Challenges and Strategies for high volume manufacturing and testing of Co-Packaged Optics

Full Transcript

https://www.youtube.com/watch?v=6wsUvp3r8IQ

[00:00] using the Q a function not the chat.
[00:02] using the Q a function not the chat function and if you could please indicate whether the question is for Torsten or for keys.
[00:09] this is the 15th in a series of webinars that we've done on co-packaged Optics and and CPO.
[00:17] um sponsored uh presented by Kobo which is the Consortium for onboard Optics and presented by Dupont Silicon Valley Technology Center.
[00:29] we will have a replay of this webinar available in about a week and the slide Decks that you're about to see will also be shared online.
[00:37] so with that let's get started Torsten welcome and the floor is all yours.
[00:45] thank you very much Jim so let me just get this presentation started.
[00:54] um so I guess you can see the presentation.
[01:00] I guess you can see the presentation area.
[01:02] Yes.
[01:03] Yes, thank you very much.
[01:05] Thank you very much, Jim.
[01:06] Jim, um, yeah, as you uh mentioned, uh, my name.
[01:09] Um, yeah, as you uh mentioned, uh, my name is Toasten Valentamp, one of the two.
[01:11] Is Toasten Valentamp, one of the two founders of Flycontact.
[01:14] Ficantech stands for fiber connecting technology.
[01:17] That is what we do since uh 23 years now.
[01:21] What we do since uh 23 years now. Um, we have started uh 2000 uh with building the first machines.
[01:27] We have 240 people working for us around the globe.
[01:30] People working for us around the globe, and we're working for the um major our photonic companies in the world as a machine builder.
[01:40] As Jim mentioned, uh, I will refer to Dave the challenges and the strategies for high volume manufacturing and testing of cool package Optics.
[01:47] And I will start uh with a slide and a diagram we all know very, very well in different uh forms, colors, uh, and magnitudes.
[01:56] It's the.
[02:00] colors uh and magnitudes it's the integrated photonic device forecast.
[02:02] integrated photonic device forecast um it's the the integrated photonic.
[02:05] um it's the the integrated photonic devices are mainly driven by data.
[02:08] devices are mainly driven by data centers today but we see a new areas.
[02:11] centers today but we see a new areas coming up just to.
[02:14] coming up just to emphasize that we are knowing uh or.
[02:17] emphasize that we are knowing uh or diagnose what we're talking about.
[02:19] diagnose what we're talking about approximately uh 40 to 50 percent of all.
[02:22] approximately uh 40 to 50 percent of all the devices which were assembled uh or.
[02:24] the devices which were assembled uh or built into 22 will uh were coming from.
[02:28] built into 22 will uh were coming from uh one of our machines so.
[02:31] uh one of our machines so um and today.
[02:33] um and today um these uh are usually pluggable.
[02:37] um these uh are usually pluggable um uh components we're assembling with.
[02:40] our our machines a lot of uh coherent transceivers but we see a drive into.
[02:42] transceivers but we see a drive into automatic assembly of co-package Optics.
[02:46] automatic assembly of co-package Optics and this is.
[02:49] and this is um why I found this topic today super.
[02:50] um why I found this topic today super interesting and uh I gave you can you.
[02:52] interesting and uh I gave you can you give you maybe a few insights uh what.
[02:55] give you maybe a few insights uh what we're doing currently.
[02:57] we're doing currently um if you see the success story of.
[03:02] um if you see the success story of semiconductors what happened over the semiconductors what happened over the last uh 35 40 years.
[03:07] last uh 35 40 years um semiconductor became so successful.
[03:10] um semiconductor became so successful because.
[03:12] because um the device manufacturers.
[03:14] um the device manufacturers um started in the beginning of their.
[03:17] um started in the beginning of their um of the the work in semiconductors to.
[03:22] um of the the work in semiconductors to work very very closely with the machine.
[03:25] work very very closely with the machine manufacturers the equipment.
[03:26] manufacturers the equipment manufacturers and due to the fact that.
[03:28] manufacturers and due to the fact that they.
[03:30] they part of the Synergy and and and the um.
[03:34] part of the Synergy and and and the um an ecosystem of devices and machines.
[03:38] an ecosystem of devices and machines um a lot of standardization are possible.
[03:40] um a lot of standardization are possible a lot of uh processes were developed.
[03:42] a lot of uh processes were developed which were really conducive to high.
[03:44] which were really conducive to high volume manufacturing and this is.
[03:47] volume manufacturing and this is something what we as an industry uh the.
[03:51] something what we as an industry uh the device makers together with the.
[03:53] device makers together with the equipment vendors and we are for sure.
[03:54] equipment vendors and we are for sure not the only one uh doing this um.
[03:59] not the only one uh doing this um uh we have to to generate.
[04:02] uh we have to to generate um a structure where we work together in.
[04:04] um a structure where we work together in order to to follow the successor of.
[04:07] order to to follow the successor of similar connectors and turn that into.
[04:09] similar connectors and turn that into the photonics uh as a photonics would uh pass so.
[04:12] the photonics uh as a photonics would uh pass so.
[04:14] pass so um that's what we are working on that's.
[04:16] um that's what we are working on that's what we are willing to uh what we're working on today with many large.
[04:18] what we are willing to uh what we're working on today with many large um device manufacturers with a lot of.
[04:21] um device manufacturers with a lot of institutes around the world and we are.
[04:23] institutes around the world and we are open to cooperate with with many other.
[04:25] open to cooperate with with many other companies which are approaching us uh to help them uh to to be in that um to.
[04:28] companies which are approaching us uh to help them uh to to be in that um to automate these kind of processes.
[04:31] um to make sure we all understand that.
[04:35] um to make sure we all understand that packaging and the testing is still a major cost driver.
[04:40] packaging and the testing is still a major cost driver in the um in the photonics industry and.
[04:43] in the um in the photonics industry and here's the industry always says it's 80.
[04:47] here's the industry always says it's 80 I I believe it's much less when it's coming to high volume and or today's.
[04:49] I I believe it's much less when it's coming to high volume and or today's high volume manufacturing.
[05:03] high volume manufacturing um but it's still like above 30.
[05:06] um but it's still like above 30 um and this is something what we have to tackle as an industry.
[05:08] um and this is something what we have to tackle as an industry.
[05:10] tackle as an industry um and that's what we are doing already.
[05:12] um and that's what we are doing already and I brought few examples where we will be working on high volume uh manufacturing already.
[05:15] and I brought few examples where we will be working on high volume uh manufacturing already.
[05:17] be working on high volume uh manufacturing already.
[05:19] manufacturing already you see here.
[05:21] you see here um it's a air Purity sensor assemblies.
[05:25] um it's a air Purity sensor assemblies uh it's a complete line where you're here in the front you put in the devices.
[05:27] uh it's a complete line where you're here in the front you put in the devices.
[05:30] here in the front you put in the devices like housings Optical elements and there are large feeders which put the optical components onto conveyors which runs through the whole line here and then you have uh in this case three active alignment cells.
[05:34] like housings Optical elements and there are large feeders which put the optical components onto conveyors which runs through the whole line here and then you have uh in this case three active alignment cells.
[05:36] are large feeders which put the optical components onto conveyors which runs through the whole line here and then you have uh in this case three active alignment cells.
[05:39] components onto conveyors which runs through the whole line here and then you have uh in this case three active alignment cells.
[05:41] through the whole line here and then you have uh in this case three active alignment cells.
[05:44] have uh in this case three active alignment cells um in the kind of buffer cell and an End of Line testing until it clear at the end will go out into blisters again and then the operator can take the components and bring them to the next process steps it's a complete automatic line for photonics here you see.
[05:46] alignment cells um in the kind of buffer cell and an End of Line testing until it clear at the end will go out into blisters again and then the operator can take the components and bring them to the next process steps it's a complete automatic line for photonics here you see.
[05:49] um in the kind of buffer cell and an End of Line testing until it clear at the end will go out into blisters again and then the operator can take the components and bring them to the next process steps it's a complete automatic line for photonics here you see.
[05:51] of Line testing until it clear at the end will go out into blisters again and then the operator can take the components and bring them to the next process steps it's a complete automatic line for photonics here you see.
[05:55] end will go out into blisters again and then the operator can take the components and bring them to the next process steps it's a complete automatic line for photonics here you see.
[05:57] then the operator can take the components and bring them to the next process steps it's a complete automatic line for photonics here you see.
[05:58] components and bring them to the next process steps it's a complete automatic line for photonics here you see.
[06:00] process steps it's a complete automatic line for photonics here you see.
[06:03] line for photonics here you see.
[06:05] here you see um an installation in uh in Thailand.
[06:08] um an installation in uh in Thailand where we have 150 machines uh cassette.
[06:10] where we have 150 machines uh cassette cassette located building transceiver uh.
[06:15] cassette located building transceiver uh transceivers for one of our our large.
[06:17] transceivers for one of our our large customers so there's one machine after.
[06:19] customers so there's one machine after the other.
[06:20] the other um they're all running fully automatic.
[06:22] um they're all running fully automatic the only thing you do is bringing a.
[06:24] the only thing you do is bringing a cassette with uh transceiver modules and.
[06:27] cassette with uh transceiver modules and at the end you take this module out uh.
[06:29] at the end you take this module out uh the cassette out and bring it to the.
[06:30] the cassette out and bring it to the next process steps for example the wire.
[06:32] next process steps for example the wire or not so high volume manufacturing and.
[06:35] or not so high volume manufacturing and photonics is not new it's done already.
[06:37] photonics is not new it's done already and.
[06:38] and um for co-package optics for sure it's a.
[06:41] um for co-package optics for sure it's a it's a different uh challenge because.
[06:45] it's a different uh challenge because the the components are completely uh.
[06:48] the the components are completely uh different and the way how the the.
[06:51] different and the way how the the structure is.
[06:54] um is made the way how the machine has.
[06:57] um is made the way how the machine has to operate in order to be able to also.
[06:59] to operate in order to be able to also bring a compact optic device to high.
[07:01] bring a compact optic device to high volume manufacturing is different and it.
[07:04] volume manufacturing is different and it doesn't matter if the.
[07:05] doesn't matter if the components are assembled actively or passive.
[07:09] I brought here it's two examples you see here it's a silicon chip in this case with v-grooves where the um ribbon is put into the into the B groups or I use use lenses and I have a glass block and put the um the fiber array in front of it so but the way how the device is moving through such an automatic machine is different from what we are doing today.
[07:35] um we are preparing for that um um I just as an example um brought here the um the passive attach of of uh fiber arrays with a little um.
[07:46] with a little [Music] [Music] um I'll call it a glass piece which goes on top of the uh the fibers so you you have the V roofs here on the on the on the Silicon chip you bring the fiber arrays in here um you put the glass lid on top you've used uh um epoxy in in different ways uh
[08:08] used uh um epoxy in in different ways uh and finally you press the the fibers.
