] course thank
[57:07] you thank you laa uh great presentation
[57:10] very exciting technology you're showing
[57:12] us um let's see if if there are any
[57:16] questions in the room
[57:18] please push the raise hand
[57:21] button in the meantime yeah I'm
[57:23] wondering maybe you can say a few words
[57:25] about the through
[57:26] of of the machines how fast can you do
[57:29] this wire bonding in fact like wire
[57:32] bonding I think I you saw the demo at
[57:33] ISM in in June this year so we
[57:37] demonstrated there at chip to chip with
[57:39] about I think it was 10 seconds for
[57:41] detecting the two wave guides and then
[57:43] around 20 seconds to print theic wire
[57:45] bombs so depending on your mode Fields
[57:49] matching depending on the the space
[57:51] between your chips depending on a wide
[57:53] variety of of parameters can
[57:56] from 20 seconds up to around 3 minutes
[57:59] so depending on on what you want to
[58:01] connect together very chip okay that's
[58:05] impressive all right uh I see there's a
[58:08] question from Stefan luden from meta
[58:10] please Stefan yeah my question is about
[58:13] uh the alignment the p with alignment is
[58:17] uh pretty coarse with 55 micrometer what
[58:19] can you get with active alignment are we
[58:23] talking significantly less than
[58:25] micrometer
[58:27] uh 50100 nanometer or what is the the
[58:31] the the CPK that you can get here I just
[58:35] step back a little bit um so what we're
[58:38] doing is we um we allow customers to
[58:41] have P alignment by doing the
[58:44] connectivity with um with 3D adive
[58:47] manufacturing so we can detect your wave
[58:49] guides where your wave guides are placed
[58:51] down to 100 nmet where where we detect
[58:54] them we can print from that point so
[58:56] print together uhic interconnect between
[58:58] two
[59:01] chips so it doesn't matter for us how
[59:03] you align you can have up to plusus 30
[59:06] microns of of this alignment and still
[59:09] have the same
[59:11] insertion of connectiv between two
[59:15] components but when you one is did the
[59:18] height where you say okay you can pre
[59:20] select uh with a certain uh uh classes
[59:24] and say they uh match with maybe 100
[59:27] nmet in height but how about when you uh
[59:31] have a lens you need X and Y uh and z um
[59:35] for the active alignment of this Optical
[59:38] lens when you put it in front of an dbr
[59:42] L or something like
[59:44] that um so then depending on the the
[59:47] lens so depending on the size of the
[59:49] lens you can compensate misalignments
[59:51] from plus- one micron up to plus- 15
[59:54] microns it depends on the mode field you
[59:56] have and the size of the lens you like
[59:58] to print how much you like to expand
[59:59] your
[01:00:02] beam this answer to the
[01:00:04] question yeah
[01:00:07] okay okay good to hear uh maybe now
[01:00:11] question from Andrew light
[01:00:15] logic yes hi um so just briefly what is
[01:00:19] the general range of temperatures for
[01:00:20] the process of the uh wire bonds uh for
[01:00:25] the chips in
[01:00:26] uh
[01:00:28] manufacturing range of temperature can
[01:00:30] survive you mean uh R range of
[01:00:33] temperatures for the uh the the actual
[01:00:36] process of printing the wire bonds so um
[01:00:40] yeah so we generally do this at room
[01:00:43] temperature okay so we stipulate that
[01:00:45] the customer has a room temperature
[01:00:46] around
[01:00:48] 21 degrees plus minus
[01:00:51] one that's the specification no customiz
[01:00:54] print also at CER temperature
[01:00:56] at higher temperatures okay very good
[01:00:59] thank
[01:01:01] you and uh yeah yeah Stefan do you have
[01:01:04] another question no not yet uh I'm
[01:01:08] wondering maybe last question laa
[01:01:12] um yeah so yeah the first of all yeah
[01:01:15] this temperature that uh we just
[01:01:17] discussed so locally there is also no
[01:01:19] temperature applied to the to the to the
[01:01:21] mar no no we do everything in room
[01:01:24] temperature but you also the the machine
[01:01:28] is enclosed as you've seen our machines
[01:01:30] they're enclosed and metal encapsulation
[01:01:32] the temperature inside remains
[01:01:34] relatively stable temperature in real
[01:01:36] time to okay and then do do do you
[01:01:40] provide at vard this as a service like
[01:01:42] if somebody wants wants to just try do a
[01:01:45] photonic wi bonding on their chip do to
[01:01:49] collaboration really want to show the
[01:01:50] technology is working so we're open to
[01:01:52] collaboration we also have a a network
[01:01:55] called ass some Partners so we can also
[01:01:58] um provide you with the names and help
[01:02:00] and support you to bring your process to
[01:02:03] their assistance if it's a larger a
[01:02:05] larger body okay and you would be the
[01:02:08] right person to to contact for for this
[01:02:10] for this quer pleas contact me any talk
[01:02:14] okay okay very good thank you for the
[01:02:18] answers and the great talk and I now
[01:02:20] pass the word to the next speaker which
[01:02:23] is York smolansky the business
[01:02:24] development manager
[01:02:26] from
[01:02:27] nanoscribe York you're ready hello yes
[01:02:31] hello
[01:02:32] everybody uh let me quickly see that I
[01:02:35] choose the right bit
[01:02:37] image I think this is one yeah can you
[01:02:40] see my image yes good is yours good um
[01:02:45] yeah I'm Yak splansky from Nanos Skai
[01:02:47] business development manager and I'm
[01:02:49] gonna talk about fabrication of optical
[01:02:51] intercos for pic to have enable low loss
[01:02:54] coupling solution and this in a very
[01:02:56] easy way and possible uh but first let
[01:02:59] me start a little bit about nanoscribe
[01:03:02] themselves we are 15 years old we
[01:03:04] introduced the printing technology in
[01:03:07] 2007 to the market we have more than 250
[01:03:11] system installed worldwide 100 employees
[01:03:13] and we have a subsidiary in the US and
[01:03:16] in uh China for service and
[01:03:19] sales um yes and more than 4,200 square
[01:03:23] meters space for office tests and
[01:03:26] feasibility studies in order to prove
[01:03:28] what we are doing a little bit overview
[01:03:32] uh Beyond this what we are doing here is
[01:03:34] we we have these kind of printing
[01:03:37] Technologies used for life science
[01:03:39] microfluidics micro needles material
[01:03:41] engineering so you see some M divers
[01:03:43] here a lot in micro Optics and all what
[01:03:46] we talk about today is photonic
[01:03:48] packaging and photonic integrated cets
[01:03:51] um and I will explain this a little bit
[01:03:53] late more where we are placed there
[01:03:56] so integrated photonics as I have
[01:03:58] already explained a couple of previous
[01:04:00] speaker Mor from hhi for example is a
[01:04:04] product which is based on different
[01:04:05] components and you need to mix and match
[01:04:07] the different mode fields and diameters
[01:04:11] in the end you will have a package
[01:04:12] prototype like we have here from the
[01:04:14] handeld OC Pro uh project where you have
[01:04:18] the die let me quickly put on the laser
[01:04:22] pointer where you have the pck here on
[01:04:24] top a fiber connector
[01:04:26] and then we have basically printed here
[01:04:29] as you can see on that side some uh
[01:04:32] Optical lenses in only only in order to
[01:04:34] do free space coupling in this case so
[01:04:36] it's not fiber coupling it's order free
[01:04:39] space as it is for OC systems so we
[01:04:41] printed precisely align these kind of
[01:04:43] optical elements to the wave guide and
[01:04:47] uh uh Mark I don't remember exactly ask
[01:04:51] what's Precision so this is with a
[01:04:52] detection Precision of 100 to 200
[01:04:54] nanometer uh precisely aligned to the
[01:04:57] wave guide so this basic means we can
[01:04:59] print on any material um silicon nitrite
[01:05:03] silicon silicon and isolator any
[01:05:05] component the P itself a laser a vexel a
[01:05:09] photo diet a single mode multi mode
[01:05:11] polymer polarization maintaining fiber
[01:05:15] um it can be two seconds but that
[01:05:17] depends on the optical uh design of the
[01:05:20] lens reprint or the
[01:05:22] connection um we for this we have velop
[01:05:26] the micro 3D printer Quantum Mi Line
[01:05:28] which is basically our printing product
[01:05:30] and where we have also resins and other
[01:05:32] accessories in house developed by us um
[01:05:36] and this always a supporting patent for
[01:05:39] portfolio so coming now to to what this
[01:05:42] means for you so uh we can provide
[01:05:45] efficient light coupling Solutions on
[01:05:46] fiber arrays so on the left side you see
[01:05:49] an fiber uh array with eight channels
[01:05:52] I'll explain a little bit later we'll
[01:05:54] see later on this can be on the ship
[01:05:56] Edge as I've shown previously or it can
[01:05:58] also be on ship surface so grating cupas
[01:06:01] or even replacing grating
[01:06:03] cupas so fiber arrays what do we do
[01:06:06] there we adapt the mode field diameter
[01:06:08] and the numerical aperature of the fiber
[01:06:10] array which is three Micron to to 10
[01:06:14] Micron size and to we have to adap as
[01:06:16] lower shorted to the small diameters on
[01:06:19] the wave guide for example um in this we
[01:06:22] have a very easy uh software Nano print
[01:06:24] X where we def find the lenses via a
[01:06:26] formula so you can this see on the upper
[01:06:28] area or you can just have the object you
[01:06:33] want to print the object micol lens or
[01:06:35] anything else and load load it into the
[01:06:38] uh software um we Mark the alignments
[01:06:42] feature you need in this case for fiber
[01:06:44] this we align to the core with less than
[01:06:46] 500 nanometer Precision you select
[01:06:49] process parameters as a already made set
[01:06:51] for every requirement in the system the
[01:06:55] software already available then you just
[01:06:57] print and you develop so we use a honey
[01:06:59] like resin you just drop it on the on
[01:07:01] the fiber and then we can print um I'll
[01:07:04] not show this you're welcome to contact
[01:07:06] me and we can set up a demo and I can
[01:07:08] show you online or on site in in Carro
[01:07:12] if you want to so in the middle you can
[01:07:14] see some results fiber array you see
[01:07:16] some sem image of colim mating lenses
[01:07:19] print time here is roughly 40 25 to 45
[01:07:23] seconds and you can see some periscope C
[01:07:25] lenses a very low loss less than I think
[01:07:28] less than 1 DB uh where you can uh I
[01:07:31] think it's a little bit more du to your
[01:07:33] Optical areas 80 to 90 seconds roughly
[01:07:37] here on the right side you can see also
[01:07:38] that we do some
[01:07:40] characterization so we have basically
[01:07:42] two characterizations we characterize
[01:07:44] the optical element that means the
[01:07:46] roughness and the shape accuracy but we
[01:07:49] also have an in-house setup where we can
[01:07:51] you can see this in blue a little bit on
[01:07:52] the line here on top where we can
[01:07:54] characterize beam propagation of the
[01:07:56] fiber and also for a chip for example
[01:07:59] and then we uh do a design with an
[01:08:02] in-house code to have the lens adapted
[01:08:05] for the requirements you need um and
[01:08:07] then we again measure it what we printed
[01:08:09] and you can see that the measurement and
[01:08:11] simulation fits quite well it's this is
[01:08:14] a case for 1550 nanometer as usual uh we
[01:08:17] also have proof for environmental
[01:08:20] conditions Thal shock or uh humidity
[01:08:23] testing um that's all
[01:08:26] standard some images now to show the
[01:08:29] flexibility so here you can see on fiber
[01:08:31] printing
[01:08:33] periscopes this is can be multiple
[01:08:35] lenses lens set here or the the taper
[01:08:38] for but coupling things like that um
[01:08:42] Periscope array and this is a design by
[01:08:45] print Optics we don't only print on
[01:08:47] normal fiber arrays but we can also
[01:08:49] print on on endoscopes or multicore
[01:08:52] Fiber bundles anything you can imagine
[01:08:55] um and this is a multiple uh Imaging
[01:08:57] lens so it's a little bit different than
[01:08:59] beam shaping this is really Imaging uh
[01:09:02] giving an image back so the quality of
[01:09:04] the resin is highly important and you
[01:09:06] can see also that we can nicely shape
[01:09:08] even the surfaces on the side to have
[01:09:10] some kind of structured surface to to
[01:09:12] avoid stray light with our propriety
[01:09:15] processes an image of couple coupling of
[01:09:18] lenses you can see how nicely uh they
[01:09:21] aligned uh was an in-house result uh
[01:09:25] print test on the edge of a ship uh what
[01:09:28] we do basically is shaping the beam from
[01:09:31] elliptical to round to couple two of
[01:09:33] fiber or maybe to another pick so it's
[01:09:36] again in the software you define the
[01:09:40] lenses again with the formula or STL in
[01:09:44] this case you align relative to markers
[01:09:46] so down to 100 nanometer Precision is
[01:09:48] possible depending on the design and on
[01:09:51] the printing speed also uh and then also
[01:09:53] you need to align to the edge and you
[01:09:55] need to make sure that you can print
[01:09:57] also precisely as the edge to avoid some
[01:09:59] shadowing effects and then Standard
[01:10:01] Process parameters print and develop in
[01:10:04] the middle you can see some results
[01:10:06] these lenses I have shown already
[01:10:07] previously and then here some multiple
[01:10:09] lenses a few minutes of print time uh
[01:10:12] for these lenses um print time here is a
[01:10:15] little bit higher so it's 90 280 seconds
[01:10:19] can be more it really depends on your
[01:10:21] Optical interface and there we need to
[01:10:23] discuss um if you want to have on the
[01:10:25] ship basically one micro two micro three
[01:10:27] micro mode field diameter and we then ad
[01:10:30] do the print the lens adapt to this with
[01:10:32] our system or rather it's our partners
[01:10:35] doing this uh then for
[01:10:39] you this is again from handeld ocn image
[01:10:42] of the
[01:10:43] chip this is a setup where we have
[01:10:45] printed lenses on both sides uh uh on a
[01:10:49] apic chip app you can see a little B on
[01:10:51] the red lights uh the lenses on the Chip
[01:10:55] And then you have a fiber Ray in front
[01:10:57] and I we achieve very low coupling
[01:10:59] losses
[01:11:01] here also what we want to stress it's
[01:11:03] not only on the edge and on fiber it's
[01:11:05] on surfaces of chips also where we can
[01:11:08] couple or print elements so the
[01:11:10] classical thing is the one uh here in
[01:11:12] the middle basically a gring array uh
[01:11:14] where we printed 38 lenses uh for a
[01:11:18] partner that was a project together with
[01:11:20] fix and another thing is also these what
[01:11:23] you can see in the software setup and
[01:11:24] the as here is kind of broadband coupler
[01:11:27] which is together with pixel photonics a
[01:11:29] customer partner of ours uh where we're
[01:11:32] kind to print a large aray of these kind
[01:11:34] of couplers on Wafers
[01:11:36] directly uh again classical thermal
[01:11:39] environment uh uh conditions are
[01:11:42] available uh print time 60 to 280
[01:11:45] seconds pretty fast and easy to be set
[01:11:50] up again here some more detailed images
[01:11:53] of it this was even packages was for
[01:11:55] prototyping for a customer um very fast
[01:12:00] set up to do to test different designs
[01:12:03] uh we went from 100 lenses to 300 lenses
[01:12:06] in less than a year with different
[01:12:08] design
[01:12:09] shapes summarizing so basically what we
[01:12:12] provide with our system or our system
[01:12:14] can do we are system manufacturer um the
[01:12:17] system can do any kind of 3p printed
[01:12:20] freespace micro ocus with our
[01:12:22] proprietary printing technology 2gl um
[01:12:25] it can be scalable manufacturing of
[01:12:26] length fiber arrays you have Herz print
[01:12:28] time so eight an eight time fiber array
[01:12:31] can can print several 10,000 pieces of
[01:12:33] it uh per year with a single system um
[01:12:36] and even this is not the end of of the
[01:12:39] possibilities we have there can be wafer
[01:12:41] level printing printing aligned to
[01:12:43] Wafers to
[01:12:45] markers uh fast
[01:12:47] prototyping uh really I think that's a