[08:12] and finally you press the the fibers into the v-booths that's today a very standard process but if you want to go to high volume manufacturing you need to deliver these fiber fiber arrays to the to the machine and uh one way um where one part of the process we are working on with different uh customers at the moment is the full automatic fiber prep because somebody has to prepare the fiber or the fiber ribbon before it goes into this process and here you see um a unit we have developed a strip cleave unit with a CO2 laser so where you um load the fiber from the spool you cut it to length with a um with a laser the strip and cleave um the the components you insert the fibers into the connector or the the V groups and then you finish the whole.
[09:10] groups and then you finish the whole um process with the with the um.
[09:14] um process with the with the um epoxy attach if you have a glass block.
[09:17] epoxy attach if you have a glass block or like an empty connector you find.
[09:20] or like an empty connector you find finally need to polish that's not done.
[09:22] finally need to polish that's not done in the machine that's an extra step.
[09:24] in the machine that's an extra step I wrote a video of this kind of process.
[09:27] I wrote a video of this kind of process just to show.
[09:30] just to show how this can uh how this how this will.
[09:32] how this can uh how this how this will look like so this is a buffer strip.
[09:34] look like so this is a buffer strip process.
[09:35] process with a CO2 laser.
[09:37] with a CO2 laser and finally there's a cleave process so.
[09:40] and finally there's a cleave process so this is the cutting of the fiber and.
[09:44] this is the cutting of the fiber and cleaving process simultaneously and this.
[09:46] cleaving process simultaneously and this is the insert of the fiber arrays into.
[09:49] is the insert of the fiber arrays into the Mt connector and you can imagine.
[09:50] the Mt connector and you can imagine this can be the same can be also done.
[09:53] this can be the same can be also done within.
[09:54] within um with a v-roof on the Silicon photonic.
[09:56] um with a v-roof on the Silicon photonic chip.
[09:57] chip so this is one of the examples where we.
[10:01] so this is one of the examples where we work together with customers or on our.
[10:04] work together with customers or on our own initiatives in order to prepare for.
[10:07] own initiatives in order to prepare for co-package Optics because we think.
[10:09] co-package Optics because we think we believe that the the industry needs.
[10:13] We believe that the the industry needs this kind of techniques.
[10:15] This kind of techniques um because it's just the missing part of.
[10:17] Um because it's just the missing part of the whole process putting the fiber.
[10:19] The whole process putting the fiber arrays into the groups.
[10:22] Arrays into the groups so there's there's many many process.
[10:24] So there's there's many many process steps like that.
[10:25] Steps like that since I only have 20 minutes I will.
[10:27] Since I only have 20 minutes I will concentrate on this one process because.
[10:30] Concentrate on this one process because I would also like to show.
[10:33] I would also like to show um.
[10:34] Um the that we have to have processes for.
[10:37] The that we have to have processes for testing it's not assembly is only one.
[10:40] Testing it's not assembly is only one part of the the whole equation testing.
[10:42] Part of the the whole equation testing the optical components before they go.
[10:44] Into the packaging process and after.
[10:46] Into the packaging process and after they are coming out of the packaging.
[10:48] They are coming out of the packaging process is essential.
[10:50] Process is essential um we have started.
[10:52] Um we have started um this activity in 2018.
[10:54] Um this activity in 2018 um when the first Wafers were brought to.
[10:56] Um when the first Wafers were brought to us and.
[10:57] Us and um uh people said okay we need automatic.
[11:00] Um uh people said okay we need automatic test equipment.
[11:02] Test equipment um to test our Wafers or singulated.
[11:03] Um to test our Wafers or singulated devices and we worked and that time it.
[11:07] Devices and we worked and that time it was still called coherent solution today.
[11:09] Quantify photonics and we built the.
[11:12] Quantify photonics and we built the first tested automatic tester including.
[11:17] first tested automatic tester including instrumentation.
[11:18] instrumentation in this case the machine was the slave.
[11:23] in this case the machine was the slave and the driving uh unit and I think he's will discuss that a little bit further.
[11:28] will discuss that a little bit further the the test instrumentation with their software was triggering our machine to go to the next.
[11:35] um to the next time so and we have evolved this technology now to a complete full standardized wafer level test system which you can literally buy off the shelf and uh it brings all the features in order to capitalize into a chip copper light out of the chip.
[11:53] electrically probe the device having RF interconnects we have one tester currently in our facility which has over 600 DC and RF probes attached to the chip and a coupling light in and out of the chip there is a full data traceability in this machines where you can finally get a complete.
[12:19] where you can finally get a complete mapping of your wafer.
[12:23] and I just want to show also a small video of this kind of machine.
[12:26] to see to demonstrate how that is operating.
[12:30] and please will come to the instrumentation in this presentation but you load that you load the wafer onto the temperature control check.
[12:39] you can temperature control these Chucks from -40 to plus 200 degrees C.
[12:45] you indicate the first or the the three outer points on the chuck on the on the wafer to make sure the machine knows where the devices are located roughly.
[12:55] and then the machine moves automatically um to the first chip.
[12:59] you do electrical probing.
[13:02] you move down uh with the optical probes and you start your active alignment.
[13:06] if you see here the top view camera where we align our singulated fiber.
[13:10] this works the same way with fiber arrays.
[13:12] here you see a fiber array just to show it can be one fiber array where it's incline in coupling out coupling or
[13:20] it's incline in coupling out coupling or two fibers where one one area is.
[13:22] two fibers where one one area is coupling in the other coupling out.
[13:25] coupling in the other coupling out very interestingly we have developed as.
[13:29] very interestingly we have developed as a partner company Vanguard automation.
[13:31] a partner company Vanguard automation these periscopes so these periscopes are.
[13:34] these periscopes so these periscopes are printed on top of a fiber array which.
[13:36] printed on top of a fiber array which you see here.
[13:38] you see here so these little.
[13:40] so these little units here they are 50 micrometer tall.
[13:44] units here they are 50 micrometer tall and with these units you can actually.
[13:47] and with these units you can actually move the fibers into a groove of a wafer.
[13:51] move the fibers into a groove of a wafer uh to do Edge coupling or in wafer level.
[13:55] it's a very interesting and very.
[13:57] it's a very interesting and very essential uh part for a lot of our.
[13:59] essential uh part for a lot of our customers already so here you see the.
[14:01] customers already so here you see the the 3D.
[14:03] the 3D um or the the schematic how that works.
[14:07] um or the the schematic how that works you can adapt these lenses um to the.
[14:09] you can adapt these lenses um to the mode side of the of the pick uh you have.
[14:12] mode side of the of the pick uh you have on the wafer but with this technology.
[14:14] on the wafer but with this technology you can move from device to device on.
[14:18] you can move from device to device on the.
[14:19] the on the wafer and do Edge coupling.
[14:24] So here, uh, my last slide, we have Indica.
[14:27] So here, uh, my last slide, we have Indica integrated this kind of technology.
[14:30] Integrated this kind of technology, um, as I mentioned already in our wafer.
[14:32] Um, as I mentioned already in our wafer level test system.
[14:35] Level test system, um, where now you do characterization of.
[14:37] Um, where now you do characterization of the devices, so the instrumentation is.
[14:40] The devices, so the instrumentation is triggering our machine to move from one.
[14:42] Triggering our machine to move from one device to the other, but you cannot do.
[14:44] That only a wafer level, we have a lot of.
[14:45] device to the other, but you cannot do that only a wafer level, we have a lot of customers who do the same.
[14:48] Customers who do the same, um, uh, the same tests on ship level, do.
[14:52] Um, uh, the same tests on ship level, do you see a chip level approach where you.
[14:54] You see a chip level approach where you have a, um, the chip on the check also.
[14:57] Have a, um, the chip on the check also temperature controlled, as I mentioned.
[14:59] Temperature controlled, as I mentioned before.
[15:00] Before, um, the DC probes are.
[15:03] Um, the DC probes are, um, around the chip, and then you have one.
[15:06] Um, around the chip, and then you have one fiber array to couple light into the.
[15:08] Fiber array to couple light into the chip and out of the chip.
[15:11] Chip and out of the chip, and I have, uh, here a picture of a tel, uh.
[15:14] And I have, uh, here a picture of a tel, uh, tester with.
[15:17] Tester with the instrumentation on top that is going.
[15:20] The instrumentation on top that is going into the mass testing, I.
[15:22] Into the mass testing, I, um, high channel count testing.
[15:26] um High Channel account testing and this kind of Technology.
[15:29] this kind of Technology um is mainly done right now with uh for.
[15:32] um is mainly done right now with uh for the the Electrical uh or pure electrical.
[15:36] the the Electrical uh or pure electrical testing but it has to be done also for.
[15:38] testing but it has to be done also for the photonic devices so we're working.
[15:42] the photonic devices so we're working with our partners.
[15:44] with our partners on Technologies to us to tackle exactly.
[15:46] on Technologies to us to tackle exactly that issue to make sure we have also.
[15:50] that issue to make sure we have also Mass testing capabilities uh for wafers.
[15:53] Mass testing capabilities uh for wafers uh in the future.
[15:55] uh in the future thank you very much and I would like to.
[15:57] thank you very much and I would like to give a hand over to Keith who gives you.
[15:59] give a hand over to Keith who gives you a much much uh closer view on all these.
[16:02] a much much uh closer view on all these requirements on instrumentation thank you.
[16:10] all right let me share my presentation.
[16:13] all right let me share my presentation just one second.
[16:15] just one second see here.
[16:33] okay is that working for everybody?
[16:37] yes it is and I just like to remind the audience if they have any questions.
[16:41] please use the Q a function and we'll address them anonymously at the end of the case presentation.
[16:50] okay I have a hard time seeing my own slides let's see can you guys see my slides?
[16:57] yes it's not in presenter mode but we see the slides.
[17:03] here we go.
[17:05] all right.
[17:06] thank you very much Jim so first of all I would like to thank Kobo for uh for hosting this webinar and bringing together different kinds of Technology Partners to really Advance the ecosystem.
[17:22] of course co-pack is Optics something really cool you know a lot of people you know want to work with it but still we're at the beginning stage and a lot of things need to happen to bring that to a mature level.
[17:32] um also wanted to thank torson for the
[17:35] um also wanted to thank torson for the for the excellent overview of photonics.
[17:38] for the excellent overview of photonics manufacturing and assembly equipment.
[17:40] manufacturing and assembly equipment it's pretty pretty impressive what you.
[17:42] it's pretty pretty impressive what you showed there so my focus is going to be.
[17:46] on testing strategies.
[17:48] to to tie it all together to go to the.
[17:51] to to tie it all together to go to the you know the the Final Destination which.
[17:54] is commercially viable photonics.
[17:57] technology or CPO technology in mass.
[18:00] technology or CPO technology in mass volume.
[18:05] so.
[18:07] so you know everybody is pretty familiar.
[18:10] you know everybody is pretty familiar with.
[18:12] with um code package Optics.