[01:12:50] very important thing to start uh new new
[01:12:53] technology new development in pick uh
[01:12:57] another thing which was mentioned before
[01:12:58] a little bit in the discussion we also
[01:13:00] do masters with this technology for nil
[01:13:02] so you can imagine something combined of
[01:13:04] prototyping and Nan imprint for mass
[01:13:06] production um we have done different
[01:13:08] substrates this is a silicon on isolator
[01:13:11] example from
[01:13:12] vtt um other Optics uh as I mentioned uh
[01:13:17] Imaging Optics on wafer level or
[01:13:20] directly on endoscopes or in different
[01:13:22] ways can be are possible and the
[01:13:24] classical one where where we started 5
[01:13:26] years ago our micol lens array for 3D
[01:13:28] zensors for example so that goes then
[01:13:31] again into the mass
[01:13:33] production so final thing is a question
[01:13:36] what can we do for you what can you do
[01:13:38] for us I think that's a classical one
[01:13:40] that's any epic meeting so yeah as I
[01:13:43] said challenge us with your Optical
[01:13:44] interconnecting packaging problem um
[01:13:46] contact me or via our website contact us
[01:13:50] um but I think the best next possibility
[01:13:52] is at AO so we at Boost f43
[01:13:55] uh and we will have a Hands-On training
[01:13:57] session the day after eok on
[01:14:00] 26 um there are still a few places
[01:14:02] available so you're kindly uh invited
[01:14:05] there's a link in here and I can provide
[01:14:07] you also with the link afterwards where
[01:14:09] you can register if you're still
[01:14:10] interested but it's really limited
[01:14:12] places available so there you can you
[01:14:14] will experience the printing the setting
[01:14:16] up of the process the easy use uh um and
[01:14:19] the software that's uh my proposal for
[01:14:22] you thank you for your attention
[01:14:27] thank you York very nice presentation
[01:14:29] and exciting technology as always uh
[01:14:32] impresses me each time I hear about it
[01:14:35] um is there other any questions in the
[01:14:38] chat maybe for York take advantage of
[01:14:42] the opportunity
[01:14:44] now um I see now there's one in the chat
[01:14:47] from Stefan uh at meta Stefan would you
[01:14:50] like to ask it
[01:14:53] yourself no that was from previous um
[01:14:57] talk one of the previous talks so it's
[01:14:58] an old question okay so here everything
[01:15:01] is clear for you now
[01:15:03] yeah okay good and then another one from
[01:15:08] meant from exam
[01:15:10] provance
[01:15:15] um no sorry yeah actually this was an
[01:15:18] old question as well okay well maybe
[01:15:20] just your then explain us uh yeah so I
[01:15:22] mean you're very experienced uh in
[01:15:25] telling us yeah what we can do for you
[01:15:27] and also what how you what you can do
[01:15:29] for us so you you can provide also this
[01:15:31] as a service right so you people can
[01:15:34] come to you with chips and you can yes
[01:15:37] most of the B yes we can demonstrate the
[01:15:39] capabilities uh we have Partners there's
[01:15:42] fix in Holland Netherlands who has a
[01:15:44] system so they can do the printing uh on
[01:15:48] fibers and Optics they have a web shop
[01:15:50] for fibers for example so you can order
[01:15:52] standard fibers arrays there uh standard
[01:15:55] designed for colum mating or focusing
[01:15:57] lenses or anything you can imagine you
[01:15:59] have seen the examples um and we have
[01:16:02] also print Optics which is another part
[01:16:04] partner which is also this they're based
[01:16:06] in stutgart and if you're interested in
[01:16:09] being a partner or Job Shop with our
[01:16:12] system contact me if you have a a
[01:16:15] challenge for optical interconnects feel
[01:16:17] free to contact me we can help you to
[01:16:20] solve it don't come too late it's good
[01:16:22] to come in the design phase I
[01:16:25] think okay okay fair enough and maybe a
[01:16:28] few words on the future what's the
[01:16:30] future of this technology and where are
[01:16:31] you heading and maybe maybe there will
[01:16:35] be potential co-development project for
[01:16:37] for your
[01:16:39] machines um codevelopment I'm not sure
[01:16:42] we we have all the T the knoow on resin
[01:16:44] software Hardware inhouse uh we work
[01:16:48] with a lot of different partners
[01:16:49] engineering companies um out there in
[01:16:52] the market um I think the future is
[01:16:55] really to bring this to mass production
[01:16:57] um this year next year in three years um
[01:17:00] depends on different projects uh it's a
[01:17:03] unique possibility to reduce losses uh
[01:17:05] in in pck and to standardize a few uh
[01:17:10] connections also I mean as as Sebastian
[01:17:14] scussel said at the Optica meeting sorry
[01:17:17] recently um uh the biggest issue is
[01:17:20] really standardization in pick that you
[01:17:22] have the interfaces as a standard and
[01:17:24] even for hybrid integration for microt
[01:17:26] transer printing standardization of the
[01:17:28] optical interconnect will bring it
[01:17:30] forward and I think this is something we
[01:17:32] should look
[01:17:33] at yeah here I agree with you okay well
[01:17:37] thank you very much York nice
[01:17:38] presentation as always and with this I
[01:17:41] pass the word to the next speaker who
[01:17:42] represents chil's BV uh Dimitri gesus
[01:17:46] the chief technology officer will tell
[01:17:49] us about the ultra narrow line with
[01:17:51] tunable
[01:17:53] lasers thank you thank you nice
[01:17:55] introduction let me share my
[01:18:08] screen
[01:18:10] good no we don't see it yet yeah yeah I
[01:18:14] have to find the okay
[01:18:23] button okay
[01:18:25] good to go let's go good thank you thank
[01:18:29] for nice introduction I'm Dimitrius from
[01:18:31] chilas and chilos we uh we we use all
[01:18:36] the stuff we have seen so far the chips
[01:18:39] the gain sections Etc to make a tunable
[01:18:41] Laser Source and um well what we do
[01:18:45] actually we combine the uh the high gain
[01:18:48] of semiconducting optical
[01:18:50] amplifier um the most mature products of
[01:18:52] us use Indian fos
[01:18:55] and we have a a cic nitrite feedback
[01:18:59] circuit which schematically looks like
[01:19:01] this and it has very low losses so we we
[01:19:04] keep the high power in the system and
[01:19:06] also out of the system for your
[01:19:08] application and there are a few elements
[01:19:10] that tune the wavelength being feed back
[01:19:12] into the cavity there are two ring
[01:19:14] resonators there the slightly different
[01:19:17] diameter so therefore the uh yeah the
[01:19:20] ring the the filter response looks like
[01:19:22] a vener you see over here in the
[01:19:25] animation bottom here that the uh the
[01:19:27] Rings slide over each other feeding back
[01:19:30] only one of the wavelengths within the
[01:19:32] gain bandwidth of the gain section and
[01:19:34] that Las light starts to oscillate back
[01:19:36] and forth and you get a clean up of the
[01:19:38] spectrum and you get a very nice single
[01:19:40] mode output with very low uh line
[01:19:45] withs there several products
[01:19:50] there
[01:19:52] what there it goes
[01:19:56] so in the uh 1500 C band
[01:20:01] um in that brange we've got a fixed
[01:20:05] wavelength laser tunable to any
[01:20:07] wavelength in the uh Cent uh with
[01:20:11] accuracy of 10 Pomer um and gives us
[01:20:15] good Al power and low line width you've
[01:20:17] got a new product which I will show a
[01:20:19] little bit more over here and also in
[01:20:21] the future and that's the swep source
[01:20:23] where we uh stits all the uh wavelengths
[01:20:27] together into a swep source and we've
[01:20:29] got a 100 Nom tunable laser which can
[01:20:33] set be set to any wavelength within the
[01:20:35] specified range exploiting really the
[01:20:37] wings of the gain Spectrum as you see
[01:20:39] over there it's nice and compact fits
[01:20:43] into a nice butterfly an ordinary 14 P
[01:20:46] butterfly and for the swep source
[01:20:48] application we have developed a piece of
[01:20:51] electronics and firmware to uh to put it
[01:20:54] into a a single module there the thing
[01:20:56] is solded hardly in there and um yeah
[01:21:00] that's
[01:21:00] it that's what you can do what can you
[01:21:03] do with a tunable laser well you can do
[01:21:05] many things with a tunable
[01:21:07] laser um Can this ribbon be removed
[01:21:11] think not ah there it go
[01:21:15] excent uh one of the things you can do
[01:21:17] with this laser you can make it very
[01:21:19] stable lock on one wavelength or you can
[01:21:22] do some fmcw for lighter application
[01:21:25] you have a small jiggle on the on the
[01:21:27] frequency or you can motor free tune the
[01:21:30] laser for spectroscopy and other
[01:21:32] applications or you sweep all over the
[01:21:34] game B pit available for OC and fiber
[01:21:37] bra rating centers so you you see a
[01:21:39] little bit of the graph so fixed
[01:21:41] wavelength very stable wiggle around
[01:21:44] fmcw up to uh 1 GHz 2 GHz of modulation
[01:21:49] depth uh sweat Source uh for very wide
[01:21:54] range of
[01:22:01] patience well here we present the the
[01:22:04] outcome of uh of the laser when it's
[01:22:06] Free Running Free Running is um it has
[01:22:10] stability of around 1 mahz so if you set
[01:22:12] it to a wavelength it will stay at a
[01:22:14] wavelength with a yter of well a wiggle
[01:22:17] around is typically thly induced of 1.2
[01:22:21] mahz and if you lock it then you get up
[01:22:24] to the kilohertz regime and the you see
[01:22:27] nicely that for the low frequencies the
[01:22:29] noise the phas noise is reduced
[01:22:31] significantly and you can also see that
[01:22:33] when you lock it to acine cell it stays
[01:22:35] there for a long long time now this is
[01:22:38] very interesting for uh Quantum
[01:22:40] application Quantum clocks and other
[01:22:42] application where need Ultra stable
[01:22:44] light for for long-term
[01:22:49] stability and the um there are several
[01:22:53] uh
[01:22:55] cavities in this laser uh there are two
[01:22:57] ring resonators there and there's also a
[01:22:59] cavity for the the overall length of the
[01:23:02] cavity and um you can tune to any
[01:23:05] wavelength within the game band withd
[01:23:08] and here we have got a demonstration of
[01:23:10] one uh one fre Spector range of the
[01:23:13] cavity which is stitched together and we
[01:23:15] very smoothly tune all the heater
[01:23:17] elements it's heat based tuned all
[01:23:20] together to have a very smooth uh uh
[01:23:23] yeah moving of the the emitted wave PLS
[01:23:26] and this is excellent for for gas
[01:23:28] absorption or any very fine
[01:23:31] spectroscopic application we uh embraced
[01:23:34] this uh this method and we stitched all
[01:23:38] the modes of the cavity together and uh
[01:23:41] I think we'll go to the uh yeah to the
[01:23:44] the next phase of of hybrid integrated
[01:23:47] lasers is that you make a swep source on
[01:23:50] the left bottom curve you see the uh the
[01:23:53] wavelength the horizontal scale and in
[01:23:55] the vertical scale you see the output
[01:23:57] power now it seems a little bit YY uh
[01:24:00] because this has been stitched some few
[01:24:03] hundred of uh fre spectral ranges of
[01:24:05] sweeping all together um but there's
[01:24:08] some control on there and then you see
[01:24:09] there's a little bit of yter on the on
[01:24:11] the output power but it scans this full
[01:24:15] 40 NM within 1 second so actually every
[01:24:18] second you sweep through all these
[01:24:20] wavelength with very very high
[01:24:21] resolution so the wavelength grid is
[01:24:24] only four Pomers so you go from four pom
[01:24:27] steps all the way over 40 ners and it's
[01:24:30] very accurate and very reproducible this
[01:24:32] is every from sweep to sweep this
[01:24:34] pattern is there
[01:24:38] always so to demonstrate that we really
[01:24:41] hit all the wavelengths because we get a
[01:24:43] lot of questions about do you hit all
[01:24:45] the wavelengths yes we do so we made
[01:24:48] this very simple setup we took a fiber
[01:24:50] splitter and put the uh one brains into
[01:24:53] the As and
[01:24:55] hcn reference cell and it has some
[01:24:58] absorption Peaks there you put it onto a
[01:25:01] photo set and then we print it on
[01:25:03] oscilloscope and there you see that you
[01:25:06] retrieve in one second all the the gas
[01:25:10] absorption lines now this might not seem
[01:25:13] very impressive but the impressive part
[01:25:15] is that the line these lines are very
[01:25:17] very narrow and uh it is really hard for
[01:25:20] a laser to really scan all of these
[01:25:22] lines and to resolve all the absorption
[01:25:25] lines there and when we zoom in onto one
[01:25:28] single line you see over here the purple
[01:25:31] line is one of the measurements so
[01:25:33] remember this passes by for the full C
[01:25:35] band in one second and then you see this
[01:25:37] four pom step sizes here and the laser
[01:25:40] resolves the full uh absorption line of
[01:25:44] the uh the predicted uh uh
[01:25:47] model in between the cells in between
[01:25:50] the points the shape is a little bit
[01:25:52] deformed and that is of course from from
[01:25:55] point to point the uh the wavelength
[01:25:58] sweep is not fully linear and uh because
[01:26:01] the thermal based thing so a little bit
[01:26:03] of of shape there but we can improve
[01:26:06] that by putting more points in between
[01:26:09] and let the uh the lasers yeah scan more
[01:26:12] smooth over that uh thing but at least
[01:26:15] this is the laser line itself is around
[01:26:17] 5 KZ line withd so you can imagine how
[01:26:21] how fine the resolution is we can scan
[01:26:23] over there
[01:26:26] now for 40 nm/ seconds that's a little
[01:26:28] bit of a fixed uh uh speed we have at
[01:26:32] the moment developed um and we can also
[01:26:35] scan over subsections of the um of the
[01:26:39] the the wavelink scan and not doing the
[01:26:41] full 40 NM but doing for example 1.7 NM
[01:26:46] and then you get a rep rate of 24 Hertz
[01:26:49] which is video rate and we've got a set
[01:26:51] the next setup for that we take one of
[01:26:53] our mic micro ring resonators and we put
[01:26:55] the heaters to work and move the drop
[01:26:58] response of the micro ring resonator
[01:27:00] while we scan over the uh the resonance
[01:27:04] there so you see on the black the the
[01:27:07] blue side on back side the uh The
[01:27:09] Continuous power on of the laser on the
[01:27:12] oscilloscope and the red curve is the uh
[01:27:15] yeah the position of this drop response
[01:27:18] this device in the test and it gives a
[01:27:20] nice video there and um well always take
[01:27:24] guts to start this video let's see if it
[01:27:28] starts
[01:27:32] no
[01:27:40] h that's a
[01:27:45] Pity do I have to be
[01:27:47] patient NOP I'm not patient myself I'll
[01:27:51] show it
[01:27:52] afterwards um
[01:27:54] and next to the the video we also have a
[01:27:57] lot of other away planks well you
[01:28:00] basically take a silicon nitrate chip
[01:28:02] and you glue any other gain section to
[01:28:04] it and there with that setup we we have
[01:28:08] several colors in the visible being
[01:28:12] developed 680 690 707 and 780 nomers for
[01:28:16] mainly Quantum application there output
[01:28:19] powers are around 1 M and tuning range
[01:28:22] is around 10 NMM and this all depending
[01:28:24] on the gain sections available there
[01:28:27] then we've got the 850 line which we
[01:28:29] have some uh some lasers available they
[01:28:32] tune about 25 nanometers and then we
[01:28:35] have also a set which is tuning around
[01:28:38] 1,700 nanometers with plus minus 59
[01:28:41] tuning
[01:28:42] R now briefly we'll exit the presenter
[01:28:46] mode Let's see if it works and see if
[01:28:48] the video works like
[01:28:51] this now I don't know if this uh
[01:28:56] I think uh I hope I'm still sharing my
[01:28:58] screen there but uh I think this is one
[01:29:01] of the breakthroughs uh we are having
[01:29:04] there is that we we can really video
[01:29:06] rate monitor some features of bring
[01:29:08] resonators there and we can customize
[01:29:11] the the laser scan motors for all the
[01:29:13] customers we have uh uh yeah we have on
[01:29:16] our hands and we expanding our
[01:29:17] wavelength R and applying the the
[01:29:19] Lessons Learned on this laser for the
[01:29:21] future as well