[18:15] um code package Optics silicon photonics.
[18:18] silicon photonics as well as photonic integrated circuits.
[18:21] as well as photonic integrated circuits you know the the value proposition of.
[18:23] you know the the value proposition of these Technologies is that you can.
[18:25] these Technologies is that you can really achieve the significant power.
[18:28] really achieve the significant power reductions that are critical in Next.
[18:30] reductions that are critical in Next Generation networks as well as the the.
[18:33] Generation networks as well as the the density a front panel bandwidth that you.
[18:37] density a front panel bandwidth that you also need in those applications however.
[18:40] also need in those applications however and I call this kind of the the Dark Side of the Moon.
[18:42] and I call this kind of the the Dark Side of the Moon we typically don't pay so much attention to how we actually make these devices and also how we make sure that these devices are meeting the the final specifications and requirements.
[18:44] so much attention to how we actually make these devices and also how we make sure that these devices are meeting the the final specifications and requirements.
[18:47] so much attention to how we actually make these devices and also how we make sure that these devices are meeting the the final specifications and requirements.
[18:52] make these devices and also how we make sure that these devices are meeting the the final specifications and requirements.
[18:54] sure that these devices are meeting the the final specifications and requirements.
[18:57] the final specifications and requirements so in order to do that of course you need to have the sophisticated and capable equipment the torsion just talked about but also you need to kind of have a holistic testing strategy to uh to make that happen.
[18:59] requirements so in order to do that of course you need to have the sophisticated and capable equipment the torsion just talked about but also you need to kind of have a holistic testing strategy to uh to make that happen.
[19:00] course you need to have the sophisticated and capable equipment the torsion just talked about but also you need to kind of have a holistic testing strategy to uh to make that happen.
[19:03] sophisticated and capable equipment the torsion just talked about but also you need to kind of have a holistic testing strategy to uh to make that happen.
[19:05] torsion just talked about but also you need to kind of have a holistic testing strategy to uh to make that happen.
[19:08] need to kind of have a holistic testing strategy to uh to make that happen.
[19:11] strategy to uh to make that happen that will be the the focus of my presentation.
[19:13] that will be the the focus of my presentation.
[19:15] presentation so just a quick Market overview where does photonics really play so of course hyperscale data centers it seems that they're getting bigger and bigger.
[19:17] so just a quick Market overview where does photonics really play so of course hyperscale data centers it seems that they're getting bigger and bigger.
[19:20] does photonics really play so of course hyperscale data centers it seems that they're getting bigger and bigger.
[19:23] hyperscale data centers it seems that they're getting bigger and bigger.
[19:26] they're getting bigger and bigger um you know these are the the data centers where thousands of storage devices switches and routers are all connected in the distances are up to a.
[19:27] um you know these are the the data centers where thousands of storage devices switches and routers are all connected in the distances are up to a.
[19:30] centers where thousands of storage devices switches and routers are all connected in the distances are up to a.
[19:34] devices switches and routers are all connected in the distances are up to a.
[19:37] connected in the distances are up to a few few kilometers so obviously to
[19:40] few few kilometers so obviously to enable that those high-speed connections
[19:42] enable that those high-speed connections over you know a few kilometers you can
[19:45] over you know a few kilometers you can only do that with photonics Optics and
[19:48] only do that with photonics Optics and then also what we see is a trend towards
[19:50] then also what we see is a trend towards improved
[19:52] improved um compute Network for AI and machine
[19:56] um compute Network for AI and machine learning kind of disaggregated networks
[19:58] learning kind of disaggregated networks where you combine the uh the compute
[20:01] where you combine the uh the compute functions on a single on a single board
[20:03] functions on a single on a single board but you connect those with high
[20:07] but you connect those with high bandwidth low latency Optical
[20:10] bandwidth low latency Optical interconnects of course AI machine
[20:13] interconnects of course AI machine learning critical for acceleration
[20:15] learning critical for acceleration infrastructure so these are very big
[20:18] infrastructure so these are very big drivers for our industry if you look at
[20:21] drivers for our industry if you look at the market size you know I I put some
[20:24] the market size you know I I put some links to Market Research reports of
[20:27] links to Market Research reports of established firms and if you look at the
[20:31] established firms and if you look at the um you know the numbers our job security
[20:34] um you know the numbers our job security is pretty much guaranteed for the next
[20:36] is pretty much guaranteed for the next couple of years but but on a serious
[20:38] couple of years but but on a serious note it really means that the
[20:40] note it really means that the pervasiveness of photonics in Optical of
[20:44] pervasiveness of photonics in Optical of or in in computer and communication
[20:47] or in in computer and communication networks is really increasing
[20:49] networks is really increasing significantly which should lead to very
[20:52] significantly which should lead to very healthy double-digit growth for the
[20:55] healthy double-digit growth for the foreseeable future
[20:58] so what does we know the problem
[21:01] so what does we know the problem statement what what is what is the the
[21:03] statement what what is what is the the big challenge what is causing the pain
[21:06] big challenge what is causing the pain um so torsion already mentioned also Jim
[21:08] um so torsion already mentioned also Jim you know we have this these silicon
[21:11] you know we have this these silicon photonics photonic integrated circuit
[21:13] photonics photonic integrated circuit technology which is kind of the basis
[21:14] technology which is kind of the basis for for for CPO
[21:17] for for for CPO um you know you have the production
[21:19] um you know you have the production stages that you need to go through all
[21:21] stages that you need to go through all with its specific test requirements so
[21:24] with its specific test requirements so first you get the wafer from The Foundry
[21:26] first you get the wafer from The Foundry you know you will need to of course do a
[21:29] you know you will need to of course do a way for short what are the good way
[21:31] way for short what are the good way first or what are the Good Die on the
[21:34] first or what are the Good Die on the way first that you're going to process
[21:36] way first that you're going to process to The Next Step then you get the die or
[21:39] to The Next Step then you get the die or the separate pick again you need to
[21:42] the separate pick again you need to handle those so the the the the complex
[21:45] handle those so the the the the complex equipment that Thorson talked about can
[21:47] equipment that Thorson talked about can handle those dies you need to you need
[21:49] handle those dies you need to you need to test them you need to align fiber
[21:52] to test them you need to align fiber arrays to the pick
[21:54] arrays to the pick um and then to the to do the active or
[21:56] um and then to the to do the active or oppressive alignment and potentially add
[21:59] oppressive alignment and potentially add some additional chiplets on top of the
[22:01] some additional chiplets on top of the pick to get to the optical sub assembly
[22:06] pick to get to the optical sub assembly um
[22:07] um then that sub assembly will go to the to
[22:09] then that sub assembly will go to the to the final stage which is it will be
[22:12] the final stage which is it will be incorporated into a package with even
[22:14] incorporated into a package with even some additional equipments like
[22:16] some additional equipments like electrical ICS to get you to the module
[22:19] electrical ICS to get you to the module level that will eventually go to the end
[22:22] level that will eventually go to the end user
[22:23] user and then you also have the the product
[22:26] and then you also have the the product life cycle so you start typically in r d
[22:29] life cycle so you start typically in r d where you get first feedback on your
[22:32] where you get first feedback on your design choices so this is kind of the I
[22:35] design choices so this is kind of the I call it the expert phase where where you
[22:37] call it the expert phase where where you know very complex test equipment needs
[22:40] know very complex test equipment needs to give insight into your designs as
[22:42] to give insight into your designs as quickly as possible to know whether
[22:44] quickly as possible to know whether you're going to meet the requirements
[22:46] you're going to meet the requirements and then the validation States it's
[22:49] and then the validation States it's really the design verification testing
[22:52] really the design verification testing you need to make sure that your product
[22:54] you need to make sure that your product meets all the requirements over the
[22:57] meets all the requirements over the intended operating conditions that it is
[22:59] intended operating conditions that it is going to see then the next step okay now
[23:02] going to see then the next step okay now you need to actually manufacture the
[23:04] you need to actually manufacture the product of course ideally you want to
[23:07] product of course ideally you want to have the minimum testing in
[23:09] have the minimum testing in manufacturing but you'll probably start
[23:12] manufacturing but you'll probably start with a kind of a pilot manufacturing
[23:14] with a kind of a pilot manufacturing line where you will do a little bit more
[23:16] line where you will do a little bit more testing initially as part of your
[23:18] testing initially as part of your learning curve you there may be a
[23:20] learning curve you there may be a temperature screen still involved and
[23:23] temperature screen still involved and then once you really I have learned from
[23:25] then once you really I have learned from that initial manufacturing stage you're
[23:27] that initial manufacturing stage you're going to go to the next and the final
[23:29] going to go to the next and the final stage full volume manufacturing and
[23:33] stage full volume manufacturing and hopefully with a minimized screen of the
[23:36] hopefully with a minimized screen of the device before it ships to the customer
[23:38] device before it ships to the customer and then you have the deployment phase
[23:40] and then you have the deployment phase where the module actually goes to the
[23:42] where the module actually goes to the end user be to be deployed in the system
[23:45] end user be to be deployed in the system test requirements that states are again
[23:48] test requirements that states are again different it's mostly like hey there is
[23:50] different it's mostly like hey there is a potential faulty unit we need to test
[23:54] a potential faulty unit we need to test that get a quick pass fill test result
[23:57] that get a quick pass fill test result an incoming inspection of these valuable
[24:00] an incoming inspection of these valuable part is it meeting the specification is
[24:02] part is it meeting the specification is it going to work or interoperability
[24:04] it going to work or interoperability testing between different
[24:07] testing between different brands of of modules so this is kind of
[24:11] brands of of modules so this is kind of the the problem statement and this will
[24:13] the the problem statement and this will Define kind of the testing strategy that
[24:16] Define kind of the testing strategy that you will need to adopt to be successful
[24:18] you will need to adopt to be successful and success is defined by commercially
[24:20] and success is defined by commercially viable products in in volume
[24:28] so
[24:30] so in summary so what is now really the
[24:33] in summary so what is now really the the requirements for the test solutions
[24:35] the requirements for the test solutions that are going to support these Optical
[24:38] that are going to support these Optical interconnects
[24:40] interconnects um so the first thing is you need to be
[24:42] um so the first thing is you need to be able to support the photonics IC testing
[24:45] able to support the photonics IC testing from way for two packets product
[24:48] from way for two packets product um again it is different than the the
[24:50] um again it is different than the the previous generation of optical
[24:52] previous generation of optical transceivers which had more discrete
[24:54] transceivers which had more discrete components that you need to assemble and