[01:29:27] um that was the end of my presentation I
[01:29:29] hope there are some questions we will
[01:29:31] have a demo at a uh in a week from now
[01:29:34] and then uh we'll show you the source
[01:29:36] obviously and I'll aim to have some
[01:29:38] break rating sensors there so you can
[01:29:40] touch touch the light and see if you are
[01:29:43] a warm blowed or cold
[01:29:44] blooded open for questions thank
[01:29:47] you yeah thank you Dimitri that was
[01:29:50] impressive good that the video also
[01:29:52] worked um
[01:29:55] yeah a great presentation uh and I hope
[01:29:58] we'll hear some questions now in the
[01:30:00] audience uh please raise your hands now
[01:30:04] uh I see there is one from Marco at AF
[01:30:08] Marco would you like to ask it
[01:30:10] yourself yes thank you I'm very
[01:30:13] impressive very impressive product I was
[01:30:15] uh wondering about the tuning speed you
[01:30:17] mentioned at some point 140 Nom a
[01:30:20] second
[01:30:21] exactly is there anything is it like
[01:30:23] thally tuned Can it can it go faster
[01:30:26] yeah it's it's a thermally tuned system
[01:30:29] and um we have obviously we are trying
[01:30:33] trying to get it even faster than this 4
[01:30:36] nomers uh I think we can go a little bit
[01:30:38] faster but not more than a factor of two
[01:30:42] um these heaters have a intrinsic
[01:30:44] response time obviously you can
[01:30:46] overdrive them a bit to speed them up a
[01:30:49] bit uh but this is for now the uh speed
[01:30:52] we are offering we always working on FAS
[01:30:55] activators there so U we have some
[01:30:59] projects starting up on the background
[01:31:01] on pzo electric and on uh lifting iate
[01:31:06] systems where the the the tuning speed
[01:31:09] is obviously much faster than in Thermo
[01:31:11] Electric
[01:31:13] effects thank you thank you very
[01:31:15] impressive about the tuning speed what
[01:31:18] is also nice is the laser has no
[01:31:20] mechanics so basically you can hop to
[01:31:22] any wavelength uh you want to go within
[01:31:25] a millisecond so if you at the end of
[01:31:28] the scan it pops back in within a
[01:31:30] fraction of millisecond to the beginning
[01:31:32] of the scan so and that also sometimes
[01:31:34] helps for yeah following features that
[01:31:37] you take a subsection and you follow a
[01:31:40] part of your of your feature which you
[01:31:42] want to follow that's uh yeah that's the
[01:31:46] way to come around with the uh tuning
[01:31:48] speed yeah perfect thank you so much
[01:31:52] thank you okay so sounds good I have a
[01:31:54] question to um I mean you mentioned
[01:31:56] several applications for the tunable
[01:31:58] lasers but what's the the main
[01:32:00] application these days and what's maybe
[01:32:02] the the upcoming one for the future what
[01:32:06] do what do they find the use um the the
[01:32:10] main applications at this moment is we
[01:32:12] see we see a lot of traction going on
[01:32:14] for fiber recating sensors any sensors
[01:32:17] we've got some micro ring resonator
[01:32:19] sensors there um in the field and we
[01:32:22] also have a lot of ction on the very
[01:32:25] narrow line which is for some cases
[01:32:27] below 1 khz and there you get for
[01:32:30] Quantum key distribution get some
[01:32:32] traction there and yeah so there a wild
[01:32:35] range of applications some last time I
[01:32:38] got called and they want to generate
[01:32:40] terahertz generation terahertz whoa um
[01:32:44] you everywhere where you need a laser
[01:32:46] tunable laser or a fixed
[01:32:48] laser uh this type of lasers they are uh
[01:32:54] of Interest I think and and again we can
[01:32:57] pick tail them to your application very
[01:32:59] easily there's a rable user interface
[01:33:01] we've got also uh an a API so all common
[01:33:05] instructions there to get it reler to
[01:33:08] your application and uh if you want to
[01:33:11] go for volume well this is now assembled
[01:33:13] with using machine assembly is fully
[01:33:15] automatically assembled um but obviously
[01:33:19] in the future will be flip chip
[01:33:20] assembled and even you don't know
[01:33:22] transfer printed uh that we get our
[01:33:24] lasers into any system replacing all the
[01:33:27] lasers in the world so let's aim for
[01:33:30] that let's aim for that indeed okay
[01:33:33] thank you very much for your
[01:33:34] presentation Dimitri thanks a lot um
[01:33:37] yeah and please feel free to contact him
[01:33:39] if you would like to try one of those
[01:33:42] tunable lasers uh and I pass the word to
[01:33:45] next speaker Andre palinski the
[01:33:47] principal application engineer from VP
[01:33:50] fonics who will talk about the pdk
[01:33:52] framework of from
[01:33:56] VPI Andre the floor is yours yes hello
[01:33:59] ready
[01:34:01] I'm yes so welcome to my presentation
[01:34:04] thank you for introduction Ian and yes
[01:34:08] so today we heard quite a lot about the
[01:34:12] technology already about the platforms
[01:34:15] dedicated for it and the product but by
[01:34:18] now we didn't hear anything about mainly
[01:34:20] the main part which is connecting all of
[01:34:22] them so about the design
[01:34:24] and within my presentation I will teach
[01:34:27] here a bit uh more on the perspective of
[01:34:31] how we can go through the platform to
[01:34:33] the design and mainly how to account for
[01:34:36] this integration part in interfacing
[01:34:38] part between different Power platforms
[01:34:41] within within the single Design Within
[01:34:42] the single final tip we want to we want
[01:34:46] to
[01:34:47] get so very briefly about the company so
[01:34:50] VPI photonics is a a software
[01:34:54] company uh providing the software
[01:34:57] solution for simulation optimization and
[01:35:00] design of uh Optical circuits uh and not
[01:35:04] only but to this I will come in a second
[01:35:07] uh we are also offering some uh services
[01:35:10] and Design Services so we are on the
[01:35:12] market over 25 years already with
[01:35:14] Regional Offices in Europe and North
[01:35:16] America with the a lot of the global
[01:35:19] networking resellers all over the world
[01:35:22] we are mainly facing with the uh with
[01:35:26] the free eyes so firstly integrate so we
[01:35:29] try to really integrate all the
[01:35:31] simulation techniques starting from the
[01:35:33] devices to the systems enabling you the
[01:35:36] design not only from the perspective of
[01:35:39] the
[01:35:40] crosssection uh through the photonic
[01:35:42] circuit but also from the system
[01:35:44] perspective so mainly how your pig
[01:35:46] should behave in the whole system where
[01:35:49] you will connect it with multiple other
[01:35:50] components like fibers or DSP afterwards
[01:35:55] the second Pi is the interoperable so we
[01:35:58] are trying mainly to make the interface
[01:36:01] with many different third party
[01:36:03] simulation tool to not limit only you to
[01:36:05] the functionality of the program itself
[01:36:07] but also to allow you mainly to
[01:36:09] interface with all other tools for
[01:36:12] example for electronic simulation for
[01:36:14] layouting and much much more which I
[01:36:17] will also mentioned in the some examples
[01:36:19] directly and the third I industry
[01:36:22] leading so we are cooperating with many
[01:36:25] industrial and research collaborations
[01:36:28] to develop uh state-ofthe-art PS uh also
[01:36:32] to set some
[01:36:33] standardization and I will just show you
[01:36:36] few examples which uh which are touching
[01:36:38] directly the the problem of the hybrid
[01:36:40] integration here so from our product
[01:36:44] perspective I mentioned we are covering
[01:36:46] everything from the device to the to the
[01:36:48] system level today I will focus only on
[01:36:51] the on the pdk interface which are allow
[01:36:53] us mainly to link The Foundry dedicated
[01:36:56] components to enable the pig design with
[01:36:59] them and Fabrication of the of the chip
[01:37:03] afterwards so very shortly about the pdk
[01:37:06] in a standard approach The Foundry just
[01:37:10] provides some kind of the description of
[01:37:12] their processes uh in the form of some
[01:37:15] pdk Library describing the all necessary
[01:37:18] information including the uh performance
[01:37:21] of the building blocks layouts of the
[01:37:23] them but also the detailed description
[01:37:26] of the process that is created that is
[01:37:29] uh that mainly reflects the technology
[01:37:32] steps in order to fabricate it based on
[01:37:35] this there are some pdk compact model
[01:37:38] database created and we are created
[01:37:40] simulation models for it these models
[01:37:43] mainly take the information from either
[01:37:45] measurement of the FB or simulations and
[01:37:49] of course you want to bring this in
[01:37:51] hopefully some standardized format uh
[01:37:54] that will enable automatic creation of
[01:37:56] this of this generated uh simulation
[01:37:59] modules then once you are having the
[01:38:01] simulation uh models you are of course
[01:38:03] building your circuit design which you
[01:38:06] are interested in and here I will come
[01:38:08] back to this example but we see the
[01:38:11] reproduction of the uh of the Wily
[01:38:15] tunable laser which was shown by Mor in
[01:38:17] in hhi uh but yeah as I mentioned I will
[01:38:21] come back to this the idea is that
[01:38:22] mainly we can simulate the the pick
[01:38:24] itself but we can also verify this pick
[01:38:27] on the system level we can Co simulate
[01:38:29] it with the electronics and once we are
[01:38:31] happy with the design we can extract the
[01:38:33] layout procet process with the with the
[01:38:36] layout design in order to to prepare the
[01:38:39] GDs file send it to the Fab to get our
[01:38:42] assembled
[01:38:43] pick so now I will talk briefly about
[01:38:47] the different uh approaches which are
[01:38:49] used between different Platforms in
[01:38:51] order to to enable this hybrid Pig
[01:38:54] design and first I will start exactly
[01:38:57] with mentioning of this uh of this
[01:39:01] transceiver in that part which is a bit
[01:39:03] extended version of the hhi laser shown
[01:39:06] before uh but mainly yes we are
[01:39:09] interested in the final design which you
[01:39:11] can see is already including some Fiber
[01:39:13] component including the coupled laser
[01:39:15] with the photo Dione chip but we start
[01:39:18] just with the building blocks so how we
[01:39:20] do it how we go through it uh yes maybe
[01:39:24] one more thing to mention you can see
[01:39:25] that within the pdk library for this
[01:39:27] polymer platform we are already having
[01:39:29] some indium phosphite components and
[01:39:31] that's exactly this t one of this
[01:39:33] typical approaches how foundaries can
[01:39:35] enable directly integration of the of
[01:39:38] the platforms so you're just building
[01:39:40] your polymer chip which will include
[01:39:42] directly on top of it some additional
[01:39:45] gain sources some additional photo dial
[01:39:48] or modules which are enabling direct
[01:39:50] coupling to the uh to the fibers and and
[01:39:53] based on those components they are
[01:39:54] already optimized for the Fab and they
[01:39:57] can be fabricated and assembled by The
[01:39:59] Fab directly this means that after your
[01:40:01] simulation after you can show the uh
[01:40:03] results which you are expecting you can
[01:40:05] directly export the layout to one of the
[01:40:08] desired layout tools and process with
[01:40:10] the fabric uh with the with the GDs
[01:40:12] generation please note that the GDs is
[01:40:15] including only the layers here which are
[01:40:18] belonging to the polymer chip but you
[01:40:20] can see there are some predefined spaces
[01:40:23] which are enabling you directly the
[01:40:25] integration of this components uh with
[01:40:28] the uh with this different platform
[01:40:30] modules and in that case if you provide
[01:40:33] such uh such design with additional
[01:40:35] information how this needs to be coupled
[01:40:38] uh
[01:40:39] HHR the assembly everything and provide
[01:40:42] the final chip which is assembl it here
[01:40:44] within the polymer chip fabricated by
[01:40:47] them and also the indium fosfate
[01:40:49] components created by their uh foundary
[01:40:53] of yeah generating the structur inum
[01:40:57] fite okay but what's happening to all
[01:41:00] other foundaries which they don't really
[01:41:02] include the information about the
[01:41:04] standard component integration so
[01:41:07] standard uh designs for the Silicon
[01:41:10] nitrite lithium niobate or polymers They
[01:41:13] Don't Really uh have directly the
[01:41:17] modules which are being enabled there by
[01:41:19] the Fab and in that case there are
[01:41:21] mainly two approaches by now how can
[01:41:23] make a design and and Fabrication
[01:41:26] firstly is directly talk to the Fab and
[01:41:29] discuss with the Fab what kind of
[01:41:31] building blocks they are offering and
[01:41:33] here a good example was uh the design
[01:41:36] which I mentioned already before
[01:41:38] although the building blocks were
[01:41:39] generated there in the pdk directly but
[01:41:42] you can discuss about different kind of
[01:41:44] IND fos fine lasers or or gain chips
[01:41:47] which could be coupled there directly on
[01:41:49] the other side you can also use some
[01:41:52] external light sources and here of there
[01:41:56] is another case so you can find out many
[01:41:58] plugable or bar lasers for visible light
[01:42:02] a lot of qcl laser for Mid infrared but
[01:42:05] there is one big issue with them so
[01:42:07] there is no clear information how to
[01:42:11] build interface with them unless
[01:42:13] provided by The Fab or provided by the
[01:42:16] laser manufacturer so here we see some
[01:42:19] different laser sources which we
[01:42:21] generated between different projects
[01:42:23] with some uh structures for visible and
[01:42:26] short uh short near infrared uh for cand
[01:42:32] and also for the for the mid infrared
[01:42:35] they all were optimized in that case
[01:42:37] based on the project work for direct for
[01:42:40] given platform if only you would like to
[01:42:43] use these components with some other
[01:42:45] platform of course this means that you
[01:42:47] need to build your own interface module
[01:42:50] and let's show this how uh how we can do
[01:42:53] it on on the
[01:42:55] example but first how we could generate
[01:42:57] in that case a platform a template of
[01:43:01] the pdk that could work for us directly
[01:43:04] uh by enabling generation of your own
[01:43:07] custom pdk so here we have a process of
[01:43:10] generating such custom pdk main it will
[01:43:13] include some templates it will include
[01:43:15] some additional layout information and
[01:43:18] while you are creating your own pdk you
[01:43:20] can easily protect the IP you can extend
[01:43:24] the pdks the existing pdks and share
[01:43:26] them mainly with your own uh with your
[01:43:29] own interest partners and if you are
[01:43:32] interested in this process please uh
[01:43:33] refer to the to the paper that we
[01:43:36] recently the article that we uh
[01:43:38] published at the start of the Year about
[01:43:40] mainly the Alm freedom and IP protection
[01:43:42] using the pdk and how this pdk can be
[01:43:46] used based on the example I will show
[01:43:48] here the hybrid integration of the
[01:43:50] modock laser using on the left side here
[01:43:53] we can see the Silicon nitrite extended
[01:43:56] cavity uh based on the lonic and here we
[01:43:59] have the SOA structure 3 five based on
[01:44:04] the smart photonics and this idea was
[01:44:06] mainly was uh recently published or
[01:44:09] recently three years ago published by
[01:44:12] the VIS mainly explaining on the design
[01:44:15] itself and and Fabrication of the
[01:44:17] structure so very easily we are creating
[01:44:19] a library of the components we are using
[01:44:22] in that case on the left side the
[01:44:24] components for the Silicon nitrite
[01:44:26] equivalent with the with the pdk of
[01:44:28] lonix on the right side we have the
[01:44:30] indium phosphide components equivalent
[01:44:32] to the smart photonics and adapted to
[01:44:34] the performance of the measur devices
[01:44:36] and here we see one additional magic
[01:44:39] component which is actually the spot
[01:44:41] sign converter between one and the other
[01:44:44] platform I'm especially not looking into