[24:56] components that you need to assemble and align together
[24:58] align together very important
[25:00] very important um you know the complexity of this
[25:02] um you know the complexity of this technology really requires that you have
[25:04] technology really requires that you have a strong integration with the probing
[25:07] a strong integration with the probing assembly and Alignment alignment
[25:09] assembly and Alignment alignment equipment for these optimized test Flows
[25:12] equipment for these optimized test Flows In throughput
[25:14] In throughput so then you need to have the ability to
[25:16] so then you need to have the ability to test these miniaturized high Channel
[25:19] test these miniaturized high Channel count devices cost effectively and high
[25:21] count devices cost effectively and high Channel count you know literally these
[25:24] Channel count you know literally these are devices with hundreds of channels
[25:26] are devices with hundreds of channels that will give you some some challenges
[25:29] that will give you some some challenges that you need to think about in your
[25:31] that you need to think about in your strategy
[25:32] strategy and then
[25:33] and then there is going to be a variable mix of
[25:36] there is going to be a variable mix of test parameters that you need to go to
[25:38] test parameters that you need to go to you know you your product lifecycle from
[25:40] you know you your product lifecycle from r d to manufacturing and Beyond there's
[25:43] r d to manufacturing and Beyond there's a lot of things that you need to test
[25:44] a lot of things that you need to test it's not going to be the same from r d
[25:46] it's not going to be the same from r d to manufacturing that flexibility is
[25:48] to manufacturing that flexibility is really critical to be able to support
[25:50] really critical to be able to support that and of course last but not least
[25:52] that and of course last but not least enable the manufacturing in high volumes
[25:55] enable the manufacturing in high volumes but do that in a very cost effective
[25:58] but do that in a very cost effective manner
[25:59] manner typically what it means you know do more
[26:01] typically what it means you know do more testing up front learn from that
[26:04] testing up front learn from that minimize the testing in the later stages
[26:06] minimize the testing in the later stages and optimize the test and Manufacturing
[26:09] and optimize the test and Manufacturing form
[26:10] form so these are kind of this is kind of
[26:11] so these are kind of this is kind of setting the groundwork for what a
[26:13] setting the groundwork for what a testing strategy and solution needs to
[26:16] testing strategy and solution needs to look like
[26:18] look like so just a quick overview of what is what
[26:20] so just a quick overview of what is what is photonic testing what are the things
[26:22] is photonic testing what are the things that that people do so you have the the
[26:25] that that people do so you have the the passive testing you know basically you
[26:28] passive testing you know basically you do a characterization of a passive
[26:31] do a characterization of a passive waveguide structure that could be you
[26:33] waveguide structure that could be you know in Social as return loss or
[26:35] know in Social as return loss or polarization uh dependence and wavel
[26:37] polarization uh dependence and wavel Independence uh you know for instance
[26:39] Independence uh you know for instance just a a passive demultiplexer you can
[26:43] just a a passive demultiplexer you can do a
[26:45] do a wavelength plot of the of that filter
[26:47] wavelength plot of the of that filter an active test is now you look at the
[26:50] an active test is now you look at the performance as a function of a some kind
[26:53] performance as a function of a some kind of a control signal and it could be a
[26:56] of a control signal and it could be a modulator you look at the modulation
[26:59] modulator you look at the modulation depth or it could be you turn on a laser
[27:01] depth or it could be you turn on a laser you're going to characterize the laser
[27:03] you're going to characterize the laser you know does it have the line line
[27:05] you know does it have the line line width side mode suppression ratio that
[27:09] width side mode suppression ratio that is required for the product
[27:11] is required for the product then another category is at speed
[27:14] then another category is at speed testing so this is really the uh the the
[27:17] testing so this is really the uh the the high speed test the driving your duty
[27:20] high speed test the driving your duty with a high speed data generator and you
[27:24] with a high speed data generator and you want to see you know what is the what is
[27:25] want to see you know what is the what is the quality of the transmitter what is
[27:28] the quality of the transmitter what is the quality of the receiver and eye
[27:29] the quality of the receiver and eye diagram tdq BR measurements or receiver
[27:33] diagram tdq BR measurements or receiver sensitivity fall on the debt category so
[27:37] sensitivity fall on the debt category so these are very typical tests but then
[27:40] these are very typical tests but then very important are also environmental
[27:43] very important are also environmental stress testing and highly accelerated
[27:46] stress testing and highly accelerated lifetime testing obviously these are you
[27:49] lifetime testing obviously these are you know very densely packed modules
[27:51] know very densely packed modules carrying a lot of data you want to make
[27:53] carrying a lot of data you want to make sure that you test you know like the
[27:56] sure that you test you know like the environmental conditions exposure to
[27:59] environmental conditions exposure to humidity to temperature make sure that
[28:02] humidity to temperature make sure that the reliability of the product is
[28:04] the reliability of the product is meeting the requirements
[28:07] meeting the requirements um that it needs to
[28:08] um that it needs to then last but not least interoperability
[28:11] then last but not least interoperability you know just testing the transmitter or
[28:13] you know just testing the transmitter or independently the receiver
[28:16] independently the receiver is fine but you typically want to do
[28:18] is fine but you typically want to do also do kind of a system and a link test
[28:20] also do kind of a system and a link test you plug it in the system you let
[28:24] you plug it in the system you let modules from different vendors
[28:26] modules from different vendors interoperate with each other over a
[28:28] interoperate with each other over a variety of conditions to make sure that
[28:30] variety of conditions to make sure that you have the the full interoperability
[28:32] you have the the full interoperability that is required for your uh for your
[28:35] that is required for your uh for your system
[28:36] system so I mean it's kind of a an elaborate uh
[28:40] so I mean it's kind of a an elaborate uh introduction but it kind of sets the the
[28:42] introduction but it kind of sets the the the the the states for uh for some of
[28:45] the the the states for uh for some of the examples that we're going to review
[28:46] the examples that we're going to review here
[28:48] here so so wafer level
[28:50] so so wafer level um inspection testing uh very important
[28:53] um inspection testing uh very important Thorson gave some some excellent
[28:55] Thorson gave some some excellent examples of it and so it again this is
[28:59] examples of it and so it again this is part of the photonic integrated circuit
[29:01] part of the photonic integrated circuit and ecosystem
[29:04] and ecosystem um you get away from from The Foundry
[29:05] um you get away from from The Foundry you need to characterize uh that way for
[29:08] you need to characterize uh that way for so you it needs to sort of testing needs
[29:11] so you it needs to sort of testing needs to be integrated with the uh the wafer
[29:15] to be integrated with the uh the wafer Handler
[29:16] Handler which is going to control you know the
[29:18] which is going to control you know the position on the uh
[29:20] position on the uh on the way for as well as the probing
[29:22] on the way for as well as the probing you need to you know get a signal an
[29:25] you need to you know get a signal an optical signal into the way for and you
[29:28] optical signal into the way for and you need to get an optical signal out of it
[29:29] need to get an optical signal out of it to be able to Performance characterize
[29:32] to be able to Performance characterize the wafer so you know this is like a
[29:36] the wafer so you know this is like a schematic on on the right so what you
[29:38] schematic on on the right so what you will see is
[29:39] will see is um the probe in the probe out you
[29:42] um the probe in the probe out you connect test equipment to that and it
[29:43] connect test equipment to that and it can be a very wide variety of test
[29:45] can be a very wide variety of test equipment so it really depends what
[29:48] equipment so it really depends what you're going to test
[29:49] you're going to test um you know that will determine the
[29:52] um you know that will determine the selection of your test equipment so it
[29:54] selection of your test equipment so it could be a fixed laser it could be a
[29:56] could be a fixed laser it could be a sweat laser if you want to do kind of a
[29:58] sweat laser if you want to do kind of a wavelength dependent measurement you can
[30:02] wavelength dependent measurement you can use an optical amplifier make sure that
[30:04] use an optical amplifier make sure that the power level is meeting the
[30:06] the power level is meeting the requirements it could be a polarization
[30:09] requirements it could be a polarization condition very important in a lot of
[30:12] condition very important in a lot of situations you cannot control
[30:13] situations you cannot control polarization you need to make sure that
[30:16] polarization you need to make sure that your device is working over a variety of
[30:19] your device is working over a variety of polarization States
[30:20] polarization States uh on the other side
[30:23] uh on the other side um you're going to do some some
[30:24] um you're going to do some some measurements so it's an optical Spectrum
[30:26] measurements so it's an optical Spectrum analyzer looking at the you know the
[30:28] analyzer looking at the you know the optical Spectrum out of your duty
[30:31] optical Spectrum out of your duty Optical power detector this can be used
[30:34] Optical power detector this can be used for alignment it could be used for
[30:36] for alignment it could be used for insertion loss return loss measurements
[30:39] insertion loss return loss measurements just a signal or just a a quality check
[30:42] just a signal or just a a quality check of your uh of your waveguide Optical to
[30:45] of your uh of your waveguide Optical to electrical converter if you want to do
[30:47] electrical converter if you want to do some additional measurements in the
[30:49] some additional measurements in the electrical domain or an oscilloscope and
[30:51] electrical domain or an oscilloscope and clock recovery for the high speed
[30:52] clock recovery for the high speed testing that we that we alluded to so
[30:56] testing that we that we alluded to so very complex testing but the key is that
[30:59] very complex testing but the key is that the testing equipment is nicely
[31:02] the testing equipment is nicely integrated with the wafer Handler and
[31:05] integrated with the wafer Handler and the also the the probing system
[31:09] then the next level it's a die in The
[31:12] then the next level it's a die in The Pick of course you know the one of the
[31:14] Pick of course you know the one of the problem statements is we're now going to
[31:16] problem statements is we're now going to have
[31:18] have um modules with hundreds of channels so
[31:21] um modules with hundreds of channels so very important that every channel works
[31:24] very important that every channel works you you know the the feedback that we're
[31:26] you you know the the feedback that we're getting from the industry is we really
[31:29] getting from the industry is we really want to make sure that we test each and
[31:31] want to make sure that we test each and every channel
[31:33] every channel um you cannot have of course a module
[31:34] um you cannot have of course a module shipping where one or two channels are
[31:36] shipping where one or two channels are not works very critical
[31:38] not works very critical um in this stage what you will do is you
[31:41] um in this stage what you will do is you will of course do the alignment of the
[31:44] will of course do the alignment of the fiber array you can do it maybe in in a
[31:47] fiber array you can do it maybe in in a passive way as as torsion torsion
[31:49] passive way as as torsion torsion mentioned but I see a lot of people
[31:51] mentioned but I see a lot of people still wanting to do kind of an an active
[31:54] still wanting to do kind of an an active alignment you look at the power levels
[31:56] alignment you look at the power levels the optimize the position then you uh
[31:59] the optimize the position then you uh then you basically you can cure the
[32:02] then you basically you can cure the adhesive to make sure that you have the
[32:04] adhesive to make sure that you have the optimum performance and then it will
[32:06] optimum performance and then it will also allow you to do a test of all
[32:09] also allow you to do a test of all channels as a performance verification
[32:10] channels as a performance verification yes the device is is working uh it can
[32:14] yes the device is is working uh it can go to the to the next stage
[32:17] go to the to the next stage so then the next stage would be kind of
[32:20] so then the next stage would be kind of the module testing so
[32:22] the module testing so um this is typically you know the final
[32:25] um this is typically you know the final stage you combine everything together
[32:26] stage you combine everything together you have your Optical sub assembly you
[32:28] you have your Optical sub assembly you maybe have a PCB some electrical ICS to
[32:31] maybe have a PCB some electrical ICS to to give it the the very the MSA defined
[32:34] to give it the the very the MSA defined form factor like the qsfp DD or or the
[32:38] form factor like the qsfp DD or or the Next Generation osfp XD or oif 3.2 t uh
[32:44] Next Generation osfp XD or oif 3.2 t uh CPO which we typically need some kind of
[32:46] CPO which we typically need some kind of a fixture to get access to the dut and
[32:49] a fixture to get access to the dut and get access to the high speed signals and
[32:52] get access to the high speed signals and and especially in in the early phases
[32:54] and especially in in the early phases you probably want to do a kind of a
[32:56] you probably want to do a kind of a thermal stress test as part of the of
[32:59] thermal stress test as part of the of the final stage so there's going to be
[33:01] the final stage so there's going to be either a thermal stream or kind of a
[33:04] either a thermal stream or kind of a tech for for temperature control so if
[33:07] tech for for temperature control so if you look at the setup here on the right
[33:09] you look at the setup here on the right this setup will allow you to do so
[33:11] this setup will allow you to do so basically it has a fixture it has a bird
[33:14] basically it has a fixture it has a bird it has some switches it has some test
[33:17] it has some switches it has some test equipment and on the sides to enable you
[33:19] equipment and on the sides to enable you to do analysis of the optical Spectrum
[33:22] to do analysis of the optical Spectrum to see whether your transmitter is
[33:24] to see whether your transmitter is working fine you can do the ad speed
[33:26] working fine you can do the ad speed testing of the eye diagram and tdq with
[33:30] testing of the eye diagram and tdq with the DSO and you can also do receiver
[33:32] the DSO and you can also do receiver sensitivity you can send the signal back
[33:35] sensitivity you can send the signal back to the receiver do a br measurement
[33:37] to the receiver do a br measurement control the optical power level so that
[33:39] control the optical power level so that you can do your your sensitivity
[33:42] you can do your your sensitivity measurement to make sure that it meets
[33:45] measurement to make sure that it meets the requirements in manufacturing
[33:47] the requirements in manufacturing obviously you if you do this this full
[33:49] obviously you if you do this this full characterization that gives you the
[33:51] characterization that gives you the ability to do some additional tweaking
[33:53] ability to do some additional tweaking of the device parameters to get your
[33:55] of the device parameters to get your maximum yield
[33:57] maximum yield in in Pilot production you're probably
[33:59] in in Pilot production you're probably going to learn a lot so that in in mass
[34:02] going to learn a lot so that in in mass production you have to hopefully do a
[34:04] production you have to hopefully do a little bit less of the testing but still
[34:06] little bit less of the testing but still there are going to be a few key tests
[34:08] there are going to be a few key tests that you need to do before you see the
[34:11] that you need to do before you see the product to your end user
[34:13] product to your end user you know a great example of CPO module
[34:17] you know a great example of CPO module testing is this uh this slide here and
[34:20] testing is this uh this slide here and so we're working with an end user they
[34:22] so we're working with an end user they want to test all channels of their
[34:24] want to test all channels of their duties a few hundred channels obviously
[34:28] duties a few hundred channels obviously doing that sequentially is just going to
[34:31] doing that sequentially is just going to you know kill the test time it's going
[34:33] you know kill the test time it's going to kill the the workflow so we just we
[34:36] to kill the the workflow so we just we developed a module with 288 channels
[34:39] developed a module with 288 channels it's a 19 inch uh with one new high
[34:44] it's a 19 inch uh with one new high pizza box with 288 channels that enables
[34:48] pizza box with 288 channels that enables the customer to do a parallel screen to
[34:52] the customer to do a parallel screen to make sure that the product is meeting
[34:53] make sure that the product is meeting the requirements so that's pretty unique
[34:55] the requirements so that's pretty unique and this is kind of really driving some
[34:58] and this is kind of really driving some of these these these these key
[35:00] of these these these these key requirements you need to have this this
[35:02] requirements you need to have this this high density you need to do the the
[35:05] high density you need to do the the parallel testing of 100 channels to be
[35:08] parallel testing of 100 channels to be able to do this commercially viable
[35:11] able to do this commercially viable technology
[35:14] technology so talk a little bit about CPO
[35:17] so talk a little bit about CPO um and and you know in kind of the test
[35:19] um and and you know in kind of the test strategy that you that you will need to
[35:21] strategy that you that you will need to plan for that so of course you'll go
[35:23] plan for that so of course you'll go through the
[35:25] through the um the the product lifecycle from r d uh
[35:28] um the the product lifecycle from r d uh to manufacturing and deployment you will
[35:31] to manufacturing and deployment you will you will have your wafer die assembly
[35:33] you will have your wafer die assembly and package products a couple of things
[35:35] and package products a couple of things I think are really important here you
[35:38] I think are really important here you know for the initial phase in r d you
[35:40] know for the initial phase in r d you know you you'll get a lot of test data
[35:42] know you you'll get a lot of test data you want to Circle that back to your
[35:44] you want to Circle that back to your design tools for the optimization of the
[35:47] design tools for the optimization of the designs the the odvts for the design
[35:50] designs the the odvts for the design verification testing uh it will start
[35:53] verification testing uh it will start expand very quickly especially in the
[35:55] expand very quickly especially in the characterization validation States get a
[35:58] characterization validation States get a lot of data understand your product
[36:00] lot of data understand your product understand your process to optimize the
[36:03] understand your process to optimize the test and workflow later on and my
[36:07] test and workflow later on and my background is telecom Optics so stress
[36:11] background is telecom Optics so stress testing reliability testing early in the
[36:14] testing reliability testing early in the process it's really critical you know to
[36:16] process it's really critical you know to to weed out potential failure modes and
[36:19] to weed out potential failure modes and to really get you to that uh you know
[36:21] to really get you to that uh you know the technology reliable technology that
[36:24] the technology reliable technology that you want to bring to Market
[36:26] you want to bring to Market um again in the early phases take as
[36:29] um again in the early phases take as much data as possible to learn from that
[36:31] much data as possible to learn from that and in the later stages focus on the
[36:33] and in the later stages focus on the critical parameters and you know what
[36:36] critical parameters and you know what you typically see in in the ecosystem
[36:38] you typically see in in the ecosystem that the developer really you know works
[36:41] that the developer really you know works on the testing strategy in the earlier
[36:43] on the testing strategy in the earlier phases in very close cooperation of
[36:46] phases in very close cooperation of course with their Partners manufacturing
[36:48] course with their Partners manufacturing Partners The Foundry the offset and the
[36:51] Partners The Foundry the offset and the contract manufacturer at the
[36:53] contract manufacturer at the manufacturing stage is typically those
[36:55] manufacturing stage is typically those manufacturing Partners will own more of
[36:58] manufacturing Partners will own more of the testing strategy and then the end
[37:00] the testing strategy and then the end user once they have the product of
[37:02] user once they have the product of course they are basically
[37:04] course they are basically defining what kind of test requirements
[37:06] defining what kind of test requirements there are
[37:08] there are so a little more detail for for the CPO
[37:11] so a little more detail for for the CPO um you know kind of I call it the the
[37:13] um you know kind of I call it the the test life cycle is you know in the early
[37:17] test life cycle is you know in the early phases you know do a lot of testing on
[37:20] phases you know do a lot of testing on your ring resonator
[37:21] your ring resonator um is it meeting the requirements do you
[37:23] um is it meeting the requirements do you have the the coupling efficiency the the
[37:26] have the the coupling efficiency the the bandwidth the channel suppression
[37:29] bandwidth the channel suppression um also the the high speed modulator you
[37:32] um also the the high speed modulator you know in the early phases make sure that
[37:34] know in the early phases make sure that you test
[37:35] you test bandwidth modulation depth those are
[37:38] bandwidth modulation depth those are going to those
[37:40] going to those designs we're going to determine the
[37:42] designs we're going to determine the success of your product so tested early
[37:44] success of your product so tested early get the data feed it back to your design
[37:46] get the data feed it back to your design tools and optimize it then for instance
[37:50] tools and optimize it then for instance in the validation States
[37:52] in the validation States um
[37:53] um you get your wafer you really want to do
[37:55] you get your wafer you really want to do a a thorough investigation of what is
[37:59] a a thorough investigation of what is the performance across the wafer do the
[38:02] the performance across the wafer do the dye have all the same behavior other
[38:04] dye have all the same behavior other patterns get a lot of data and try to
[38:07] patterns get a lot of data and try to figure out whether you can come up with
[38:09] figure out whether you can come up with very simple screening routines to Def to
[38:13] very simple screening routines to Def to to basically test and measure and know
[38:16] to basically test and measure and know whether your dye is a good die or not so
[38:19] whether your dye is a good die or not so again get a lot of data based on that
[38:23] again get a lot of data based on that you will Define a die screening test and
[38:26] you will Define a die screening test and hopefully that the more data you get the
[38:28] hopefully that the more data you get the more you know you can simplify that test
[38:33] more you know you can simplify that test a couple of other things I think just
[38:35] a couple of other things I think just looking at the time here for a few
[38:37] looking at the time here for a few minutes left and
[38:40] minutes left and also in in the middle stages the
[38:42] also in in the middle stages the validation characterization States
[38:44] validation characterization States doesn't have to be maybe necessarily a
[38:46] doesn't have to be maybe necessarily a package product you can test the the
[38:48] package product you can test the the wavelength employee polarization
[38:50] wavelength employee polarization dependence of the photonic integrated
[38:53] dependence of the photonic integrated circuit you know a lot of cases we
[38:55] circuit you know a lot of cases we cannot control the polarization of the
[38:57] cannot control the polarization of the light that goes into your into your
[38:59] light that goes into your into your device so you need to be basically for
[39:03] device so you need to be basically for polarization insensitive and a lot of
[39:06] polarization insensitive and a lot of devices have a wavelength range over
[39:08] devices have a wavelength range over which they need to operate so testing
[39:11] which they need to operate so testing that your device is meeting the
[39:13] that your device is meeting the requirements over that specific