[01:44:47] this component but if you are interested
[01:44:49] exactly how it functions and what can be
[01:44:52] done here you can refer back to the
[01:44:54] paper is described in details including
[01:44:56] even some tolerances of the coupling and
[01:44:59] misalignment with the total map how the
[01:45:01] coupling should behave but for the
[01:45:04] perspective of the design I would like
[01:45:05] to refer more that of course such
[01:45:09] combined platforms we have some design
[01:45:12] with the combined with different
[01:45:14] platforms can be created on a single
[01:45:16] Chet chip when you are directly
[01:45:19] simulating the performance so here we
[01:45:20] can see our spectrum of our laser with
[01:45:23] we can measure the repetition rate and
[01:45:25] also observe the waveform very similarly
[01:45:28] to the ones which were achieved in the
[01:45:29] paper and of course what we can do on
[01:45:32] top of it we can perform some tolerance
[01:45:34] analysis either based on the implemented
[01:45:37] by The Foundry tolerance analysis or by
[01:45:39] just varying of the interest and
[01:45:43] providing given anal uh given tolerance
[01:45:46] analyis of our choice in that case I was
[01:45:49] using mainly the provided uh information
[01:45:53] from Smart photonics on the tolerances
[01:45:54] plus some additional gaussian variations
[01:45:58] on on given components to uh to
[01:46:00] investigate mainly how the frequency
[01:46:02] shift of the main peck so main the the
[01:46:05] peak power of the whole spectrum and
[01:46:07] also the maximum power of the spectrum
[01:46:09] will behave based on given number of
[01:46:13] runs so to conclude uh with the standard
[01:46:16] approach which uh which was very often
[01:46:18] shown what you can do for us first of
[01:46:21] course you can use our tool to develop
[01:46:23] your own pdks and share them with your
[01:46:26] customers in order to allow them to
[01:46:28] really follow up with your designs but
[01:46:32] also we will be very happy to give to
[01:46:34] get feedback from you regarding your
[01:46:36] design is and regarding your pdk
[01:46:38] development uh especially if uh
[01:46:41] something you believe should be added on
[01:46:43] top of the tool and where we can help
[01:46:46] you mainly we are uh helping here with
[01:46:49] the enabling the various strategies for
[01:46:51] the pig design of offering the workflow
[01:46:53] from devices to the systems via of
[01:46:56] course circuits and by offering you the
[01:46:59] custom pdk framework enabling you mainly
[01:47:01] to develop your own components and
[01:47:03] interfaces to build the design and uh
[01:47:06] and be able mainly to uh to fabricate
[01:47:09] those integrated uh platforms directly
[01:47:12] uh just maybe short comment only on at
[01:47:15] the end we are helping to accelerate
[01:47:17] this design together with the export to
[01:47:19] the layout which we presed already
[01:47:21] several times before
[01:47:23] and also we are offering the
[01:47:25] personalized support with the help to
[01:47:27] develop this PD case so if only you have
[01:47:29] some interest in those topics or many
[01:47:31] others which I just listed feel free to
[01:47:33] contact us either directly or via Ian or
[01:47:37] at EO we are also there so if you have
[01:47:40] any questions please feel free to to
[01:47:42] contact us uh and I'm so happy to answer
[01:47:44] now if we still having
[01:47:48] time thank you Andre very very nice
[01:47:51] presentation very detailed
[01:47:53] so yeah I'm sure many people will try
[01:47:56] the VPI products after this and uh yeah
[01:48:00] let's see if there are questions I see
[01:48:02] one from Dimitri please go
[01:48:05] ahead hi andj very nice presentation
[01:48:08] always impressive what you managed to
[01:48:10] simulate and I see you already have
[01:48:14] quite an effort on the lonic technology
[01:48:17] and uh and rear gain section material I
[01:48:20] think we should sit together because I
[01:48:22] think it's easy for you to model some
[01:48:24] ring resonators there right yes we also
[01:48:27] have example with lionix with the ring
[01:48:30] resonators with the laser fabricated by
[01:48:35] I don't remember now sorry but with the
[01:48:37] Freer ring laser structure for for
[01:48:39] narrow line with tunable lasers yeah I
[01:48:42] remember there was a pro with ya and fun
[01:48:44] at that time I think excellent very nice
[01:48:47] work thanks a lot for sharing
[01:48:50] it yeah so I'm happy to talk to you
[01:48:53] either any time now or at Eco in person
[01:48:56] so we can we can go in details there
[01:48:59] let's do that thanks that's that's the
[01:49:01] spirit of the Epic meeting okay good
[01:49:03] thanks for your involvement and question
[01:49:06] Dimitri uh anyone
[01:49:10] else okay if not indeed uh I mean you
[01:49:14] have an opportunity to meet most of us
[01:49:16] here at eok I can imagine so consider
[01:49:19] the information you got now and we can
[01:49:21] talk in person
[01:49:23] uh so see you there as well Andrew and
[01:49:25] thank you again uh now before the last
[01:49:28] presentation uh let me do a little
[01:49:30] intervention here with a couple of
[01:49:33] slides I'd like to share with
[01:49:35] you um first of all first of all um I
[01:49:40] didn't mention that we have a sponsor of
[01:49:42] the meeting today and this is the famous
[01:49:44] uh uh packaging house called fix fix
[01:49:49] photonics assembly uh they're located in
[01:49:52] Netherlands
[01:49:53] and uh from which they Supply pcks and
[01:49:57] Ms based components and models in
[01:49:59] scalable production
[01:50:01] volumes uh they can work with all kinds
[01:50:04] of uh Pig platforms silicon and
[01:50:07] non-silicon based uh they work from
[01:50:10] prototype to volume they help to
[01:50:12] optimize the pig designs and
[01:50:14] modeles and uh they also have World
[01:50:18] leading expertise in hybrid pics fiber
[01:50:21] attachments and the ultra high frequency
[01:50:24] electronic interfacing so if any of this
[01:50:27] packaging Services interest you please
[01:50:30] feel free to contact Marcel van Vin the
[01:50:32] sales director of
[01:50:34] fix and the second piece of news I have
[01:50:37] is that there is an upcoming Peak event
[01:50:40] from our friends um photonic Photon
[01:50:44] Delta again in Netherlands so on the
[01:50:47] 15th and 16th of October they will have
[01:50:49] a great event the two days event full of
[01:50:53] information on the photonic integrated
[01:50:55] circuits so please come and join Photon
[01:50:58] Delta epic and everyone else uh in this
[01:51:01] exciting event um one of the most
[01:51:05] influential ones in Europe and uh this
[01:51:08] year they gather over 700 visitors from
[01:51:11] more than 20 countries so the program is
[01:51:14] again two days it involves the speakers
[01:51:17] from famous companies as Nvidia Global
[01:51:20] foundies IBM and airb
[01:51:23] and on the second day there are more
[01:51:24] dedicated sections including uh section
[01:51:28] on Tech tour Next Generation ic's and
[01:51:32] the section on Quantum integrated
[01:51:34] photonics and future of integrated
[01:51:36] photonics so epic is the Strategic
[01:51:39] partner of this event I'll be there
[01:51:41] myself as well we'll be happy to see all
[01:51:43] of you in person and epic members enjoy
[01:51:46] a significant discount for the entrance
[01:51:48] fee uh so for this you have to use the
[01:51:50] discount code on the right hand side
[01:51:54] called epic
[01:51:55] 15% so hopefully see you in October at
[01:51:59] the Pak Summit and with this um I'm done
[01:52:03] and I would like to introduce the
[01:52:06] closing speaker of this session
[01:52:08] today um Hima Garcia Romeo Nunes is the
[01:52:12] CEO of Al photonics and she will talk
[01:52:15] about leveraging hybrid integration to
[01:52:18] accelerate batonic adoption Hima hope
[01:52:22] you're with with
[01:52:24] us you just need to unmute and uh share
[01:52:28] your slides and you're good to
[01:52:32] go
[01:52:35] okay thank you very much for your
[01:52:38] introduction good afternoon we are Al
[01:52:40] photonics we do integrated photonics
[01:52:42] design and as most of you I don't know
[01:52:45] last week you heard this message from