[39:15] requirements over that specific wavelength range is really important and
[39:17] wavelength range is really important and there's a lot of test modules out there
[39:19] there's a lot of test modules out there you know we have them in pxi format like
[39:22] you know we have them in pxi format like an optical Spectrum analyzer a tunable
[39:26] an optical Spectrum analyzer a tunable Laser Source a polarization conditioner
[39:29] Laser Source a polarization conditioner and an array of photo detectors that
[39:31] and an array of photo detectors that will enable that kind of testing
[39:34] will enable that kind of testing once again for the for the package
[39:36] once again for the for the package device make sure that you spend a lot of
[39:39] device make sure that you spend a lot of time on the link testing persistent
[39:41] time on the link testing persistent testing transmitter receiver
[39:43] testing transmitter receiver measurements are good but really making
[39:46] measurements are good but really making sure that it actually works in the
[39:48] sure that it actually works in the intended system environment cannot
[39:50] intended system environment cannot communicate to another module really
[39:54] communicate to another module really really important uh it also of course
[39:56] really important uh it also of course making sure that you do the the process
[39:59] making sure that you do the the process voltage and temperature testing of those
[40:03] voltage and temperature testing of those modules to make sure that they're going
[40:05] modules to make sure that they're going to meet the requirements over the
[40:07] to meet the requirements over the intended range of operating conditions
[40:10] intended range of operating conditions but also over the process parameters
[40:12] but also over the process parameters that you have defined and and last but
[40:16] that you have defined and and last but not least in the manufacturing phase of
[40:18] not least in the manufacturing phase of course is really really important you
[40:20] course is really really important you know that that you know a lot of the
[40:21] know that that you know a lot of the testing the testing that you do in
[40:23] testing the testing that you do in manufacturing has a very direct impact
[40:25] manufacturing has a very direct impact on the cost of your modules you know
[40:28] on the cost of your modules you know testing all channels is feedback that we
[40:30] testing all channels is feedback that we get you know from a lot of participants
[40:32] get you know from a lot of participants in the market so we enable the very
[40:35] in the market so we enable the very densely integrated Mass parallel testing
[40:38] densely integrated Mass parallel testing that is required for that and
[40:40] that is required for that and then for for pilot production you know
[40:43] then for for pilot production you know it's it's good to to get a little bit
[40:45] it's it's good to to get a little bit more data
[40:47] more data um as part of the learning curve
[40:49] um as part of the learning curve um you know get all the test results uh
[40:52] um you know get all the test results uh make sure that you can do the the
[40:54] make sure that you can do the the optimization of the device uh to
[40:57] optimization of the device uh to maximize uh your yield and spec
[40:59] maximize uh your yield and spec compliance maybe validate some of the
[41:01] compliance maybe validate some of the spec compliance over temperature and
[41:04] spec compliance over temperature and then use this information to say okay I
[41:06] then use this information to say okay I really understand my product my process
[41:08] really understand my product my process much better right now for the the final
[41:11] much better right now for the the final stage Mouse production I can do kind of
[41:13] stage Mouse production I can do kind of a limited set of tests to really make
[41:17] a limited set of tests to really make sure that it's sufficient also to prove
[41:20] sure that it's sufficient also to prove that the product is in Spec before you
[41:23] that the product is in Spec before you ship it
[41:25] ship it so that brings me to uh the conclusions
[41:28] so that brings me to uh the conclusions um yeah I think the key is really that
[41:30] um yeah I think the key is really that uh what we believe is important that you
[41:33] uh what we believe is important that you have a testing infrastructure uh with
[41:36] have a testing infrastructure uh with with certain characteristics that can
[41:38] with certain characteristics that can meet the requirements of the the new
[41:41] meet the requirements of the the new integrated photonics uh ecosystem
[41:45] integrated photonics uh ecosystem um the key is really to cooperate with
[41:47] um the key is really to cooperate with Partners you know Thorson mentioned that
[41:50] Partners you know Thorson mentioned that um and and of course Cowboy is doing
[41:52] um and and of course Cowboy is doing this as well really inviting different
[41:53] this as well really inviting different kinds of Technology Partners to
[41:55] kinds of Technology Partners to participate in these kind of events and
[41:57] participate in these kind of events and you know this is this isn't this is not
[41:59] you know this is this isn't this is not an easy problem to solve so cooperating
[42:01] an easy problem to solve so cooperating with the developers of Optics the
[42:05] with the developers of Optics the equipment manufacturers the service
[42:07] equipment manufacturers the service providers to help move the industry to
[42:10] providers to help move the industry to the next level and so
[42:13] the next level and so the infrastructure needs to be flexible
[42:16] the infrastructure needs to be flexible different kinds of test modules
[42:18] different kinds of test modules different kinds of form factors because
[42:20] different kinds of form factors because the mix is going to change throughout
[42:23] the mix is going to change throughout the product life cycle scalable maybe an
[42:26] the product life cycle scalable maybe an initial phase you test a few channels
[42:28] initial phase you test a few channels there are a lot of stages where you need
[42:30] there are a lot of stages where you need to test all the channels so you need to
[42:31] to test all the channels so you need to be able to do multi-duty but for sure
[42:35] be able to do multi-duty but for sure multi-port testing of potentially
[42:37] multi-port testing of potentially hundreds of channels very important high
[42:40] hundreds of channels very important high density Rackspace is important uh you
[42:43] density Rackspace is important uh you know we chose the pxi platform and also
[42:45] know we chose the pxi platform and also an additional custom platform that can
[42:48] an additional custom platform that can really get you to these extremely dense
[42:51] really get you to these extremely dense test platforms that you can then nicely
[42:53] test platforms that you can then nicely integrate into uh you know for instance
[42:57] integrate into uh you know for instance a
[42:58] a photonics assembly and test system and
[43:03] photonics assembly and test system and the size Matters a lot because obviously
[43:04] the size Matters a lot because obviously you know your size is is kind of is
[43:08] you know your size is is kind of is expensive
[43:09] expensive mix signal very important you know you
[43:12] mix signal very important you know you have a mix of tests that you need to do
[43:14] have a mix of tests that you need to do being able to combine it with smus uh
[43:18] being able to combine it with smus uh General Spectrum analyzer and the
[43:20] General Spectrum analyzer and the photonics test platform in the pxi uh
[43:23] photonics test platform in the pxi uh form factor is is really important it
[43:26] form factor is is really important it has kind of a nice triggering so that
[43:28] has kind of a nice triggering so that you you can actually optimize the test
[43:31] you you can actually optimize the test and Manufacturing flow again to drive
[43:33] and Manufacturing flow again to drive this cost Effectiveness
[43:35] this cost Effectiveness versatile very wide selection of of test
[43:39] versatile very wide selection of of test functions are needed you need to be able
[43:41] functions are needed you need to be able to support it for your Optical test
[43:43] to support it for your Optical test bands and last but not least you know
[43:46] bands and last but not least you know being able to easily integrate into a
[43:49] being able to easily integrate into a kind of a larger test platform or more
[43:54] kind of a larger test platform or more importantly kind of an assembly
[43:56] importantly kind of an assembly alignment and probing system so having a
[44:00] alignment and probing system so having a common user interface an easy defined
[44:03] common user interface an easy defined API that can easily be used to integrate
[44:06] API that can easily be used to integrate into a larger set of equipment like like
[44:09] into a larger set of equipment like like Phi contacts or really important
[44:12] Phi contacts or really important requirements that you need to fulfill to
[44:14] requirements that you need to fulfill to be able to to drive this technology to
[44:18] be able to to drive this technology to the next level so this kind of concludes
[44:20] the next level so this kind of concludes my my presentation thank you very much
[44:23] my my presentation thank you very much for for your attention and we're all
[44:26] for for your attention and we're all going to be at OC and hopefully we'll
[44:28] going to be at OC and hopefully we'll can meet face to face if you have any
[44:30] can meet face to face if you have any specific follow-up questions
[44:33] specific follow-up questions thank you
[44:36] all right thank you thank you case thank
[44:39] all right thank you thank you case thank you Torsten to excellent presentations
[44:41] you Torsten to excellent presentations lots of interesting materials in cases
[44:44] lots of interesting materials in cases you said this is not something easy it's
[44:46] you said this is not something easy it's obviously a big technical challenge to
[44:48] obviously a big technical challenge to do this so thank you again for sharing
[44:51] do this so thank you again for sharing your insights
[44:52] your insights so we're going to be going through the Q
[44:54] so we're going to be going through the Q a portion now I see a number of
[44:56] a portion now I see a number of questions are coming in as we get um
[44:59] questions are coming in as we get um started I will read through the
[45:00] started I will read through the questions anonymously by the way and
[45:02] questions anonymously by the way and we'll get through as many as we can
[45:04] we'll get through as many as we can in case could you as we start this could
[45:07] in case could you as we start this could you maybe share your screen again and
[45:09] you maybe share your screen again and I'd like to go back to slide number 10
[45:11] I'd like to go back to slide number 10 and ask you ask Torsten a question about
[45:13] and ask you ask Torsten a question about that actually it's the I think you were
[45:17] that actually it's the I think you were showing um the density challenge there
[45:21] showing um the density challenge there and as we are looking ahead towards
[45:25] and as we are looking ahead towards 51.2 terabit package switches it's clear
[45:29] 51.2 terabit package switches it's clear we're going to have hundreds maybe even
[45:32] we're going to have hundreds maybe even a thousand fibers coming in so I'd like
[45:35] a thousand fibers coming in so I'd like to get you know torsten's perspective on
[45:37] to get you know torsten's perspective on that
[45:38] that um is that something that we are from
[45:41] um is that something that we are from from the manufacturing side
[45:43] from the manufacturing side um prepared to do
[45:45] um prepared to do so the the larger
[45:48] so the the larger fiber arrays we have done so far there
[45:51] fiber arrays we have done so far there are 256 fibers we see that currently uh
[45:56] are 256 fibers we see that currently uh more on the the quantum uh space rather
[45:59] more on the the quantum uh space rather than the the
[46:01] than the the um Telecom Datacom uh space but in
[46:04] um Telecom Datacom uh space but in general if it's becoming more than 250
[46:08] general if it's becoming more than 250 fibers you finally get a problem with
[46:11] fibers you finally get a problem with the with the accuracy of the outer
[46:12] the with the accuracy of the outer fibers uh being being aligned properly
[46:15] fibers uh being being aligned properly but it's a new challenge
[46:18] but it's a new challenge that I see so our first question
[46:21] that I see so our first question um in the same regard um for you to
[46:24] um in the same regard um for you to understand two coupling architectures
[46:25] understand two coupling architectures edge and v-groove were mentioned are
[46:28] edge and v-groove were mentioned are companies developing different
[46:29] companies developing different proprietary systems or is there any
[46:31] proprietary systems or is there any convergence towards standardization or a
[46:34] convergence towards standardization or a preferred solution
[46:37] preferred solution um
[46:38] um there's a lot of our customers or a lot