[01:52:48] the BP of tsmc they expect silicon
[01:52:51] photonics Market to explode over the
[01:52:54] next years and they understand that
[01:52:58] behind this there is a strong pool from
[01:53:02] Communications but I also foresee a
[01:53:04] number of markets we're going to be
[01:53:06] behind this and we all have heard of the
[01:53:08] poor of integrated photonics we all hear
[01:53:12] from investor from analyst that a lot of
[01:53:14] Industries are about to adopt it and for
[01:53:18] years it's been a talk of with silicon
[01:53:20] photonis as as we were discussing today
[01:53:22] is not silicon anymore it's a number of
[01:53:25] platforms that we expect to be solving
[01:53:27] the issues of each application and still
[01:53:31] from some of these application it won't
[01:53:33] be one single platform and a good very
[01:53:35] good examples everyone's talking about
[01:53:37] the next generation of transceiver 800
[01:53:40] gigabytes and so on and we all
[01:53:42] acknowledge that it's going to be a
[01:53:44] combination of maybe Le now some other
[01:53:48] platform for modulator another platform
[01:53:50] for managing the signal another platform
[01:53:52] for detectors so it's true that one
[01:53:56] single platform is not meeting all the
[01:54:00] needs in market so it seems that we all
[01:54:03] need this having available
[01:54:06] designs so that customers can choose the
[01:54:09] better fit for the products in that
[01:54:13] sense that's what Alim photonics does we
[01:54:15] do Master a different kind of designs
[01:54:19] techniques which basically make us
[01:54:21] capable signing very efficient design so
[01:54:24] we usually are very efficient at bank
[01:54:26] withd and polarization
[01:54:28] management and translating or designs
[01:54:31] from one platform for another so being
[01:54:33] capable of bringing this IP from one
[01:54:36] platform into another so we were born uh
[01:54:40] on an unique design approach as WG which
[01:54:43] uh means that we can Mana slight in a
[01:54:46] very flexible way enabling a metam
[01:54:50] material approach to design but we will
[01:54:54] also were born with a model IP mindset
[01:54:57] with the idea of that customer Le should
[01:55:01] be defining which functionalities are
[01:55:04] they needing which performance they are
[01:55:06] needed and for that we decided to build
[01:55:09] a set a number of blocks and pics which
[01:55:13] include passive tunable and active
[01:55:16] designs through different materials and
[01:55:19] now validating through different
[01:55:21] foundies so basically we are a company
[01:55:24] which is making photonics design those
[01:55:26] blocks that or those PS that BPA was
[01:55:29] mentioned before that need to be
[01:55:30] combined to Pro to build an application
[01:55:33] along different platforms because we
[01:55:36] understand is customer choice to decize
[01:55:38] was the better fit for each stage of its
[01:55:42] product so basically what we do is we do
[01:55:45] we do design uh we do a very efficient
[01:55:47] design of different photonics elements
[01:55:50] we are working with a number of com
[01:55:52] funding so validating making sure that
[01:55:55] they are very efficient but especially
[01:55:57] making sure that they are reliable
[01:55:59] because we do understand that in order
[01:56:02] to happen this massive adoption of
[01:56:04] photonis that everyone is promising for
[01:56:07] years reliability is a mass of the
[01:56:09] industry so that customers can bring all
[01:56:13] this together into the final application
[01:56:16] so in an nut cell what Al can do for you
[01:56:19] is on the one hand making sure that
[01:56:22] different functionalities are designed
[01:56:24] in an efficient way bringing the best
[01:56:27] performance for CH functionality but
[01:56:30] also ensuring your business through uh
[01:56:33] or agreements with different foundies so
[01:56:35] that time to Market when they finding a
[01:56:38] new product and the market for the next
[01:56:39] generation of
[01:56:41] application it's going to sorten for a
[01:56:45] customer and in an nutel that's us you
[01:56:48] can contact us if you're interested in
[01:56:50] bringing this new application into
[01:56:53] Market but also your a fundry or a
[01:56:55] partner that requires from the science
[01:56:57] to make this uh capacities of yours
[01:57:00] easier into your customers because
[01:57:01] making photonic easier for the future is
[01:57:05] what we do at
[01:57:12] Al okay
[01:57:16] greata very very good
[01:57:20] presentation can you hear me
[01:57:22] yeah good okay thank you for the
[01:57:25] presentation uh maybe any
[01:57:29] questions then I'll start with the most
[01:57:32] important one so so so what can you do
[01:57:34] for us and what can we do for you as
[01:57:36] epic members as a Bic members as we
[01:57:39] mentioned and we are in conversation
[01:57:40] with some of the members is how we make
[01:57:43] uh more easier foris who we make IP
[01:57:46] available for any customers not everyone
[01:57:48] needs have a PC and design an mm from
[01:57:51] scratch
[01:57:52] ER that's basically what we do for
[01:57:54] others and in collaboration with
[01:57:58] fonds uh so that uh and because learning
[01:58:01] is that customer choice where they're
[01:58:02] going to scale so that's what we can do
[01:58:05] for everyone here and what we expect
[01:58:07] from you is let us know you find a Road
[01:58:10] M somewhere we have not explored yet and
[01:58:12] we mentioned some of the things we are
[01:58:13] doing but we are open to
[01:58:15] explore uh new materials and happy to
[01:58:19] bring us into life
[01:58:22] okay that sounds like a nice Motel okay
[01:58:25] thank you very much Hima um any further
[01:58:29] questions because if not we're hitting
[01:58:32] the twoh hour uh barrier now so um I'd
[01:58:36] like to thank Hima and all the speakers
[01:58:39] of this session one more time and just
[01:58:43] quickly share a few things with you so
[01:58:46] this was the online technology meeting
[01:58:48] on hybrid photonic integrated circuits
[01:58:50] presented by epic for you
[01:58:54] um so just to remind you again epic is
[01:58:58] there to help you with technology
[01:59:00] consultations Market studies networking
[01:59:02] opportunities mentorship recruiting and
[01:59:05] investment uh
[01:59:08] opportunities um so this was uh made
[01:59:12] possible by all the team of Epic my
[01:59:16] brilliant colleagues here and just one
[01:59:19] more reminder for you the 15 and 16 of
[01:59:21] October have a pck summit Europe coming
[01:59:24] so please uh join and uh please uh don't
[01:59:28] forget to use the Epic 15% discount code
[01:59:32] uh with this this is the end of the
[01:59:33] event thank you very much for your
[01:59:35] attention thank you for staying with us
[01:59:37] until the very end and hope to see you
[01:59:40] on the next occasion thank
[01:59:45] you thanks a lot bye thank you yeah at
[01:59:49] this point yes we stopped the recording
[01:59:52] so the meeting is available will be
[01:59:53] available later also on YouTube so I
[01:59:56] hope all of you got some information
[01:59:59] from this again if you miss any contacts
[02:00:03] uh you want to get in touch with our
[02:00:04] speakers or you have any other idea for
[02:00:07] collaboration don't hesitate let me know
[02:00:10] uh also also the room will be available
[02:00:13] for a few more minutes if you want to
[02:00:14] have a discussion with someone now you
[02:00:17] have the open mic
[02:00:20] session thanks
[02:00:24] and uh yeah like we discussed next week
[02:00:27] at Eco uh don't forget to register for
[02:00:30] the Epic reception at Eco please join us
[02:00:33] for
[02:00:34] the
[02:00:36] um uh for the product release uh session
[02:00:39] we have there and for all the other epic
[02:00:43] events organized so looking forward to
[02:00:46] see you in
[02:00:49] Frankfurt and uh I think out of the
[02:00:52] speakers everyone is coming basically
[02:00:54] that's what that's what I
[02:00:56] understood so so we really gathered in
[02:00:59] time
[02:01:02] now yeah
[02:01:12] good Evan goodbye thanks for
[02:01:15] organizing thanks York goodbye we see
[02:01:19] each other on the next occasion yes Edie
[02:01:22] goodbye Lara goodbye