[46:41] there's a lot of our customers or a lot of Industry approach
[46:43] of Industry approach um to
[46:45] um to to go to to uh to use lead groups
[46:48] to go to to uh to use lead groups um on our machines we have nothing seen
[46:51] um on our machines we have nothing seen today which is in in a higher volume
[46:54] today which is in in a higher volume production
[46:55] production so
[46:57] so um there's a lot of attempts
[46:59] um there's a lot of attempts um and um I think sooner or later we
[47:02] um and um I think sooner or later we will succeed to bring that into into a
[47:04] will succeed to bring that into into a high volume manufacturing there's a few
[47:06] high volume manufacturing there's a few things which are properly which I cannot
[47:08] things which are properly which I cannot mention how how exactly to do that
[47:11] mention how how exactly to do that um but um
[47:12] um but um uh I'm sure we'll see passive attached
[47:16] uh I'm sure we'll see passive attached but at the moment everything is active
[47:17] but at the moment everything is active Okay you also mentioned
[47:20] Okay you also mentioned um epoxy that these are bonded in in
[47:23] um epoxy that these are bonded in in that way
[47:24] that way um is that something that
[47:27] um is that something that um perhaps is changing as well do you
[47:29] um perhaps is changing as well do you see you know need for other types of
[47:31] see you know need for other types of materials especially temperature wise
[47:34] materials especially temperature wise um the the higher volume uh devices
[47:37] um the the higher volume uh devices there are uh currently
[47:41] there are uh currently um
[47:42] um if it's
[47:44] if it's [Music]
[47:44] [Music] um
[47:47] there is epoxy in in in one of the
[47:50] there is epoxy in in in one of the devices either on the lens side or on
[47:52] devices either on the lens side or on the on the fiber array side
[47:54] the on the fiber array side um uh if it goes into into space
[47:56] um uh if it goes into into space applications or into a co-organic
[47:58] applications or into a co-organic applications then
[48:01] applications then um there's uh laser soldering techniques
[48:04] um there's uh laser soldering techniques I used uh use but but not in the high
[48:07] I used uh use but but not in the high volume manufacturing we are doing with
[48:09] volume manufacturing we are doing with the machine okay okay
[48:12] the machine okay okay um a second question for you first in
[48:14] um a second question for you first in regarding the photonic tester how does
[48:16] regarding the photonic tester how does the system communicate with The Foundry
[48:18] the system communicate with The Foundry mes where the system works or does the
[48:21] mes where the system works or does the system work stand alone
[48:23] system work stand alone um note that so first of all there's an
[48:26] um note that so first of all there's an um TCP uh protocol between the test
[48:29] um TCP uh protocol between the test instrumentation and and the Machine
[48:32] instrumentation and and the Machine which they use where the the test
[48:35] which they use where the the test instrumentation is triggering in the
[48:38] instrumentation is triggering in the machine or other way around and then
[48:40] machine or other way around and then there are multiple mes systems in the
[48:43] there are multiple mes systems in the market and
[48:45] market and we have this is usually a custom
[48:47] we have this is usually a custom interface uh we are providing
[48:50] interface uh we are providing um we have like done I think like four
[48:52] um we have like done I think like four or five different uh um mes Integrations
[48:56] or five different uh um mes Integrations now with the with the tester
[48:58] now with the with the tester um but this is usually custom
[49:00] um but this is usually custom okay in case I I don't think you need to
[49:03] okay in case I I don't think you need to share this slide anymore
[49:05] share this slide anymore um maybe we'll go back to a different
[49:07] um maybe we'll go back to a different one in a bit um but this next question I
[49:09] one in a bit um but this next question I think can go to uh both uh presenters
[49:13] think can go to uh both uh presenters and it's about the yield rate so how can
[49:16] and it's about the yield rate so how can we improve the first pass yield rate
[49:18] we improve the first pass yield rate considering we have so many fibers and
[49:21] considering we have so many fibers and this higher level of complexity that's
[49:23] this higher level of complexity that's coming into the assembly process how are
[49:26] coming into the assembly process how are we doing on yields overall and do you
[49:29] we doing on yields overall and do you see this improving
[49:33] first
[49:39] so do you mean the the yield Improvement
[49:42] so do you mean the the yield Improvement after the assembly process or on the
[49:45] after the assembly process or on the chip level uh I I think
[49:47] chip level uh I I think after the assembly process in general
[49:51] after the assembly process in general um
[49:52] um assembly process the assembly process
[49:55] assembly process the assembly process itself is is not as long as it's active
[50:00] itself is is not as long as it's active um that is not where you lose your
[50:02] um that is not where you lose your devices
[50:03] devices um actually we this machines and the the
[50:07] um actually we this machines and the the um the picture I've uh I've shown in the
[50:09] um the picture I've uh I've shown in the where the uh the production
[50:12] where the uh the production uh in Thailand these machines are
[50:14] uh in Thailand these machines are running on online yeah close over 99 uh
[50:18] running on online yeah close over 99 uh percent uh yield so that is not
[50:21] percent uh yield so that is not necessary where you lose the Lucy
[50:24] necessary where you lose the Lucy devices there are other processes in
[50:26] devices there are other processes in there in the adjacent uh and uh that
[50:31] there in the adjacent uh and uh that that the laser integration of the um of
[50:33] that the laser integration of the um of the chips are not not perfectly done
[50:35] the chips are not not perfectly done that uh
[50:37] that uh um that other areas in the in the
[50:39] um that other areas in the in the assembly process and also on the trip
[50:40] assembly process and also on the trip side uh which of course uh ear drops
[50:44] side uh which of course uh ear drops okay uh which is how about from your
[50:47] okay uh which is how about from your perspective or testing is being done
[50:49] perspective or testing is being done obviously that's where the you know it's
[50:52] obviously that's where the you know it's good or it's bad right so yeah well
[50:55] good or it's bad right so yeah well that's true and and I think one of the
[50:58] that's true and and I think one of the the key keys for for doing a successful
[51:02] the key keys for for doing a successful testing strategy is really try to you
[51:05] testing strategy is really try to you know gather as much information early in
[51:07] know gather as much information early in the process to really understand the
[51:09] the process to really understand the product and the process how it behaves
[51:11] product and the process how it behaves over certain conditions well once you
[51:14] over certain conditions well once you have good information then you can just
[51:15] have good information then you can just have very smart screening procedures so
[51:18] have very smart screening procedures so that you once you do test a a a a a chip
[51:22] that you once you do test a a a a a chip or a pick
[51:25] or a pick um in the in the in the later stages of
[51:27] um in the in the in the later stages of the production that you know that you
[51:29] the production that you know that you have an effective screen so getting a
[51:31] have an effective screen so getting a lot of data early on to really
[51:32] lot of data early on to really understand product and process will help
[51:34] understand product and process will help you come up with the the best screening
[51:37] you come up with the the best screening parameters later in the process so that
[51:39] parameters later in the process so that you will actually have a better yield as
[51:41] you will actually have a better yield as opposed to you know you do a screen but
[51:43] opposed to you know you do a screen but you really did not do the right kind of
[51:45] you really did not do the right kind of screening and you're still going to pass
[51:47] screening and you're still going to pass through devices that are not going to
[51:49] through devices that are not going to meet the requirements
[51:52] meet the requirements um okay
[51:53] um okay and that of course impacts economics
[51:56] and that of course impacts economics um this next question though I think uh
[51:58] um this next question though I think uh goes back to Torsten again what what are
[52:00] goes back to Torsten again what what are the DFT requirements which are photonic
[52:03] the DFT requirements which are photonic chip designer should follow to allow for
[52:05] chip designer should follow to allow for optical coupling using prisms in the B
[52:07] optical coupling using prisms in the B groups at the wafer level
[52:10] groups at the wafer level sorry can you repeat that question it's
[52:13] sorry can you repeat that question it's about the DFT requirements which are
[52:15] about the DFT requirements which are photonic chip designer should use so
[52:18] photonic chip designer should use so when you're designing your photonic chip
[52:20] when you're designing your photonic chip what are those requirements if you're
[52:22] what are those requirements if you're thinking or you want to allow Optical
[52:25] thinking or you want to allow Optical coupling using prisms in the v grooves
[52:28] coupling using prisms in the v grooves at the wafer level test
[52:32] at the wafer level test oh um so that is very uh um so in
[52:36] oh um so that is very uh um so in general we just need a 50 uh 50 Micron
[52:39] general we just need a 50 uh 50 Micron wide a 50 Micron deep Groove next to the
[52:42] wide a 50 Micron deep Groove next to the chip to to bring the periscopes in
[52:45] chip to to bring the periscopes in yeah I take it you are working with
[52:48] yeah I take it you are working with photonic chip designers on those kind of
[52:50] photonic chip designers on those kind of questions right so yeah so and generally
[52:53] questions right so yeah so and generally we adapt the these little periscopes um
[52:56] we adapt the these little periscopes um you we are usually getting the
[52:59] you we are usually getting the um uh the mode Fields uh from the chip
[53:02] um uh the mode Fields uh from the chip designers and then they are they're it's
[53:05] designers and then they are they're it's actually printed so we keep these these
[53:06] actually printed so we keep these these periscopes can be very easily adapted to
[53:08] periscopes can be very easily adapted to any kind of mode field uh and and uh and
[53:12] any kind of mode field uh and and uh and and requirements on the on the chip side
[53:14] and requirements on the on the chip side could you perhaps show that slide to
[53:16] could you perhaps show that slide to Austin with the periscopes again
[53:19] Austin with the periscopes again let me just go
[53:23] let me just go back there
[53:26] I wanted to ask also about those
[53:28] I wanted to ask also about those periscopes um is that a proprietary
[53:31] periscopes um is that a proprietary technology or you can buy that uh it's
[53:34] technology or you can buy that uh it's not an option off-the-shelf product but
[53:36] not an option off-the-shelf product but you can buy that from uh from a company
[53:38] you can buy that from uh from a company Vanguard automation
[53:41] Vanguard automation okay and and these are attached and with
[53:45] okay and and these are attached and with the v-grooves so it's actually uh this
[53:48] the v-grooves so it's actually uh this is this process is is called two Photon
[53:51] is this process is is called two Photon polarization
[53:53] polarization um this we we built is actually a part
[53:55] um this we we built is actually a part so the the the boxes uh um Vanguard is
[54:00] so the the the boxes uh um Vanguard is using um they are actually built with uh
[54:03] using um they are actually built with uh um also by by contact so we have a close
[54:06] um also by by contact so we have a close cooperation with them and actually it's
[54:07] cooperation with them and actually it's a photo two Photon colonization so you
[54:10] a photo two Photon colonization so you actually you you put a glove top of uh
[54:13] actually you you put a glove top of uh epoxy a polymer onto the onto the fiber
[54:17] epoxy a polymer onto the onto the fiber array and then you with a with a filter
[54:19] array and then you with a with a filter second laser you actually writing
[54:23] second laser you actually writing um the structure you're generating the
[54:26] um the structure you're generating the structure and finally you you develop
[54:28] structure and finally you you develop the resist and what's left over is these
[54:31] the resist and what's left over is these is these um is the structure of the
[54:33] is these um is the structure of the Periscope okay uh I I know we have more
[54:37] Periscope okay uh I I know we have more questions coming but um I just wanted to
[54:40] questions coming but um I just wanted to ask what would be the advantages of
[54:42] ask what would be the advantages of using this this um Periscope idea this
[54:44] using this this um Periscope idea this prison in general
[54:47] prison in general um
[54:48] um it's very
[54:50] it's very um so the the prism usually needs a much
[54:55] um so the the prism usually needs a much a larger
[54:57] a larger real estate or at least my knowledge a
[54:59] real estate or at least my knowledge a real estate on the wafer in order to be
[55:01] real estate on the wafer in order to be brought into the into the group
[55:05] brought into the into the group okay um and these these uh periscopes
[55:08] okay um and these these uh periscopes can be super tiny is it like as small as
[55:10] can be super tiny is it like as small as 50 microns
[55:12] 50 microns okay
[55:15] okay interesting
[55:17] interesting um interesting I would like to learn
[55:19] um interesting I would like to learn more about that at some point
[55:23] let's keep moving on to some of the
[55:25] let's keep moving on to some of the other questions
[55:26] other questions um uh keys I think this next one would
[55:29] um uh keys I think this next one would be for you any insight on how to improve
[55:32] be for you any insight on how to improve the efficiency of optical active testing
[55:35] the efficiency of optical active testing 51.2 T mentioned again 400g
[55:39] 51.2 T mentioned again 400g fr4 as an example that might require
[55:42] fr4 as an example that might require what 128 ports
[55:47] yeah I mean that's uh that's obviously
[55:49] yeah I mean that's uh that's obviously it's going to be a little bit of a
[55:50] it's going to be a little bit of a challenge I think some of the the the
[55:53] challenge I think some of the the the the the key requirements that we talked
[55:56] the the key requirements that we talked about you really need to have an answer
[55:57] about you really need to have an answer for that so for for those Technologies
[56:00] for that so for for those Technologies with so many many channels
[56:02] with so many many channels um you know you need to really look at
[56:03] um you know you need to really look at how can I come up with a cost-effective
[56:06] how can I come up with a cost-effective test strategy that makes sense so uh
[56:09] test strategy that makes sense so uh just just focusing on the capex for test
[56:12] just just focusing on the capex for test equipment is is important because but
[56:15] equipment is is important because but but you really need to make sure that
[56:17] but you really need to make sure that you that you select the equipment that
[56:19] you that you select the equipment that is is good enough to do the test that
[56:21] is is good enough to do the test that has the feature set to do the testing
[56:23] has the feature set to do the testing but really focusing on the operational
[56:26] but really focusing on the operational expenditures of the of the test making
[56:29] expenditures of the of the test making sure that you uh optimize the the the
[56:33] sure that you uh optimize the the the test flow you know working with a
[56:36] test flow you know working with a experienced partner like Phi contact to
[56:38] experienced partner like Phi contact to really understand like this is the flow
[56:40] really understand like this is the flow that we're going to do
[56:42] that we're going to do um you know the manufacturing and test
[56:43] um you know the manufacturing and test flow to optimize that so that you can
[56:46] flow to optimize that so that you can really you know have an Optimum
[56:47] really you know have an Optimum throughput
[56:49] throughput um
[56:50] um having fast test times is really
[56:52] having fast test times is really important so that you can really
[56:54] important so that you can really optimize the overall flow having the
[56:56] optimize the overall flow having the density that extreme density of test
[56:59] density that extreme density of test equipment because that's that obviously
[57:01] equipment because that's that obviously for those kind of channels is going to
[57:03] for those kind of channels is going to be important and also having solutions
[57:05] be important and also having solutions that allow you to do the testing of
[57:08] that allow you to do the testing of hundreds of channels in parallel is
[57:11] hundreds of channels in parallel is critical so that you can do this this
[57:13] critical so that you can do this this kind of cost effective testing so and
[57:17] kind of cost effective testing so and and of course the the really the
[57:18] and of course the the really the integration of the of the testing is
[57:20] integration of the of the testing is part of the uh the uh the manufacturing
[57:23] part of the uh the uh the manufacturing process so all those parameters are
[57:26] process so all those parameters are really critical to deliver a test
[57:28] really critical to deliver a test solution that can effectively cost
[57:31] solution that can effectively cost effectively test those Next Generation
[57:33] effectively test those Next Generation CPO modules okay and and that comment
[57:37] CPO modules okay and and that comment about fast test times why is that so
[57:40] about fast test times why is that so critical these are high value parts so
[57:44] critical these are high value parts so it's more well yeah that's that's that's
[57:46] it's more well yeah that's that's that's that's a great question I mean obviously
[57:48] that's a great question I mean obviously you need to look at the the overall the
[57:50] you need to look at the the overall the bigger picture what is your cost of
[57:52] bigger picture what is your cost of testing we're actually writing a a white
[57:54] testing we're actually writing a a white paper where we give some some guidance
[57:56] paper where we give some some guidance you know what what are the parameters
[57:57] you know what what are the parameters that you need to focus on I mean if if
[57:59] that you need to focus on I mean if if you you need to be very critical about
[58:02] you you need to be very critical about it if you if you have a setup time that
[58:04] it if you if you have a setup time that takes you 15 minutes and then you need
[58:06] takes you 15 minutes and then you need to do a quick measurement you know it
[58:08] to do a quick measurement you know it needs to be relatively fast to that uh
[58:10] needs to be relatively fast to that uh not not dramatically fast road but but
[58:12] not not dramatically fast road but but you know if you do set up time and then
[58:15] you know if you do set up time and then you need to do a quick measurement that
[58:17] you need to do a quick measurement that is really important if you do a scan
[58:19] is really important if you do a scan over a a wafer you know you you cannot
[58:22] over a a wafer you know you you cannot just you can just count it uh if you
[58:26] just you can just count it uh if you have like thousands of cells that you
[58:28] have like thousands of cells that you need to test test time for every cell is
[58:31] need to test test time for every cell is super critical so having these fast test
[58:33] super critical so having these fast test times having this test equipment that
[58:35] times having this test equipment that can give you results quickly will
[58:38] can give you results quickly will significantly impact your your cost
[58:40] significantly impact your your cost strategy or your your testing strategy
[58:43] strategy or your your testing strategy okay all right great well we are at the
[58:46] okay all right great well we are at the top of the hour unfortunately we haven't
[58:48] top of the hour unfortunately we haven't been able to answer all of the questions
[58:49] been able to answer all of the questions many more excellent questions have come
[58:52] many more excellent questions have come in uh so I I guess one final question
[58:55] in uh so I I guess one final question for for both of you will you be at ofc
[58:58] for for both of you will you be at ofc yes yes and uh so for for those who have
[59:01] yes yes and uh so for for those who have questions I I uh I guess that will be an
[59:04] questions I I uh I guess that will be an opportunity to meet in person and have
[59:06] opportunity to meet in person and have them addressed directly
[59:08] them addressed directly um will you be at the Kobo Booth or will
[59:11] um will you be at the Kobo Booth or will you be at your at your own booth where
[59:13] you be at your at your own booth where where can people find you
[59:15] where can people find you so let us go first no you caught me by
[59:19] so let us go first no you caught me by surprise I don't think
[59:21] surprise I don't think it's with me uh but but uh we're under
[59:25] it's with me uh but but uh we're under the main hall so Falcon Tech
[59:28] the main hall so Falcon Tech um we have a pretty pretty large boost
[59:29] um we have a pretty pretty large boost over there
[59:30] over there in case yeah we have we have a boot
[59:34] in case yeah we have we have a boot there as well I think it's four five one
[59:36] there as well I think it's four five one one
[59:37] one um but uh you know we have some also we
[59:40] um but uh you know we have some also we have some presents at the at the Cobo
[59:42] have some presents at the at the Cobo Booth to talk a little bit about you
[59:43] Booth to talk a little bit about you know kind of testing strategies for for
[59:45] know kind of testing strategies for for CPO
[59:47] CPO um and we have some other some other
[59:49] um and we have some other some other places as well but there will definitely
[59:51] places as well but there will definitely be at RFC
[59:54] uh four uh seven two five sorry all
[59:58] uh four uh seven two five sorry all right fantastic fantastic well um the
[01:00:02] right fantastic fantastic well um the slides that were presented by by both
[01:00:04] slides that were presented by by both torson and keys are now available on the
[01:00:06] torson and keys are now available on the Kobo website
[01:00:08] Kobo website onboardoptics.org for anybody who would
[01:00:10] onboardoptics.org for anybody who would uh like to see them share them with
[01:00:12] uh like to see them share them with their colleagues this whole webcast
[01:00:15] their colleagues this whole webcast webinar will be available probably in
[01:00:17] webinar will be available probably in about a week or so and uh we'll send out
[01:00:20] about a week or so and uh we'll send out information on that and you're welcome
[01:00:22] information on that and you're welcome to share that with your colleagues for
[01:00:24] to share that with your colleagues for watching on demand
[01:00:26] watching on demand um please stop by and see our two
[01:00:28] um please stop by and see our two presenters and the Kobo booth at uh ofc
[01:00:31] presenters and the Kobo booth at uh ofc um I hope to answer any of those
[01:00:33] um I hope to answer any of those questions for you guys at that time and
[01:00:36] questions for you guys at that time and with that we'll we'll wrap up our our
[01:00:38] with that we'll we'll wrap up our our webinar for today I'd also like to thank
[01:00:41] webinar for today I'd also like to thank Dupont Silicon Valley for sponsoring and
[01:00:44] Dupont Silicon Valley for sponsoring and for posting this webinar and of course
[01:00:46] for posting this webinar and of course Kobo the
[01:00:49] Kobo the onboardoptics.org so uh thank you both
[01:00:51] onboardoptics.org so uh thank you both and thank you to our audience and I hope
[01:00:54] and thank you to our audience and I hope to see you again next time
[01:00:56] to see you again next time thank you thank you so much thanks bye
[01:01:02] thank you

https://www.youtube.com/watch?v=6wsUvp3r8IQ

Summary

TL;DR — The webinar discusses the challenges and strategies for high-volume manufacturing and testing of Co-Packaged Optics (CPO). Key players in the industry, including machine builders and testing solution providers, are collaborating to overcome hurdles in assembly, testing, and standardization to enable the widespread adoption of CPO technology.

Key points

• The growth of data centers and AI/ML applications is driving the demand for high-bandwidth, low-latency optical interconnects, making CPO a critical technology.

• High-volume manufacturing of CPO requires close collaboration between device manufacturers and equipment vendors, similar to the semiconductor industry's success.

• Packaging and testing remain significant cost drivers in photonics, necessitating innovative solutions for efficiency and cost-effectiveness.

• Advanced automation in assembly, including precise fiber preparation and alignment, is crucial for CPO manufacturing.

• Comprehensive testing strategies are needed across the product lifecycle, from wafer-level to final module testing, to ensure reliability and performance.

• Standardization in areas like coupling architectures (e.g., V-grooves) and testing methodologies is emerging, though proprietary solutions still exist.

Takeaway — Industry collaboration and advanced automation in both manufacturing and testing are essential to overcome the challenges and realize the full potential of Co-Packaged Optics for high-volume deployment.